Friday, December 20th 2024
EU Approves €1.3B Italian Subsidy for Silicon Box Chiplet Plant
Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy. The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities.
The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.
The new first-of-its-kind advanced manufacturing facility in Novara will feature:
Regional Impact and Partnerships
Under the Italian measure, Silicon Box is committed to strengthening Italy's and the wider EU semiconductor value chain by bringing in advancing packaging technologies, managing supply shortages through priority orders, and developing workforce training programs.
Silicon Box is already in talks with the local government to develop partnerships with educational institutions and workforce programs to cultivate a robust native talent which will include technicians and maintenance workers with expertise in automation, robotics, mechatronics, computer science, and graduates in electronic, mechanical, management, chemical and physical engineering.
Source:
Silicon Box
The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.
"This strategic investment in Italy represents a pivotal moment in Europe's semiconductor renaissance," says Dr. Byung Joon Han, Chief Executive Officer of Silicon Box. "By bringing our advanced packaging technologies to the heart of Europe, we're not just expanding our global footprint - we're creating a cornerstone of the EU's semiconductor ecosystem that will serve critical sectors from automotive to artificial intelligence."Project Details and Timeline
The new first-of-its-kind advanced manufacturing facility in Novara will feature:
- Panel-level packaging and heterogeneous integration capabilities
- R&D center focusing on next-generation packaging solutions
- Industry 4.0 automated manufacturing systems
- Key net-zero technologies to minimize carbon footprint and environmental impact
Regional Impact and Partnerships
Under the Italian measure, Silicon Box is committed to strengthening Italy's and the wider EU semiconductor value chain by bringing in advancing packaging technologies, managing supply shortages through priority orders, and developing workforce training programs.
Silicon Box is already in talks with the local government to develop partnerships with educational institutions and workforce programs to cultivate a robust native talent which will include technicians and maintenance workers with expertise in automation, robotics, mechatronics, computer science, and graduates in electronic, mechanical, management, chemical and physical engineering.
"We're committed to creating high-quality jobs, fostering local partnerships, and driving technological advancements that will benefit our customers and the broader economy, " says Michael Han, Head of Business, Silicon Box. "Silicon Box would like to express our gratitude to the Ministry of Enterprises and Made in Italy, Piedmonte government, local officials, and our partners for supporting this expansion. Silicon Box remains committed to driving innovation, ensuring supply chain resilience, and contributing to the economic growth of Italy and beyond."Silicon Box's key manufacturing services will enable the adoption of chiplets and high-performance alternatives that require integrating a wide variety of technology nodes and materials. The plant will specialize in advanced packaging solutions for AI, high-performance computing (HPC), data centers, automotive, mobile, IoT and robotic applications, addressing Europe's growing demand for advanced chip technologies.
7 Comments on EU Approves €1.3B Italian Subsidy for Silicon Box Chiplet Plant
I hate EU. Renovating some schools for no kids, bribing other county politicians, failed education, laughable support for farmers, promised money for mega projects and not thinking about inflation.