Intel today announced that it is among the leading U.S. quantum technology companies included in Q-NEXT, one of five new national quantum research centers established by the White House Office of Science and Technology Policy (OSTP) and the U.S. Department of Energy (DOE). Q-NEXT, National Quantum Information Science Research Center, is led by Argonne National Laboratory and brings together world-class researchers from national laboratories, universities and leading technology companies to ensure U.S. scientific and economic leadership in this advancing field. The collaboration will enable Intel to actively contribute to the industry's efforts on quantum computing.

"Advancing quantum practicality will be a team sport across the ecosystem, and our partnership with Argonne National Laboratory on Q-NEXT will enable us to bring our unique areas of expertise to this cross-industry effort to drive meaningful progress in the field. At Intel, we are taking a broad view of quantum research that spans hardware and software with a singular focus on getting quantum out of labs and into the real world, where it can solve real problems," said James Clarke, director of Quantum Hardware at Intel.

With more people gaming than ever before, Intel is teaming up with leading PC manufacturers and retailers to offer some of the best PC deals of the year. The third-annual Intel Gamer Days kicks off Aug. 28 and continues through Sept. 6. Also, for the first time, Intel is taking Gamer Days international with deals open to gamers in 10 countries. This year, Intel pulled out all the stops in building the Intel Gamer Days showcase PC. The experienced system modding team at PCjunkieMods showed what they could do with this unbelievable gaming and streaming rig. This one-of-a-kind creation contains not one, but two total PCs - one fully devoted to gaming, and another built for streaming.

Inside, you'll find fully custom water cooling and 10th Gen Intel Core i9-10900K and 10th Gen Intel Core i7-10700K processors. Two Intel Optane 660p SSDs keep storage snappy while providing plenty of capacity. A custom paint job and etching ensure that this is a truly unique PC. SteelSeries peripherals complete the bundle.

MSI today rolled out the MAG B460 Torpedo, a Socket LGA1200 motherboard based on the Intel B460 chipset. This marks the debut of the new "Torpedo" brand extension that's part of the MSI Arsenal Gaming (MAG) product family, positioned a notch below the MAG Tomahawk. MSI has been giving the Tomahawk extension value additions over the past few generations, pushing its typical pricing up, along with features such as dual Ethernet, rear I/O shroud, etc. The MAG B460 Torpedo keeps things simple within the ATX form-factor. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and uses a 13-phase VRM to power the CPU. The VRM heatsinks appear slightly smaller than the ones on the MAG B460 Tomahawk. The tiny heatsink over the PCH is hard to miss, too.

Expansion slots on the MSI MAG B460 Torpedo include one PCI-Express 3.0 x16 reinforced slot wired to the CPU, a PCI-Express 3.0 x16 (electrical x4) slot wired to the B460 PCH, and two other PCIe x1 slots. Storage connectivity includes two M.2 NVMe slots, both PCI-Express 3.0 x4 wiring, one of which includes a heatsink; and six SATA 6 Gbps ports. Networking features one 2.5 GbE interface driven by a Realtek 8125B controller. The onboard audio solution uses a Realtek ALC1200 codec with audio grade capacitors, 8-channel jacks, and headphones amp. As part of the CoreBoost feature set, you get to eke out more performance from your non-K 10th Gen Core processors by relaxing power limits. MSI is pricing the MAG B460 Torpedo at USD $109.99, about $30 cheaper than the Tomahawk.

Intel Corporation today announced it is entering into accelerated share repurchase (ASR) agreements to repurchase an aggregate of $10 billion of Intel's common stock. Following completion of these agreements, Intel will have repurchased a total of approximately $17.6 billion in shares as part of the planned $20 billion share repurchases announced in October 2019.

"We achieved record financial results in the first half of 2020 and raised our full-year outlook as customers rely on Intel technology for delivering critical services and enabling people to work, learn and stay connected. As the ongoing growth of data fuels demand for Intel products to process, move and store, we are confident in our multiyear plan to deliver leadership products," said Intel CEO Bob Swan. "While the macro-economic environment remains uncertain, Intel shares are currently trading well below our intrinsic valuation, and we believe these repurchases are prudent at this time."

Under the terms of the ASR agreements, Intel will receive an initial share delivery of approximately 166 million shares, with the final settlement scheduled to occur by the end of 2020. The final number of shares to be repurchased by Intel will be based on the volume-weighted average stock price of Intel's common stock during the term of the agreements, less a discount and subject to adjustments.

Intel recently announced its 10th Gen Core KA line of Socket LGA1200 desktop processors that are co-branded by Marvel's Avengers, complete with fancy retail channel packaging that's sure to attract collectors from the Marvel fanbase. Turns out, that the box doesn't actually include the game by Square Enix, as discovered by momomo_us. A fine-print on the bottom left corner of the front face of the retail box reads "Game Not Included." All you really do get is a fancy box that's been designed by artist Tristan Eaton. Some retailers may include plushies such as the one pictured below, which obviously cost less than a copy of the game. Marvel's Avengers (the game) releases on September 4, 2020, and is up for pre-order on Steam for $59.99.

Lenovo unveiled five new Yoga consumer laptops combining style, power and portability. Designed to deliver premium experiences and refined craftsmanship through bold innovation, Lenovo Yoga is our top-of-the-line consumer PC sub-brand at the forefront of making smarter technology an everyday reality for the most discerning consumers. So, whether you want to binge videos, enjoy the summer's hottest tunes, or need a fully-equipped multimedia experience as you create content, you can do it all and more with powerful Windows 10 performance and a range of smart features including Alexa, optimized battery life, rapid charging, and super-fast Wi-Fi 6.

Building on successful thin and light laptops to create a better interconnected world takes attention to design details and offering consumers their choice of the latest processors. The ultra-slim Lenovo Yoga Slim 7i5 (13-inch), next-gen Lenovo Yoga Slim 7i Pro (14-inch), and new portable 2-in-1 Lenovo Yoga 7i5 laptop available in 14-inch and 15.6-inch, feature the next-gen Intel Core processors (coming soon) and are designed for people who want high performance, immersive visuals, great connectivity, and long-lasting battery life so they don't have to feel anchored to an outlet. The 14-inch sleek Lenovo Yoga Slim 7 Pro is packed with performance too, as is our first-gen Lenovo Yoga 6 (13.3-inch) convertible laptop—both offering AMD Ryzen 4000 Series Mobile Processor options for amazing responsiveness to fuel creative and productivity tasks, even on-the-go.

Raja Koduri, Intel's chief architect and senior vice president of Intel's discrete graphics division, has today held a talk at HotChips 32, the latest online conference of 2020, that shows off the latest architectural advancements in the semiconductor industry. So Intel has prepared two talks, one about Ice Lake-SP server CPUs and one about Intel's efforts in the upcoming graphics card launch. So what has Intel been working on the whole time? Raja Koduri took over the talk and has benchmarked the upcoming GPU and recorded how much raw power the GPUs posses, possibly counting in PetaFLOPs.

When Mr. Koduri got to talk, he pulled the 4-tile Xe HP GPU out of his pocket and showed for the first time how the chip looks. And it is one big chip. Featuring 4 tiles, the GPU represents Intel's fastest and biggest variant of Xe HP GPUs. The benchmark Intel ran was made to show off scaling on the Xe architecture and how the increase in the number of tiles results in a scalable increase in performance. Running on a single tile, the GPU managed to develop the performance of 10588 GFLOPs or around 10.588 TeraFLOPs. When there are two tiles, the performance scales almost perfectly at 21161 GFLOPS (21.161 TeraFLOPs) for 1.999X improvement. At four tiles the GPU achieves 3.993 times scaling and scores 41908 GFLOPs resulting in 41.908 TeraFLOPS, all measured in single-precision FP32.

Intel in the opening presentation of the Hot Chips 32 virtual conference detailed its next-generation Xeon Scalable "Ice Lake-SP" enterprise processor. Built on the company's 10 nm silicon fabrication process, "Ice Lake-SP" sees the first non-client and non-mobile deployment of the company's new "Sunny Cove" CPU core that introduces higher IPC than the "Skylake" core that's been powering Intel microarchitectures since 2015. While the "Sunny Cove" core itself is largely unchanged from its implementation in 10th Gen Core "Ice Lake-U" mobile processors, it conforms to the cache hierarchy and tile silicon topology of Intel's enterprise chips.

The "Ice Lake-SP" die Intel talked about in its Hot Chips 32 presentation had 28 cores. The "Sunny Cove" CPU core is configured with the same 48 KB L1D cache as its client-segment implementation, but a much larger 1280 KB (1.25 MB) dedicated L2 cache. The core also receives a second fused multiply/add (FMA-512) unit, which the client-segment implementation lacks. It also receives a handful new instruction sets exclusive to the enterprise segment, including AVX-512 VPMADD52, Vector-AES, Vector Carry-less Multiply, GFNI, SHA-NI, Vector POPCNT, Bit Shuffle, and Vector BMI. In one of the slides, Intel also detailed the performance uplifts from the new instructions compared to "Cascade Lake-SP".

We previously reported on the leaked listings for the upcoming Intel KA series processors from a Vietnamese retailer. Intel has now officially unveiled the chips and provided some extra details on the collaboration. The Intel KA series of processors are identical to their K series siblings apart from the Marvel Avengers box branding. Intel is reportedly launching five models from their i5, i7, and i9 lineups the Intel Core i5-10600KA, i7-10700KA, i9-10850KA, and i9-10900KA. The box artwork was designed by painter/muralist Tristan Eaton, Intel didn't announce pricing or availability for the lineup.

Intel on Thursday at its 2020 Architecture Day event announced a high performance gaming variant of its Xe graphics architecture, which it calls Xe HPG. The Xe architecture is designed to scale between tiny iGPUs and mobile discrete GPUs as Xe LP, up to scalar compute processors under Xe HP, and beyond to HPCs and supercomputers, under Xe HPC. The combination of the client graphics feature-set of Xe LP, with the scale of Xe HP, results in Xe HPG. Intel is designing Xe HPG for a third-party semiconductor foundry, and hopes to debut it in 2021.

In our older graphics detailing the Xe LP, we tried to explain just how easy it is for Intel scale up the iGPU to a discrete GPU SoC. This is done by simply dialing up the Xe slices, and dropping in dGPU ancillaries such as a PCI-Express host interface and memory controllers for the prevalent client-segment discrete graphics, namely GDDR6. There will be additional components, such as ray-tracing hardware. Intel is gunning for DirectX 12 Ultimate logo compliance, and ray-tracing forms a big part of that.

A lot is riding for Intel on its 11th Gen Core "Tiger Lake" system-on-chip (SoC), which will launch exclusively on mobile platforms, hoping to dominate the 7 W thru 15 W ultraportable form-factors in 2020, while eventually scaling up to the 25 W thru 45 W H-segment form-factors in 2021, with a variant that is rumored to double core-counts. The chip is built on Intel's new 10 nm SuperFin silicon fabrication node that enables a double digit percentage energy efficiency growth over 10 nm, allowing Intel to significantly dial up clock speeds without impacting the power envelope. The CPU and iGPU make up the two key components of the "Tiger Lake" SoC.

The CPU component on the "Tiger Lake" processors that launch in a few weeks from now features four "Willow Cove" CPU cores. Coupled with HyperThreading, this ends up being a 4-core/8-thread setup, although much of Intel's innovation is in giving these cores significant IPC increases over the "Skylake" core powering "Comet Lake" processors, and compared to the "Sunny Cove" cores powering "Ice Lake" a minor IPC (although major net performance increase from clock speeds). The "Willow Cove" CPU core appears to be a derivative of the "Sunny Cove" core, designed to take advantage of the 10 nm SuperFin node, along with three key innovations.

Intel on Thursday made several technological disclosures about its latest silicon fabrication process, the 10 nm SuperFin. With this, the company is changing the nomenclature of its node refinements, away from the ## nm++ naming scheme (with each "+" denoting a refinement, or internode), to a more descriptive naming scheme. The new 10 nm SuperFin node is the first refinement of the company's 10 nm node that debuted with the company's 10th Gen Core "Ice Lake" processors last year, and promises energy efficiency in the ballpark of 7 nm-class nodes by competitors TSMC and Samsung. While past generations of internodes (refinements) delivered energy efficiency improvements of around 3-5%, 10 nm SuperFin offers the kind of improvements expected from a brand new node, according to Intel.

The 10 nm SuperFin node is composed of two key innovations, the SuperMIM capacitor and a redesigned FinFET transistor. The new SuperMIM (metal insulator metal) capacitor offers a 5x increase in capacitance compared to devices in this class. The redesigned FinFET introduces a new barrier that reduces via resistance by 30%. Combined, the 10 nm SuperFin node affords chips a V/F curve comparable to a die-shrink to a whole new silicon fabrication node, without any change in transistor density. The first product built on 10 nm SuperFin is the upcoming Core "Tiger Lake" processor addressing the client-segment. The company is already working on enhancements of this node relevant for data-center processors.

Lenovo Group (HKSE: 992) PINK SHEETS: LNVGY) today announced Group revenue in the first quarter of US $13.3 billion, up almost 7% year-on-year (up 10% year-on-year excluding currency impact). Pre-tax income grew 38% compared to the same quarter a year earlier, to US $332 million, while net income also increased by 31% year-on-year to US$213 million. Basic earnings per share for the first quarter were 1.80 US cents or 13.95 HK cents.

"Our outstanding performance last quarter proves that Lenovo has quickly regained momentum from the impact of the pandemic and is capturing the new opportunities emerging from remote working, education and accelerated digitalization," said Yang Yuanqing, Lenovo Chairman and CEO. "While the world continues to face challenges, Lenovo is focused on delivering sustainable growth through our core businesses as well as the new services and solutions opportunities presented by our service-led intelligent transformation."

Intel has been focusing its resources on data center and high-performance computing lately and the company has made some interesting products. Today, Intel has released its latest creation - mOS operating system. Created as a research project, Intel has made an OS made for some extreme-scale HPC systems, meaning that the OS is created for hyper scalers and ones alike. The goal of mOS is to deliver a high-performance environment for software with low-noise, scalability, and the concept of lightweight kernels (LWK) that manage the system.. Being based on the Linux kernel, the OS is essentially another distribution, however, it has been modified so it fits the HPC ecosystem the best way. The mOS is a product in the pre-alpha phase, however, it can already be used in supercomputers like ASCI Red, IBM Blue Gene, and others. Intel is aiming to develop a stable release by the time the Aurora exascale system is ready so it can deploy mOS there.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the QXG-2G1T-I225 PCIe network card. Providing single-port 2.5GBASE-T connectivity that supports 2.5G, 1G, 100 Mbps and 10 Mbps network speeds, the QXG-2G1T-I225 is a PCIe 2.0 x1 card that can be installed in a QNAP NAS or a Windows /Linux PC. Existing CAT 5e cables can be used with the QXG-2G1T-I225 to provide an immediate upgrade to 2.5 GbE networking. The QXG-2G1T-I225 also supports Windows Server 2019 and provides efficient server management with support for Intel Teaming (Link aggregation), PXE, Intel AMT, Wake on LAN, and VLAN.

"The QXG-2G1T-I225 represents QNAP's commitment to providing affordable 2.5 GbE solutions. By using existing CAT 5e cables, users can immediately benefit from 2.5 GbE by pairing their QXG-2G1T-I225 with a 2.5 GbE switch and NAS." said Stanley Huang, Product Manager of QNAP, adding "2.5 GbE provides immediate benefits to both home and business users across a wide range of applications - including gaming, multimedia, virtualization, backup, and general everyday usage. QNAP's 2.5 GbE solutions represent the easiest and most wallet-friendly way to adopt high-speed networking."

Intel appears to have every intention of addressing the performance gaming segment with its Xe graphics architecture. According to information leaked to the web by VideoCardz, Xe-HPG (high performance gaming?) represents a product vertical dedicated to the gaming segment. Among the other verticals are Xe-HPC (high performance compute). The Xe-HPG graphics architecture is being developed for a 2021 market launch. It will feature all the client-segment staples, including a conventional PCI-Express interface, and GDDR6 memory instead of HBM. Intel may also eye DirectX 12 Ultimate logo compliance. Intel's Xe discrete GPU and scalar processor development is already de-coupled with Intel's foundry business development, and so the company could contract external foundries to manufacture these chips.

As for specs, it is learned that each Xe-HP "tile" (a silicon die sub-unit that adds up in MCMs for higher tiers of Xe scalar processors), features 512 execution units (EUs). Compare this to the Xe-LP iGPU solution found in the upcoming "Tiger Lake" processor, which has 96. Intel has been able to design scalar processors with up to four tiles, adding up to 2,048 EUs. It remains to be seen if each tile on the scalar processors also include the raster hardware needed for the silicon to function as a GPU. The number of tiles on Xe-HPG are not known, but it reportedly features GDDR6 memory, and so the tile could be a variation of the Xe-HP. Intel SVP and technology head Raja Koduri is expected to detail the near-future of Intel architectures at a virtual event later today, and Xe-HPG is expected to come up.

Intel's upcoming 11th Generation Core "Tiger Lake" processors introduce the company's first major refinement of its 10 nanometer silicon fabrication node, dubbed 10 nm+. The node introduces two key features that work to improve the power characteristics of the silicon, allowing Intel to yield more performance without raising power/thermals over the previous generation. VideoCardz scored a major scoop on 10 nm+, including the introduction of the new SuperFin transistor, and SuperMIM capacitor.

SuperFin is a redesigned FinFET, a nanoscale transistor, which offers increased gate pitch, yielding higher drive current, improved channel mobility, and an improved source/drain, yielding in lower resistance. The other key component of 10 nm+ is SuperMIM, delivering a 5 times increase in metal-insulator-metal capacitance. Intel is yet to put out energy efficiency gain numbers for the process, but promises a "dramatic increase in frequency" over the previous generation, which lines up with leaks of the Core i7-1185G7 shipping with significantly higher clock speeds.

Intel Optane persistent memory (PMem), in combination with Intel's open-source distributed asynchronous object storage (DAOS) solution, sets a new world record, soaring to the top of the Virtual Institute for I/O IO-500 list. With just 30 servers of Intel Optane PMem, Intel's DAOS solution defeated today's best supercomputers and now ranks No. 1 for file system performance worldwide. These results validate the solution's delivery as having the most performance of any distributed storage today. They also demonstrate how Intel is truly changing the storage paradigm by providing customers the persistence of disk storage with the fine-grained and low-latency data access of memory in its Intel Optane PMem product.

"The recent IO-500 results for DAOS demonstrate the continuing maturity of the software's functionality enabled by a well-managed code development and testing process. The collaborative development program will continue to deliver additional capabilities for DAOS in support of Argonne's upcoming exascale system, Aurora," said Gordon McPheeters, HPC systems administration specialist at the Argonne Leadership Computing Facility.

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

"Global demand for storage and memory in the data center is increasing as AI-powered business intelligence and data processing growth continues", said Youjong Kang, VP of Growth Strategy, SK hynix. "SiFive is well-positioned to grow with opportunities created from data center, enterprise, storage and networking requirements for workload-focused processor IP."

Database spelunker TUM_APISAK has brought to the surface another revealing entry regarding Intel's upcoming Tiger Lake CPUs. Discovered in SiSoftware's database entries, the Intel Core i3-1115G4 has reared its head sporting a mightily impressive base core clock set at 3.0 GHz. Compare this to the Ice Lake-based Core i3-1005G1, which while making use of the 10 nm process itself, only managed to run on a 1.2 GHz base clock. This increase speaks to Intel's refinement of the 10 nm manufacturing process (even sporting its well-known woes) and the usage of the new Willow Cove architecture core that will power the i3-1115G4.

Whilst still being a 2-core, 4-thread processor (ehrm), the new i3-1115G4 based on Tiger Lake sports a number of improvements on both its CPU and GPU core design. The new architectural improvements baked into Willow Cove are aided by an L3 cache boost from 4 MB to 6 MB, and its GPU is expected to make use of Intel's Xe graphics, featuring 96 EUs (compared to the 64 EUs in Ice Lake's 12th Gen graphics). It remains to be seen exactly how competitive Tiger Lake will be compared to AMD's current (and future) Ryzen offerings, but these are some encouraging leaks.

Device IDs of Intel's upcoming line of standalone USB 4.0 host controllers leaked to the web, courtesy Hardware Leaks (@_rogame). The controller possibly comes in three variants, bearing device IDs 0x9A1B, 0x9A1D, and 0x9A13. The alleged Intel confidential document screengrab speaks of USB 4.0 and USB 3.2 support (no mention of USB 2.0/1.1), and USB Power Delivery 3.0.

With USB 4.0, the USB-IF (USB Implementers Forum, or the special interest group behind USB), appears to want to standardize the USB type-C connector, eventually phasing out the type-A connector. To that effect, the document leaves out mention of USB 2.0/1.1 backwards compatibility. USB 4.0 debuts with an interface bandwidth of 40 Gbps, or 8 times that of USB 3.0, or over 80 times that of USB 2.0.

Intel designed an Apple-exclusive Core i9-10910 10-core processor for its new-generation iMac, with an interesting set of specs. The chip has a base frequency of 3.60 GHz - much higher than the 2.90 GHz of the i9-10900 - but a lower max boost frequency of 5.00 GHz (against 5.20 GHz TVB max of the i9-10900). The TDP of the new chip is rumored to be higher, at 95 W, giving its boosting algorithm more breathing room. Leakbench, a twitter handle that tracks interesting submissions to the Geekbench online database, fished out one of the first Geekbench 5 submissions of the i9-10910.

The i9-10910 serves up 6.9% higher single-threaded performance than the i9-10900. It however, falls behind the i9-10900 in multi-threaded performance by 9.6%. These results as surprising. Normally, we'd expect the i9-10910 to have a lower single-threaded performance and higher multi-threaded performance. As its max boost frequency is lower, and the i9-10900 is able to run single-threaded workloads on its favored cores at frequencies of up to 5.20 GHz (as opposed to 5.00 GHz on the i9-10910). On the other hand, with a higher TDP (higher PL1), the i9-10910 has more power budget for its cores to sustain higher boost states, which should give it a slight edge over the i9-10900 in multi-threaded performance. The raison d'être of the i9-10910 appears to be in giving Apple a variation of the 10-core "Comet Lake" die that macOS can make the most of, as it probably lacks optimization for Turbo Boost Max 3.0 and Thermal Velocity Boost.

The US is one of the leading countries when it comes to chip design technologies and know-how; however, when it comes to actual manufacturing those designs, it's fallen from grace in recent years. Once the leader in both design and manufacturing, nowadays the US can only claim some 12% of the world's semiconductor production. The rest of it is mainly produced in Asia, where TSMC stands as the industry juggernaut, with other companies stretching across Taiwan, Japan, and most recently (and surging) China - the country has more than doubled its 300 mm manufacturing sites since 2017. This places some strain on the US' dependence from foreign shipments; and the country is looking to bridge that gap in its perceived national interests by investing heavily in silicon manufacturing to be brought back to the country. Recent slippages from Intel when it comes to keeping its manufacturing lead have apparently also instilled preoccupation amongst US policy makers.

MediaTek and Intel have reached a milestone in the development and certification of 5G T700 modem solutions for next-generation PC experiences. As announced by MediaTek today, the project is on schedule and the team has conducted 5G calls with the chipset. Intel is also well under way developing platform optimizations for best-in-class 5G PC user experiences that include validation and system integration, and readying co-engineering support for further enablement of its OEM partners.

"A successful partnership is measured by execution, and we're excited to see the rapid progress we are making with MediaTek on our 5G modem solution with customer sampling starting later this quarter. Building on Intel's 4G/LTE leadership in PCs, 5G is poised to further transform the way we connect, compute and communicate. Intel is committed to enhancing those capabilities on the world's best PCs," said Chris Walker, corporate vice president and general manager of Mobile Client Platforms at Intel.

Intel became the official PC hardware partner for the PC version of Marvel's Avengers last year and it seems like Intel is looking to take advantage of that with new limited edition "KA" Avengers series processors. Trusted leaked @momomo_us recently discovered listings for several of these Intel "KA" series processors on a Vietnamese retailer. It appears Intel is preparing to release 4 processors across their i5, i7, and i9 lineups these being the i5-10600KA, i7-10700KA, i9-10850KA and i9-10900KA. These processors should be identical to their K series counterparts apart from the commemorative packaging and the possible inclusion of Marvel's Avengers game codes. These processors will likely see a global release in the coming weeks/months in preparation for the launch of Marvel's Avengers on September 4th.