G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, demonstrates high-speed DDR5 CSO-DIMM memory operating at DDR5-8133 with 48 GB (2x24GB) kit capacity on the newly announced ASRock DeskMini B860 system. CSO-DIMM is a relatively new form factor that adds a clock driver (CKD) onto the compact SO-DIMM design, and is supported by the latest platform generation with Intel Core Ultra 200 series processors.

DDR5-8133 48 GB (2x24GB) Extreme Speed with CSO-DIMM Modules
Thanks to the ASRock DeskMini B860 system that implements DDR5 CSO-DIMM support and provides outstanding memory overclock performance, G.SKILL is able to unleash the ultimate overclock potential of the new high-speed CSO-DIMM memory kits. The screenshot below shows the G.SKILL CSO-DIMM memory kit with 48 GB (2x24GB) running at DDR5-8133 CL46-52-52-130 with the ASRock B860M-STX motherboard and the Intel Core Ultra 9 285 desktop processor.

Ventiva, the leader in thermal solutions, today announced that its Ventiva ICE9 thermal management suite is being featured in a fan-less proof-of-concept laptop design, powered by Intel Lunar Lake processors at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12 mm laptops.

"Ventiva ICE technology offers a revolutionary approach to help achieve thin, light, and silent laptop designs that offer great performance," said Josh Newman, Vice President, Client Computing Group, and General Manager, Product Marketing & Management, Intel. "Intel is excited about the result of the close co-engineering collaboration with Ventiva and Dell Technologies to help ready their technology for future Intel Core Ultra devices."

AAEON, has today announced the release of the GAR-A750E, the company's first advanced graphics card. Built on Intel Arc A750E GPU architecture, the GAR-A750E features 28 Xe-Cores and supports a variety of advanced AI development frameworks in a discreet 236 mm x 109 mm x 42 mm form factor. Designed to handle intensive AI workloads, the GAR-A750E offers substantial raw computing power, with a graphics turbo frequency of 2400 MHz alongside the AI task acceleration capabilities of 448 Intel XMX Engines. Along with its high performance benchmark, the card's Intel Deep Link Technology support—which includes Hyper Compute, Hyper Encode, and Stream Assist - allows it to optimize the Intel Arc A750E GPU's capabilities while maximizing efficiency for efficient multi-tasking and accelerated workflows.

The GAR-A750E is easily integrated into a number of systems and motherboards via PCIe Gen 4 (x16) interface, with AAEON already having confirmed its suitability for use with a number of its own industrial motherboard platforms, including the ATX-Q670A, MAX-Q670A, and MIX-Q670A1, all supporting 13th Generation Intel Core CPUs and built on the Intel Q670E Chipset.

Today's gamers are not just players; we are the innovators and leaders of tomorrow's workforce. As someone who recognizes the incredible potential within our gaming community, I'm committed to supporting your journey both in and out of the game. In our latest announcements focusing on the future of play and work, we've shared exciting updates across various fronts, including some major innovations in gaming. I'm thrilled to introduce even more gear designed to enhance your gaming experience. From the powerful OMEN 16 Laptop and the compact OMEN 16L Desktop to our stunning new OMEN displays and precise HyperX mice, I can't wait to dive into the details and show you how these products will elevate your play and keep you ahead of the curve. We're not just creating innovations; we're shaping the future of play.

Power and Performance for All: The OMEN 16 Laptop and OMEN 16L Desktop
At HP, your feedback is our guiding star. You told us you want smooth, immersive gameplay on machines that stay cool and quiet; we created the third-generation OMEN 16 to be our coolest and quietest version yet. The OMEN 16 elevates your gaming experience with cutting-edge technology and thoughtful design, keeping performance at its peak. Let's dive into the technical specifics.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, just dropped the curtain on two groundbreaking additions to its APEX line: the all-new APEX FORCE and the upgraded APEX RUSH. These state-of-the-art gaming PCs redefine performance, cooling, and customization for the most discerning gamers.

APEX FORCE: There's No Replacement for Displacement
The APEX FORCE features a full-tower chassis design based on the popular Phanteks NV9, concealed rear external cable management, and panoramic tempered glass panels trimmed with a diffused illuminated edge, that maximizes the premium aesthetics of the FORCE. Inside, it's immediately noticeable that MAINGEAR spent countless hours precisely engineering the APEX hardline cooling system with 10-degree offset tubing to perfectly mate with the chassis' unique design language, making the FORCE a masterpiece of functional design and engineering. Upgradable RGB lighting accentuates the cooling components and premium hardware perfectly.

Shuttle is expanding its range of Mini-PCs with the XPC Barebone DH770 from the "XPC slim" family. The 1.3-liter PC offers powerful hardware, extensive connection options and flexible customization options for a wide range of professional applications. With support for 12th, 13th and 14th generation Intel Core processors (LGA1700) and modern DDR5 technology, the DH770 is the ideal solution for applications that require high computing power and reliability.

Outstanding performance and flexibility
The Shuttle XPC Barebone DH770 is based on the Intel H770 chipset and is compatible with the latest Intel Core processors up to the Raptor Lake-S Refresh series. With support for up to 96 GB DDR5 RAM and storage options via M.2 PCIe Gen 4 and SATA, the mini PC offers impressive performance in a compact format. Thanks to the option of operating up to four independent 4K displays simultaneously, the DH770 is ideal for demanding graphical applications, digital signage and control systems.

CyberLink Corp., a leading provider of digital creative editing software and artificial intelligence (AI) solutions, is showcasing the cutting-edge AI capabilities and NPU (Neural Processing Unit) optimizations of their Generative AI digital marketing design software, Promeo, and award-winning video and photo editing software, PowerDirector and PhotoDirector, this week during CES 2025 in Las Vegas.

Cognizant of the expanding adoption from PC makers of the latest Intel LunarLake platform and capabilities for AI, CyberLink's close partnership with Intel is ensuring PC makers releasing LunarLake enabled hardware, from laptops to mini-PCs, will be able to take advantage of CyberLink's creative editing software's AI functionalities.

ASRock has showcased its custom design Intel Arc B580 12 GB "Battlemage" GPU-based graphics cards at CES 2025—these offerings sat somewhat unnoticed next to a whole heap of newly revealed AMD Radeon RX 9070 XT and 9070 models. A TechPowerUp staffer took the opportunity to analyze ASRock's B580 Challenger OC and Steel Legend OC demonstration samples. Team Blue's wallet friendly pricing at launch (around mid-December) resulted in stock being swiftly snapped up—many budget hardware enthusiasts have missed out on handling the initial batches of Battlemage. ASRock's dual-fan Arc B580 Challenger OC sports a new design scheme—also featured on a nearby triple-fan Radeon RX 9070 model. An understated gray-black shroud sports a single RGB lighting strip on its top side.

The longer triple-fan configured ASRock Arc B580 Steel Legend OC model is already a familiar sight for many regular readers of TechPowerUp's review section. W1zzard's mid-December evaluation deemed this card worthy of receiving two awards: "Highly Recommended" and "Great Value." Steel Legend sits above Challenger in ASRock's product hierarchy, so the extra cost gets you an almost all-white design, a larger cooling solution and more RGB lighting zones. The CES 2025 demonstration unit appears to be a normal retail example—no big surprises or revelations to report. We hope that Team Blue and its manufacturing partners are doing their best to replenish B580 GPU stock.

At CES this year, UGREEN was showing off two new NAS models, the NASync iDX6011 and the iDX6011 Pro, with the i in the model name seemingly denoting that both models are using Intel Core Ultra processors. The basic design builds on last years NASync models and the UGOS Pro operating system, but with several added features that may or may not appeal to the target audience. The common feature set between the two models is six 3.5-inch drive bays and a pair of M.2 slots that can be used for either storage or as a cache for the mechanical drives. Both models are expected to ship with 32 GB of RAM as standard and can be expanded to 64 GB and both of them also supports a PCIe 4.0 x8 expansion card slot, although at this point it's not clear what that slot can be used for. As with the already launched NASync models, the two new SKUs will come with the OS installed on a 128 GB SSD.

Where things get interesting is on the connectivity side of things, as both models sports dual 10 Gbps Ethernet ports, what is said to be an 8K capable HDMI port, a pair of USB 3.2 (10 Gbps) ports, two USB 2.0 ports and an SD 4.0 card slot. However, the NASync iDX6011 comes with a pair of Thunderbolt 4 ports around the front, although it's not clear if it can be used as a DAS using these ports, or if they simply act as virtual network ports. The iDX6011 Pro on the other hand, sports two USB Type-C ports around the front—as well as a small status LCD display—in favour of an OCuLink port around the back. The OCuLink port is capable of up to 64 Gbps of bandwidth, compared to 40 Gbps for the Thunderbolt 4 ports. It's currently not know what the OCuLink port can be used for, but it's more or less an external PCIe interface. It's also unknown what type of AI or LLM features the two new NASync devices will support, but it's clear they'll rely on the capabilities of the Intel processors they're built around. No pricing was announced at CES and the NASync iDX6011 is expected to launch sometime in the second quarter this year, with the NASync iDX6011 Pro launching in the third quarter. We should also note that the NASync iDX6011 Pro wasn't on display at CES, hence the renders below.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Thermal Grizzly, a high-performance cooling solutions provider, introduces the Intel 1851 Delid-Die-Mate Heater V1, a tool designed to assist in removing the heat spreader from Intel Core Ultra 200 CPUs using the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of the CPU and the delidder to the required 165°C for delidding.

Delidding processors based on the Intel Arrow Lake architecture (Core Ultra, Pentium) carries a higher risk compared to older Intel CPUs. This is likely due to structural factors such as the size of the CPU die and the fact that the CPU die consists of multiple smaller dies, known as "tiles." To minimize the risk during delidding, the CPU should be heated to approximately 165°C / 330°F to soften the indium solder.

At CES, Intel unveiled an expanded product portfolio and new partnerships designed to accelerate automakers' transitions to electric and software-defined vehicles (SDVs). Intel now offers a whole-vehicle platform, including high-performance compute, discrete graphics, artificial intelligence (AI), power management and zonal controller solutions alongside the Intel Automotive Virtual Design Environment (VDE) co-developed with Amazon Web Services (AWS). Intel's approach addresses automakers' cost and performance scalability challenges, enabling faster, more efficient and more profitable SDV development and deployment.

"Intel automotive is bringing innovative solutions that reduce cost in the SDV revolution. Our whole-vehicle approach, combined with cloud integration, delivers a complete solution that drives down total cost of development and deployment while empowering automakers to build the future of mobility faster, more efficiently and more profitably." said Jack Weast, Intel Fellow, vice president and general manager of Intel Automotive.

UnifyDrive's participation at CES 2025 marked a pivotal moment in the evolution of portable data storage, as the company unveiled the UP6, the world's first AI-equipped portable tablet NAS. Met with overwhelming acclaim, attendees praised the UP6 as a leap forward in portable data storage, combining intuitive file organization, performance, and Artificial Intelligence to meet the demands of creators, businesses, and modern consumers.

Powered by Intel Core Ultra Processor and integrated with a Large Language Model (LLM), the UP6 has reshaped how users interact with their data. The device's ability to enable natural language searches, retrieve local data, and restore and enhance images resonated strongly with attendees. Many praised its potential to revolutionize productivity workflows, with one industry analyst describing it as "a fundamental change in smart storage solutions."

UGREEN, a leading innovator in consumer electronics, is due to showcase its latest innovations at CES 2025 under the theme of "Activate the Possibility of AI." The highlight of the event will be the unveiling of the highly anticipated NASync iDX6011 and NASync iDX6011 Pro devices, which are from the cutting-edge AI NAS lineup of the NASync series. Alongside these groundbreaking products, the Nexode 500 W 6-Port GaN Desktop Fast Charger and the Revodok Max 2131 Thunderbolt 5 Docking Station will also take center stage.

The NASync series AI NAS models are set to redefine expectations with integrated large language models (LLMs) for advanced natural language processing and AI-driven interactive capabilities. Powered by cutting-edge Intel Core Ultra Processors, the iDX6011 and iDX6011 Pro deliver unmatched performance, enabling seamless functionality and exceptional AI applications. These models build on the success of earlier NASync series products, such as the NASync DXP models, which garnered widespread attention and raised over $6.6 million during a Kickstarter campaign in March 2024.

GIGABYTE, the world's leading computer brand, unveiled its next-gen AI PCs at CES 2025. GiMATE, a groundbreaking AI agent for seamless hardware and software control, takes center stage in the all-new lineup, redefining gaming, creation, and productivity in the AI era. Powered by NVIDIA GeForce RTX 50 Series Laptop GPUs and NVIDIA NIM microservices for advanced AI NIM and RTX AI, AMD Ryzen AI, Intel NPU AI, and enhanced by Microsoft Copilot, the AORUS MASTER, GIGABYTE AERO, and the GIGABYTE GAMING series deliver cutting-edge performance with upgraded WINDFORCE cooling in sleek, portable designs.

GiMATE, GIGABYTE's exclusive AI agent, integrates with an advanced Large Language Model (LLM) and the "Press and Speak" feature, making laptop control more natural and intuitive. From AI Power Gear II for optimal energy efficiency to AI Boost II's precision overclocking, GiMATE ensures optimal settings for every scenario. AI Cooling delivers 0dB ambiance, perfect for work environments, while AI Audio and AI Voice optimize sound for any setting. Safeguard your screen with AI Privacy, which detects prying eyes and activates protection instantly. GiMATE aims to be users' smart AI Mate, that redefines laptops in users' daily lives.

Corsair is pleased to announce that the award-winning VENGEANCE Gaming PCs, powered by high-performance Corsair components, now feature the game-changing performance, efficiency, and AI-powered graphics of NVIDIA GeForce RTX 50 Series graphics cards. With world-class components in every category, each VENGEANCE PC delivers ultra-high-performance gaming, exceptional productivity, and expansive creative potential.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

ASUS today announced a significant expansion of its innovative Copilot+ PC lineup, the fastest, most intelligent Windows PCs, bringing artificial intelligence (AI) capabilities to users in every segment—empowering more people than ever to embrace the exciting and burgeoning era of AI.

As AI reshapes both how people interact with technology and their expectations of what a computer should be, our all-new Copilot+ PC lineup is designed to meet the growing demand for more affordable, more efficient, more secure and faster laptops that elevate both personal and professional workflows. Powered by the latest AI-enabled processors from Qualcomm, AMD and Intel, and available in a diverse range of styles and form factors, ASUS is leading the charge in making AI technology universally accessible.

ASUS today announced the 2025 TUF Gaming laptop lineup, including the first 18-inch member of the family. Featuring the latest processors from AMD, Intel, and NVIDIA, the TUF Gaming A16, F16, and A18 aim to deliver incredible performance without breaking the bank.

The first TUF Gaming 18-inch laptop
The TUF Gaming Alliance is proud to introduce the A18, the first 18-inch laptop in the TUF Gaming lineup. Equipped with up to an AMD Ryzen 7 260 processor and an NVIDIA GeForce RTX 5070 Laptop GPU, the TUF Gaming A18 can easily handle the latest games. Also featuring up to 32 GB of DDR5 5600 MHz memory and up to 2 TB of PCIe Gen 4 storage, gamers can easily game, stream, and store their entire library. The A18 also boasts a gorgeous 2.5K resolution 240 Hz display, with an extra-tall 16:10 aspect ratio, 500 nits of peak brightness, and 100% coverage of the DCI-P3 colors space for incredibly immersive gameplay.

At CES 2025, Lenovo unveiled a bold lineup of AI-powered business solutions designed to redefine the modern workplace. Highlights include the boldly redesigned Lenovo ThinkPad X9 Aura Editions, the innovative and unique ThinkBook Plus Gen 6 with rollable display, and the latest commercial desktops, including the high performance ThinkCentre M90a Pro Gen 6, and the groundbreaking ThinkCentre neo 50q QC powered by Snapdragon. Lenovo also introduces its next-generation ThinkVision P Series monitors and a comprehensive ecosystem of smart accessories, all engineered to elevate productivity and connectivity. Rounding out the announcements, Lenovo showcases cutting-edge proof-of-concept innovations that push the boundaries of technology, offering a glimpse into the future of intelligent, adaptable business solutions.

Lenovo Unveils ThinkPad X9 Series: Revolutionary Design Meets Pro-Level Performance
Lenovo introduces the ThinkPad X9 14 and X9 15 Aura Editions, its latest premium business laptops designed for innovative thinkers from prosumers to small and medium businesses to large corporations. These Copilot+ PCs powered by Intel Core Ultra processors are cutting-edge, AI-enhanced devices for creative professionals that combine powerful and efficient Intel and Windows 11 platforms, personalized AI-enabled experiences, in an all-new progressive design. ThinkPad X9 offers the ideal toolkit for today's hybrid users who demand high performance, proven reliability, and seamless productivity.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

Today at CES 2025, gamers can now elevate their gameplay like never before with the newest OMEN and HyperX PCs and solutions from HP Inc. PC gamers demand the best when it comes to powerful and personalized gaming technology. Three-quarters of them are purchasing new devices for better performance and features while more than half want customization options to represent their individuality. With the newest OMEN Max 16 Laptop paired with OMEN AI technology, gamers can play with confidence knowing that their device is designed to automatically and continually adjust performance and thermals for the best in uninterrupted gameplay.

OMEN AI: Revolutionizing the Gaming Experience
Introducing OMEN AI Beta, a groundbreaking software innovation redefining gaming performance optimization. Gamers often spend countless hours searching forums and using trial and error to achieve optimal frames per second (FPS). With 85% of gamers prioritizing high FPS, a simpler solution is essential. OMEN AI offers a personalized, one-click solution tailored to each game, recommending OS, hardware, and game settings based on each unique rig and game - eliminating endless troubleshooting. As the first AI-powered game learning application that continually adjusts for optimized performance, OMEN AI adapts and improves settings over time. Launching with support for Counter-Strike 2, the application will expand to more popular titles. OMEN AI simplifies and elevates gaming experiences by taking the guesswork out of optimization.

Acer today announced significant performance and feature updates to its line of powerful Predator gaming laptops, including its flagship Predator Helios 16 AI and Predator Helios 18 AI. Acer has also expanded its Helios Neo portfolio of midrange gaming laptops with the launch of the all-new Predator Helios Neo 16S AI, bringing a slimmer chassis to the mix without sacrificing performance.

All the devices are powered by up to Intel Core Ultra 9 processor 275HX and next-gen NVIDIA GeForce RTX 50 Series Laptop GPUs, built to deliver next-level gaming and AI performance. Powered by NVIDIA Blackwell, GeForce RTX 50 Series Laptop GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiple performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus access NVIDIA NIM Microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, announced new GIGABYTE G893 series servers using the NVIDIA HGX B200 platform. The launch of these flagship 8U air-cooled servers, the G893-SD1-AAX5 and G893-ZD1-AAX5, signifies a new architecture and platform change for GIGABYTE in the demanding world of high-performance computing and AI, setting new standards for speed, scalability, and versatility.

These servers join GIGABYTE's accelerated computing portfolio alongside the NVIDIA GB200 NVL72 platform, which is a rack-scale design that connects 36 NVIDIA Grace CPUs and 72 NVIDIA Blackwell GPUs. At CES 2025 (January 7-10), the GIGABYTE booth will display the NVIDIA GB200 NVL72, and attendees can engage in discussions about the benefits of GIGABYTE platforms with the NVIDIA Blackwell architecture.