Thermaltake, a leading PC DIY brand for premium hardware solutions, launches The Tower 250 Mini Tower Chassis, the latest Mini-ITX case in The Tower Series, featuring incredible hardware compatibility, an iconic vertical body design with an octagonal prism shape, and LCD customization. Available in Black, Snow, Matcha Green and Hydrangea Blue finishes, The Tower 250 is built for optimized cooling performance and enhanced capabilities.

Compatible with a wide range of hardware gadgets, The Tower 250 can house a 360 mm high-end GPU, a 360 mm AIO radiator and a standard ATX or SFX power supply up to 200 mm, along with eight 120 mm or five 140 mm fans. Additionally, this Mini-ITX case excels in thermal efficiency with two CT120 fans pre-installed on the top of the case, and room for a 360 mm/280 mm all-in-one CPU cooler on the right. Behind the motherboard tray, two 2.5" SSDs or one 3.5" HDD can be installed, offering maximum storage support.

We are excited to announce the European release of the TRYX LUCA L70. Continuing with the launch of our highly anticipated products showcased at Computex, European PC enthusiasts can finally join the revolution, customers from Germany and UK can place the order on caseking.de and overclockers UK now, pre-orders are available for other regions in Europe.

Product Lineup for Europe
The European release of the TRYX LUCA L70 will feature two color options of black and white.

Chinese giant TCL has officially begun mass production of inkjet-printed OLED displays. The company's subsidiary, TCL CSOT, is leading this initiative with its first product: a 21.6-inch 4K UHD panel designed for professional monitors. The new display boasts a 204 pixels per inch density and coverage of 99% of the DCI-P3 color space. With a maximum brightness of 350 cd/m², the panel is suited for professional applications, with TCL CSOT targeting the medical sector. Additionally, the firm advertises more than 1,000,000:1 contrast ratio. Using the leftovers from JOLED's closure, a Japanese venture that previously attempted similar technology but filed for bankruptcy in 2023, TCL's approach utilizes Gen 5.5 glass substrates measuring 1,300 × 1,500 mm. Notably, it incorporates other materials from the former Japanese pioneer.

Printed OLED technology promises more cost-effective display production compared to traditional methods. Unlike traditional evaporation methods in OLED production that use shadow masks and waste significant amounts of material, inkjet OLED printing allows for precise deposition of organic materials directly onto substrates. This maskless process not only reduces material waste but also minimizes contamination risks, which is crucial given OLEDs' sensitivity to environmental factors. The choice of starting with medical monitors mirrors JOLED's initial strategy from 2017, when they launched a similar 21.6-inch 4K panel for the same market segment. TCL has already announced plans to expand its printed OLED lineup in 2025 with additional display sizes. The success of this venture could potentially revolutionize OLED display manufacturing, making high-quality screens more accessible across various market segments, and we hope, one day, the enthusiast segment. TCL's consumer brand carrying these printed displays will be named APEX.

Antec Inc., a global leader in high-performance computer components and accessories, is proud to announce the launch of the Antec CX600M Trio Mid-Tower Gaming Case. This latest addition to Antec's chassis lineup combines compact design with cutting-edge modern style, delivering a jaw dropping microATX case that's perfect for modern, high-performance PCs.

Triple Transparent View
Display your build through the top, front and side with seamless tempered glass panels. The well-crafted CX600M Trio ARGB provides you with the ultimate unobstructed view.

If you want a stylishly modern glass look for your hardware, then the AK6 RGB is just what you need! This eye-catching ATX case not only puts the focus on the hardware, but also on a good airflow. This is thanks to four pre-installed addressable RGB fans along with a specially designed intake of air through a side panel. In addition, the AK6 RGB is equipped with modern connectivity, broad BTF mainboard compatibility, and plenty of space for components.

Stylish Glass Look
A special highlight of the AK6 RGB is the modern look of the tempered glass, which forms a continuous window around the front and side of the case.

Nikon Corporation (Nikon) is developing a digital lithography system with resolution of one micron (L/S) and high productivity for advanced semiconductor packaging applications. This product is scheduled to be released in Nikon's fiscal year 2026.

The rapid adoption of artificial intelligence (AI) technology is driving demand for integrated circuits (ICs) for data centers. In the field of advanced packaging, including chiplets, the size of packages is increasing with the miniaturization of wiring patterns. This will lead to heightened demand for panel level packages that use glass and other materials suitable for larger packages, requiring exposure equipment that combines high resolution with a large exposure area. To meet these demands, Nikon is developing digital exposure equipment that combines the high-resolution technology of its semiconductor lithography systems, which has been cultivated over many decades, along with the excellent productivity made possible with the multi-lens technology of its FPD lithography systems.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, has introduced the latest model to its O11 series of PC cases with the O11 Vision Compact. Developed in collaboration with PC Master Race (PCMR), the O11 Vision Compact is a refinement of the previous O11 Vision. It maintains the 3-sided tempered glass showcase style while adding a top mesh panel and bracket for top cooling options. With a fixed motherboard tray and a more compact design, the O11 Vision Compact can support back-connect ATX motherboards. It features a large grommet passthrough for AIO radiators to connect to a side-mounted radiator in the second chamber. The O11 Vision Compact even integrates a rear passthrough for an internal IPS display, which can be easily mounted above the motherboard. The O11 Vision Compact is available in black and white at an MSRP of $119.99.

Two Configurations
The O11 Vision Compact now includes a top mesh option for excellent airflow in addition to the top glass configuration. The top glass mode provides a completely unobstructed view of the system with top, front, and left-side tempered glass panels. The magnetic mounting key in the top left corner performs double duty, securing the mesh configuration top bracket to the front glass, and with top glass, holding the three glass panels together with 35 kg of supporting force.

[Editor's note: Our in-depth review of the Lian Li O11 Vision Compact is now live]

Corning Incorporated, one of the world's leading innovators in glass, ceramic, and materials science, today unveiled Corning EXTREME ULE Glass, a next-generation material that will support chip manufacturers in meeting the rapidly growing demand for advanced and intelligent technologies. The new material will help chipmakers improve photomasks - the stencils for chip design - which are critical for the mass production of today's most advanced and cost-efficient microchips.

Corning designed EXTREME ULE Glass to withstand the highest intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.

Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ECX350F, a 0.44-type Full HD resolution OLED Microdisplay that combines the industry's smallest 5.1 µm pixels (approximately 5,000 ppi) with the industry's highest brightness of up to 10,000 cd/m².

The ECX350F is an OLED Microdisplay designed for use in augmented reality (AR) glasses, an application which demands a thin, lightweight form factor without compromising visibility. Adopting a novel OLED structure and microlenses, the microdisplay enhances pixel light emission despite its diminutive size. This innovation allows for Full HD resolution within a compact 0.44-inch panel while delivering a peak brightness of 10,000 cd/m² — approximately double that of the conventional model. This new product represents a breakthrough that addresses the longstanding challenge of delivering high brightness with small pixels.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to introduce the latest additions to The Tower 300 Series: the Limestone and Gravel Sand Micro Tower Chassis. In celebration of the autumn season, these new colors bring a sophisticated touch to the already popular Tower 300 series, offering enthusiasts a fresh and stylish option for their builds.

The new Limestone edition brings a sophisticated, soft gray tone, while the Gravel Sand version showcases a warm, earthy beige. Both colors are designed to complement and enhance any setup, adding a modern and refined touch to your workspace or gaming area.

E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers.

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, HYAWEI OPTRONICS for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and other key component suppliers such as HIWIN, HIWIN MIKROSYSTEM, Keyence Taiwan, Mirle Group, ACE PILLAR CHYI DING), and Coherent.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.

SilverStone today introduced the FARA 514X and FARA 314X tower-type cases designed for space and high air-flow. The FARA 314X is a Micro-ATX tower, while the FARA 514X is an ATX mid-tower. Both cases are characterized by their mesh front intakes, and large included 140 mm intake fans, besides an included 120 mm exhaust fan); a tempered glass left side-panel, and room for graphics cards up to 36.5 cm in length, along with CPU coolers up to 17.3 cm in height. Both cases feature a horizontally partitioned layout, with the upper compartment holding the spacious motherboard tray, and the lower one with a PSU with up to 21.7 cm of room for the spaghetti.

The FARA 314X (model: SST-FA312X-BG) measures 220 mm x 410 mm x 412.4 mm (WxHxD), dry-weighing 5.76 kg. It offers 4 expansion slots, and supports Micro-ATX (or smaller) motherboard form-factors. Fan mounts include either three 120 mm or two 140 mm front intakes, which hold onto the two included 140 mm ARGB fans; and two 140/120 mm top exhausts, besides the obligatory 120 mm rear exhaust. Your radiator options include a 280 mm x 140 mm (or smaller) along the front intake, and another 280 mm x 140 mm (or smaller) along the top exhaust. The only drive bay is a 3.5-inch/2.5-inch in the bottom compartment, and there are three aditional 2.5-inch mounts along the motherboard tray. Front-panel connectivity includes two USB 3.x type-A, a 3.5 mm audio jacks.

GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the C500 PANORAMIC STEALTH mid-tower gaming case. The C500 PANORAMIC STEALTH features panoramic tempered glass design on the front and side panels, the 270 degree panoramic viewing angle makes the internal rig and RGB lighting perfectly display at every details, which let the devices appear as if it were artworks in a glass showcase, exuding ultimate craftsmanship and aesthetics, while showcasing the components carefully selected by users. In addition, the C500 PANORAMIC STEALTH provides both black and white colors, the users can depend on their preferences, rig styles, and user scenarios to choose the color, and create the fantastic PC by their own.

Enjoy with 270-degree Panoramic View
To provide users with an exceptional panoramic view, the front and side panels of the case are designed with full-size tempered glass, achieving a complete 270-degree. This allows the interior rig and RGB equipment of the case to be perfectly displayed. Additionally, the no-drill design of both glass panels effectively reduces the risk of damage, enhancing the overall aesthetics of the entire PC and providing safety during disassembly, thereby extending the product's lifespan.

AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and mechanical strength. These characteristics make them well-suited for advanced SiPs containing multiple chiplets, especially in data center applications where performance and durability are critical. The adoption of glass substrates aligns with the industry's broader trend towards more complex chip designs. As leading-edge process technologies become increasingly expensive and yield gains diminish, manufacturers turn to multi-chiplet designs to improve performance. AMD's current EPYC server processors already incorporate up to 13 chiplets, while its Instinct AI accelerators feature 22 pieces of silicon. A more extreme testament is Intel's Ponte Vecchio, which utilized 63 tiles in a single package.

Glass substrates could enable AMD to create even more complex designs without relying on costly interposers, potentially reducing overall production expenses. This technology could further boost the performance of AI and HPC accelerators, which are a growing market and require constant innovation. The glass substrate market is heating up, with major players like Intel, Samsung, and LG Innotek also investing heavily in this technology. Market projections suggest explosive growth, from $23 million in 2024 to $4.2 billion by 2034. Last year, Intel committed to investing up to 1.3 trillion Won (almost one billion USD) to start applying glass substrates to its processors by 2028. Everything suggests that glass substrates are the future of chip design, and we await to see first high-volume production designs.

FlexEnable, the leader in the development and production of flexible organic electronics for active optics and displays, today announced that the world's first mass-produced consumer product incorporating organic transistor technology has started shipping. The device, called Ledger Stax, is a secure crypto wallet developed by French company and market-leader Ledger. FlexEnable partnered with display manufacturing companies DKE (Shanghai) and Giantplus (Taiwan) to realise Ledger's design for a credit card-sized product with an E Ink display uniquely wrapped around a 180-degree bend.

Ledger Stax features a display radius of curvature never before achieved in an e-paper display product, made possible by the use of highly flexible organic thin-film transistors (OTFTs), comprising organic materials and process IP developed, supplied and licensed by FlexEnable.

ENERMAX unveiled a couple of new PC cases at the Computex 2024 show, including the Air240 mid-tower case, the Pano270 and the Pano D58. The new cases feature enhanced cooling performance, modular internal structure for easier installation and cable management, as well as support for motherboards with back connectors.

The new ENERMAX Air240 is a mid-tower case supporting up to ATX motherboards, and featuring standard three-side mesh panel design, which should enhance overall cooling performance, according to ENERMAX. The Air240 is pretty much a standard PC case, but it does have a unique feature which allows the PSU compartment baffle to be redirected in order to provide more airflow to the graphics card. The new ENERMAX Pano270 and Pano D58 PC cases certainly attracted a lot of attention as these are following the current design trend with a 270-degree curved glass panel, which provides a panoramic view of key hardware. The Pano270 supports motherboards with backside connectors, and while it is a smaller case that supports up to a Micro-ATX motherboards, it still supports up to 360 mm AIO coolers and up to nine fans. It also has 37 mm of cable management space, and can support up to 170 mm tall CPU air coolers. The Pano D58 is a slightly different and bigger counterpart and while it has the same panoramic glass, it isn't a curved one. Of course, since it is bigger, it supports ATX motherboards, up to 360 mm AIO coolers on the side and top, and up to nine fans. It supports up to 250 mm long PSUs, up to 420 mm long GPUs, and up to 180 mm tall CPU coolers. All three CPU cases should be available soon.

When we think of InWin, we think of their Signature PC chassis - an equally long-lived and impressively designed line of exclusive products that have garnered appreciation, establishing InWin among top manufacturers. This year, at Computex 2024, InWin unveils its 11th Signature Series chassis, taking a standard case and making it unique. The main visual highlight is the 180-degree curved glass panel (the largest we've seen on a PC), which blends seamlessly with the aluminium frame into a sleek design.

The chassis is a full tower that can accommodate E-ATX, ATX, Micro-ATX, and Mini-ITX motherboards, including support for ASUS BTF and MSI Project Zero Series Back-Connector motherboards. It offers 7x PCI-E expansion slots, 2x 2.5" internal drive bays, 1x USB 3.2 Gen 2 x 2 Type-C port, 2x USB 3.2 Gen 1 ports, and HD audio combo ports. For cooling, it is compatible with 120 mm fans (3 at the front, 1 in the rear), and a water cooling 360 mm x 65 mm radiator could also be fitted in the front. No information regarding exact availability and pricing has been provided at this moment.

Rokid has announced the launch of its new AR device, the Rokid AR Lite, on Kickstarter, marking the first AR glasses powered by the Snapdragon 6 Gen 1 Mobile Platform. This integration brings the power and versatility of a mid-range smartphone into an AR device, opening up a new chapter in the industry.

Priced at USD $749, with early backers able to purchase it for USD $499, the Rokid AR Lite offers an accessible entry point into advanced AR technology. The versatility of Rokid AR Lite makes it suitable for various activities, including entertainment, work, and productivity tasks. It supports video conferencing, document editing, navigation, and photo-taking, enhancing user experiences across different scenarios.

MICLEDI Microdisplays today announced a first closing of its Series A funding round with participation from imec.xpand, PMV, imec, KBC and SFPIM demonstrating strong support for the company's value proposition and commercial and technological progress achieved in the seed round. Series A follows a significant seed round award and additional non-dilutive funding in the form of grants and other vehicles from VLAIO. This brings the company's total funding to date to nearly $30 million.

"The company's achievements during this seed round have been astounding," said Sean Lord, CEO of MICLEDI. "Our door is open to engagements with some of the world's largest and most innovative electronic product manufacturing companies, most of whom are working on their own internal development projects for augmented reality (AR) displays in such diverse use cases as smart-wearable devices and automotive HUDs. This level of total funding to date is almost unheard of for a four-year-old startup."

ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

ZALMAN today introduced the P10 series Micro-ATX mini-tower case, which comes in black and white variants. A striking design feature with the case is its pillarless front-left corner, where the front- and left tempered glass panels meet. You still get a glass edge, this isn't a single piece glass panel. Inside, the case features a horizontally partitioned layout, with the bottom portion only accessible by removing the right panel, which is mostly perforated for good airflow. On the left- and front, this portion is completely walled off, but has some side-facing vents for passive ventilation for the PSU bay.

The motherboard bay of the ZALMAN P10 offers maximum clearance of 38.2 cm for graphics cards, and 17.3 cm for CPU coolers. There are 5 expansion slots, and a graphics card reinforcement that can be adjusted to fit the thickness of your graphics card. It counteracts PCB bending of graphics cards over time. Storage options include a single 3.5-inch bay, and an additional 2.5-inch mount. Ventilation options include either three 120 mm or two 140 mm vents at the top; two 120 mm along the bottom; and a 120 mm rear exhaust. You can mount a 360 mm or 280 mm radiator along the top, and a 240 mm radiator along the bottom. The case measures 216 mm x 418 mm x 422 mm (WxHxD), weighing 6.1 kg. The company didn't reveal pricing.

Samsung Electronics today unveiled the Galaxy S24 Ultra, Galaxy S24+ and Galaxy S24, unleashing new mobile experiences with Galaxy AI. Galaxy S series leads the way into a new era that will forever change how mobile devices empower users. AI amplifies nearly every experience on Galaxy S24 series, from enabling barrier-free communication with intelligent text and call translations, to maximizing creative freedom with Galaxy's ProVisual Engine, to setting a new standard for search that will change how Galaxy users discover the world around them.

"The Galaxy S24 series transforms our connection with the world and ignites the next decade of mobile innovation," said TM Roh, President and Head of Mobile eXperience (MX) Business at Samsung Electronics. "Galaxy AI is built on our innovation heritage and deep understanding of how people use their phones. We're excited to see how our users around the world empower their everyday lives with Galaxy AI to open up new possibilities."

Transparent LEDs are poised to redefine viewing experiences, making the line between content and reality virtually indistinguishable. Leveraging this groundbreaking technology, Samsung Electronics has upleveled its leading MICRO LED display to expand how users enjoy visual content. The company's Transparent MICRO LED display was unveiled for the first time at Samsung First Look 2024 on January 7 (local time)—ahead of this week's Consumer Electronics Show (CES) 2024, the world's largest consumer electronics and information technology exhibition held in Las Vegas from January 9 to 12.

Combining superior craftsmanship with six years of tireless research and development, this new modular MICRO LED wowed attendees with its futuristic design. The Transparent MICRO LED's crystal-clear, glass-like display has revolutionized the viewing experience and attracted the attention of global consumers.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.