Hewlett Packard Enterprise (NYSE: HPE) today announced its ongoing commitment in Europe by building its first factory in the region for next-generation high performance computing (HPC) and artificial intelligence (AI) systems to accelerate delivery to customers and strengthen the region's supplier ecosystem. The new site will manufacture HPE's industry-leading systems as custom-designed solutions to advance scientific research, mature AL/ML initiatives, and bolster innovation.

The dedicated HPC factory, which will become the fourth of HPE's global HPC sites, will be located in Kutná Hora, Czech Republic, next to HPE's existing European site for manufacturing its industry-standard servers and storage solutions. Operations will begin in summer 2022.

This past week, the EU's Internal Market and Consumer Protection Committee agreed on adopting USB Type-C as the union's standard charging connector, with 43 votes in favour and two against. It's part of the Radio Equipment Directive and it means that USB-C is now very close to becoming the de facto connector for charging a wide range of consumer electronics. The charging standard will apply to what the committee calls small and medium-sized electronic gadgets and include mobile phones, tablets, digital cameras, headphones and headsets, handheld videogame consoles and portable speakers. Exemptions will apply for devices that are too small to incorporate a USB-C port, such a smart watches, health trackers and some sports equipment.

The directive still has to be approved by the EU parliament, which is expected to happen in May during the plenary session. There will be an initial transition period and the new requirements aren't expected to start to apply until early 2024. In addition to the new directive, the MEPs also want to see clear labelling on devices in terms of how much power they can deliver, since this can sometimes be hard to figure out as a consumer. They also want to see clear labelling on product packaging if a charger is supplied or not. Furthermore, the MEPs want the European Commission to present a strategy with regards to wireless chargers by the end of 2026, to make sure there's some kind of minimal interoperability between the various wireless charging standards. This is said to be to try and avoid market fragmentation, as well as to reduce e-waste and to try and prevent consumer "lock-in" to proprietary charging standards. The EU is said to end up with 11 to 13-thousand tons of e-waste from chargers alone on a yearly basis, so it's not hard to see why the union wants to see a unified charging standard for most electronics.

With Intel still not having announced where in Europe they'll set up shop next, but with Magdeburg, Germany being the hot ticket, Italy is now trying to figure out how they can win over some chip makers, least not Intel. The country is working on a €4 billion chip fund of its own to entice chip makers to set up shop in the nation. However, it seems like the fund is going to spread out over time, as it'll run until 2030, the same time frame as the EU's €15 billion chip fund is going to run. Italy will apparently divide the money in chunks of €500 million per year from 2023 to 2030.

Italy was apparently considering giving it all to Intel, according to Reuters, plus another €4 billion in other incentives, over a 10 year period. If that is still the case, isn't clear, especially as the nation is said to be in talks with STMicroelectronics, MEMC Electronic Materials, Tower Semi (now Intel) and others. Reuters claims that negotiations with Intel are very tough, as the company has a lot of demands. The Italian government is also said to be promoting "research and development of microprocessor technology and investments in new industrial applications of innovative technologies".

At Intel's 2022 investor meeting, the company has presented a technology roadmap update to give its clients an insight into what is to come. Today, team blue announced one of the first discrete data-centric graphics cards in the lineup, codenamed Arctic Sound-M GPU. Based on the DG2 Xe-HPG variation of Intel Xe GPUs, Arctic Sound-M is the company's first design to enter the data center space. The DG2 GPU features 512 Execution Units (EUs), which get passive cooling from the single-slot design of Arctic Sound's heatsink, envisioned for data center enclosures with external airflow.

One of the most significant selling points that Intel advertises is support for hardware-based AV1 encoding standard. This feature allows the card to achieve a 30% greater bandwidth, and it is the main differentiator between consumer-oriented Arc Alchemist GPUs and itself. The card is powered by PCIe power and an 8-pin EPS power connector. Arctic Sound-M is already sampling to select customers and it will become available in the middle of 2022.Below is Intel's teaser video.

Today, the Commission proposes a comprehensive set of measures to ensure the EU's security of supply, resilience and technological leadership in semiconductor technologies and applications. The European Chips Act will bolster Europe's competitiveness, resilience and help achieve both the digital and green transition. Recent global semiconductors shortages forced factory closures in a wide range of sectors from cars to healthcare devices. In the car sector, for example, production in some Member States decreased by one third in 2021. This made more evident the extreme global dependency of the semiconductor value chain on a very limited number of actors in a complex geopolitical context. But it also illustrated the importance of semiconductors for the entire European industry and society.

The EU Chips Act will build on Europe's strengths - world-leading research and technology organisations and networks as well as host of pioneering equipment manufacturers - and address outstanding weaknesses. It will bring about a thriving semiconductor sector from research to production and a resilient supply chain. It will mobilise more than €43 billion euros of public and private investments and set measures to prevent, prepare, anticipate and swiftly respond to any future supply chains disruption, together with Member States and our international partners. It will enable the EU to reach its ambition to double its current market share to 20% in 2030.

NVIDIA's long-awaited acquisition of Arm Ltd. is collapsing, confirm Financial Times and Reuters. According to the latest information, the deal is not happening, and the previously agreed terms are no longer valid. As we now know, NVIDIA will have to pay Softbank (Arm's owner) a break-up fee of $1.25 billion, which was the deal that the two settled on if the acquisition fails. NVIDIA has originally planned to purchase Arm for $40 billion. However, the regulators from UK and EU have been blocking the deal from happening on the terms that it would hurt competition and block innovation.

What is next for Arm Ltd. is to go public and list itself on one of the world's biggest stock exchanges, either domestically or overseas in the US. The IPO efforts of Arm are estimated to be worth around $80 billion, representing a double amount of what NVIDIA wanted to purchase the company for.Update 08:35 UTC: Here is the official press release from NVIDIA and Softbank below:

The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched 3 new research and innovation projects. The projects aim to bring the EU and its partners in the EuroHPC JU closer to developing independent microprocessor and HPC technology and advance a sovereign European HPC ecosystem. The European Processor Initiative (EPI SGA2), The European PILOT and the European Pilot for Exascale (EUPEX) are interlinked projects and an important milestone towards a more autonomous European supply chain for digital technologies and specifically HPC.

With joint investments of €140 million from the European Union (EU) and the EuroHPC JU Participating States, the three projects will carry out research and innovation activities to contribute to the overarching goal of securing European autonomy and sovereignty in HPC components and technologies, especially in anticipation of the European exascale supercomputers.

Remember that €1.06 billion antitrust lawsuit that Intel was slapped with by the European Commission back in 2009? It's ok if you don't, but it involved Intel being accused of "market malpractice, by influencing computer hardware manufacturers to postpone and/or cancel launches of their products that use CPUs made by its rival AMD" based on our own reporting from 2009. As these thing goes, Intel appealed to a higher court and that higher court handed back the case to the lower court who has now withdrawn the fine and the judges went as far as to say "The (European) Commission's analysis is incomplete and does not make it possible to establish to the requisite legal standard that the rebates at issue were capable of having, or likely to have, anticompetitive effects,".

The European Commission has said it will study the new judgement and will consider its next steps, but it seems unlikely that they'll be able to bring this case to court again, without some additional proof of wrongdoing. The end result of this is also likely to make it tougher to bring cases like to court in the future for the European Commission, as they will have to provide more detailed cases where they prove that things like MDF and rebates to their customers cause real, anti-competitive damages to other companies in the same line of business, in this case AMD. The case can still be appealed to the CJEU, so this 13 year saga might still not be over.

Tachyum today announced that it was selected by the Slovak Republic to participate in the latest submission for the Important Projects of Common European Interest (IPCEI), to develop Prodigy 2 for HPC/AI. Prodigy 2 for HPC/AI will enable 1 AI Zettaflop and more than 10 DP Exaflops computers to support superhuman brain-scale computing by 2024 for under €1B. As part of this selection, Tachyum could receive a 49 million Euro grant to accelerate a second-generation of its Tachyum Prodigy processor for HPC/AI in a 3-nanometer process.

The IPCEI program can make a very important contribution to sustainable economic growth, jobs, competitiveness and resilience for industry and the economy in the European Union. IPCEI will strengthen the EU's open strategic autonomy by enabling breakthrough innovation and infrastructure projects through cross-border cooperation and with positive spill-over effects on the internal market and society as a whole.

Intel's upcoming Arc Alchemist lineup of discrete graphics cards generates a lot of attention from consumers. Leaks of these cards' performance and detailed specifications appear more and more as we enter the countdown to the launch day, which is sometime in Q1 of this year. Today, we managed to see a slide from @9950pro on Twitter that shows the laptop memory configuration of Intel's DG2 GPU. As the picture suggests, we can see that the top-end SKU1 with 512 EUs supports a 16 GB capacity of GDDR6 memory that runs at 16 Gbps speeds. The memory runs on a 256-bit bus and generates 512 GB/s bandwidth while having eight VRAM modules present.

When it comes to SKU2, which is a variant with 384 EUs, this configuration supports six VRAM modules on a 192-bit bus, running at 16 Gbps speeds. They generate a total capacity of 12 GBs and a bandwidth of 384 GB/s. We have SKU3 DG2 GPU going down the stack, featuring 256 EUs, four VRAM modules on a 128-bit bus, 8 GB capacity, and a 256 GB/s bandwidth. And last but not least, the smallest DG2 variants come in the form of SKU4 and SKU5, feating 128 EUs and 96 EUs, respectively. Intel envisions these lower-end SKUs with two VRAM modules on a 64-bit bus, and this time slower GDDR6 memory running at 14 Gbps. They are paired with 4 GB of total capacity, and the total bandwidth comes down to 112 GB/s.

Intel's Arc Alchemist discrete lineup of graphics cards is scheduled for launch this quarter. We are getting some performance benchmarks of the DG2-512EU silicon, representing the top-end Xe-HPG configuration. Thanks to a discovery of a famous hardware leaker TUM_APISAK, we have a measurement performed in the SiSoftware database that shows Intel's Arc Alchemist GPU with 4096 cores and, according to the report from the benchmark, just 12.8 GB of GDDR6 VRAM. This is just an error on the report, as this GPU SKU should be coupled with 16 GB of GDDR6 VRAM. The card was reportedly running at 2.1 GHz frequency. However, we don't know if this represents base or boost speeds.

When it comes to actual performance, the DG2-512EU GPU managed to score 9017.52 Mpix/s, while something like NVIDIA GeForce RTX 3070 Ti managed to get 8369.51 Mpix/s in the same test group. Comparing these two cards in floating-point operations, Intel has an advantage in half-float, double-float, and quad-float tests, while NVIDIA manages to hold the single-float crown. This represents a 7% advantage for Intel's GPU, meaning that Arc Alchemist has the potential for standing up against NVIDIA's offerings.

EU antitrust regulators have paused their probe into NVIDIA's proposed $40 billion acquisition of ARM as they await further information. This takeover which would be the largest chip merger in history is now "highly unlikely" according to analysts as regulators from the FTC in the US are suing to block the deal. The UK's Competition and Markets Authority (CMA) is also undergoing an in-depth investigation to discover potential national security risks and competition concerns. These competition concerns are shared by the FTC who state that the acquisition would stifle innovation in next-generation technologies and would distort Arm's incentives to benefit NVIDIA by undermining rivals. NVIDIA has originally hoped to complete the deal within 2 years however this timeline is now unachievable as noted by CEO Jensen Huang in August.

According to Margrethe Vestager—the European Commissioner for Competition—the EU is hoping to be able to produce up to 20 percent of leading edge chips within the EU by 2030. Today that number is around 10 percent, down from some 40 percent back in the 1990's.

However, it seems like the EU has understood that it can not be self-reliant on semiconductor parts, no matter how many companies it can entice to build foundries within the EU. However, the EU is very much looking at getting more chip production happening inside the union, especially for the automotive industry. At the same time, the EU understands that it has to work with global suppliers of chips, especially what is being referred to as legacy technology in the interview with CNBC.

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

Acer today announced the expansion of its Predator gaming portfolio with new Predator Orion 7000 series desktops, featuring powerful performance in a stunning design, and two smart 4K gaming projectors. Further enhancing the gaming experience is the Predator gaming desk, which offers two practical surface options and a convenient storage rack.

"Predator Orion 7000-series desktops are premium, powerful rigs for serious players who demand incredible performance from even the most demanding titles," said Jeff Lee, General Manager, Stationary Computing, IT Product Business, Acer Inc. "In order to offer that next-level performance, we're excited to be among the first companies bringing the new 12th Gen Intel Core CPUs to our product portfolio."

The European Processor Initiative (EPI) https://www.european-processor-initiative.eu/, a project with 28 partners from 10 European countries, with the goal of making EU achieve independence in HPC chip technologies and HPC infrastructure, is proud to announce that EPAC 1.0 RISC-V Test Chip samples were delivered to EPI and initial tests of their operation were successful.

One key segment of EPI activities is to develop and demonstrate fully European-grown processor IPs based on the RISC-V Instruction Set Architecture, providing power-efficient and high-throughput accelerator cores named EPAC (European Processor Accelerators).

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

Intel is in talks with the German government to build a European chip factory hoping to counter the global chip shortages and help achieve the EU local chip manufacturing target. Germany is interested in attracting semiconductor companies to increase domestic chip production to improve security for their automotive industry which increasingly relies on foreign chips. Intel wants to open up manufacturing capacity at their foundries to external companies allowing them to compete with TSMC and Samsung in the high-end market. Intel is seeking large subsidies from the German government to the tune of several billion to help make the new factory a reality.

Today, Mr. Raja Koduri, senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel, has teased Intel's upcoming Xe-HPG (DG2) gaming GPU on Twitter. Sharing a die shot of Intel's Xe-HPG design with 512 Execution Units (EUs), Mr. Koduri has highlighted the progress that the company is currently going through. The Xe-HPG will represent the company's efforts of going into a very competitive discrete GPU market, dominated by a duopoly of AMD and NVIDIA. The Xe-HPG design pictured below is representative of a maxed-out SKU with 512 EUs, translating into 4096 shading units. This model is expected to be paired with 16 GB of GDDR6 memory.

"From jittery journeys to buttery smooth" - it is quoted in a Tweet of Mr. Koduri. This doubles down on the efforts Intel is putting into creating a GPU and the difficulties that the company is facing. It is also noted that there remains a lot of work in form of driver coding and a lot of game optimizations, which are very important for the new GPU. You can check out the complete Tweet below.

Raja KoduriXe-HPG (DG2) real candy - very productive time at the Folsom lab couple of weeks ago. "From jittery journeys to buttery smooth" said @rogerdchandler - lots of game and driver optimization work ahead for @gfxlisa's software team. They are all very excited..and a little scared:)

Yesterday, we got information that Intel's upcoming DG2 discrete graphics card is "right around the corner". That means that we are inching closer to the launch of Intel's discrete GPU offerings, and we are going to get another major player in the current GPU market duopoly. Today, however, we are in luck because Igor from Igor's LAB has managed to get ahold of the specifications of Intel's Xe-HPG DG2 graphics card. For starters, it is important to note that DG2 GPU will first come to laptops later this year. More precisely, laptops powered by Alder Lake-P processors will get paired with DG2 discrete GPU in the second half of 2021. The CPU and GPU will connect using the PCIe 4.0 x12 link as shown in the diagram below, where the GPU is paired with the Tiger Lake-H processor. The GPU has its subsystem that handles the IO as well.

The global supply chain of graphics cards is currently not very well equipped to handle the massive demand that exists for the latest generation of GPUs. Just like we have seen with the launch of NVIDIA GeForce RTX 3000 series Ampere, and AMD Radeon RX 6000 series Big Navi SKUs, the latest generation graphics cards are experiencing massive demand. And manufacturers of these GPUs are not very well equipped to handle it all, so there is a huge scarce for GPUs in the global market. With AMD's recent announcement of the Radeon RX 6700 XT graphics card, things are not looking any better, and the availability of this GPU could be very tight at launch.

According to information obtained by Igor's Lab, AMD could supply only a few thousand Radeon RX 6700 XT GPUs for Europe as a whole. To be precise, Igor's Lab notes that "If you condense the information of various board partners and distributors to a trend, then there are, depending on the manufacturer and model, only a few pieces (for Germany) to a few thousand for the EU as a whole." This could be a very bad indication of AMD's supply of these new GPUs globally, not just for Europe. The company is currently relying on the overbooked TSMC, which can only produce a limited amount of chips at the time, and we don't know how much capacity AMD allocated for the new chip.

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

Epic Games today announced it has filed an antitrust complaint against Apple in the European Union (EU), expanding the company's fight to advance fairer digital platform practices for developers and consumers. The complaint, filed with the European Commission's Directorate-General for Competition, alleges that through a series of carefully designed anti-competitive restrictions, Apple has not just harmed but completely eliminated competition in app distribution and payment processes. Apple uses its control of the iOS ecosystem to benefit itself while blocking competitors and its conduct is an abuse of a dominant position and in breach of EU competition law.

The complaint complements legal processes already underway in both the US and Australia, as well as Epic's recent filing before the UK's Competition Appeal Tribunal. "What's at stake here is the very future of mobile platforms." Epic Games founder and CEO Tim Sweeney said today. "Consumers have the right to install apps from sources of their choosing and developers have the right to compete in a fair marketplace. We will not stand idly by and allow Apple to use its platform dominance to control what should be a level digital playing field. It's bad for consumers, who are paying inflated prices due to the complete lack of competition among stores and in-app payment processing. And it's bad for developers, whose very livelihoods often hinge on Apple's complete discretion as to who to allow on the iOS platform, and on which terms."

In September of last year, NVIDIA has officially announced that the current industry rumor about its big acquisition was true. The company has announced that it is acquiring Arm Limited from the Softbank Group. Paying as much as $40 billion for the purchase, NVIDIA is gaining access to the complete company, along with its extensive portfolio of IP and knowledge. That means that NVIDIA is not essentially a holder of the Arm ISA, which is the most dominant ISA within mobile processors. Such a deal, however, is a bit hard to process without some troubles popping up along the way. As Arm held a neutral position as IP provider, NVIDIA is expected to remain as such, and the company even promised to stay true to that.

However, not everything is going as planned. Before completing the acquisition process, NVIDIA must first comply with regulators from all around the world, including the US, UK, EU, and China. If any objections raise within those regions, they are to be interrogated. Today, Google, Microsoft, and Qualcomm have objected that NVIDIA's Arm acquisition is hurting the market and are urging antitrust officials to intervene. Mentioned companies believe that NVIDIA's move is hurting the market and the company could limit its competitors from accessing the IP, thus breaking Arm's neutral position as an IP provider. NVIDIA has made statements that Arm will remain in such a position, however, the skepticism of the mentioned companies is slowing the merger. Now all that remains is to see how the conflicted companies solve their worries.

European Union has today processed a declaration that was signed by 17 member states about the development of a 2 nm semiconductor node and an advanced low-power processor. The declaration signed today proposes that the EU puts away 145 billion Euros for the development of the technologies needed to manufacture a 2 nm semiconductor manufacturing process, along with the development of a custom, low-power embedded processor designed for industrial applications. The 17 member countries include Belgium, France, Germany, Croatia, Estonia, Italy, Greece, Malta, Spain, The Netherlands, Portugal, Austria, Slovenia, Slovakia, Romania, Finland, and Cyprus. All of the countries listed are going to join the development of these technologies and will have the funds to do it over the next 2-3 years.

EU DeclarationTo ensure Europe's technology sovereignty and competitiveness, as well as our capacity to address key environmental and societal challenges and new emerging mass markets, we need to strengthen Europe's capacity to develop the next generation of processors and semiconductors. This includes chips and embedded systems that offer the best performance for specific applications across a wide range of sectors as well as leading-edge manufacturing progressively advancing towards 2 nm nodes for processor technology. Using connectivity, where Europe enjoys global lead, as a major use case driver for developing such capacity enables Europe to set the right level of ambition. This will require a collective effort to pool investment and to coordinate actions, by both public and private stakeholders.