QNAP Systems, Inc. today launched the 2-bay TS-251D NAS. Powered by an Intel J4005 dual-core processor, the TS-251D can be used with QNAP's smart AI photo management application, QuMagie, which integrates AI image recognition to group similar photos together in album "People", "Things" and "Places". The 4K media transcoding and streaming capabilities of the TS-251D brings users an excellent and satisfying cross-device multimedia experience. The TS-251D also provides a PCIe slot for expanding its core functionality.

Powered by an Intel Celeron J4005 dual-core 2.00 GHz processor (burst up to 2.7 GHz), DDR4 RAM (up to 8 GB), one Gigabit LAN port, and supports SATA 6 Gbps drives. The TS-251D provides dependable read/write speeds and Intel AES-NI 256 hardware-accelerated encryption to secure sensitive and confidential data on the NAS. The TS-251D also supports snapshots, allowing users to quickly recover data in the event of accidental deletion/modification or ransomware attack.

Intel's policy on CPU pricing has been a strong, definite one for years: no price reductions. Faced with less than admirable competition from a struggling AMD back in its Phenom and especially Bulldozer days, Intel enforced a heavy hand on the market and on CPU pricing. However, a much revitalized AMD and difficulties in the transition to the 10 nm process have left Intel with no other recourse than to cut pricing on its CPUs in order to remain competitive. No uptake of new I/O technologies such as PCIe 4.0 has also taken its toll on Intel's position in the server and HEDT market, which has led to recent price-cuts and tightening of Intel's Xeon line of CPUs - as well as price-cuts in the order of 50% in their Cascade Lake-X processors compared to the previous generation.

DigiTimes, citing industry PC makers, says that Intel is gearing up to keep fighting in the only front it actually can, besides puny core count increases on their heavily-iterated Skylake architecture - pricing. This move comes in a bid to keep its market dominance, which Intel themselves have said - after Zen 2, that is - isn't a priority for the consumer market. You can rest assured that Intel is very, very likely already practicing hefty price reductions for tray-quantity purchases for partners. However, it seems that the company might bring some price cuts on to its upcoming Comet Lake CPUs. The company has always been loathe to reduce pricing on existing inventory, rather choosing to reduce the price on new launches (see the Cascade Lake-X example above), which, arguably, saves Intel's face on claims of only being able to compete on pricing - which lurks dangerously close to Intel being painted as the budget, price-cut alternative to AMD.

Intel NUC 11 Extreme is the spiritual successor to the "Hades Canyon" and "Skull Canyon" NUC, and implements the company's next-generation 10 nm+ "Tiger Lake" processor. Codenamed "Panther Canyon," the NUC 11 Extreme represents a line of ultra-compact desktops with serious computing power, bringing together the company's highest-performance CPU cores and iGPUs. The "Tiger Lake-U" SoC powering the NUC 11 Extreme will reportedly be configured with a 28-Watt TDP, and will come in Core i3, Core i5, and Core i7 variants.

The "Tiger Lake-U" processor is expected to combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture, in what could be the first commercial outing for both. The NUC 11 Extreme "Panther Canyon" will also support up to 64 GB of dual-channel DDR4-3200 memory over SO-DIMMs, an M.2-2280 slot with PCI-Express 4.0 x4 and SATA 6 Gbps wiring, and option for Intel Optane M10 cache memory. On the connectivity front, and Intel AX-201 WLAN card provides 802.11ax Wi-Fi 6, and Bluetooth 5. A 2.5 GbE wired interface will also be available. These will also be among the first NUCs to feature front- and rear-Thunderbolt ports (possibly next-gen 80 Gbps given that the platform implements PCIe gen 4.0). The NUC 11 Extreme "Panther Canyon" is expected to launch some time in the second half of 2020.

This year's Game Developers Conference (GDC) that will take place in March is forming to become a very interesting one. According to the GDC schedule platform, Intel is having a presentation about its upcoming Xe graphics card architecture. Saying that "Intel's brand new Xe Architecture, has been teased for a while, and is scheduled for release later this year! This update brings a significant compute, geometry and throughput improvements over today's widely used Gen9 and Gen11 graphics.", Intel is giving us a slight hint of what is to come.

Presented by Intel's senior developer relations engineer, Antonie Cohade, the talk will include an in-depth look of the Xe hardware architecture and its implementations. Said to introduce "powerful new features", the talk about Xe graphics should include a mention of the latest trend in the world of 3D graphics, ray tracing, and show us what are the capabilities of the new GPU architecture.

Razer had an interesting outing at CES 2020. There were no new PC gaming peripherals, other than Star Wars "storm trooper" co-branded Kraken, Goliathus, and Atheris; but three interesting exhibits. To begin with, Razer Kishi is an adjustable, split game controller for smartphones. The controller's two ends (meant for your left and right hands, wrap around the two ends of your smartphone. You get two analog thumbsticks, a D-pad, four action buttons, and four triggers. The Razer Gamepad app lets you map the controller to your smartphone over Bluetooth, and provides custom button mapping. The company also showed off Arctech line of smartphone sleeves that are designed to dissipate heat.

Having made its mark as a leading gaming notebook vendor, Razer is turning its attention to pre-built gaming desktops, and we saw one of its first creations, the Tomahawk SFF. Much like Apple, Razer has a serious focus on form as much as function, and that's evident with the aluminium CNC precision-milled chassis with tempered glass side-panels, and a size that's fit both for desks and the living room.

The ThinkPad brand from Lenovo has always represented serious business on the move, right from its IBM origins. At CES 2020, the company unveiled what is possibly the best foldable PC design we've seen till date, the ThinkPad X1 Fold. The X1 Fold is a 13.3-inch tablet that folds perfectly along the middle to either a book-like orientation, or as a laptop, in which the top half becomes the display, and the bottom half your keyboard of whichever possible layout. If a touchscreen keyboard doesn't appeal to you, you can dock an accessory that has a physical keyboard and trackpad.

Under the hood of the X1 Fold is an Intel "Lakefield" Hybrid x86 SoC that combines high-performance and high-efficiency x86 cores and dynamically allots workload to them while power-gating on the fly (a la ARM big.LITTLE). When it comes out mid-2020 (likely a Computex 2020 launch), the ThinkPad X1 Fold will be driven by Windows 10X, a new operating system Microsoft is designing specifically for dual-screen mobile computing devices. The Flex 5G is Lenovo's first business notebook with an integrated 5G modem (in addition to Wi-Fi 6), so you can enjoy high-speed mobile Internet on the move. Lastly, we spotted the Lenovo Ducati notebook, a co-branded product of the company's MotoGP team sponsorship.

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the release of the Vulkan 1.2 specification for GPU acceleration. This release integrates 23 proven extensions into the core Vulkan API, bringing significant developer-requested access to new hardware functionality, improved application performance, and enhanced API usability. Multiple GPU vendors have certified conformant implementations, and significant open source tooling is expected during January 2020.

Vulkan continues to evolve by listening to developer needs, shipping new functionality as extensions, and then consolidating extensions that receive positive developer feedback into a unified core API specification. Carefully selected API features are made optional to enable market-focused implementations. Many Vulkan 1.2 features were requested by developers to meet critical needs in their engines and applications, including: timeline semaphores for easily managed synchronization; a formal memory model to precisely define the semantics of synchronization and memory operations in different threads; descriptor indexing to enable reuse of descriptor layouts by multiple shaders; deeper support for shaders written in HLSL, and more.

Way back in June 2018, when the first Threadrippers made landfall, it was reported that Intel was working on a new 22-core "Skylake-X" silicon that sat in between the 18-core HCC (high core-count) die, and the 28-core XCC (extreme core-count) die. The roughly 700 mm² XCC die, with its 6 memory channels, couldn't be integrated with the LGA2066 package, and was reserved for the enterprise LGA3647 package that made a workstation/quasi-client debut with the 28-core Xeon W-3175X. It was hence rumored that an in-between 22-core silicon was under development that could be integrated with LGA2066. Fast forward to 2020, and Intel's client HEDT processor lineup doesn't look much different from its 2017 one. The 18-core i9-10980XE leads the pack, and despite its $1,000 price, has received largely lukewarm reviews. If screenshots surfacing on Chinese tech forums are to be believed, Intel is toying with the idea of the 22-core die meant for LGA2066 once again.

Referenced as Core i9-10990XE in straight-up CPU-Z screenshots, the processor is based on the "Cascade Lake-X" microarchitecture, and has the same I/O as the i9-10980XE, looking at the instruction sets featured. It has 22 cores and HyperThreading enables 44 threads. Cache hierarchy and balance are characteristic of "Cascade Lake," with 1 MB of dedicated L2 cache per core, and 30.25 MB of shared L3 cache. The I/O is likely identical to the i9-10980XE as that's a function of the platform and the socket. What's more interesting are the clock-speeds. The name-string of the engineering sample references a nominal clock-speed of 4.00 GHz, and in the screenshot, the chip is shown running at 5.00 GHz (at least on one core). There's also a performance benchmark to go with the leak, possibly CineBench R20 nT. Here, the i9-10990XE is shown scoring 14,005 points, which is in the same ballpark as the 24-core Ryzen Threadripper 3960X.

At this year's CES show, Sharp, a company behind Dynabook, unveiled what they call the world's lightest 13-inch notebook weighing in at just 1.9 lbs or 0.86 kilograms for all the metric system folks out there. The Portégé X30L-G as it is called is a 13-inch laptop of many qualities. For starters, it comes equipped with a 13.3-inch, 1080p IGZO display with a peak brightness of 470 nits. At its core, the Portégé X30L-G uses Intel's 10th generation of Core processors, presumably the Comet Lake variants. Onboard is also Intel's WiFi 6 standard for faster internet speeds, while the I/O is petty decent as well with two USB-A, one USB-C, one HDMI and one Ethernet port.

The laptop's chassis is made out of magnesium alloy and it features dust and drops resistance per military testing methodologies, making it a durable design that can take on everyday work. Additionally, there is a battery of unknown capacity that is advertised to last up to 14.5 hours, however, that is based on Dynabook's testing and we will have to wait for 3rd party reviews to confirm. The X30L-G is going to arrive sometime in February for the price of $1600.

At a media event on Wednesday, Intel invited us to check out their first working modern discrete graphics card, the Xe DG1 Software Development Vehicle (developer-edition). Leading the event was our host Ari Rauch, Intel Vice President and General Manager for Graphics Technology Engineering and dGPU Business. Much like gruff developer-editions of game consoles released to developers several quarters ahead of market launch, the DG1-SDV allows software developers to discover and learn the Xe graphics architecture, and develop optimization processes for their current and future software within their organizations. We walked into the event expecting to see a big ugly PCB with a bare fan-heatsink and a contraption that sort-of looks like a graphics card; but were pleasantly surprised with what we saw: a rather professional product design.

What we didn't get at the event, through, was a juicy technical breakdown of the Xe graphics architecture, and its various components that add up to the GPU. We still left pleasantly surprised for what we were shown: it works! The DG1-SDV is able to play games at 1080p, even if they are technically lightweight titles like "Warframe," and aren't maxing out settings. The SDV is a 15.2 cm-long graphics card that relies on the PCI-Express slot for power entirely (and hence pulling less than 75 W).

At CES 2020, Dell's gaming-inspired division, Alienware, had a handful of new products to showcase. Among these, we found a new product that is still in development called the Concept UFO. The UFO is a concept product that hints a new development strategy for gaming PCs, and that is a portability first approach. Inspired by Nintendo's Switch console, this computer puts gaming PCs on the go. Designed to be a handheld based solution, this PC is based on Windows 10 operating system so you can be sure that all of your existing game libraries are also playable on it as well.

Having an Intel processor as its base, the Concept UFO uses Intel's iGPU to power an 8-inch display of unknown resolution. While we don't know which architecture is powering the UFO, we speculate that Ice Lake is behind it. Our speculation is based on an assumption that, if the concept is capable of playing games, Alienware would put as high-performance iGPU as possible, and such performance is currently only found inside Intel's Ice Lake processors, in form of Intel Iris Plus integrated graphics. Frank Azor of AMD tweeted a question if anyone would like to see this product come with new AMD 4000 series of Ryzen mobile processors, so we could be in for a surprise, given that final specifications are not determined. Ryzen 4000 series would represent a perfect choice as it offers a lot of CPU and GPU power in a mere 15 W TDP package, however, we don't know what solution will be present in the end.

At this year's CES, ASUS announced the latest addition to their TUG gaming lineup of laptops - two 15-inch TUF Gaming A15 and TUF Gaming F15, and two 17-inch TUF Gaming A17 and TUF Gaming F17. Being advertised as durable, high-performance gaming laptops, the TUF lineup is here to bring "unprecedented experience for the price" meaning that the pricing of these models will be more than adequate for what they offer. Inside these new machines are the latest mobile processors from both Intel and AMD. The "A" series, as it is called, is an AMD based solution that features Ryzen 4000 series of mobile processors, which can be configured to go up to 8 cores and 16 threads, while the so-called "F" series is based on Intel's 10th generation of Core processors, which can be configured to go up to 6 cores and 12 threads.

During this year's CES, Intel had an event called the Performance Workshop, where many things were presented. Among those are Intel's upcoming Comet Lake-H CPUs, Ghost Canyon NUC 9, and last but not the least there was a mention of the future Tiger Lake processor and its AI performance. Starting with the Comet Lake-H announcement, Intel promised to deliver 8 core, 16 thread processors that are capable of reaching as high as 5 GHz clock speeds, in a 45 W TDP. These processors are the answer to AMD's upcoming "Renoir" Ryzen 4000 series of mobile processors, which are rumored to feature up to 8 cores and 16 threads as well. The advertised 5 GHz boost on these Comet Lake-H CPUs is for the Core i7 model, while Core i9 SKUs are supposed to reach even higher speeds. All the system improvements tied to Comet Lake like support for WiFi 6, Thunderbolt 3 and Optane memory support are also present on these CPUs.

Dell Technologies today unveiled new products and software across its premium Latitude, XPS and displays portfolios to help people innovate, collaborate and accomplish more in the next decade. Featuring artificial intelligence (AI), 5G and innovative design, the latest Dell Technologies' PCs and displays make work and play more seamless, intelligent and enjoyable.

"The PC industry has never been more vibrant with built-in AI, 5G and the best design we've ever seen, all to help make our lives easier and more fulfilled," said Sam Burd, president of Dell Client Solutions Group. "What's exciting to me is that, with all of the cool news we'll see come out of CES next week, the PC plays a central role in helping people innovate, influence and achieve more."

AMD veterans yesterday must've sneakily left their respective offices yesterday for a well-deserved rest and a glass of champagne - and if they didn't, they deserved it. The company yesterday broke their previous all-time stock pricing record achieved way back in June 2000, at $47.50 per share, when it traded at $49.10 per share yesterday.

It's been a long time coming for AMD, and irrespective of any brand loyalty, it certainly pays, as a consumer and as an enthusiast, to see a company that nearly went bankrupt in 2016 - who had to sell and then lease back their own headquarters for a quick cash infusion, spin-off its manufacturing division in a change of strategy that couldn't have been easy on morale - achieve such a colossal feat. Even more impressive this is should you even be considering the blue behemoth the company actually has to contend with - a $260.35B Intel who, by both happenstance and poor CPU execution vision, is being fired upon on all markets by comparative David AMD, today valued at $51.07B. Here's hoping all AMD employees got their well-deserved party and standing ovation from each other. None of them - not even Lisa Su - achieved this alone.

Samsung Electronics Co., Ltd. today introduced Galaxy Book Flex α (alpha), a new variant of Galaxy Book Flex that offers long-lasting battery, immersive QLED display, and exquisite design features at a competitive price-point. Today's consumers are constantly striving to blend their personal and work lives - and everything in between. Galaxy Book Flex α is the latest installment in Samsung's new line of Galaxy Computing devices, which combine the productivity and premium experience of a laptop with the mobility and flexibility of a smartphone.

"We all have different routines, and we need technology that works the way we work, and with our new Galaxy Computing line, we're giving consumers the ability to choose a PC that meets their unique needs," said Alanna Cotton, Senior Vice President and General Manager at Samsung Electronics America. "Galaxy Book Flex α is a stellar new variant of the Galaxy Computing line, offering many of the best design, hardware, and display features at an accessible price-point."

Intel's upcoming Core i9-10900K desktop processor is up to 30 percent faster than the Core i9-9900K according to the company, which put out a performance guidance slide that got leaked to the web. Based on the 14 nm "Comet Lake-S" silicon and built for the new LGA1200 platform (Intel 400-series chipset motherboards); the i9-10900K is a 10-core/20-thread processor that leverages increased TDP headroom of 125 W to sustain higher clock-speeds than 9th generation "Coffee Lake Refresh," while also offering a 25% increase in processing muscle over the i9-9900K, thanks to the two additional CPU cores.

In its performance guidance slide, Intel shows the i9-10900K scoring 30% more than the i9-9900K in SPECint_rate_base2006_IC16.0. There's also a 25% boost in floating-point performance, in SPECfp_rate_base2006_IC16.0, which roughly aligns with the additional core count, as both these tests are multi-threaded. Other noteworthy results include a 26% gain in Cinebench R15, and 10% in SYSMark 2014 SE. In tests that don't scale with cores, Intel appears to rely entirely on the increased clock-speeds and improved boosting algorithm to eke out performance gains in the low-to-mid single-digit percentages. Intel is introducing a new clock-speed boosting technology called Thermal Velocity Boost, which can dial up clock-speeds of the i9-10900K up to 5.30 GHz.

Ahead of a possible reveal in the sidelines of CES, followed by an early-Q2 2020 product-launch, company slides detailing Intel's 10th generation Core desktop processors in the LGA1200 package, codenamed "Comet Lake-S," leaked to the web courtesy Informatica Cero. They confirm that HyperThreading will play a key role, with Intel enabling it across the lineup. The range-topping Core i9 series will be 10-core/20-thread along with 20 MB of L3 cache. The Core i7 series will be 8-core/16-thread, along with 16 MB L3 cache. The all-important Core i5 series will be 6-core/12-thread, equipped with 12 MB of L3 cache. The Core i3 series will have two sub-tiers: i3-103xx series with 4-core/8-thread and 8 MB L3 cache; and i3-101xx series 4-core/8-thread with 6 MB L3 cache.

The Core i7 and Core i9 "Comet Lake" chips will feature native support for dual-channel DDR4-2933, while the Core i5 and Core i3 will make do with native DDR4-2667 support (memory overclocking possible). Besides core/thread counts, and cache size increases, Intel will dial up clock speeds across the board by as much as 300 MHz per SKU (vs. their 9th gen predecessor), and introduce Turbo Boost Max 3.0, which has been exclusive to its HEDT processors. The introduction of Turbo Boost Max 3.0 could also bring about modern favored-core capability (benefiting Windows 10 1909 and later). The classic Turbo Boost is also available. There's also a mysterious new feature called "Thermal Velocity Boost," with its own set of clock-speeds depending on core/thread load. The chips could also feature Modern Standby C10 power-state support (first to the desktop platform). Intel is said to have also added several new core and memory overclocking features on the K-SKUs.

According to sources at DigiTimes, Intel will announce its advanced cooling solutions for project Athena thin and light laptops, at 2020's CES. Pushing project Athena to be the finest of all laptop options, Intel wants to give users the ability to have their laptops run even cooler than ever with a new thermal solution that will supposedly enable an additional 25-30% of cooling headroom. The new cooling module will combine two ingredients to make up for a powerful cooling solution - vapor chambers and graphite sheets.

Usually, the cooling modules inside laptops are placed between the keyboard and laptop's bottom shell, where they could utilize only a small space, so thermal management became hard. In contrast, Intel's design is combining the vapor chamber with graphite sheets to create a bigger surface for heat dissipation. The vapor chamber will replace all the current modules and connect to graphite sheets placed behind the laptop screen, where a lot of area is available. Connecting the vapor chamber to the graphite sheet is a laptop hinge, where a graphite cooling solution would pass through. This hints at a complete redesign of laptop hinges, so we can expect to see some creative solutions there as well. Additionally, this design will allow manufacturers to make fanless laptops that use lower-power CPU models, and we can expect to see even slimmer laptop designs than ever before.

The DARK rises again. Not content to merely shatter records and competition in the consumer market, the EVGA SR-3 DARK merges two extreme performance lines of EVGA motherboards to bring balance to the force with exceptional performance and engineering. Featuring the Intel C622 chipset, hexa-channel memory support, 23 phase power design, 16-layer PCB, dual-10 GbE LAN ports, a waterblock to passively or actively cool the DARK's VRM, and so much more, this board is packed with everything and is still compact enough to fit in a full E-ATX form factor.

With the EVGA SR-3 DARK, you don't need to see its identification to know that the next evolution of the X299 and Z390 DARK motherboards features the latest improvements for performance and enthusiast needs.

This piece of news shouldn't surprise anyone, except for the fact that Intel is apparently signing on a TDP of 125 W for even its K-series unlocked processors for their next-generation Comet Lake-S family. Intel's current Comet Lake 9900K CPU features a TDP of "only" 95 W - when compared to the rumored 125 W of the 10900K), whilst their current top offering, the i9-9900KS, features a 127 W TDP. Remember that Intel's 10900K should feature 10 cores and 20 threads, two extra cores than their current 9900K - this should explain the increased TDP, a mathematical necessity given that Intel can only count on marginal improvements to its 14 nm fabrication process to frequencies and power consumption of its CPUs.

A leaked slide from momomo on Twitter shows, if real, that Intel's future enthusiast-grade CPUs (likely i5-10600K, i7-10700K and i9-10900K) will feature this 125 W TDP, while other launches in that family will make do with the more traditional 65 W TDP (interesting to see that Intel has some 10-core CPUs with 65 W TDP, the same as their current 9900, despite two more cores). A footnote on the leaked slide shows that these K processors can be configured for a 95 W TDP, but this would likely come at a significant cost to operating frequency. Intel seems to be bringing a knife to a gunfight (in terms of core counts and TDP) with AMD's Ryzen 3000 and perhaps Ryzen 4000 CPUs, should those and Intel's future offerings actually coexist in the market.

As we are approaching the year 2020, when Intel is rumored to launch its discrete graphics cards to the hand of consumers around the world, we are gearing up on the number of leaks about the upcoming products. Thanks to Twitter user @KOMACHI_ENSAKA, who found the latest EEC listing, we have new information regarding Intel's upcoming DG1 discrete graphics solution.

In the leaked EEC listing, the DG1 GPU is being presented as a GPU with 96 execution units, meaning that Intel is planning to take on entry-level graphics cards with this GPU. If the graphics unit is following the same design principle of the previous-generation GPUs, then there should be around 8 shading units per one execution unit, totaling 768 shading units for the whole DG1 GPU. If the 12th Gen Xe design inside the DG1 follows a different approach, then we can expect to see a double amount of shading units, meaning 1536 in total.

Intel's upcoming LGA1200 mainstream desktop socket (aka socket H5), appears to be cooler-compatible with older LGA115x sockets. This would mean any CPU cooler compatible with sockets LGA1156, LGA1155, LGA1150, and LGA1151, should be mechanically compatible with LGA1200. You'd still need to ensure the cooler has enough thermal capacity to cool some of the higher TDP SKUs such as the range-topping Core i9-10900K.

Comparative mechanical drawings of LGA1200 and LGA1151 were posted by momomo_us and eUUUK50, which show the LGA1200 package to have the same dimensions as the older socket. A picture of the land-grid of an LGA1200 package also leaked to the web, showing how Intel utilized empty bits of the fiberglass substrate to cram in the additional 49 pins, without changing the size of the contacts. The LGA1200 socket debuts with Intel's 10th generation Core "Comet Lake" desktop processors and motherboards based on the company's 400-series chipsets. Intel is expected to launch these processors by Q2-2020.

Intel's latest talent acquisition from rival AMD, as it builds a GPU product lineup, is Masooma Bhaiwala. "After 15+ amazing years at AMD, I have decided to take on a different opportunity... It was a truly fun ride, with an incredible team, during which we built some truly cool chips," she wrote in a LinkedIn post. According to her profile, Bhaiwala takes the role of Vice President, discrete GPU SoCs, and works under Intel's Graphics and Throughput Computing Hardware Engineering group headed by Raja Koduri.

Koduri's team has been a glassdoor for former AMD executives and tech-leads. While it has hired engineering talent such as Balaji Kanigicherla, Kalyan Thumaty and Joseph Facca; it has simultaneously lost client-graphics marketing talent, with the likes of Chris Hook, Heather Lennon, and Jon Carvill waltzing out of the company in less than a year of their association. Besides Koduri's Intel's most priced tech talent acquisition is Jim Keller, who is working on a future high-IPC CPU core design for the company. While working for AMD, Keller's "Zen" microarchitecture coupled with CEO Lisa Su's leadership have scripted one of the biggest turnarounds in Silicon Valley.

Intel Corporation today announced that it has acquired Habana Labs, an Israel-based developer of programmable deep learning accelerators for the data center for approximately $2 billion. The combination strengthens Intel's artificial intelligence (AI) portfolio and accelerates its efforts in the nascent, fast-growing AI silicon market, which Intel expects to be greater than $25 billion by 2024 (1).

"This acquisition advances our AI strategy, which is to provide customers with solutions to fit every performance need - from the intelligent edge to the data center," said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. "More specifically, Habana turbo-charges our AI offerings for the data center with a high-performance training processor family and a standards-based programming environment to address evolving AI workloads."

Intel's AI strategy is grounded in the belief that harnessing the power of AI to improve business outcomes requires a broad mix of technology - hardware and software - and full ecosystem support. Today, Intel AI solutions are helping customers turn data into business value and driving meaningful revenue for the company. In 2019, Intel expects to generate over $3.5 billion in AI-driven revenue, up more than 20 percent year-over-year. Together, Intel and Habana can accelerate the delivery of best-in-class AI products for the data center, addressing customers' evolving needs.