Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy. The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities.

The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.

The EUV lithography machine from ASML ordered by Rapidus is expected to arrive in Japan in mid-December, according to information from Nikkei cited by TrendForce. This marks the first deployment of EUV technology in Japan, an important step for the country's semiconductor industry as it seeks to establish itself as a major player. Rapidus is currently building a factory in Chitose, Hokkaido, and plans to start mass production of 2 nm chips in 2027. The company also plans to purchase several EUV devices if the 2-nanometer chip production is successful, and intends to build a second production facility specifically for 1.4 nm chips. To support these operations, ASML will establish a service center in Chitose City.

NVIDIA CEO Jensen Huang hinted at the possibility of outsourcing AI chip production to Rapidus. As of October, construction progress on the Rapidus facility, which began in September 2023, is up to 63% and remains on track. In addition to Rapidus, Micron's Hiroshima plant is scheduled to install EUV equipment in 2025, allowing for mass production in 2026. JASM, a TSMC subsidiary in Japan, plans to integrate EUV lithography with a second wafer plant in 2027 that will have a 6 nm production line.

Intel has plans to expands its chip packaging and testing operations in Chengdu, China. The company will put $300 million into Intel Products (Chengdu), as stated in a WeChat post by Chengdu's Reform and Development Commission, and reported by TrendForce. Intel announced its Chengdu plant in August 2003 as a semiconductor chip packaging and testing facility in the Chengdu Hi-Tech West Zone. The first phase began in February 2004 with the construction of a chipset factory, which was completed and put into production by the end of 2005. The second phase commenced in August 2005 and was completed in October 2006. By 2007, the packaging and testing facility was fully operational, handling Intel's most advanced processors.

Since its launch in 2003, Intel's Chengdu plant has handled over half of the packaging and testing for Intel's laptop processors. Even with rising US-China tensions, China remains Intel's biggest market making up 27 percent of its total income last year. The announced expansion will increase the packaging and testing ability of server chips and will add a new "customer solutions center." This center aims to make the supply chain more effective, give more support to Chinese customers, and speed up response times. Intel's Chengdu site plays a key role in the company's global supply chain, benefiting from the area's "favorable" business climate, CEO Patrick Gelsinger said during his visit last year.

Last year, Micron unveiled plans to construct a cutting-edge DRAM factory in Hiroshima, Japan. However, the project has faced a significant two-year delay, pushing back the initial timeline for mass production of the company's most advanced memory products. Originally slated to begin mass production by the end of 2025, Micron now aims to have the new facility operational by 2027. The complexity of integrating extreme ultraviolet lithography (EUV) equipment, which enables the production of highly advanced chips, has contributed to the delay. The Hiroshima plant will produce next-generation 1-gamma DRAM and high-bandwidth memory (HBM) designed for generative AI applications. Micron expects the HBM market, currently dominated by rivals SK Hynix and Samsung, to experience rapid growth, with the company targeting a 25% market share by 2025.

The project is expected to cost between 600 and 800 billion Japanese yen ($3.8 to $5.1 billion), with Japan's government covering one-third of the cost. Micron has received a subsidy of up to 192 billion yen ($1.2 billion) for construction and equipment, as well as a subsidy to cover half of the necessary funding to produce HBM at the plant, amounting to 25 billion yen ($159 million). Despite the delay, the increased investment in the factory reflects Micron's commitment to advancing its memory technology and capitalizing on the growing demand for HBM. An indication of that is the fact that customers have pre-ordered 100% of the HBM capacity for 2024, not leaving a single HBM die unused.

According to the report from Volksstimme.de, Intel has delayed its Magdeburg fab construction until 2025 due to difficulties in acquiring suitable land. The company had initially planned to begin construction in 2024, but the process has been slowed significantly due to the availability of suitable land. The Magdeburg plant is a significant investment for Intel, with the company planning to invest around €30 billion in the facility. The plant is expected to create thousands of jobs and play a crucial role in the company's European expansion plans. However, the delay in construction is likely to impact these plans and may result in a longer timeline for the plant's completion.

The delay is attributed to the difficulty in finding suitable land for the plant. Intel's original plan of producing a factory on the land concluded that there was humus-rich black soil up to 40 cm in the ground, which would get removed for usage by agricultural fields in Germany. However, now the top layer of black soil, which needs to be excavated, is measured up to 90 cm in depth, which doesn't allow fab construction to start and requires the removal of the soil in order to satisfy the safety regulations. This useful soil has to be extracted first before being "contaminated" with concrete and other types of foundation soils like gravel. The state of Saxony-Anhalt postponed the construction until the required soil was removed and regulations were met. This will supposedly happen by the end of 2024, and construction will start in 2025.

Malaysia is firmly positioning itself as a hub for semiconductor investment, with Prime Minister Anwar Ibrahim stating the country aims to attract over $100 billion in investment into the industry. This aligns with recent trends in the region, such as China's announcement of a massive $47.5 billion investment fund or Micron's plans to build a new chip factory in Hiroshima, Japan by the end of 2027.

As a major player accounting for 13% of global chip testing and packaging, Malaysia has benefited from strong investments by Intel ($7 billion for an advanced packaging plant) and Infineon ($5.4 billion to expand its power chip plant). The country now hopes around 10 local companies will make substantial investments in new facilities focused on chip design and advanced packaging. To support this goal, the Malaysian government plans to allocate $5.3 billion in fiscal backing, along with tax breaks and subsidies. It is targeting these investments to generate revenues between $210 million and $1 billion for the semiconductor industry in Malaysia.

At 07:58 local time, Taiwan was rocked by a magnitude 7.4 earthquake on the east coast which was felt nationwide and as far as to the southeastern parts of China and southern Japan. It caused some major damage in the east coast city of Hualien where the epicentre of the quake was located, as well as surrounding areas. The earthquake reportedly left nine people dead and over 900 people injured islandwide. TSMC, UMC, PSMC and Innolux all halted some of their production lines in the Hsinchu Science Park on the west coast of the island, although this is said to have been as a preventive step, rather than caused by actual damage from the earthquake.

All the above-mentioned companies also evacuated their staff from their factories due to the intensity of the quake, as it reached a magnitude of around four or five almost island wide. The semiconductor manufacturers are all inspecting their fabs now to make sure none of the equipment was damaged by the earthquake. Innolux also has a factory in the southern city of Kaohsiung and has reported that it has suspended production in Hsinchu, but that production in Kaohsiung wasn't affected. Local media in Taiwan hasn't made any mention of the likes of Micron or other chip manufacturers, but it's likely that the situation is similar, since all of these companies are located in the same areas on the island. Aftershocks have continued throughout the day and there's a risk for further big earthquakes to follow in the coming days.Images courtesy of the Taiwan Central Weather Administration (CWA).

Update 15:11 UTC: Updated with an official statement from Micron below.

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Box, a cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6 billion (€3.2 billion) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

As well as bringing the most advanced chiplet integration, packaging, and testing to Italy, Silicon Box's manufacturing process is based on panel-level-production; a world leading, first-of-its-kind combination that is already shipping product to customers from its Singapore foundry. Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally. The new integrated production facility is expected to serve as a catalyst for broader ecosystem investments and innovation in Italy, as well as the rest of the European Union.

Morris Chang, TSMC's founder and semiconductor industry icon, was present at the opening ceremony of his company's new semiconductor fabrication plant in Kumamoto Prefecture, Japan. According to a Nikkei Asia article, Chang predicted that the nation will experience "a chip renaissance" during his February 24 commencement speech. The Japanese government also announced that it will supply an additional ¥732 billion ($4.86 billion) in subsidies for Taiwan Semiconductor Manufacturing Co. to expand semiconductor operations on the island of Kyūshū. Economy Minister Ken Saito stated: "TSMC is the most important partner for Japan in realizing digital transformation, and its Kumamoto factory is an important contributor for us to stably procure cutting-edge logic chips that is extremely essential for the future of industries in Japan."

Chang disclosed some interesting insights during last weekend's conference segment—according to Nikkei's report, he revealed that unnamed TSMC customers had made some outlandish requests: "They are not talking about tens of thousands of wafers. They are talking about fabs, (saying): 'We need so many fabs. We need three fabs, five fabs, 10 fabs.' Well, I can hardly believe that one." The Taiwanese chip manufacturing giant reportedly has the resources to create a new "Gigafab" within reasonable timeframes, but demands for (up to) ten new plants are extremely fanciful. Chang set expectations at a reasonable level—he predicted that demand for AI processors would lie somewhere in the middle ground: "between tens of thousands of wafers and tens of fabs." Past insider reports suggested that OpenAI has been discussing the formation of a proprietary fabrication network, with proposed investments of roughly $5 to $7 trillion. OpenAI CEO, Sam Altman, reportedly engaged in talks with notable contract chip manufacturers—The Wall Street Journal posited that TSMC would be an ideal partner.

We're happy to share that Framework Laptop 16's are now in customer hands. It's been an excellent journey over the last two years designing and building an ultra-upgradeable, high-performance machine, and we're excited to see the early feedback. As always with Framework products, the first shipment is just the beginning, and we're looking forward to continuing to deliver on longevity, upgradeability, and repairability as we go. We've seen more press reviews go live as well, including by far the most thorough one, a deep dive from Jarrod's Tech that includes both a broad range of benchmarks and subjective evaluation of the overall experience. Framework Laptop 16 pre-orders are still open as we continue to manufacture our way through the pre-order batches. Most of our factory capacity, which we doubled last year, is now allocated to getting you Framework Laptop 16's as quickly as we can.

We recently uploaded the first set of developer documentation around Framework Laptop 16 internals on GitHub, adding to the existing material we have for the Expansion Bay and Input Module systems. The new release includes drawings and connector part numbers for the Mainboard to enable re-use. We'll continue to build out this documentation over time, like we have for Framework Laptop 13.

Providing a peek at the architecture powering advanced AI factories, NVIDIA released a video that offers the first public look at Eos, its latest data-center-scale supercomputer. An extremely large-scale NVIDIA DGX SuperPOD, Eos is where NVIDIA developers create their AI breakthroughs using accelerated computing infrastructure and fully optimized software. Eos is built with 576 NVIDIA DGX H100 systems, NVIDIA Quantum-2 InfiniBand networking and software, providing a total of 18.4 exaflops of FP8 AI performance. Revealed in November at the Supercomputing 2023 trade show, Eos—named for the Greek goddess said to open the gates of dawn each day—reflects NVIDIA's commitment to advancing AI technology.

Eos Supercomputer Fuels Innovation
Each DGX H100 system is equipped with eight NVIDIA H100 Tensor Core GPUs. Eos features a total of 4,608 H100 GPUs. As a result, Eos can handle the largest AI workloads to train large language models, recommender systems, quantum simulations and more. It's a showcase of what NVIDIA's technologies can do, when working at scale. Eos is arriving at the perfect time. People are changing the world with generative AI, from drug discovery to chatbots to autonomous machines and beyond. To achieve these breakthroughs, they need more than AI expertise and development skills. They need an AI factory—a purpose-built AI engine that's always available and can help ramp their capacity to build AI models at scale Eos delivers. Ranked No. 9 in the TOP 500 list of the world's fastest supercomputers, Eos pushes the boundaries of AI technology and infrastructure.

Today, Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Intel's breakthrough 3D packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance and cost.

"Today, we celebrate the opening of Intel's first high-volume semiconductor operations and the only U.S. factory producing the world's most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation," said Keyvan Esfarjani, Intel executive vice president and chief global operations officer.

Micron Technology, Inc., one of the world's largest semiconductor companies, today marked a historic day with the opening of its new cutting-edge assembly and test facility in Batu Kawan, Penang, alongside the celebration of Micron's 45th anniversary. A ceremony officiated by Chief Minister of Penang, Yang Amat Berhormat Tuan Chow Kon Yeow, underscored the regional significance of Micron's expansion, highlighting the company's four and a half decades of innovation and excellence.

Micron previously invested $1 billion and will add up to another billion including construction and full equipping of this new facility over the next few years in Penang to increase factory space to a total of 1.5 million square feet. This expansion enables Micron Malaysia to boost production output and further strengthen its assembly and test capabilities, allowing it to supply leading-edge NAND, PCDRAM and SSD modules to meet the growing demand for transformative technologies such as artificial intelligence and autonomous or electric vehicles.

We're happy to share that ordering is now available in Taiwan! That includes the in-stock Framework Laptop 13 (13th Gen Intel Core) with Traditional Chinese keyboard, pre-orders for AMD Ryzen 7040 Series and Framework Laptop 16, and the modules in the Framework Marketplace. This is an especially important launch for us because our manufacturing site for laptops, our main warehouse, and about a third of the Framework team itself are all in Taiwan. This also means that shipping is going to be ultra fast for local customers! As always, we're continuing to build out infrastructure to reach more of you across the world. We're in 13 countries now, and actively preparing for more. The best way to let us know where to go next is to register your interest on the country selection page.

Starting production on Framework Laptop 13 (AMD Ryzen 7040 Series)
We're also excited to announce that we've started mass production of Framework Laptop 13 (AMD Ryzen 7040 Series)! A set of electrical issues we found during validation along with late delivery of firmware from our upstream suppliers required us to delay our original production schedule. We've been sending bi-weekly status updates on this to customers in Batches 1-3 whose orders were at risk of delay. This week, we kicked off SMT (surface mount production of Mainboards) in Taiwan, which feeds into FATP (final assembly, test, and pack out of laptops) in the same factory, after which we'll transfer inventory to our warehouse and start shipments. We've doubled production capacity and moved into a new, larger logistics warehouse since the launch of 13th Gen Intel Core earlier this year, so we're confident we'll be able to move through the pre-order backlog quickly.

Leading provider of embedded PC solutions, AAEON, is delighted to announce the official launch of the BOXER-6406-ADN, a compact and fanless embedded computer built upon the Intel Atom Processor X Series/Intel Processor N-series Processor platform.

Designed to cater to the demands of smart factory applications, the BOXER-6406-ADN boasts a range of features that establish it as a remarkably robust choice for industrial projects. Notably, the system boasts an impressive operational temperature range spanning from -20°C to 60°C. Furthermore, it supports a wide voltage input range of 9 V to 36 V, inclusive of over/under-voltage current protection as well as short-circuit protection. To enhance its durability, the system is equipped with IEC 68-2-27 anti-shock tolerance and advanced anti-vibration capabilities. Lockable I/O connectors have also been incorporated to safeguard against wear and tear.

With dimensions measuring just 186 mm x 104.6 mm x 49.1 mm, the BOXER-6406-ADN's compact chassis can be easily wall-mounted for convenient deployment. The system relies solely on passive cooling mechanisms, foregoing fan-assisted cooling systems to prevent the accumulation of contaminants when deployed in smart factory settings.

Somewhat out of the blue, Silicon Box has announced the opening of its US$2 billion semiconductor assembly plant in Singapore. The "startup" is founded by several of Marvell's founders, suggesting the company has the right pedigree to compete in what is sure to be a very competitive market over the next few years. Silicon Box is not a foundry and will at least at this point in time, not be involved in foundry services, but instead the company will focus on advanced chip packaging technologies, focusing on chiplets.

The company is promising "faster time-to-market, lower new device design cost" on its very rudimentary website, something the company has yet to prove to be capable of. However, its new plant in Singapore covers 73,000 square metres and is said to feature state of the art production equipment for turning chiplets into chips. The factory is said to create some 1,200 jobs in Singapore, suggesting that this is a company that means business. According to a comment by company founder and CEO BJ Han to Reuters, "customers had been lining up" since before the completion of the assembly plant. Silicon Box is expecting to have several AI chipset companies as its customers, including Tenstorrent, which so far is the only officially mentioned client. Time will tell if Silicon Box can compete with established chip packaging businesses and if they can deliver on their promise to be faster and cheaper than the competition.

Semiconductor industry research firm TechInsights said it has found that Samsung's 3 nm GAA (gate-all-around) process has been incorporated into the crypto miner ASIC (Whatsminer M56S++) from a Chinese manufacturer, MicroBT. In a Disruptive Technology Event Brief exclusively provided to DIGITIMES Asia, TechInsights points out that the significance of this development lies in the commercial utilization of GAA technology, which facilitates the scaling of transistors to 2 nm and beyond. "This development is crucial because it has the potential to enhance performance, improve energy efficiency, keep up with Moore's Law, and enable advanced applications," said TechInsights, identifying the MicroBT ASIC chip the first commercialized product using GAA technology in the industry.

But this would also reveal that Samsung is the foundry for MicroBT, using the 3 nm GAA process. DIGITIMES Research semiconductor analyst Eric Chen pointed out that Samsung indeed has started producing chips using the 3 nm GAA process, but the capacity is still small. "Getting revenues from shipment can be defined as 'commercialization', but ASIC is a relatively simple kind of chip to produce, in terms of architecture."

According to the latest report from Reuters, a former Samsung executive was arrested by the South Korean authorities yesterday, being accused of stealing company secrets to build a similar chip production facility in China. The former executive had worked for SK Hynix before joining Samsung, where he was involved in the Samsung Electronics division responsible for semiconductor factories. According to the report, the person planned to build a competing factory 1.5 km from a Samsung chip manufacturing facility in Xian, China. The suspect, who was not identified publically, has a collective of 28 years of experience with the South Korean chip makers.

Interestingly, the suspect also caused financial harm to the company, which the Suwon District Prosecutors' Office estimates to be around 300 billion won ($233 million). Prosecutors have announced the indictment of six additional individuals suspected of involvement in the case, including an employee of an inspection company who is charged with allegedly disclosing the architectural blueprint of Samsung's semiconductor plant. A police official commented, "We will sternly deal with any leakage of our technology abroad and strongly respond to illegal leak of domestic companies' core technologies in semiconductor, automobile and shipbuilding sectors among other."

Foxconn has commited to $500 million of investments into new operations within Telangana, a southern state located in India. The region's IT minister, K. T. Rama Rao, broke the news earlier today and declared that the Taiwanese multinational electronics contract manufacturer will be building new factory facilities - with the first example breaking ground in Kongara Kalan (a village to the south of Hyderabad) this morning.

The minister estimates that the "first phase" of new Foxconn manufacturing plants will help generate 25,000 "direct jobs" across the state of Telangana. Reuters has previously reported that Foxconn has been granted a new contract for the manufacture of next generation AirPods - Apple is a key client for the company, and executives have pushed for a shift in production locations due to problems encountered in China. Foxconn's move into India is observed as a strategic decision - facilities are less likely to get shutdown (due to health restrictions) and the country is not getting hit with advanced semiconductor sanctions.

The bipartisan Protecting Circuit Boards and Substrates Act of 2023 introduced by Representatives Blake Moore (R-UT-1) and Anna Eshoo (D-CA-16) finishes the job the CHIPS Act began by incentivizing investment in the domestic printed circuit board (PCB) industry. This bill is a necessary follow-on to the CHIPS Act: without a trusted, reliable domestic source of PCBs and substrates, computer chips don't connect to end use electronic devices.

Domestic PCB production shrunk over the past 20 years, falling from 30% to barely 4% of the world's supply. Ninety percent of the world's supply now comes from Asia…56% in China alone.

LG is reported to be making substantial investments into improving and upgrading its OLED manufacturing facilities in South Korea - last month we found out about a similar effort underway at Samsung (courtesy of Reuters). Nikkei Asia has today published an article that explores this situation plus a wider context - their findings reaffirm existing claims that Samsung Display has spent $3+ billion on the sprucing up of its Tangjeong factory. LG's modernization bill is smaller at a mere $2.5 billion - this will be spent on creating additional production lines at the company's mainline Paju plant. LG is aiming to increase factory output of medium-sized OLED panels using sixth generation technology.

According to last month's report, industry insiders have suggested that Samsung was ramping up its high end OLED production lines in order to secure substantial component orders from a key client, Apple, with premium display panels destined for fitting on next generation iPad and MacBook products. Reuters posited that LG was not able to fulfil any new requests from Apple at the time - due to its display factories being fully booked and operating at maximum capacity. It seems that LG is now addressing this problem by making necessary and essential upgrades at its Paju P10 OLED facility. A domestic rivalry is only part of the problem, both giant South Korean electronics firms are also keeping a collective eye on other rival manufacturers (operating out of nearby nations).

TSMC has confirmed to Taiwan News this weekend that a fire at its Phoenix-general area, Arizona semiconductor plant was only "limited to an outside trash chute and immediately extinguished" - the chipmaker was responding to an afternoon incident from Friday (April 28). A worker took photos of black smoke rising from a section of the brand new factory, the employee then proceeded to share their snaps online via a discussion board. A local firefighting crew extinguished the blaze soon after evacuating workers from the affected area, a preliminary investigation conducted by the emergency responders found that the fire originated from a waste/refuse chute. A root cause has not yet been identified according to the newspaper's article.

The Arizona plant was not the only TSMC location to play host to an unexpected incident this week - reports from Wednesday (April 26) state that a fire broke out during the (preceding) evening/night at a company facility in North Taiwan. No injuries or casualties were reported following a response by firefighters who had the situation under control soon after 9 pm - TSMC believes that the fire started at around 19:30. The incomplete factory is situated within Taiwan's Hsinchu Science Park, and is set to bolster the company's existing advanced 3D IC package manufacturing efforts. Part of the facility will also be setup as a component testing lab. TSMC has declared that it is conducting an investigation into the incident at its Zhunan, Miaoli County location.

NVIDIA's fresh faced GeForce RTX 4070 graphic card range has not been flying off shelves around the world, and Team Green could be pivoting their approach somewhat after receiving lower than expected sales figures via company reports. Their component suppliers have already mentioned that the entire GeForce RTX 40 family is on a comfortably steady production schedule - with no instructions received from HQ to up the ante. In the latest development this week, individuals with insider knowledge of factory schedules in China have claimed that NVIDIA has informed board partners (AICs) that output for the GeForce RTX 4070 line is getting paused for a month. The temporary cutoff in factory output will allow, they hope, for the currently sitting stock to get cleared out. A substantial surplus of GeForce RTX 4070 cards could disrupt distribution networks and overstock warehouses.

Industry watchdogs have theorized that NVIDIA's board partners are having a difficult time offloading their premium tier RTX 4070 custom cards onto paying customers. The Founders Edition and closer-to-reference models have sold quite respectable numbers according to early analyses, but more expensive options are considered to be too expensive by the customer base. There is apparent crossover in pricing with the fancier GeForce RTX 4070 Ti range, and a savvy buyer will tend toward superior silicon rather than a shiny cooling solution combined with a factory-issued overclock. A computer hardware retailer in the UK, Novatech, has chosen to cut the price of a Palit RTX 4070 Dual model by £40/$50, as reported yesterday. The asking price has since returned closer to RRP - at the time of writing it stands at £579.98.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.