According to a new research report from leading analyst firm Jon Peddie Research (JPR), unit shipments in the add-in board (AIB) market increased in Q2'24 from last quarter and increased year over year. Meanwhile, Nvidia slightly increased market share from last quarter, as well as year over year. In Q2'24, total graphics card shipments increased to 9.5 million units, up from 8.7 million units last quarter.

AMD's quarter-to-quarter total desktop AIB unit shipments increased 9% and increased 3% from last year. Nvidia's quarter-to-quarter unit shipments increased 9.7% and increased 61.9% from last year while continuing to hold a dominant market share position at 88%. Intel, which entered the AIB market in Q3'22 with the Arc A770 and A750, remained flat, as the company has yet to gain significant traction in the add-in board market.Market share changes quarter to quarter and year to year.

Back in August, Intel started shipping its 0x129 microcode update for 13/14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This update fixed incorrect voltage requests to the processor that are causing elevated operating voltage. Intel's analysis showed that the root cause of stability problems is voltage levels that are too high during the operation of the processors. These increases in voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin." Today, the company discovered the root cause of this instability issue and informed users that a new microcode patch is underway. As explained by Intel, the Vmin Shift instability problem stems from a clock tree circuit in the IA core. When exposed to high voltage and temperature conditions, this circuit is vulnerable to reliability degradation. Intel's research has shown that these factors can cause a shift in the duty cycle of the clocks, resulting in system instability.

There are four scenarios that can cause Vmin Shift: increased motherboard power delivery, eTVB microcode algorithm running at higher performance operating states even at higher temperatures, microcode SVID algorithm requesting higher voltages at higher frequencies and longer durations, and finally microcode and BIOS requesting elevated core voltages. For motherboard power settings, mitigation is switching back to default settings. For the eTVB issue, the fix is a 0x125 microcode update. The 0x129 patch fixes the SVID algorithm, and the fourth condition, where microcode and BIOS request elevated core voltage, is fixed by the upcoming 0x12B microcode update. Intel is reportedly working with OEMs to start rolling out the 0x12B update with no apparent performance degradation. While the timeframe for shipping this update is unknown, we expect to see it soon. Additionally, Intel once again confirmed that the upcoming "Arrow Lake" CPUs don't have these issues.

Intel's upcoming Arc "Battlemage" G21 GPU has made an appearance in Geekbench benchmarks, offering a glimpse into the future of the company's discrete graphics offerings. This next-generation GPU, part of Intel's Xe2 graphics architecture, shows promising performance that puts it almost on par with the current Arc A770 in initial tests. The benchmark results reveal a GPU with 20 Xe2 cores, translating to 160 CUs. Notably, the chip boasts a clock speed of 2,850 MHz. Equipped with 12 GB of memory, this particular model appears to be targeting the mid-range segment of the market.

Identified by the PCI ID "8086:E20B" and listed as "Intel Xe Graphics RI," the GPU scored 97,943 points in Geekbench 6's OpenCL test. This score places it near the Arc A770 and NVIDIA's GeForce RTX 4060, suggesting competitive performance in its class. The test system paired the Battlemage GPU with an Intel Core i5-13600K CPU and 32 GB of DDR5-4800 memory, providing a solid platform for evaluation. One interesting thing to note is that, while these early benchmarks show weak OpenCL performance, Intel didn't historically target this particular API, and the final performance will be higher in actual games that use DirectX 12 or Vulkan APIs, possibly worthy of competing with NVIDIA and AMD solutions.

Intel has released version 1.2 of its X86S architecture specification. The X86S project, first announced last year, aims to modernize the x86 architecture that has been the heart of PCs since the late 1970s. Over the decades, Intel and AMD have continually expanded x86's capabilities, resulting in a complex instruction set that Intel now sees as partially outdated. The latest specification primarily focuses on removing legacy features, particularly 16-bit and 32-bit support. This radical departure from x86's long-standing commitment to backward compatibility aligns with the simplification of x86. While the specification does mention a "32-bit compatibility mode," we are yet to how would 32-bit apps run. This ambiguity raises questions about how X86S might handle existing 32-bit applications, which, despite declining relevance, still play a role in many computing environments.

The potential transition to X86S comes at a time when the industry is already moving away from 32-bit support. However, the proposed changes are subject to controversy. The x86 architecture's strength has long been its extensive legacy support, allowing older software to run on modern hardware. A move to X86S could disrupt this ecosystem, particularly for users relying on older applications. Furthermore, introducing X86S raises questions about the future relationship between Intel and AMD, the two primary x86 CPU designers. While Intel leads the initiative, AMD's role in the potential transition remains uncertain, given its significant contributions to the current x86-64 standard.

Yesterday, Intel launched its Xeon 6 family of server processors based on P-cores manufactured on Intel 3 node. While the early reviews seem promising, Intel is preparing a more advanced generation of processors that will make or break its product and foundry leadership. Codenamed "Clearwater Forest," these CPUs are expected to be the first high-volume production chips based on the Intel 18A node. We have pictures of the five-tile Clearwater Forest processor thanks to Tom's Hardware. During the Enterprise Tech Tour event in Portland, Oregon, Tom's Hardware managed to take a picture of the complex Clearwater Forest design. With compute logic built on 18A, this CPU uses Intel's 3-T process technology, which serves as the foundation for the base die, marking its debut in this role. Compute dies are stacked on this base die, making the CPU building more complex but more flexible.

The Foveros Direct 3D and EMIB technologies enable large-scale integration on a package, achieving capabilities that previous monolithic single-chip designs could not deliver. Other technologies like RibbonFET and PowerVia will also be present for Clearwater Forest. If everything continues to advance according to plan, we expect to see this next-generation CPU sometime next year. However, it is crucial to note that if this CPU shows that the high-volume production of Intel 18A is viable, many Intel Foundry customers would be reassured that Intel can compete with TSMC and Samsung in producing high-performance silicon on advanced nodes at scale.

ASRock Rack Inc., a leading innovative server company, today announced the launch of its new server platforms, powered by Intel Xeon 6900 series processors with Performance-Cores (P-Cores). These advanced platforms are designed to deliver exceptional performance across a wide range of demanding workloads, including High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.

The Intel Xeon 6900 Series Processors are optimized for high performance per core and are delivered in a new class of Intel server platform design. They offer up to 12 memory channels, providing greater memory bandwidth to support demanding environments such as cloud, AI, and HPC. Leveraging these processors, ASRock Rack's newly released platforms—the 1U all-flash storage server 1U8E1S-GNRAPDNO and the GNRAPD12DNO server motherboard—fully maximize throughput with unprecedented compute capability.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

"Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions."

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment. To meet this demand head-on, Intel today launched Xeon 6 with Performance-cores (P-cores) and Gaudi 3 AI accelerators, bolstering the company's commitment to deliver powerful AI systems with optimal performance per watt and lower total cost of ownership (TCO).

"Demand for AI is leading to a massive transformation in the data center, and the industry is asking for choice in hardware, software and developer tools," said Justin Hotard, Intel executive vice president and general manager of the Data Center and Artificial Intelligence Group. "With our launch of Xeon 6 with P-cores and Gaudi 3 AI accelerators, Intel is enabling an open ecosystem that allows our customers to implement all of their workloads with greater performance, efficiency and security."

MSI, a leading global server provider, today introduced its latest server platforms, powered by Intel Xeon 6 processor with Performance Cores (P-cores). These new products deliver unprecedented performance for compute-intensive tasks, tailored to meet the diverse demands of data center workloads.

"The demand for data center performance has never been greater, driven by compute-intensive AI, HPC applications, and mission-critical database and analytics workloads," said Danny Hsu, General Manager of Enterprise Platform Solutions. "To meet these demands, IT teams need reliable performance across an increasingly diverse array of workloads." MSI's new server platforms, powered by Intel Xeon 6 processors, deliver high performance across a broad range of tasks, meeting diverse requirements for both performance and efficiency.

Intel could get a substantial multibillion-dollar investment from Apollo Global Management Inc., according to a recent report by Bloomberg which relies on inside information from people familiar with the matter. It is said that Apollo is willing to invest up to $5 billion in Intel, and it is worth noting that this came up just after rumors about Qualcomm's intentions for a friendly takeover of Intel emerged last week. Intel and Apollo representatives have declined to comment thus far, however, it is said that Intel executives have been weighing Apollo's proposal.

Apollo is not a newcomer to the chipmaking industry; in 2023, the New York-based company made a $900 million investment in Western Digital buying convertible preferred stock. As for Intel and Apollo, they are no strangers to each other. Just this past June, Intel agreed to sell a stake in a joint venture that controls Intel's Fab 34 plant in Ireland to Apollo for $11 billion. While rumors come and go, one thing is for sure: Intel's short-term future relies on the success of its upcoming products like Arrow Lake desktop architecture to be released on October 24, and its foundry business division.

Canadian online retailer ShopRBC put up listings of unreleased Intel Core Ultra 200-series "Arrow Lake-S" desktop processors. While the availability listed is zero, you can backorder these chips at the prices listed, so they are shipped when available. The flagship Intel Core Ultra 9 285K (8P+16E) processor is listed at CAD $852 (around USD $628). There is no "KF" variant of this part unlike with past generations of Intel flagship SKUs. The Core Ultra 7 265K (8P+12E) is next up, at CAD $589 (USD $435). Its KF variant, which lacks integrated graphics, is up for CAD $22 less than that (CAD $567 or USD $418).

Intel's middle-of-the-market part for this generation, the Core Ultra 5 245K (6P+8E) is next up, listed at CAD $450, or USD $331. You can back-order its KF variant for CA $23 less, at CA $427 (USD $315). The Core Ultra 200 "Arrow Lake-S" introduces the new Socket LGA1851, and so online retailers around the world should begin putting up compatible motherboards based on the Intel Z890 chipset, which is rumored to be the only chipset option available with these chips until Q1-2025, when Intel fleshes out the series with non-K SKUs and value chipsets such as the B860.

Detailed specifications and a somewhat blurry slide showing off all the details of MSI's upcoming high-end MEG Z890 Unify-X motherboard have leaked courtesy of @ChamberTech_ on X/Twitter. The motherboard is likely to appeal to those looking to squeeze every extra bit of performance out of their new Ultra 200K series CPU when they launch next month. You get support for memory speeds of up to 10,000 MT/s and with only two DIMM slots, it might be able to go even higher with the latest DDR5 CUDIMMs. The board also sports a 110 Ampere 20+1+1+1 VRM design on an eight layer PCB, and it also ships with what MSI calls an OC Tuning Controller, suggesting the board is targeting overclockers.

MSI has included a pair of PCIe 5.0 x16 slots for GPUs that presumably operate in dual x8 mode when both slots are in use, and a third PCIe 4.0 x16 slot that operates in x4 mode, as well as a single PCIe 4.0 x1 slot. There's also no less than six M.2 slots, of which two are PCIe 5.0 and one PCIe 4.0, as well as six SATA ports. Where things get a bit interesting is in the network connectivity, as the slide claims that the board features a 5 Gbps Intel Killer Ethernet interface, which is the first we've heard of such a thing, as well as an Intel Killer Wi-Fi 7 and Bluetooth 5.4 module for wireless connectivity.

Intel late Friday released the latest version of the Arc GPU Graphics drivers. Version 101.6078 WHQL is essentially the same set of drivers as the 101.6077 Beta drivers Intel released on September 18, but with the added WHQL signing. As such the drivers don't introduce any new Game On optimization from 101.6077 Beta, which had them for "Dead Rising Deluxe" Remaster, "Final Fantasy XVI," "Frostpunk 2," and "God of War Ragnarök," nor do these drivers introduce any fixes from the previous release. The "known issues" list, which lets you know if Intel has identified a new issue that will be fixed in a future driver release, remains the same for Arc A-series discrete GPUs, but has been expanded for Arc integrated graphics found with Core Ultra processors. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6078 WHQL

This is not an April fool, as Qualcomm has apparently approached Intel with a takeover bid, according to the Wall Street Journal. The news follows earlier rumours about Qualcomm having eyed the opportunity to buy parts of Intel's client PC business, especially the parts related to chip design. Now it looks like Qualcomm has decided it might as well give it a go and take over Intel entirely, if the WSJ's sources can be trusted. It's still early days though and no official offers appear to have been proposed by Qualcomm so far and it doesn't appear to be a hostile takeover offer at this point in time. As such, this could turn out to be nothing, or we could see a huge change in the chip market if something comes of it.

It's worth keeping in mind that Intel's share price has dropped by around 57 percent so far this year—not taking into account today's small jump for Intel—and Qualcomm's market cap stands at over twice that of Intel's at 188 vs 93 billion US dollars. Even if Intel was to agree to a takeover offer from Qualcomm, there are several antitrust hurdles in multiple countries to get around for the two giants as well. This is despite the two not being direct competitors, but with Qualcomm recently having entered the Windows laptop market, the two are at least competing for some market share there. It's also unclear what Qualcomm would do with Intel's x86 legacy if it acquired Intel, as Qualcomm might not be interested in keeping it, at least not on the consumer side of its business. Time will tell if this is just some advanced speculation or a serious consideration by Qualcomm.

While the upcoming desktop versions of Intel's "Arrow Lake" processors are stealing all the hype, we are getting a leak about the high-performance "Arrow Lake-HX" chips for laptop space. Thanks to Jaykihn on X, we learn that Intel has prepared six SKUs for laptop enthusiasts to power workstations and gaming. The upcoming Core Ultra 200 series SKUs are 285HX, 275HX, 265HX, 255HX, 245HX, and 235HX. Starting with the lower-end Core Ultra Core Ultra 5 245HX / 235HX, we get six P-cores running at 3.1 and 2.9 GHz base speeds, respectively. For both SKUs, E-cores are clocked at 2.6 GHz at the base. Boosing the P-cores yields a maximum of 5.1 GHz, while E-cores top out at 4.5 GHz. For graphics, the 48 EUs inside the iGPU are clocked at 1.8 GHz on the 235 HX, while 245 HX runs at 1.9 GHz. THese models don't support Thermal Velocity Boost and Turbo Boost Max 3.0, while of the remaining SKUs support both features.

Moving to the middle of the stack, there are two SKUs: Core Ultra 7 265HX / 255HX. Both feature eight P-cores and twelve E-cores. The differentiator here is the clock speed. P-cores on the 255HX run at 2.4 GHz base and 5.2 GHz boost, while the P-cores on 265HX run at 2.6 GHz base and 5.3 GHz boost. E-cores have a wider gap with the 255HX running at 1.8 GHz base and 4.5 GHz boost, while 265HX has E-cores pinned at 2.3 GHz base and 4.6 GHz boost. Both of these SKUs have iGPU with 64 EUs set at 1.9 GHz.

Hot on the heels of yesterday's leak of the Core Ultra 9 285K "Arrow Lake" retail box, we have pictures of the boxes the Core Ultra 7 265K/KF, and the Core Ultra 5 245K/KF. These are simpler paperboard boxes that retain essential box-art design of the 285K, but lack the fancy jewel-case. The processor comes in the usual plastic blister inside the box, along with the case badge. This time around, Intel is not releasing a "KF" variant of the Core Ultra 9 285K, but if down the line it does, you can expect it to come in a similar simple retail package as the 265K/KF.

The Intel Core Ultra main brand is positioned prominently on the front face. Much like the 14th Gen Core, the Intel brand is displayed in the same font size as Core. Below the two, is the Unlocked designation, followed by "Series 2," which indicates the 200 processor model numbering sequence. The top-right corner has the brand extension (3, 5, 7, 9). Intel is expected to launch its Core Ultra 200-series "Arrow Lake-S" desktop processors in late-October, 2024.

Intel's Core Ultra 200 series "Arrow Lake" CPU generation is bringing a complete P/E core redesign and, allegedly, a new package. According to VideoCardz, Intel's flagship SKU—Core Ultra 9 285K—features a completely redesigned box with new accent colors. Colors of choice include blue, black, and gray tones with a futuristic look. At the center of the new box is grey plastic packaging that protects and holds the actual processor. As the recent leaks suggested, this SKU will boast 8 "Lion Cove" P-Cores and 16 "Skymont" E-Cores without Hyper-Threading and with a maximum boost of 5.7 GHz. All of this will be packed inside a 125-watt power envelope. While we await the official launch, supposedly scheduled for October 10 and released on October 24, we can preview the new packaging box that Intel prepared for its new CPU family.

MSI is pleased to announce the launch of the MSI Cubi NUC 13MQ, the latest addition to its esteemed Cubi NUC series, winner of the Red Dot Award 2024. Expanding on the robust features of the MSI Cubi NUC 1M, the new Cubi NUC 13MQ integrates the powerful Intel vPro platform, providing businesses with enhanced security, manageability, performance, stability, and sustainability within a small form factor.

The MSI Cubi NUC 13MQ is a significant advancement in the mini PC market, tailored to meet the intricate demands of contemporary businesses. With the integration of Intel vPro technology, the Cubi NUC 13MQ offers advanced functionalities such as remote management, robust security provisions, exceptional performance, and superior stability. As a result, this product is an optimal choice for IT administrators aiming to implement secure, efficient, and scalable computing solutions across their organizations.

In today's fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial's commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel Xeon W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency and speed.

Key Features of the IMB-X1900 Motherboard:

• Unrivaled Processing Power: Featuring Intel Xeon W-3500/3400 and W-2500/2400 Series Processors with W790 chipset, the IMB-X1900 supports up to 60 cores, making it a powerhouse for computationally intensive workloads. This capability is crucial for industries such as 3D rendering, product simulation, and large-scale AI models training and inference.
• Expansive Memory Capacity: With support for up to 2 TB of DDR5 RDIMM ECC memory across 8 slots, the IMB-X1900 ensures seamless management of extensive datasets and complex simulations. This inclusion of ECC memory further enhances system reliability and data integrity, essential for industries like financial analysis, scientific research, and mission-critical applications.

Today Intel released its latest Arc GPU graphics drivers, with version 101.6077 beta hitting our servers. This latest version brings game-ready support for titles like Dead Rising Deluxe Remaster, Final Fantasy XVI, Frostpunk 2, and God of War Ragnarok. Besides adding support for latest titles, the 101.6077 beta drivers also fixed issues like corruption on certain reflective surfaces during gameplay of The Last of Us Part I (DX12), and corrupted lines on certain textures during gameplay of Age of Empires IV (DX12). Interestingly, few issues persist like Diablo IV (DX12) intermittently crashing while toggling Ray Tracing settings during gameplay, and Doom Eternal (VK) exhibiting intermittent flickering corruption in the game menu and during gameplay. Few more notes are included in the changelog and known issues, which can be seen below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6077 Beta.

All eyes have been on Intel since we announced Q2 earnings. There has been no shortage of rumors and speculation about the company, including last week's Board of Directors meeting, so I'm writing today to provide some updates and outline what comes next. Let me start by saying we had a highly productive and supportive Board meeting. We have a strong Board comprised of independent directors whose job it is to challenge and push us to perform at our best. And we had deep discussions about our strategy, our portfolio and the immediate progress we are making against the plan we announced on August 1.

The Board and I agreed that we have a lot of work ahead to drive greater efficiency, improve our profitability and enhance our market competitiveness—and there are three key takeaways from last week's meeting that I want to focus on:

• We must build on our momentum in Foundry as we near the launch of Intel 18A and drive greater capital efficiency across this part of our business.
• We must continue acting with urgency to create a more competitive cost structure and deliver the $10B in savings target we announced last month.
• We must refocus on our strong x86 franchise as we drive our AI strategy while streamlining our product portfolio in service to Intel customers and partners.

We have several pieces of news to share that support these priorities.

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies' longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.

As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company's most advanced process node. Intel will also produce a custom Xeon 6 chip on Intel 3, building on the existing partnership under which Intel produces Xeon Scalable processors for AWS.

AAEON, a global leader in embedded computing, has introduced the GENESYSM-ADN6, a slimline SubCompact System powered by Intel Core Processor N-series CPUs. Measuring just 178 mm x 134.1 mm x 43 mm, the GENESYSM-ADN6 is a compact option built to satisfy demand for mini PCs suitable for smart retail, industrial automation, and edge gateway applications. The PC's connectivity and scalability clearly align it with the latter of these vertical markets, with a standout feature being its three LAN ports, configured for Intel Ethernet Controller I226 running at 2.5GbE speed. Alongside this is extensive expansion options for Wi-Fi, 5G, and additional storage through the system's M.2 2230 E-Key, M.2 3052 B-Key, and mSATA slots respectively.

In addition to its compact size, the GENESYSM-ADN6 is well-suited to deployment in industrial settings, with a wide power input range of 9 V to 36 V and fanless operation. Moreover, the system boasts two COM ports for RS-232/422/485, with the option of two additional ports for RS-232. Elsewhere, two USB 3.2 Gen 2 ports, an 8-bit GPIO, and SMBus/I2C are available for integrating sensors, actuators, and other peripheral devices, making it an excellent option when it comes to PLCs, robotic arms, and SCADA systems. The system's interfaces are bolstered by high-bandwidth, SODIMM-based DDR5 system memory for expedited data processing and optional TPM 2.0 for added data security.

According to Tom's Hardware, AMD has confirmed that its upcoming FidelityFX Super Resolution 4 (FSR 4.0) graphics upscaling solution will harness the power of AI for frame generation and frame interpolation. This update marks a significant shift from the company's previous analytical-based approaches, as revealed by Jack Huynh, AMD's senior vice president and general manager of the Computing and Graphics Business Group. Initially, FSR4's primary focus is addressing the persistent challenge of battery life in handheld gaming devices. Huynh emphasized the need for extended playtime, stating, "I need to play a Wukong for three hours, not 60 minutes." To achieve this, AMD has been working on AI-based upscaling techniques for nearly a year. As a reminder, FSR 1.0 used spatial upscaling, version 2.0 used temporal upscaling, and FSR 3.0 also used temporal upscaling with optional frame generation.

While the initial context for FSR4 centers on handheld devices, AMD's work with developing open-source, architecture-agnostic algorithms suggests broader applications. FSR4 might be compatible with a wide range of GPU solutions, including non-handheld devices, benefiting desktop and laptop users as well. This move to AI-based technology aligns AMD with competitors like Intel, who have implemented similar approaches in their XeSS technology, and NVIDIA with its DLSS solution. Although the release date for FSR4 remains unannounced, its year-long development suggests it may be nearing completion. However, as with previous upscaling solutions, widespread adoption in games may take time following its release.

ASUS today announced that the Zenbook DUO (2024) (UX8406) and ProArt PZ13 (HT5306) laptops won Silver Awards in the Consumer Technology category at the International Design Excellence Awards (IDEA) 2024. Additionally, eight more ASUS products were named as finalists, marking 2024 as the company's most successful year at IDEA. This strong showing underlines the company's dedication to redefining user experiences through innovative design that balances aesthetics and technological excellence.

ASUS Zenbook DUO (2024) also earned a spot in the permanent collection of the Henry Ford Museum of American Innovation, highlighting the ingenuity of the world's first AI-powered 14-inch dual-screen laptop. The museum, a longstanding partner of the IDEA awards, adds select award-winning products to its permanent collection every year.