Team Group Inc. had actively deployed strategic products for the year 2011, and will release all new card reader series products for the first time at 2011 Computex. The first that was announced would be the 42-in-1 USB 3.0 high speed card reader - TR1151. It combines three major features of high performance, compatibility and lightweight in one, supporting the new generation SDXC UHS-1 specifications and weighs only 80 grams with an ultra thin volume. It is said at the moment to be the smallest USB 3.0 card reader in the industry.

Team Group's TR1151 card reader has a colorful painting design targeting the younger consumers. Two different types of Pop Art designs add more fun to users' everyday life. With both USB 2.0 and USB 3.0 interfaces, TR1151 allows users to enjoy the high transfer speed of USB 3.0 while at the same time thoughtfully equipped with a built-in USB 2.0 connector so that users would not have to worry about preparing extra cables for data transmission. TR1151 is not only convenient but also easy to travel with.

Elitegroup Computer Systems (ECS) introduces the latest AMD based motherboard series - ECS Black Deluxe A75F-A, and ECS mainstream series A75F-M and A75F-M2 motherboards. ECS A75 series motherboards powered by AMD Hudson D3 chipset support the latest AMD A series APU.

As one of the ECS Black Deluxe series, ECS A75F-A has passed 50°C burn test, presenting high quality and unbelievable durability. ECS Black Deluxe A75F-A also equips with complete expansion slots from PCI Express 2nd generation x16, x4 to PCI 1st generation for users to enlarge the power of yours computers with every possibility. To match the amazing graphics power of APU, ECS A75F-A has full video output options: HDMI/DVI/D-Sub with optical audio output for you to enjoy the ultimate entertainment moment.

Since Team Group Inc. released the TP1023 portable hard drive, which adopts a streamline sports car design, it has created a new trend. Following up this success, Team Group schedules to display the first sports car-designed flash drive disks at Computex 2011. The Team SR1 /SR3 carrying with exclusive "Team EZ Go" application software and come in both USB 3.0 and USB 2.0 interfaces, respectively, are made of the same material and streamline sports car design as the TP1023. In addition to data storage, it is perfect for showcasing personal zest for sports and making a statement of masculine vitality and energy.

Thermaltake is readying a new variant of its Meka G mechanical gaming keyboard under the Tt eSports banner. Called the Tt eSports Meka G Unit, the new keyboard, according to the company, will be the first mechanical keyboard with onboard memory and individual key illumination and key map-based illumination (only those keys that a game is bound to will be illuminated, which can quickly switch to all-illuminated when text-chatting in-game).

The keyboard switches between "Game Mode", in which accidental keystrokes are minimized, and normal mode. The ISS (Instant Shift System) advanced macro key shifting function allows Gamer to reach all 60 macro keys within one profile. The Meka G Unit uses Cherry Black switches that provide good tactile feedback without the "clickity" noise. As a mechanical keyboard, the Meka has a longer key lifespan than common membrane-type keyboards, with the switches supporting 50 million keystrokes each.

VIA Technologies revealed its upcoming 4-core processor, simply called "QuadCore". The chip comes in BGA packages, and is simply a multi-chip module (MCM) of two Nano X2 dies built on the 40 nm process. One of the first models is the QuadCore L4700, which is clocked at 1.20 GHz with a BClk of 266 MHz. Using the Adaptive Overclocking feature, the processor can bump clock speeds up to 1.46 GHz provided the thermal solution by the manufacturer can keep up, while keeping the chip within its thermal constraint of 27.5W TDP. Each of the two dies can independently up speeds based on their individual loads and temperatures.

The VIA QuadCore L4700 features four x86-64 cores split between two dual-core dies that share a V4 front-side bus clocked at 1333 MHz. The processor has a total L2 cache of 4 MB, also split between the two dies. On the feature-set front, SIMD extensions up to SSE3 are available, so is VIA Virtualization Technology, and Padlock Security Engine, which is a fast hardware random number generator that speeds up AES encryption. The processor itself doesn't feature on-die memory controller or integrated graphics, and continues to rely on the chipset for memory and graphics. VIA's QuadCore L4700 is expected to be released in Q3, 2011, at least one can expect VIA-made demo platforms to be shown at Computex.

With no new GPUs in the works by either of the two main manufacturers, AMD and NVIDIA, this year's Computex event isn't going to be a very big exhibition of graphics cards. Instead, Intel's LGA2011 and AMD's AM3+ platforms are going to steal the show. It does leave graphics card manufacturers some attention, if they come up with something really out of the ordinary. PowerColor wants to be one of them. Flexing its in-house engineering muscle, the company is readying a dual-GPU graphics card that makes use of two 40 nm "Barts" GPUs for a CrossFire on-a-stick solution.

The two Barts chips will feature the BartsXT (Radeon HD 6870) configuration, with the card being designed to offer performance on par with HD 6870 CrossFire, with 3-GPU and 4-GPU CrossFireX support, and lower power draw than two single-GPU HD 6870 cards. The PCB design is the same as every dual-GPU AMD card ever made, there are two GPUs sitting on either sides of a PLX-made PCI-Express bridge chip, and each GPU system having its own VRM. There's 1 GB of GDDR5 memory over a 256-bit wide memory interface per GPU. Power is drawn from two 8-pin PCI-Express power connectors. The cooling solution is not pictured, but expect a multi-fan heatsink that spits hot air into the case.

At Computex 2010, motherboard vendors across the board displayed socket LGA1155 motherboards that support Intel "Sandy Bridge" processors, based on P67, H67 chipsets, months in advance of the platform actually making it to the market. This year, the motherboard industry will do something similar and show off socket LGA2011 motherboards based on the Intel X79 "Patsburg" chipset.

Detailed to much length in older articles, the platform schematic of Sandy Bridge-E surfaced, confirming X79's feature-set, including a PCI-Express 3.0 based supplementary interconnect between the processor and chipset to bolster enough bandwidth for the massive 10-port SATA 6 Gb/s controller, and a 8-port PCI-Express 2.0 hub. Sandy Bridge-E processor itself comes in three main variants, an all-enabled 6-core Extreme Edition, a 6-core unlocked variant, and a limited-OC 4-core variant. The platform is slated for late 2011.

Intel is preparing to unveil its next-generation processors based on the Ivy Bridge architecture as early as by Computex 2011 (May 30 to June 4), according to Commercial Times, a Chinese language business newspaper. Ivy Bridge is an optical shrink of the Sandy Bridge architecture, processors based on it will be manufactured on the 22 nanometer silicon fabrication process. Intel launched its Sandy Bridge 32 nm processors at CES 2011, in January. In related news from the same source, AMD has also accelerated the production of its Llano APUs and is expected to begin shipping the APUs to ODM/OEM makers in May at the earliest instead of the original schedule set in the third quarter.

Biostar is ready with its pair of mid-range motherboards for the upcoming LGA1155 Sandy Bridge processor platform, based on the Intel P67/H67 Express chipsets. The two were earlier pictured in their pre-release forms at this year's Computex event. Both models fall into the company's mid-range TSeries family. The TSeries TP67XE is the larger (ATX) model that builds slightly over the chipset's feature set, it is outfitted with USB 3.0 and SATA 6 Gb/s (2 ports each). The rather high-end looking CPU VRM uses a total of 9 phases, power is drawn from two 8-pin ATX EPS connectors (probably connecting both connectors is optional, and only to enhance overclocking). Expansion slots include two each of PCI-Express 2.0 x16 (electrical x8/x8, when both are populated), PCI-Express x1, and PCI. Connectivity includes 8-channel HD audio, gigabit Ethernet, USB 3.0, FireWire, eSATA 3 Gb/s, and a number of USB 2.0 ports.

The second smaller (micro-ATX) board, the TSeries TH67XE, is based on the H67 chipset, and supports FDI that lets you use the integrated graphics processor on some processors. It uses a simpler 6+1 phase VRM, and goes slightly easy on the overclocking-capability department, but does retain USB 3.0 and SATA 6 Gb/s. Expansion slots include one PCI-Express 2.0 x16, one PCI-Express x16 (electrical x4), a PCI-Express x1, and a PCI. One out of six of the SATA 3 Gb/s channels from the PCH are assigned as an eSATA port. Other connectivity features include 8-channel HD audio, FireWire, gigabit Ethernet. Display connectivity includes DVI and D-Sub. Both boards will be out by the year's end, when Intel releases its new processor platform.

Shuttle Inc., a leading developer and manufacturer of multi-form-factor solutions such as the world-famous XPC Mini-PC Barebones, today announces the official European sales launch of the XS35 series. There are in total eleven versions of the new model available, which all boast a compact format of just 38 mm in width, high connectivity and a completely passive (fanless) cooling system.

As the smallest-ever Mini-PC from Shuttle (25.2 x 3.85 x 16.2 [cm, DWH]) the XS35 offers particularly low energy consumption. The series is based on efficient technologies and uses the Intel Atom D510 dual-core processor (2x 1.66 GHz), SO-DIMM memory, 2.5 inch hard disks and slim-line drives. Since no fans are used at all, any models work virtually silently even under heavy load. Using no fans also means less maintenance is required.

If you recall, at this year's Computex event held in Taipei, almost every motherboard vendor scuffled to show of their first motherboards based on the Intel P67 and H67 chipsets, that support new socket LGA1155 socket processors based on the next-generation Sandy Bridge architecture. The Intel Developer Forum (IDF) 2010 event is presenting many of them a second chance, and we're beginning to see some new designs that didn't make it to Computex. Intel's own Desktop Board division came up with a new Extreme Series motherboard, the DP67BG "Burrage". As with every other Intel Desktop Board, this one looks clean, and well spaced-out. While there's nothing fancy about the heatsinks, the glowing skull is there, and this time it's positioned properly.

The processor is powered by a 4+2 phase PWM circuit, it's wired to four DDR3 DIMM slots for dual-channel memory support. Among few of its kind, the Burrage makes room of all seven expansion slots in the ATX specification. There are two PCI-Express 2.0 x16 (x8, x8 when both are populated), three PCI-E x1, and two PCI. Apart from six SATA 3 Gb/s ports from the P67 PCH, there's an additional Marvell-made SATA controller that drives an eSATA port. Connectivity includes 8-channel HD audio, gigabit Ethernet, a number of USB 2.0 ports, FireWire, and eSATA. After being neophobic toward USB 3.0, Intel has finally embraced it on its Desktop Board brand, an NEC/Renesas controller gives out two ports on the rear-panel. This feature-set should put rest to rumors of Intel embedding USB 3.0 and SATA 6 Gb/s into its chipset. The DP67BG from Intel should be out when the first-wave of LGA1155 processors make it to the market.

At this year's Computex expo held in Taiwan, some of the most unexpected exhibits were socket LGA1155 motherboards from almost every motherboard vendor, including from lesser known brands, among market-heavyweights such as ASUS, Gigabyte, and MSI. Socket LGA1155 is expected to be the platform on which value-thru-performance processors from Intel, based on its next-generation Sandy Bridge architecture will run. The fact that motherboard vendors managed to show almost market-ready products as early as May, shows that these products could in fact reach market before next year's CES event, which is typically held in January.

That seems to be the case, according to a recent report by PC World. In the company's Q2 conference call, Intel CEO Paul Otellini said that due to rave reviews by industry customers (which likely include OEMs, hardware vendors, and other partners), Intel is speeding up launch of new processors. "I am more excited by Sandy Bridge than I have been in any product that the company has launched in a number of years," he said, adding "Due to the very strong reception of Sandy Bridge, we have accelerated our 32-nanometer factory ramp and have raised our capex guidance to enable us to meet the anticipated demand."

Last week's Computex Taipei trade show saw the first public showing of several upcoming Noctua products and prototypes such as an upgrade to the C-series of down-draft CPU coolers, possible additions to the U and D-series as well as a new low profile heatsink. Giving an exclusive insight into our current projects, we've gathered excellent feedback from our sales partners, visitors and members of the international press.

First off, we've been exhibiting four tower-style prototypes following in the footsteps of our current U and D line of CPU coolers. The two D-style heatsinks pick up the dual-radiator design of our award-winning NH-D14 and adopt it to 120mm and 92mm size. Due to the asymmetric construction of the 120mm prototype, the heatsink doesn't overhang the RAM slots on LGA1156 and thus allows for improved compatibility with tall memory heatspreaders. Measuring 95mm by 95mm, the prototype with 92mm fan is the same size as the LGA1156 socket square and hence allows for optimal compatibility with high profile RAM or chipset heatsinks too.

At Computex today, Intel Corporation unveiled new products and features based on its low-power Intel Atom processor family, including plans to further differentiate the popular netbook category and expand into several new market segments beyond its growing PC, laptop and server businesses.

In the past 45 days, Intel and its Atom processor has entered a variety of markets beyond the more than 50 million Intel-based netbooks sold in the past 2 years. Intel announced a processor and MeeGo* software win with Chinese carmaker HawTai Automobile for a future in-vehicle-infotainment platform; a greater than 50-times lower platform idle power reduction with Intel's next generation Atom processor platform for handheld devices including smartphones; and a collaboration with Google*, Sony* and Logitech* to deliver a new Smart TVs experience powered by Intel Atom CE products and running Android*-based Google TV*.

TechPowerUp is coming to you live from Computex 2010, quite literally. A new technology used lets you see high-quality photos from Computex seconds after they're taken from our reporters in the field. A new interface lets you browse through those images, as well as chat with other TechPowerUp members to discuss without even entering the forums. Select pictures will be detailed further in news posts.

TechPowerUp LIVE

So, the temperatures are rising and we have made our way to Taipei for Computex 2010. The next few days are full of meetings to take a look at some of the things the industry has to offer. Stay tuned on Techpowerup.com for all the news, real pictures and information about the newest gadgets, hardware and technologies. We will also be updating our Twitter TechPowerUp from time to time with some behind the scenes info and happenings as we go along, so make sure to follow us there as well.

ASUS is proud to unveil an array of display products catered towards the needs of different market segments. The Designo ML Series LED monitors, the VG236 and PG276 3D monitors, the PA246Q professional monitor and LED projector will all be showcased at Computex 2010 at the Taipei International Convention Center (TICC).

Since its launch, the Designo MS and LS LED monitors have received numerous accolades that include the Japanese Good Design Award, and the iF China Award. These monitors' award-winning lines are matched by the true-to-life Full HD visuals showcased on their mercury-free LED-backlit panels. These monitors deliver the industry's contrast ratio benchmark of 10,000,000:1 thanks to ASUS Smart Contrast Ratio (ASCR) Technology. Together with a 2ms (gray-to-gray) response time and ASUS Splendid Video Intelligence Technology, which optimizes color fidelity with five pre-set modes (gaming, theater, night view, scenery and standard), the Designo Series displays provide sharp and crisp visuals for almost every situation.

Lian Li Industrial Co. Ltd., the award-winning, aluminum computer chassis manufacturer, is ready to present itself at one of world's largest computer exhibitions - COMPUTEX TAIPEI 2010 - in Nangang, Taipei, Taiwan from 1 ~ 5 June 2010. Visitors will be able to check out a variety of products under both the Lian Li and Lancool brands.

It is even more exciting that visitors will be able to check out total of seven brand-new products displayed at Lian Li's booth for the first time during this year's Computex. In addition to the new Lancool case available in three colors, there will be the new generation of V-series, Q-series and C-series under the Lian Li brand. The Corporation has fully demonstrated itself in offering top-quality and full-range features on all form factors including the HPTX, ATX, micro-ATX and HTPC.

Team Group Incorporation officially announces its brand new USB3.0 flash disk X101 at Computex 2010. With a bandwidth up to 5Gbps, the USB3.0 interface is 10 times faster than the previous generation USB2.0 at 480Mbps. Therefore, whether HD movies, photos, or a large amount of music using lossless data compression, users can transfer them to the X101 in an instant. For example, it usually takes about 20 minutes to back up a movie from a 25GB Bluray disc to a USB2.0 flash disk. Now with the brand new large-capacity X101 equipped with USB3.0, it takes only 2 minutes to finish the same task, thus bringing Bluray media portability to a super-speed state.

The X101 has a no-cap-loss design that users can fix the cap at the end of the disk to prevent losing it accidentally. With a simple design that is matched with sharp colors, the X101 blends high-performance with fashion for consumers and fully display Team's innovation of blending 3C with fashion. With the X101, all people of all ages can enjoy karaoke or appreciate HD movies anywhere, anytime.

Futuremark is readying the next generation of its popular 3D graphics benchmark, the 3DMark. The new version will be called 3DMark 11 (probably named after the year 2011 or DirectX 11), and will strive to be every present-generation GPU's worst nightmare (stress test). With NVIDIA's entry into the DirectX 11 generation of graphics following ATI making the new GPUs "current", 3DMark 11 will focus on the GPUs' DirectX 11 capabilities, probably exploiting new texturing and hardware tessellation features.

The benchmark will be able to push present and future GPUs to their maximum capabilities. At least one of its game tests have been known to be called "Undersea Submarine". There is no mention of NVIDIA PhysX, so it's safe to assume that the benchmark will use industry standard features which are available to all DirectX 11 generation GPUs. However, similar to a marketing deal with Sapphire for 3DMark Vantage (where a certain game test showed a futuristic vehicle with Sapphire logo on it), this version will market MSI. What's more, it will be bundled with MSI graphics cards when the software releases. Futuremark will show off its latest creation at this year's Computex event held in early June, in Taiwan. The software will be released some time in Q3, 2010.

More details have surfaced about NVIDIA's upcoming GPU which is on the low-end of the GeForce GTX 400 series, the GTX 465. Chinese website eNet.com.cn published some lesser known specifications about the GPUs, which pieced together with known details more or less completes the picture. The GTX 465 has not four, but five streaming multiprocessors (SMs) disabled from the GF100 core, yielding 352 CUDA cores (against the earlier known number of 384). With a 256-bit wide GDDR5 memory interface, the GPU has 32 out of 48 ROPs enabled, and makes use of 1 GB of memory.

Out of the few benchmarks the GTX 465 was put through, it scored 5488 points in the eXtreme preset of 3DMark Vantage, which is roughly 20% less than what a GTX 470 would manage. It is said to have outperformed the ATI Radeon HD 5870 in Far Cry 2, while was slower than Radeon HD 5830 in Crysis Warhead. The GeForce GTX 465 will be launched on the 3rd of June, at the Computex 2010 event.

NVIDIA's Fermi architecture seems to be finally coming of age, with the company planning to introduce mid-range GPUs derived from the architecture, which are expected to be energy-efficient and competitive with mid-range lineup of rival ATI. Identified so far by some sections of the media as GF104, the new GPU will form base for a number of new SKUs that will capture key price-points in the mainstream segment.

A new report suggests that NVIDIA might well be at the end of developing this GPU, and will be ready to talk about it to the public as early as in June, at the Computex 2010 event in Taiwan. Select groups of people, particularly board partners, OEM vendors, etc., will also be able to see engineering samples in private. In the following month (July), NVIDIA will be in a position to launch these mainstream SKUs, just about in time for Summer, which is one of the two main shopping seasons in major markets.

Patriot Memory is planning two highlights for its Computex 2010 booth among a number of new products the company will release around that time. Jumping into the DDR3-2500 MHz bandwagon, Patriot will introduce Viper II Series Sector 5 Edition 2500MHz memory kits that come in dual-channel 4 GB and triple-channel 6 GB variants. The modules will be able to operate at 2500 MHz with relatively tight timings of 9-11-9-27T, and voltage ranging between 1.65 to 1.7V. On the solid-state drive (SSD) front, Patriot will introduce new SSDs that make use of the popular SandForce-made SSD controllers. Patriot's booth will be up at Computex between June 1 and June 5, 2010.

Shuttle Inc., the market leader in the Mini-PC segment and manufacturer of Multi-Form-Factor solutions, is now shipping the All-in-One-PC X 5000TA that was shown at the Computex in Taipei as a barebone. Now users can decide for themselves which components should be installed in their All-in-One-PC.

Now individualists can really get their money's worth. With the Shuttle X50 Barebone the decision for HDD or SSD, 512 MB or 2 GB DDR2-memory is totally left to the purchaser of this little gem that is only 3.6 cm thin.

We had a chance to drop by the XFX suite during the Computex. They are showing off their Radeon HD 4770. It comes with the dual slot reference cooler, which was actually not intended for retail and the power supply has a very unique design along with a cable management system. The PSU is rated for 850W and features a single 70A 12V rail. On top of that it is 80Plus Silver certified.