EU Approves €1.3B Italian Subsidy for Silicon Box Chiplet Plant
Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy. The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities.
The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.
The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.