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ASUS Announces ESC N8-E11 AI Server with NVIDIA HGX H200

ASUS today announced the latest marvel in the groundbreaking lineup of ASUS AI servers - ESC N8-E11, featuring the intensely powerful NVIDIA HGX H200 platform. With this AI titan, ASUS has secured its first industry deal, showcasing the exceptional performance, reliability and desirability of ESC N8-E11 with HGX H200, as well as the ability of ASUS to move first and fast in creating strong, beneficial partnerships with forward-thinking organizations seeking the world's most powerful AI solutions.

Shipments of the ESC N8-E11 with NVIDIA HGX H200 are scheduled to begin in early Q4 2024, marking a new milestone in the ongoing ASUS commitment to excellence. ASUS has been actively supporting clients by assisting in the development of cooling solutions to optimize overall PUE, guaranteeing that every ESC N8-E11 unit delivers top-tier efficiency and performance - ready to power the new era of AI.

Intel Xeon 6 Delivers up to 17x AI Performance Gains over 4 Years of MLPerf Results

Today, MLCommons published results of its industry-standard AI performance benchmark suite, MLPerf Inference v4.1. Intel submitted results across six MLPerf benchmarks for 5th Gen Intel Xeon Scalable processors and, for the first time, Intel Xeon 6 processors with Performance-cores (P-cores). Intel Xeon 6 processors with P-cores achieved about 1.9x geomean performance improvement in AI performance compared with 5th Gen Xeon processors.

"The newest MLPerf results show how continued investment and resourcing is critical for improving AI performance. Over the past four years, we have raised the bar for AI performance on Intel Xeon processors by up to 17x based on MLPerf. As we near general availability later this year, we look forward to ramping Xeon 6 with our customers and partners," said Pallavi Mahajan, Intel corporate vice president and general manager of Data Center and AI Software.

Intel Launches Xeon W-3500 and W-2500 Series Workstation Processors

Intel today launched its Xeon W-3500 series and Xeon W-2500 series workstation processors. These chips are based on the "Sapphire Rapids" microarchitecture featuring the enterprise version of "Golden Cove" P-cores. These are a refresh over the Xeon W-3400 series and W-2400 series, as they feature higher CPU core counts, L3 cache, and clock speeds, at given price-points. Intel has also slightly de-cluttered its lineup with this series. The key difference between the W-3500 series and the W-2500 series, is that the former comes with 8-channel DDR5 memory interface and 112 PCI-Express Gen 5 lanes; while the latter offers a 4-channel DDR5 memory interface, along with 64 PCI-Express Gen 5 lanes. The W-2500 series also comes with lower CPU core counts compared to the W-3500, which is somewhat made up for with higher CPU clock speeds. Perhaps the highlight of this refresh is that now Intel sells CPU core counts of up to 60-core/120-thread in the workstation segment. The W-3400 series had topped off at 36-core/72-thread.

The series is led by the Xeon W9-3595X. This beast maxes out the "Sapphire Rapids" chip, with a 60-core/120-thread configuration, with each of the 60 cores featuring 2 MB of dedicated L2 cache, and sharing 112.5 MB of L3 cache. The chip comes with a base frequency of 2.00 GHz, and a maximum boost frequency of 4.80 GHz. The next highest SKU sees a rather steep drop in core-counts, with the Xeon W9-3575X coming in with a 44-core/88-thread configuration, along with 97.5 MB of shared L3 cache, besides the 2 MB of dedicated L2 cache per core. This chip ticks at 2.20 GHz base, along with 4.80 GHz maximum boost. There's yet another steep drop in core-counts with the Xeon W7-3545, featuring a 24-core/48-thread configuration, 67.5 MB of shared L3 cache, 2.70 GHz base frequency, and 4.80 GHz maximum boost.

Intel Readies "Arrow Lake" Variant with Oversized iGPU to Take on AMD "Strix Halo"

AMD "Strix Halo" isn't just a mobile processor with an oversized iGPU meant to power "gaming ultraportables," it has other potential applications such as game consoles (both handheld and standalone). Not willing to cede this market to AMD, Intel is reportedly readying its own such chip, which is being reported as the "Arrow Lake Halo" for the lack of an official name. This chip will feature a large iGPU based on the Xe2 "Battlemage" graphics architecture, the variant of Xe2 Intel plans to use for its next-generation Arc discrete GPUs. The CPU compute complex will be carried over from the regular "Arrow Lake" chips, and feature a mix of "Lion Cove" P-cores, and "Skymont" E-core clusters.

To meet the higher memory bandwidth demand that arises from a high-performance iGPU and CPU, AMD designed the RDNA 3.5 graphics architecture to be more LPDDR5-aware, since at the physical layer, LPDDR operates differently from GDDR. Intel will probably do something similar, and deploy a 256-bit wide LPDDR5/x memory interface replacing the 128-bit wide interface the regular "Arrow Lake" mobile chips come with. Whether "Arrow Lake Halo" and "Strix Halo" remain competitive will depend a lot on which gaming experiences the two companies want to sell. The way the iGPU of "Strix Halo" is rumored to be specced suggests something that is 1440p-capable, or 4K-capable with FSR 3.

Team Group Launches The T-FORCE DELTA RGB ECO DDR5 Desktop Memory and The TEAMGROUP PD20 Eco Mini External SSD

As the leading global provider of premium storage solutions, Team Group Inc. aligns with international trends and prioritizes environmental sustainability by integrating eco-friendly practices into its core products and developing a wide selection of green products for its customers. Today, Team Group launched the T-FORCE DELTA RGB ECO DDR5 Desktop Memory and the Team Group PD20 ECO Mini External SSD, as a part of the ECO series that highlights the concept of circular economy. Both products feature PCR (post-consumer recycled) plastics and are packaged with FSC-certified materials, fully embodying Team Groupp's commitment to green innovation from product technology to packaging and fostering the spirit of environmental sustainability.

Minisforum Announces New G7 Ti Mini-PC With Core i9-14900HX and RTX 4070

Minisforum is thrilled to announce the launch of the new G7 Ti Mini-PC, a marvel of engineering designed specifically for professionals in AI development, video rendering, 3D design, and AI-driven creative fields. This ultra-compact yet extraordinarily powerful system is set to revolutionize the market, offering top-tier performance in a sleek, space-saving design.

Unleashing Power with Intel Core i9-14900HX
At the heart of the G7 Ti Mini-PC lies the Intel Core i9-14900HX processor, a dynamic powerhouse that brings desktop-caliber performance to a mini-PC format. With its advanced architecture, the i9-14900HX is optimized for high-speed computing tasks and multitasking, making it an ideal choice for professionals who demand efficiency and speed in their workflow.

AAEON Expands its Fanless Embedded Box Offerings with Two New Intel-Powered Mini PCs

AAEON, a leading provider of industrial PC solutions, has introduced two new models to its comprehensive Fanless Embedded Box PC portfolio: the BOXER-6645U-RPL and the BOXER-6406U-ADN. The concurrent launch of these two products underscores AAEON's dedication to delivering high-quality industrial computing systems that cater to diverse application requirements, while leveraging the full spectrum of Intel processing technology.

The BOXER-6645U-RPL is a high-performance embedded PC with cross-generation CPU compatibility, as indicated by its support for 12th, 13th, and 14th Generation Intel Core socket-type processors, up to 65 W. Consequently, AAEON anticipates that the BOXER-6645U-RPL will serve as an optimal solution for customers seeking robust and easily deployable hardware capable of managing highly demanding workloads.

Intel Targets 35% Cost Reduction in Sales and Marketing Group, Bracing for Tough Times Ahead

Intel's Sales and Marketing Group (SMG) has announced a 35% reduction in costs as the company looks to streamline operations and adapt to challenging market conditions. The cuts, revealed during an all-hands meeting on August 5th, will impact both jobs and marketing expenses within the SMG. Intel has directed the group to "simplify programs end-to-end" by the end of the year, a directive that comes on the heels of the company's announcement that it would lay off 15% of its global workforce to save $10 billion in operating expenses. "We are becoming a simpler, leaner, and more agile company that's easier for partners and customers to work with while ensuring we focus our investments on areas where we see the greatest opportunities for innovation and growth," Intel said in a statement to CRN. The company emphasized that this restructuring is about "building a stronger Intel for the future," with partners integral to its plans.

The job cuts within the SMG are expected to target overlapping responsibilities, such as account managers and industry-focused teams, which can confuse customers navigating Intel's complex organization. Additionally, the company plans to significantly reduce its marketing budget and simplify programs, aiming to save at least $100 million in the latter half of 2024 and an additional $300 million in the first half of 2025. The impact will also be felt in Intel's market development fund (MDF), a crucial tool for supporting OEMs and other partners through events, training, and more. An ex-Intel executive warned that the MDF had become vital as the company's product leadership waned, allowing it to maintain valuable relationships with partners. As Intel navigates these changes, its partners are bracing for the impact, with one CEO describing the situation as everyone "hunkering down and just waiting to hear something." Another partner executive expressed concerns about Intel's ability to maintain the level of service and support its customers have come to expect.

Intel Releases Arc GPU Graphics Drivers 101.5971 Beta

Intel today released the latest version of the Arc GPU Graphics Drivers. Version 101.5971 beta comes with day-zero optimization for "Black Myth: Wukong." It also comes with optimization for "Hunt: Showdown 1896" and "World of Warcraft: The War Within." The drivers also fix a couple of issues with this release. The alpha playtest of Delta Force: Hawk Ops experiences application instability during gameplay, which has been fixed with these drivers. A bug that causes foliage in "Shadow of the Tomb Raider" to exhibit corruption has been fixed. For Core Ultra 100 "Meteor Lake" processors with Arc Graphics, the drivers fix a bug that causes "Force of Warships" to exhibit texture corruption during gameplay. Grab the driver from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5971 Beta

Intel Readies Core Ultra 3 205, Brings E-cores to the "3" Tier

Intel may have debuted its Hybrid (heterogeneous multicore) architecture for the desktop with the 12th Gen Core "Alder Lake-S," but the value-ended Core i3 series SKUs throughout the 12th, 13th, and 14th Gen Core processors have remained 4-core/8-thread traditional multicore chips, with just four P-cores. Intel is about to change this with the Core Ultra 200 series "Arrow Lake-S." According to OneRaichu, a reliable source with Intel leaks, the company is giving finishing touches to a pair of Core Ultra 3 series desktop processor SKUs based on the "Arrow Lake" microarchitecture. These will be 8-core chips, a doubling in core-count form the past generations, but the nature of these 8 cores is not yet known.

Among the SKUs in the leak are the Core Ultra 3 205, and the Core Ultra 3 215, both of which are 8-core chips. The two are probably differentiated in a similar manner to past generations of Intel Core i3 desktop did, using cache sizes (eg: Core i3-10100 and i3-10300). The chips probably feature a 4P+4E core configuration, as a "2P+6E" configuration might not be possible, as the E-core clusters are indivisible, although we don't know if the same rule applies to the "Skymont" E-core clusters. The dedicated L2 caches of both the P-cores and E-core clusters could be smaller than on Core Ultra 5 and above SKUs. The Core Ultra 200V "Lunar Lake" processor uses "Lion Cove" P-cores with 2.5 MB of L2 cache per core, while the Core Ultra 9 285K probably has "Lion Cove" P-cores with 3 MB of L2 cache per core.

Intel Core Ultra "Arrow Lake-S" Launches in October

With AMD having launched its new processor generation, all eyes are now on the Core Ultra 200 series "Arrow Lake." We finally have some idea about its launch date, thanks to a leak by Benchlife.info. Apparently, Intel is launching the Core Ultra 200 "Arrow Lake-S" series processor family on October 10, 2024. At this point it's not known if this will be a low-key media event, or a completely online launch, since Intel has pulled the plug on the Innovation 2024 event, which would have been the launchpad for these processors. The October 10 date aligns with past rumors that pointed to a Q4-2024 launch for at least the -K and -KF desktop processor SKUs targeting PC enthusiasts and gamers; with the series putting on bulk in 2025. We've gone into the probable SKUs Intel will launch in its first wave in our older article, here.

Intel Core Ultra 200 "Arrow Lake-S" Lineup and Clock Speeds Revealed

Intel is preparing at least twelve Core Ultra 200-series "Arrow Lake-S" desktop processor SKUs for the consumer segment, with more variants possible for the commercial desktop segment in the future. Q4 2024 could see the company debut its first SKUs targeting the PC enthusiast and gamer crowd with as many as five unlocked K or KF series SKUs. These, and finer details such as clock speeds, were revealed in a massive info dump by Jaykihn, a reliable source with Intel leaks. Intel is expected to debut the series later this year with the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF; and the Core Ultra 5 245K and 245KF. The company is skipping a KF SKU for its top Core Ultra 9 part.

As has been consistent for several past generations of Intel processors, the top Core Ultra 9 (formerly Core i9) tier gets Thermal Velocity Boost, Turbo Boost Max 3.0, and classic Turbo Boost 2.0. The 285K maxes out the "Arrow Lake-S" B0 silicon, enabling all 8 "Lion Cove" P-cores, and all 16 "Skymont" E-cores. It comes with a P-core base frequency of 3.70 GHz, and an impressive 3.20 GHz E-core base frequency. The maximum P-core boost frequency achievable for up to two cores is 5.70 GHz, and 3-6 as well as 7-8 cores boost up to 5.40 GHz, making it the all-P-core boost frequency for this chip. The four E-core clusters are assured an all-E-core boost frequency of 4.60 GHz. The iGPU has 64 execution units, and ticks at up to 2.00 GHz.

Top Intel Core Ultra 9 "Arrow Lake-S" Part Boost Clocks Surface

Intel Core Ultra "Arrow Lake-S" desktop processors are expected to debut later this year, and introduce the new Lion Cove P-cores, along with Skymont E-cores to the desktop platform. Engineering samples and qualification samples with specs close to retail chips seem to already be in the hands of PC OEMs and motherboard vendors, given the volume of leaks over the past few days. Jaykihn0, one of the more influential sources of these leaks, revealed a few interesting details of the maximum boost frequencies of these chips.

The QS of a top Core Ultra 9 "Arrow Lake-S" SKU, probably the flagship model that succeeds the current Core i9-14900K, is described as having a maximum P-core boost frequency of 5.70 GHz, and an all-P-core boost frequency of 5.40 GHz. The maximum E-core boost frequency, which is also the all-E-core boost frequency, is said to be 4.60 GHz. Let's unpack this. "Arrow Lake" uses the same mix of "Lion Cove" P-cores and "Skymont" E-cores as "Lunar Lake," albeit arranged along a ringbus, and sharing an L3 cache, unlike on "Lunar Lake," where the P-cores have their own exclusive L3 cache, and the E-cores are arranged in a low-power island, with the fabric of the SoC tile connecting the two.

TSMC Reportedly to Manufacture SoftBank's AI Chips, Replacing Intel

SoftBank has reportedly decided against using Intel's foundry for its ambitious AI venture, Project Izanagi, and is opting for TSMC instead. The conglomerate aims to challenge NVIDIA in the AI accelerator market by developing its own AI processors. This decision marks another setback for Intel, which has faced several challenges recently. In February 2024, reports emerged that SoftBank's CEO, Masayoshi Son, planned to invest up to $100 billion to create a company similar to NVIDIA, focused on selling AI accelerators. Although SoftBank initially worked with Intel, it recently switched to TSMC, citing concerns about Intel's ability to meet demands for "volume and speed."

The decision, reported by the Financial Times, raises questions about Intel's future involvement and how SoftBank's ownership of Arm Holdings will factor into the project. While TSMC is now SoftBank's choice, the foundry is already operating at full capacity, making it uncertain how it will accommodate this new venture. Neither SoftBank, Intel nor TSMC has commented on the situation, but given the complexities involved, it will likely take time for this plan to materialize. SoftBank will need to replicate NVIDIA's entire ecosystem, from chip design to data centers and a software stack rivaling CUDA, a bold and ambitious goal.

"Sinkclose" Vulnerability Affects Every AMD CPU Dating Back to 2006

A critical security flaw known as "Sinkclose" (CVE-2023-31315) has been identified in all AMD processors dating back to 2006, potentially affecting hundreds of millions of devices worldwide. This vulnerability allows malicious actors to exploit the chip architecture, leading to unauthorized access to sensitive data. Researchers Enrique Nissim and Krzysztof Okupski, researchers from the security firm IOActive, have revealed that the vulnerability can be exploited through various methods, enabling attackers to extract confidential information from affected systems, including passwords and personal data. The issue is especially concerning, given that it is present in all AMD CPUs made in the last 18 years and their widespread use in both consumer and enterprise environments. However, to exploit this vulnerability, an attacker must possess access to system's kernel. Downloading of malware-infused files can trigger it, so general safety measures are recommended.

The Sinkclose method exploits a little-known capability in AMD processors called TClose. This name is a blend of "TClose" and "Sinkhole," with the latter referring to a previous vulnerability found in Intel's System Management Mode in 2015. AMD chips employ a protective mechanism named TSeg, which blocks operating systems from accessing a specific memory area reserved for System Management Mode (SMM), known as System Management Random Access Memory (SMRAM). However, the TClose feature is designed to maintain backward compatibility with older hardware that might use the same memory addresses as SMRAM. It does this by remapping memory when activated. The security experts discovered that they could manipulate this TClose remapping function using only standard operating system permissions. By doing so, they could deceive the SMM into retrieving altered data, enabling them to redirect the processor and run their own instructions with the high-level privileges of SMM. This technique essentially allows attackers to bypass standard security measures and execute malicious code at one of the most privileged levels of the processor, potentially compromising the entire system.

Samsung to Install High-NA EUV Machines Ahead of TSMC in Q4 2024 or Q1 2025

Samsung Electronics is set to make a significant leap in semiconductor manufacturing technology with the introduction of its first High-NA 0.55 EUV lithography tool. The company plans to install the ASML Twinscan EXE:5000 system at its Hwaseong campus between Q4 2024 and Q1 2025, marking a crucial step in developing next-generation process technologies for logic and DRAM production. This move positions Samsung about a year behind Intel but ahead of rivals TSMC and SK Hynix in adopting High-NA EUV technology. The system is expected to be operational by mid-2025, primarily for research and development purposes. Samsung is not just focusing on the lithography equipment itself but is building a comprehensive ecosystem around High-NA EUV technology.

The company is collaborating with several key partners like Lasertec (developing inspection equipment for High-NA photomasks), JSR (working on advanced photoresists), Tokyo Electron (enhancing etching machines), and Synopsys (shifting to curvilinear patterns on photomasks for improved circuit precision). The High-NA EUV technology promises significant advancements in chip manufacturing. With an 8 nm resolution capability, it could make transistors about 1.7 times smaller and increase transistor density by nearly three times compared to current Low-NA EUV systems. However, the transition to High-NA EUV comes with challenges. The tools are more expensive, costing up to $380 million each, and have a smaller imaging field. Their larger size also requires chipmakers to reconsider fab layouts. Despite these hurdles, Samsung aims for commercial implementation of High-NA EUV by 2027.

MSI Introduces New PRO DP21 14MQ Business Desktop

MSI proudly announces the launch of the PRO DP21 14MQ series, the latest addition to its esteemed business desktops. This new model features a compact 2.3-liter chassis, designed to excel in confined workspaces without sacrificing performance. The PRO DP21 14MQ supports Intel vPro technology and DDR5 memory, delivering robust security, efficient remote management, reliable materials, and high-speed data processing. The Intel vPro platform stands out with its essential features, including hardware-based security, remote manageability, and reliable performance, making it the ultimate solution for businesses prioritizing IT security and productivity. Moreover, the PRO DP21 14MQ boasts a rear USB 10 Gbps Type C, a new front USB 5 Gbps Type C port, and a total of 6 USB type A ports, leading to faster data transfer speeds.

The PRO DP21 14MQ is designed with versatility in mind and is VESA mountable, enabling users to effortlessly attach it to a monitor or wall. It also supports MSI Power Link, enabling the PRO DP21 14MQ series desktop to be powered on by an MSI-selected monitor. This ensures a seamless user experience, efficient power management, and enhanced connectivity, especially when mounted behind a monitor.

Eurocom Launches 14-inch and 16-inch Blitz Ultra Enterprise Class Laptop

Eurocom launches the Blitz Ultra, a 14-inch and 16-inch enterprise class laptop loaded with features related to security and manageability while carrying unmatched connectivity and expandability. It is powered by Intel's ultra-efficient 14th-gen Intel Ultra Meteor Lake Processor, a robust 73Wh 10hrs+ battery and a captivating 16:10 screen. Your productivity will soar to new heights. Heavy duty, yet lightweight 1.6 kg / 3.52 lbs design that meets military standard MIL-STD 810H. When it comes to security features, the Blitz Ultra has built-in TPM 2.0 data-encryption module, BIOS support for SED (Self Encrypting Drives) and a Kensington lock making it the ultimate enterprise-class laptop for security, connectivity and expandability.

"The Eurocom Blitz Ultra is designed for government, military, security, healthcare and corporate professionals engaged in mission-critical computing and/or handling corporate IP assets and/or customer's sensitive data. It provides secure access via data encryption via TPM 2.0 module. Blitz Ultra has a Factory- installed Offline Permanent Disconnect Option. This is an optional upgrade to physically remove all connectivity and communications components to ensure a 100% offline system for maximum security of sensitive data and protection of intellectual property. " - Mark Bialic, Eurocom President.

Intel Core Ultra 200V "Lunar Lake" Launches on September 3: Acer

Intel's ambitious new ultraportable mobile processor series, the Core Ultra 200V series "Lunar Lake," launches on September 3, according to an Acer announcement for a media event covering the launch of its notebooks based on these chips. Acer scheduled this event on September 4, which means Intel to launch these processors no later than September 3. Media events by PC OEMs tend to follow a day after Intel's launch of a new processor generation or platform. A September 3 launch would precede the IFA 2024 Conference in Berlin, which kicks off on September 6, but which is open to press and industry delegates a little sooner, as is the norm for trade shows.

The Core Ultra 200V "Lunar Lake" is Intel's first processor generation to implement MoP (memory on package), eliminating the need for discrete memory modules. This reduces the Z height as well as PCB footprint of the platform, enabling thinner notebooks. MoP also has certain power and latency advantages compared to discrete memory. The compute complex of "Lunar Lake" consists of a 4P+4E CPU with "Lion Cove" P-cores, and "Skymont" E-cores. This is also the first processor to debut Intel's Xe2 "Battlemage" graphics architecture, as it powers its iGPU. It packs a powerful NPU that meets Microsoft Copilot+ AI PC requirements. You can learn all about "Lunar Lake" in our architecture deep-dive.

Intel Parts Ways with Arm Holdings, Sells Entire Stake

As Intel's recent challenges continue, the company just sold its 1.18 million share stake in Arm Holdings during Q2, as revealed in a recent regulatory filing, according to Reuters. The sale potentially generated around $146.7 million for Intel, based on Arm's average stock price between April and June. The company recently announced plans to reduce its workforce by over 15% (about 15,000 jobs) and suspend dividend payments, reflecting a downturn in traditional data center semiconductor demand and a shift towards AI chips, a sector where Intel trails competitors like NVIDIA.

CEO Pat Gelsinger is steering Intel towards developing advanced AI chips and expanding its contract manufacturing capabilities, aiming to regain ground lost to Taiwan's TSMC, the industry's leading contract chipmaker. This strategic pivot has increased costs and squeezed profit margins, necessitating cost-cutting measures.

"Black Myth: Wukong" Game Gets Benchmarking Tool Companion Designed to Evaluate PC Performance

Game Science, the developer behind the highly anticipated action RPG "Black Myth: Wukong," has released a free benchmark tool on Steam for its upcoming game. This standalone application, separate from the main game, allows PC users to evaluate their hardware performance and system compatibility in preparation for the game's launch. The "Black Myth: Wukong Benchmark Tool" offers a unique glimpse into the game's visuals by rendering a real-time in-game sequence. While not playable, it provides valuable insights into how well a user's system will handle the game's demanding graphics and performance requirements. One of the tool's standout features is its customization options. Users can tweak various graphics settings to preview the game's visuals and performance under different configurations. This flexibility allows gamers to find the optimal balance between visual fidelity and smooth gameplay for their specific hardware setup.

However, Game Science has cautioned that due to the complexity and variability of gaming scenarios, the benchmark results may not fully represent the final gaming experience. This caveat shows the tool's role as a guide rather than a definitive measure of performance. The benchmark tool's system requirements offer a clear picture of the hardware needed to run "Black Myth: Wukong." At a minimum, users will need a Windows 10 system with an Intel Core i5-8400 or AMD Ryzen 5 1600 processor, 16 GB of RAM, and either an NVIDIA GeForce GTX 1060 6 GB or AMD Radeon RX 580 8 GB graphics card. For an optimal experience, the recommended specifications include an Intel Core i7-9700 or AMD Ryzen 5 5500 processor and an NVIDIA GeForce RTX 2060, AMD Radeon RX 5700 XT, or Intel Arc A750 graphics card. Interestingly, the benchmark tool supports DLSS, FSR, and XeSS technologies, indicating that the final game will likely include these performance-enhancing features. The developers also strongly recommend using an SSD for storage.

AMD Gains Data Center Market Share in Q2 2024, Drops Share in Desktop Segment

In a recent report by Mercury Research, AMD has shown significant progress in the CPU market during Q2 2024, particularly in the data center and laptop segments. AMD's most notable achievement comes in the server CPU space, where it now holds 24.1% of the market, a 5.6% increase year-over-year, and a 0.5% increase from the previous quarter. This growth is particularly impressive in terms of revenue, with AMD capturing 33.7% of server CPU revenue despite its lower unit share. This suggests that AMD's high-end EPYC processors carry premium prices in the data center market and are most of the unit volume. AMD has also made advancements in the laptop CPU segment, reaching a 20.3% market share. This represents a 1% increase from the previous quarter and a 3.8% rise year-over-year. The company's success in laptops can be attributed to solid demand for its existing products, propelled by Intel's reported supply issues with Meteor Lake processors.

However, AMD experienced a slight setback in the desktop CPU market, losing a 1% share to Intel quarter-over-quarter. AMD now controls 23% of this segment, compared to Intel's 77%. This dip may be due to AMD's preparation for the launch of its new Zen 5-based CPUs in August. Despite AMD's gains, Intel maintains its overall dominance in the CPU market. In the total client PC space, Intel holds a 78.9% market share, with AMD at 21.1%. Intel still holds the majority of revenue and market share on all fronts. However, AMD is executing well, and Intel's financial troubles could be a setback for team blue. More competition at every front is great to see, and we are curious to look at the data from upcoming quarters and analyze how well both of companies perform.

BIOSTAR Releases BIOS Update For Intel Core 14th and 13th Gen Desktop Processor Instability

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today announces the latest BIOS updates for Intel 700 and 600 series motherboards with the 0x129 microcode to mitigate the instability of the Intel Core 14th /13th Gen desktop processors. In response to recent instability concerns with Intel Core 14th and 13th Gen desktop processors, BIOSTAR releases BIOS update for Intel 700 and 600 series motherboards including the new 0x129 microcode, designed to enhance system stability for best performance.

The first batch release will cover the Z790 VALKYRIE and Z790A-SILVER, with further updates for the entire Intel 700 and 600 series motherboards expected to follow in the coming weeks. For further information, please visit BIOSTAR official website for latest information.

Intel Arc "Battlemage" Graphics Card with 12GB of 19 Gbps GDDR6 Memory Surfaces

A prototype discrete GPU based on the Intel Arc "Battlemage" graphics architecture was spotted in a public boot log by Intel GFX Continuous Integration group. The group is probably testing a prototype discrete GPU with a Linux driver. The OS loads its driver at boot, which puts out a few messages in the boot log, including explicit mention of "Battlemage" as BMG. It also mentions its memory size to be 12 GB, a memory speed of 19 Gbps, and a memory bus width of 192-bit.

It is hence likely that this is a mid-tier GPU from the series, with the top tier one probably featuring a 256-bit memory interface. This aligns with Intel's strategy of targeting the bulk of the gaming graphics market, instead of gunning for the enthusiast class. The new "Battlemage" architecture is expected to make Intel contemporary against rival architectures in the segment, such as NVIDIA "Ada" and AMD RDNA 3, although it remains to be seen if it can square off against the next-generation NVIDIA "Blackwell" and AMD RDNA 4.

Intel Ships 0x129 Microcode Update for 13th and 14th Generation Processors with Stability Issues

Intel has officially started shipping the "0x129" microcode update for its 13th and 14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This critical update is currently being pushed to all OEM/ODM partners to address the stability issues that Intel's processors have been facing. According to Intel, this microcode update fixes "incorrect voltage requests to the processor that are causing elevated operating voltage." Intel's analysis shows that the root cause of stability problems is caused by too high voltage during operation of the processor. These increases to voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin"—it's a theoretical construct, not an actual voltage, think "speed for an airplane required to fly". The latest 0x129 microcode patch will limit the processor's voltage to no higher than 1.55 V, which should avoid further degradation. Overclocking is still supported, enthusiasts will have to disable the eTVB setting in their BIOS to push the processor beyond the 1.55 V threshold. The company's internal testing shows that the new default settings with limited voltages with standard run-to-run variations show minimal performance impact, with only a single game (Hitman 3: Dartmoor) showing degradation. For a full statement from Intel, see the quote below.
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