AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and mechanical strength. These characteristics make them well-suited for advanced SiPs containing multiple chiplets, especially in data center applications where performance and durability are critical. The adoption of glass substrates aligns with the industry's broader trend towards more complex chip designs. As leading-edge process technologies become increasingly expensive and yield gains diminish, manufacturers turn to multi-chiplet designs to improve performance. AMD's current EPYC server processors already incorporate up to 13 chiplets, while its Instinct AI accelerators feature 22 pieces of silicon. A more extreme testament is Intel's Ponte Vecchio, which utilized 63 tiles in a single package.

Glass substrates could enable AMD to create even more complex designs without relying on costly interposers, potentially reducing overall production expenses. This technology could further boost the performance of AI and HPC accelerators, which are a growing market and require constant innovation. The glass substrate market is heating up, with major players like Intel, Samsung, and LG Innotek also investing heavily in this technology. Market projections suggest explosive growth, from $23 million in 2024 to $4.2 billion by 2034. Last year, Intel committed to investing up to 1.3 trillion Won (almost one billion USD) to start applying glass substrates to its processors by 2028. Everything suggests that glass substrates are the future of chip design, and we await to see first high-volume production designs.

FlexEnable, the leader in the development and production of flexible organic electronics for active optics and displays, today announced that the world's first mass-produced consumer product incorporating organic transistor technology has started shipping. The device, called Ledger Stax, is a secure crypto wallet developed by French company and market-leader Ledger. FlexEnable partnered with display manufacturing companies DKE (Shanghai) and Giantplus (Taiwan) to realise Ledger's design for a credit card-sized product with an E Ink display uniquely wrapped around a 180-degree bend.

Ledger Stax features a display radius of curvature never before achieved in an e-paper display product, made possible by the use of highly flexible organic thin-film transistors (OTFTs), comprising organic materials and process IP developed, supplied and licensed by FlexEnable.

ENERMAX unveiled a couple of new PC cases at the Computex 2024 show, including the Air240 mid-tower case, the Pano270 and the Pano D58. The new cases feature enhanced cooling performance, modular internal structure for easier installation and cable management, as well as support for motherboards with back connectors.

The new ENERMAX Air240 is a mid-tower case supporting up to ATX motherboards, and featuring standard three-side mesh panel design, which should enhance overall cooling performance, according to ENERMAX. The Air240 is pretty much a standard PC case, but it does have a unique feature which allows the PSU compartment baffle to be redirected in order to provide more airflow to the graphics card. The new ENERMAX Pano270 and Pano D58 PC cases certainly attracted a lot of attention as these are following the current design trend with a 270-degree curved glass panel, which provides a panoramic view of key hardware. The Pano270 supports motherboards with backside connectors, and while it is a smaller case that supports up to a Micro-ATX motherboards, it still supports up to 360 mm AIO coolers and up to nine fans. It also has 37 mm of cable management space, and can support up to 170 mm tall CPU air coolers. The Pano D58 is a slightly different and bigger counterpart and while it has the same panoramic glass, it isn't a curved one. Of course, since it is bigger, it supports ATX motherboards, up to 360 mm AIO coolers on the side and top, and up to nine fans. It supports up to 250 mm long PSUs, up to 420 mm long GPUs, and up to 180 mm tall CPU coolers. All three CPU cases should be available soon.

When we think of InWin, we think of their Signature PC chassis - an equally long-lived and impressively designed line of exclusive products that have garnered appreciation, establishing InWin among top manufacturers. This year, at Computex 2024, InWin unveils its 11th Signature Series chassis, taking a standard case and making it unique. The main visual highlight is the 180-degree curved glass panel (the largest we've seen on a PC), which blends seamlessly with the aluminium frame into a sleek design.

The chassis is a full tower that can accommodate E-ATX, ATX, Micro-ATX, and Mini-ITX motherboards, including support for ASUS BTF and MSI Project Zero Series Back-Connector motherboards. It offers 7x PCI-E expansion slots, 2x 2.5" internal drive bays, 1x USB 3.2 Gen 2 x 2 Type-C port, 2x USB 3.2 Gen 1 ports, and HD audio combo ports. For cooling, it is compatible with 120 mm fans (3 at the front, 1 in the rear), and a water cooling 360 mm x 65 mm radiator could also be fitted in the front. No information regarding exact availability and pricing has been provided at this moment.

Rokid has announced the launch of its new AR device, the Rokid AR Lite, on Kickstarter, marking the first AR glasses powered by the Snapdragon 6 Gen 1 Mobile Platform. This integration brings the power and versatility of a mid-range smartphone into an AR device, opening up a new chapter in the industry.

Priced at USD $749, with early backers able to purchase it for USD $499, the Rokid AR Lite offers an accessible entry point into advanced AR technology. The versatility of Rokid AR Lite makes it suitable for various activities, including entertainment, work, and productivity tasks. It supports video conferencing, document editing, navigation, and photo-taking, enhancing user experiences across different scenarios.

MICLEDI Microdisplays today announced a first closing of its Series A funding round with participation from imec.xpand, PMV, imec, KBC and SFPIM demonstrating strong support for the company's value proposition and commercial and technological progress achieved in the seed round. Series A follows a significant seed round award and additional non-dilutive funding in the form of grants and other vehicles from VLAIO. This brings the company's total funding to date to nearly $30 million.

"The company's achievements during this seed round have been astounding," said Sean Lord, CEO of MICLEDI. "Our door is open to engagements with some of the world's largest and most innovative electronic product manufacturing companies, most of whom are working on their own internal development projects for augmented reality (AR) displays in such diverse use cases as smart-wearable devices and automotive HUDs. This level of total funding to date is almost unheard of for a four-year-old startup."

ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

ZALMAN today introduced the P10 series Micro-ATX mini-tower case, which comes in black and white variants. A striking design feature with the case is its pillarless front-left corner, where the front- and left tempered glass panels meet. You still get a glass edge, this isn't a single piece glass panel. Inside, the case features a horizontally partitioned layout, with the bottom portion only accessible by removing the right panel, which is mostly perforated for good airflow. On the left- and front, this portion is completely walled off, but has some side-facing vents for passive ventilation for the PSU bay.

The motherboard bay of the ZALMAN P10 offers maximum clearance of 38.2 cm for graphics cards, and 17.3 cm for CPU coolers. There are 5 expansion slots, and a graphics card reinforcement that can be adjusted to fit the thickness of your graphics card. It counteracts PCB bending of graphics cards over time. Storage options include a single 3.5-inch bay, and an additional 2.5-inch mount. Ventilation options include either three 120 mm or two 140 mm vents at the top; two 120 mm along the bottom; and a 120 mm rear exhaust. You can mount a 360 mm or 280 mm radiator along the top, and a 240 mm radiator along the bottom. The case measures 216 mm x 418 mm x 422 mm (WxHxD), weighing 6.1 kg. The company didn't reveal pricing.

Samsung Electronics today unveiled the Galaxy S24 Ultra, Galaxy S24+ and Galaxy S24, unleashing new mobile experiences with Galaxy AI. Galaxy S series leads the way into a new era that will forever change how mobile devices empower users. AI amplifies nearly every experience on Galaxy S24 series, from enabling barrier-free communication with intelligent text and call translations, to maximizing creative freedom with Galaxy's ProVisual Engine, to setting a new standard for search that will change how Galaxy users discover the world around them.

"The Galaxy S24 series transforms our connection with the world and ignites the next decade of mobile innovation," said TM Roh, President and Head of Mobile eXperience (MX) Business at Samsung Electronics. "Galaxy AI is built on our innovation heritage and deep understanding of how people use their phones. We're excited to see how our users around the world empower their everyday lives with Galaxy AI to open up new possibilities."

Transparent LEDs are poised to redefine viewing experiences, making the line between content and reality virtually indistinguishable. Leveraging this groundbreaking technology, Samsung Electronics has upleveled its leading MICRO LED display to expand how users enjoy visual content. The company's Transparent MICRO LED display was unveiled for the first time at Samsung First Look 2024 on January 7 (local time)—ahead of this week's Consumer Electronics Show (CES) 2024, the world's largest consumer electronics and information technology exhibition held in Las Vegas from January 9 to 12.

Combining superior craftsmanship with six years of tireless research and development, this new modular MICRO LED wowed attendees with its futuristic design. The Transparent MICRO LED's crystal-clear, glass-like display has revolutionized the viewing experience and attracted the attention of global consumers.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.

TrendForce's "2024 New Mini LED BLU Display Trend Analysis" report reveals that due to declining demand in consumer electronics, shipments of Mini LED products are expected to decrease to 13.337 million units in 2023. However, the market is projected to rebound in 2024, with shipments estimated at 13.792 million units, and the growth trend is expected to continue through 2027. This decline is part of a larger trend of decreasing prices for Mini LED products, setting the stage for sustained growth in shipments. The report predicts that by 2027, shipments could reach as high as 31.453 million units, with a CAGR of approximately 23.9% from 2023 to 2027.

In the television sector, despite the robust increase in LCD panel prices and the continued high depreciation costs of OLED products, Mini LED component prices are on a downward trend. Now, apart from the relatively small-scale and still early-stage glass-based Mini LEDs, the costs of various other Mini LED TV panels are lower than those of White OLED and QD OLED. Thus, TrendForce maintains that Mini LEDs remain the most effective and optimal solution for enhancing contrast. Against this backdrop, the forecast for Mini LED TVs is positive, with an expected continuous growth in shipment volumes. Shipments are projected to reach 6.21 million units by 2024, marking a 53.5% YoY increase. Moving forward to 2027, shipment volumes are projected to hit 24.4 million units, capturing roughly 12.1% of the overall TV market. The CAGR for this segment from 2023 to 2027 is projected to be around 56.7%.

What's New: Intel today announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver data-centric applications.

"After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development

Innovative Design Elevates Space Efficiency and Thermal Performance in the Compact, Updated Q300L V2 Cooler Master takes things up a few notches from the original MasterBox Q300L mATX case with the launch of the all-new Q300L V2 to bring out the full potential of the mATX form factor. An ongoing commitment to mATX, the innovations on the Q300L V2 are about bringing out efficiencies and delivering superior thermal performance without compromise to space and aesthetics.

LOS ANGELES, Sept. 6, 2023 /PRNewswire-PRWeb/ -- Cooler Master, a global leader in PC components, has launched the Q300L V2 - a revitalized and rejuvenated successor to the original MasterBox Q300L. Taking each feature of its predecessor to new heights, the Q300L V2 boldly redefines the capabilities and performance of mATX cases.

A new series of ENDORFY Arx 700 Air and Arx 700 ARGB PC cases has just been released, developed for gamers, creators, and technology enthusiasts who are looking for maximum cooling potential and convenient access to all internal components. These are the largest cases to date in ENDORFY's portfolio, able to accommodate, among other things, a tall cooling system, 8 fans, and virtually any graphics card currently available on the market.

The ENDORFY Arx 700 is designed to provide the best possible airflow, while ensuring easy and convenient installation and the maximum possible compatibility with air- and water-cooling systems or the latest, large-sized graphics cards. Arx 700 provides maximum cooling potential, wide possibilities of computer configuration, and freedom in the choice of components used.

During Computex 2023, EK Water Blocks, a company known for making all kinds of liquid cooling solutions, showed off a concept case in partnership with InWin. Called 977EK, the concept case is a pre-production model that centers around the idea of a brushed aluminium shell combined with tempered glass panels. The case is made out of the internal structure, and for the outside, the two brushed aluminium sheets meet in the back and at the bottom of the case, removing the visible lines of the 4 mm thick aluminium sheets meeting, improving aesthetics. On the sides, the case carries two tempered glass panels held by thumb screws in the corners. An odd shape perforates the top part of the aluminium sheet.

The internal structure is interesting, as the case is built for water cooling of the system. While the motherboard tray can support any format from Mini-ITX to E-ATX, the tray itself can be rotated, reversed, and removed entirely based on user preference. For radiator setup, the 977EK concept case can accommodate up to 420 mm radiators with 45 mm thickness at both the top and bottom of the chassis. Additionally, the case has support for 350 mm GPU, 7 or 8 PCIe slots (depending on the configuration), a PSU of 160 mm length, and an option for either one 3.5-inch drive bay or two 2.5-inch bays. The final production case will see some changes, as EK notes; however, they won't be too significant.

Gamesense has announced that its new glass mouse pad is available to purchase: "The Sonar is in-stock and ready to ship! Comes in all black or the limited edition Minhwa of Pearl. We expect the Minhwa of Pearl to be sold out very quickly." The standard black edition is currently on offer at $75 (normally $90), and the "Minhwa of Pearl" Limited Launch Edition is priced at $100, but only a small number of these special units remain in stock.

The Sonar pad is generously sized with measurements of 500 x 400 mm - its glass construction has a 4.7 mm material thickness. Competitive multiplayer gamers will enjoy the Sonar's surface properties - its incredible smoothness offers an unrivalled level of movement speed as well as precision. The rounded beveled edges provide maximum comfort and prevent any catching of clothing or skin. The Sonar pad is designed to stay firmly in place thanks to an array of anti-slip rubber feet attached to its base.

[Editor's note: Our in-depth review of Antec Performance 1 FT Case is now live]

With outstanding cooling performance and lots of useful features, Antec Inc. presents the latest flagship of full towers, the new Performance 1 FT. Featuring an airflow-enhanced front panel design, magnetic front filter, and four pre-installed PWM fans, this new chassis provides efficient airflow and great cooling performance. The case is now commercially available from MSRP US$159.99.

The new Antec flagship supports the latest RTX 40 Series GPUs. Considering the increasing demands for CPU and GPU cooling, Antec designed the Performance 1 FT to enhance the air intake, improve the cable routing, and enable an easy installation with various options. The new temperature display function allows to keep control of the components. The display screen located on the case top allows users to check the temperature of the GPU and CPU at a glance. It addresses the need for temperature monitoring without purchasing expensive cooling kits.

Dai Nippon Printing Co., Ltd. (DNP) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on currently available technology. In addition, by adapting our panel manufacturing process, the new product can also support demands for high efficiency and large-scale substrate.

Features
Fine pitch and high reliability
The newly developed GCS includes a TGV necessary for electrically connecting the fine metal wiring configured on the front and back of the glass. It is a Conformal Type glass substrate in which a metal layer is adhered to the side walls of the via. Our new proprietary manufacturing method enhances the adhesion between glass and metal, which was difficult to achieve with conventional technology, to realize fine pitch and high reliability.

Delux is lining up significant upgrades for its top-of-the-line M800PRO model, which is a not too subtle clone of Razer's Viper series of symmetrical-shaped gaming mice. Enthusiasts have placed the M800's chassis as an intermediate between the full-sized Viper and Viper Mini, so it could be considered as a medium-sized equivalent. In order to match the competition in terms of specifications and features, Delux has sought to upgrade the M800PRO's internal hardware and has also made changes to its externals.

Pixart's PAW3395 has been selected as the new optical sensor, which is a significant generational upgrade over the previous M800PRO iteration's PAW3370. Delux has not confirmed, within its specifications list, whether MotionSync will be enabled by default. The upgraded sensor is capable of running this feature, and the vast majority of gaming mouse manufacturers have chosen to enable it. The PAW3395 is rated for a 26,000 maximum DPI, 650 IPS speed, 50 g acceleration and 1000 Hz polling rate. The lift off distance (LOD) is adjustable between heights of 1 and 2 mm.