The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Global technology brand HONOR today announced its groundbreaking AI-enabled hardware capabilities and a collaborative AI privacy protection architecture, showcasing its commitment to innovative empowerment in an AI-driven world, at IFA 2024. The HONOR MagicBook Art 14 represents a groundbreaking leap in laptop industry, transforming conventional laptop experience by infusing human-centric innovation with robust capabilities.

Showcasing the Vine-leaf Curves Design and Satin Enamel Spraying Technology, this laptop is a marvel of lightweight engineering, incorporating cutting-edge platform-level AI features alongside robust hardware and software solutions, ensuring unmatched productivity and user experience. Translating the lightweight and slim characteristics synonymous with smartphones to laptops, HONOR is introducing the so far lightest and slimmest AIPC to the market. The HONOR MagicBook Art 14 showcases the pioneering Topology Lightweight Structure, weighing just approximately 1 kg and measuring a slim thickness of 10 mm. Boasting an alloy body crafted from magnesium and a keyboard constructed with titanium, this laptop epitomizes a perfect balance of lightweight design and durability.

Lenovo, a global leader in technology innovation, announced its latest advancements at Lenovo Innovation World 2024, unveiling a series of AI PC devices, including ThinkPad, ThinkBook, Yoga, and IdeaPad laptops, designed to transform both enterprise and consumer user experiences.

AI PC Era
AI PCs are set to revolutionize computing as their relevance grows, with 60% of PCs shipped by 2027 anticipated to be AI-capable. Lenovo's AI PCs are at the forefront of this transformation, leveraging natural interactions, personalized large language models, and advanced computing architectures. These innovations make computing more personal by tailoring experiences to individual users, more productive by enhancing workflow efficiency, and more protected by integrating robust security features into AI-driven systems.

Taipei, Taiwan－September 5th, 2024－Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to announce that a total of 71 cooling products are fully compatible with the latest Intel Arrow Lake-S and AMD Ryzen 9000 series processors. The upcoming Intel 15th Gen CPUs feature the new LGA 1851 socket and retain compatibility with the LGA 1700 socket.

Meanwhile, the AMD Ryzen 9000 series is continually designed with the AM5 socket. This indicates that users can seamlessly upgrade to the brand-new Intel and AMD CPUs while pairing up with the existing Thermaltake coolers. Regardless of air coolers, all-in-one liquid coolers, or water blocks, Thermaltake offers a wide range of superior cooling solutions to these next-gen processors.

SCHENKER is updating the KEY series with three new models for 2024. As the most powerful laptop in the portfolio, the 17.3-inch KEY 17 Pro desktop replacement workstation receives a significant upgrade to its comprehensive features: two Thunderbolt 5 ports allow for maximum flexibility. With the fastest laptop processor, the Intel Core i9-14900HX, and graphics cards up to the NVIDIA GeForce RTX 4090, the Varjo-Ready-certified KEY 17 Pro excels as a powerful, professional VR and content creation workstation. New additions to the product range include the 14-inch SCHENKER KEY 14 with an Intel Core Ultra 7 155H and the 16-inch KEY 16 Pro with an Intel Core i9-14900HX. Both models feature graphics cards up to the GeForce RTX 4070 and are NVIDIA GeForce RTX Studio certified.

SCHENKER KEY 17 Pro: Desktop Replacement Workstation with Two Thunderbolt 5 Ports, PCIe 5.0 SSD, Optional UHD Display, and Varjo-Ready Certification
The SCHENKER KEY 17 Pro (M24) succeeds its predecessor with a crucial upgrade: two Thunderbolt 4 ports have been replaced by two Thunderbolt 5 ports with a total bandwidth of 80 Gbps (shared by both ports, depending on the bandwidth requirement per connection) for the best display experience. This laptop provides maximum performance with the next generation of Thunderbolt 5 peripherals, such as multifunctional docking stations and high-performance external storage solutions or the newest DP2.1 based displays. One of these multi-purpose ports can also support charging the workstation with up to 100 watts. The significantly increased bandwidth compared to the previous generation allows for the operation of up to three external 4K monitors at 144 Hz or dual 6K displays. Thunderbolt 5 technology offers maximum flexibility, being backwards compatible with existing Thunderbolt 4, Thunderbolt 3 and USB peripherals. Additionally, Thunderbolt Share enables direct data exchange and ultra-low-latency screen sharing between two computers.

ASUS today announced ExpertBook B1, a durable, reliable and versatile laptop that's ready for the rigors of the modern business world. ExpertBook B1's lineup of powerful features includes up to an Intel Core 7 processor with Intel Iris Xe Graphics, up to 64 GB of memory and ample storage, plus a vibrant screen with a tall 16:9 aspect ratio - all encased in a sleek 1.4 kg chassis. ExpertBook B1 is designed for seamless connectivity, featuring up to WiFi 6E and a comprehensive array of I/O ports. In addition, it offers military-grade durability and incorporates an eco-friendly design that reflects a commitment to sustainability and accountability.

Robust performance
ExpertBook B1 is engineered to enhance business capabilities, providing the fast and responsive performance essential for today's demands—enabling seamless multitasking, advanced data handling, and streamlined operations. Powered by up to an Intel Core 7 processor with Intel Iris Xe Graphics, ExpertBook B1 delivers the robust performance needed to get the job done.

Intel has announced the cancellation of its 20A node for Foundry customers, as well as shifting majority of Arrow Lake production to external foundries. The tech giant will instead focus its resources on the more advanced 18A node while relying on external partners for Arrow Lake production, likely tapping TSMC or Samsung for their 2 nm nodes. The decision follows Intel's successful release of the 18A Process Design Kit (PDK) 1.0 in July, which garnered positive feedback from the ecosystem, according to the company. Intel reports that the 18A node is already operational, booting operating systems and yielding well, keeping the company on track for a 2025 launch. This early success has enabled Intel to reallocate engineering resources from 20A to 18A sooner than anticipated. As a result, the "Arrow Lake processor family will be built primarily using external partners and packaged by Intel Foundry".

The 20A node, while now cancelled for Arrow Lake, has played a crucial role in Intel's journey towards 18A. It served as a testbed for new techniques, materials, and transistor architectures essential for advancing Moore's Law. The 20A node successfully integrated both RibbonFET gate-all-around transistor architecture and PowerVia backside power delivery for the first time, providing valuable insights that directly informed the development of 18A. Intel's decision to focus on 18A is also driven by economic factors. With the current 18A defect density already at D0 <0.40, the company sees an opportunity to optimize its engineering investments by transitioning now. However, challenges remain, as evidenced by recent reports of Broadcom's disappointment in the 18A node. Despite these hurdles, Intel remains optimistic about the future of its foundry services and the potential of its advanced manufacturing processes. The coming months will be crucial as the company works to demonstrate the capabilities of its 18A node and secure more partners for its foundry business.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new flagship GIGABYTE G593 series servers supporting direct liquid cooling (DLC) technology to advance green data centers using NVIDIA HGX H200 GPU. As DLC technology is becoming a necessity for many data centers, GIGABYTE continues to increase its product portfolio with new DLC solutions for GPU and CPU technologies, and for these new G593 servers the cold plates are made by CoolIT Systems.

G593 Series - Tailored Cooling
The GPU-centric G593 series is custom engineered to house an 8-GPU baseboard, and its design had foresight for both air and liquid cooling. The compact 5U chassis leads the industry in its readily scalable nature, fitting up to sixty-four GPUs in a single rack and supporting 100kW of IT hardware. This helps to consolidate the IT hardware, and in turn, decrease the data center footprint. The G593 series servers for DLC are in response to the rising customer demand for greater energy efficiency. Liquids have a higher thermal conductivity than air, so they can rapidly and effectively remove heat from hot components to maintain lower operating temperatures. And by relying on water and heat exchangers, the overall energy consumption of the data center is reduced.

ASUS today announced ExpertBook P5 (P5405), a groundbreaking Copilot+ PC1 designed to empower modern professionals. Powered by the latest Intel Core Ultra processor (Series 2) with up to 48 NPU TOPS2, delivering an up to 3X AI performance boost over the prior generation and featuring ASUS AI ExpertMeet, this AI-driven powerhouse streamlines workflows and enhances collaboration. Its sleek, durable aluminum chassis houses a stunning 2.5K 144 Hz display, delivering exceptional visuals. With a 1.29 kg3 feather-light design, robust security features, and a focus on sustainability, ExpertBook P5 is the perfect companion for on-the-go professionals seeking peak performance and efficiency.

The future of work
Crafted with meticulous attention to detail, ExpertBook P5 boasts a premium aluminum design that seamlessly blends aesthetics and ergonomics. Despite its lightweight construction, at just 1.29 kg, P5 offers exceptional durability — meeting the exacting US MIL-STD 810H military standard. Its thoughtfully designed workspace, featuring conveniently placed function keys and a spacious mouse area, optimizes productivity and comfort during video conferences and multitasking. Engineered with the ASUS ExpertCool thermal structure, a newly-enhanced cooling design, the ExpertBook P5 ensures consistent, optimal cooling whether the lid is open or closed, guaranteeing peak performance even during extended usage. It is a productivity powerhouse designed to elevate professional performance, empowering users to achieve their full potential.

According to a recent Reuters report, Intel's 18A node doesn't seem to be production-ready. As the sources indicate, Broadcom has been reportedly testing Intel's 18A node on its internal company designs, which include an extensive range of products from AI accelerators to networking switches. However, as Broadcom received the initial production run from Intel, the 18A node seems to be in a worse state than initially expected. After testing the wafers and powering them on, Broadcom reportedly concluded that the 18A process is not yet ready for high-volume production. With Broadcom's comments reflecting high-volume production, it signals that the 18A node is not producing a decent yield that would satisfy external customers.

While this is not a good sign of Intel's Fundry contract business development, it shows that the node is presumably in a good state in terms of power/performance. Intel's CEO Pat Gelsinger confirmed that 18A is now at 0.4 d0 defect density, and it is now a "healthy process." However, alternatives exist at TSMC, which proves to be a very challenging competitor to take on, as its N7 and N5 nodes had a defect density of 0.33 during development and 0.1 defect density during high-volume production. This leads to better yields and lower costs for the contracting party, resulting in higher profits. Ultimately, it is up to Intel to improve its production process further to satisfy customers. Gelsinger wants to see Intel Foundry as "manufacturing ready" by the end of the year, and we can see the first designs in 2025 reach volume production. There are still a few more months to improve the node, and we expect to see changes implemented by the end of the year.

ASUS today announced that it showcased its latest technological innovations at the Always Incredible Media Day for IFA 2024 in Berlin, Germany. The company highlighted its commitment to its Ubiquitous AI. Incredible Possibilities vision by unveiling a new portfolio of next-generation ASUS Copilot+ PCs. Equipped with the latest Intel Core Ultra processors (Series 2), they deliver style, robust features and functionality, robust connectivity and heighten levels of performance alongside AI capabilities. ASUS has harnessed the full potential of Intel Core Ultra processors (Series 2) in the latest ASUS NUC mini PC. This new model outperforms the competition with superior performance, while maintaining an impressively compact design and robust array of connections and expansion support. With an integrated NPU delivering up to 48 TOPS, it enabled on-device AI capabilities. The NUC 14 Pro Ai will receive a free update to Copilot+ PC experiences when available.

The company's collaboration with Intel has been key in bringing these cutting-edge devices to life. "The powerful Intel Core Ultra processors at the heart of our latest Zenbook, Vivobook, ExpertBook laptops, and NUC Mini PC deliver unmatched performance and enable a wide range of AI experiences," said Rangoon Chang, ASUS Corporate Vice President, Consumer Business Unit. "With these new devices, together we are empowering users to harness the full potential of AI to enjoy smarter, more intuitive computing."

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable.

Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.

Shuttle, a leading manufacturer of Mini-PCs, presents the new XPC all-in-one P25N, which has been developed specifically for use in point of sale (POS) environments. The P25N combines a compact design with modern technology and robust properties so it can cater perfectly for the requirements in retail and hospitality.

Compact and powerful
The P25N is Shuttle's smallest all-in-one PC to date and impresses with the amount of space it saves. With an Intel N100 processor from the 12th generation and up to 16 GB of DDR5 RAM, the machine delivers powerful performance designed to handle any standard POS applications. The 11.6-inch multitouch display with a resolution of 1366 x 768 pixels and IP54 protection is both dust-proof and splash-proof, which means the P25N can withstand any environmental influences.

LG Electronics (LG) is excited to announce that its newest LG gram laptop featuring the Intel Core Ultra processor (Series 2) will be showcased at the Intel Core Ultra Global Launch Event from September 3-8. Renowned for its powerful performance and ultra-lightweight design, the LG gram series now integrates advanced AI capabilities powered by the latest Intel Core Ultra processor. The LG gram 16 Pro, the first model to feature these new Intel processors, will be unveiled before its release at the end of 2024.

As the first on-device AI laptop from the LG gram series, it offers up to an impressive 48 neural processing unit (NPU) tera operations per second (TOPS), setting a new standard for AI PCs and providing the exceptional performance required for Copilot experiences. Powered by the latest Intel Core Ultra processor, the LG gram 16 Pro is now more efficient thanks to advanced AI functionalities such as productivity assistants, text and image creation and collaboration tools. What's more, its extended battery life helps users handle tasks without worry.

Samsung Electronics today announced the Galaxy Book5 Pro 360, a Copilot+ PC and the first in the all-new Galaxy Book5 series. Performance upgrades made possible by the Intel Core Ultra processors (Series 2) bring next-level computing power, with up to 47 total TOPs NPU - and more than 300 AI-accelerated features across 100+ creativity, productivity, gaming and entertainment apps. Microsoft Phone Link provides access to your Galaxy phone screen on a larger, more immersive PC display, enabling use of fan-favorite Galaxy AI features like Circle to Search with Google, Chat Assist, Live Translate and more. And with the Intel ARC GPU, graphics performance is improved by 17%. When paired with stunning features like the Dynamic AMOLED 2X display with Vision Booster and 10-point multi-touchscreen, Galaxy Book5 Pro 360 allows creation anytime, anywhere.

"The Galaxy Book5 series brings even more cutting-edge AI experiences to Galaxy users around the world who want to enhance and simplify their everyday tasks - a vision made possible by our continued collaboration with longtime industry partners," said Dr. Hark-Sang Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "As one of our most powerful PCs, Galaxy Book5 Pro 360 brings together top-tier performance with Galaxy's expansive mobile AI ecosystem for the ultimate AI PC experience."

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable. Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.

"MSI not only brings the industry's most comprehensive AI+ PC lineup but also introduces multiple new laptops and handheld devices designed for gamers worldwide," said Eric Kuo, MSI's Executive Vice President and General Manager of NB Business Unit. "We welcome global guests to visit the MSI booth to experience next-gen AI computing and exciting gaming products."

Intel today launched its most efficient family of x86 processors ever, the Intel Core Ultra 200V series processors. They deliver exceptional performance, breakthrough x86 power efficiency, a massive leap in graphics performance, no-compromise application compatibility, enhanced security and unmatched AI compute. The technology will power the industry's most complete and capable AI PCs with more than 80 consumer designs from more than 20 of the world's top manufacturing partners, including Acer, ASUS, Dell Technologies, HP, Lenovo, LG, MSI and Samsung. Pre-orders begin today with systems available globally on-shelf and online at over 30 global retailers starting Sept. 24. All designs featuring Intel Core Ultra 200V series processors and running the latest version of Windows are eligible to receive Copilot+ PC features as a free update starting in November.

"Intel's newest Core Ultra processors set the industry standard for mobile AI and graphics performance, and smash misconceptions about x86 efficiency. Only Intel has the scale through our partnerships with ISVs and OEMs, and the broader technology ecosystem, to provide consumers with a no-compromise AI PC experience."
--Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group

Intel's 13th and 14th generation processors, codenamed "Raptor Lake" and "Raptor Lake Refresh," have been notoriously riddled with stability issues over the past few months, up until Intel shipped the 0x129 microcode update on August 10 to fix these issues. However, the upcoming Intel Core Ultra 200 "Arrow Lake" and 200V series "Lunar Lake" processors will not have these issues as the company confirmed that an all-new design is used, even for the segment of power regulation. The official company note states: "Intel confirms that its next generation of processors, codenamed Arrow Lake and Lunar Lake, are not affected by the Vmin Shift Instability issue due to the new architectures powering both product families. Intel will ensure future product families are protected against the Vmin Shift Instability issue as well."

Originally, Intel's analysis for 13th—and 14th-generation processors indicated that stability issues stemmed from excessive voltage during processor operation. These voltage increases led to degradation, raising the minimum voltage necessary for stable performance, which Intel refers to as "Vmin shift." Given that the design phase of new architectures lasts for years, Intel has surely anticipated that the old power delivery could yield problems, and the upcoming CPU generations are now exempt from these issues, bringing stability once again to Intel's platforms. When these new products launch, all eyes will be on the platform's performance, but with a massive interest in stability testing from enthusiasts.

Intel is reportedly exploring the sale of its Altera business, a move guided by CEO Pat Gelsinger as part of broader restructuring efforts. Acquired by Intel in 2015 for $16.7 billion, Altera, formerly known as the Programmable Solutions Group, has been a profitable segment. However, with Intel facing financial strain due to extensive spending, the company is now considering divesting its FPGA business to recoup capital. Currently, Altera operates as a separate entity within Intel, relying on the tech giant for R&D, sales, marketing, and support. Gelsinger is expected to propose the sale at a board meeting scheduled for mid-September, where he will outline his vision for Intel's future. This restructuring could also affect other parts of Intel's operations, including its Foundry business.

While previous reports suggested that Intel might spin off its Foundry unit or sell it to industry leaders like TSMC or Samsung, the latest information indicates that Intel plans to retain this division, albeit with scaled-back expansion efforts. The $32 billion factory in Germany, for example, may be scrapped, along with other capital-intensive projects, and other capital expansions may also be put on hold. Pat Gelsinger's vision still needs to be finalized and is still in the drafting phase, so until the mid-September board meeting, we have to wait to gain more information.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, launches the flagship iGame Z790D5 Vulcan W and Z790D5 Vulcan X motherboards. First seen at COMPUTEX 2024, the iGame Z790D5 Vulcan is available in white and black models and comes in an E-ATX form-factor. The motherboard comes equipped with the latest technologies including USB4 40 Gbps connectivity and the latest Wi-Fi 7 solution.

Designed for high-performance gaming and content creation, the iGame Z790D5 Vulcan W/X motherboards are equipped with a 19+1+1 power phase design with DrMos 105 A power stages. Furthermore, the motherboard has a dedicated LN2 Mode for extreme overclocking. The motherboard's server-grade 8-layer low-loss PCB helps achieve higher and stable overclocks.

Thermal Grizzly Holding GmbH presents the Intel Mycro Direct-Die RGB PRO V1, an optimized version of the Intel Mycro Direct-Die water cooler. In addition to a new design, the Pro version offers one thing above all: better cooling performance! Various changes to the microfin structure of the base plate, combined with a revised water flow, enable up to 6 degrees Celsius lower processor temperatures under full load.

The optimized cooling channel slot width on the surface of the Intel Mycro Direct-Die Pro RGB V1's copper base plate allows for 43 percent more cooling fins compared to the standard version. Additionally, a specially developed jet plate reduces the flow resistance of the cooler, enabling the Intel Mycro Direct-Die Pro RGB V1 to achieve a higher flow rate in liters per minute at the same pump speed as the Intel Mycro Direct-Die V1. This increased flow means that the pump can either be turned down to reduce noise or used to dissipate more waste heat at the same noise level.

According to a recent report from Bloomberg, Intel is in talks with investment banks about a possible spin-out of its foundry business, as well as scraping some existing expansion plans to cut losses. As the report highlights, sources close to Intel noted that the company is exploring various ways to deal with the recent Q2 2024 earnings report. While Intel's revenues are in decline, they are still high. However, the profitability of running its business has declined so much that the company is now operating on a net loss, with an astonishing $1.61 billion in the red. CEO Pat Gelsinger is now exploring various ways to control these losses and make the 56-year-old giant profitable again. Goldman Sachs and Morgan Stanley are reportedly advising Intel about its future moves regarding the foundry business and overall operations.

The Intel Foundry unit represents the biggest consumer of the company's funds, as the expansion plans across the US and Europe are costing Intel billions of US Dollars. Even though the company receives various state subsidies to build semiconductor manufacturing facilities, it still has to put much of its capital to work. Given that the company is running tight on funds, some of these expansion plans that are not business-critical may get scraped. Additionally, running the foundry business is also turning out to be rather costly, with Q2 2024 recording a negative 65.5% operating margin. Separating Intel Product and Intel Foundry may be an option, or even selling the foundry business as a whole is on the table. Whatever happens next is yet to be cleared up. During the Deutsche Bank Technology Conference on Thursday, Pat Gelsinger also noted that "It's been a difficult few weeks" for Intel, with many employees getting laid off to try to establish new cost-saving measures.

Leading global motherboard manufacturer, ASRock has announced that its W790 series workstation motherboards, including the W790 WS and W790 WS R2.0, now support the newly released Intel Xeon W-3500 series and Xeon W-2500 series processors. This enables consumers to experience the superior performance of the latest Intel Xeon series processors.

The ASRock W790 WS series workstation motherboards feature up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

IBM and Intel announced a global collaboration to deploy Intel Gaudi 3 AI accelerators as a service on IBM Cloud. This offering, which is expected to be available in early 2025, aims to help more cost-effectively scale enterprise AI and drive innovation underpinned with security and resiliency. This collaboration will also enable support for Gaudi 3 within IBM's watsonx AI and data platform. IBM Cloud is the first cloud service provider (CSP) to adopt Gaudi 3, and the offering will be available for both hybrid and on-premise environments.

"Unlocking the full potential of AI requires an open and collaborative ecosystem that provides customers with choice and accessible solutions. By integrating Gaudi 3 AI accelerators and Xeon CPUs with IBM Cloud, we are creating new AI capabilities and meeting the demand for affordable, secure and innovative AI computing solutions," said Justin Hotard, Intel executive vice president and general manager of the Data Center and AI Group.