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Intel Could Get up to $5 Billion Investment From Apollo

Intel could get a substantial multibillion-dollar investment from Apollo Global Management Inc., according to a recent report by Bloomberg which relies on inside information from people familiar with the matter. It is said that Apollo is willing to invest up to $5 billion in Intel, and it is worth noting that this came up just after rumors about Qualcomm's intentions for a friendly takeover of Intel emerged last week. Intel and Apollo representatives have declined to comment thus far, however, it is said that Intel executives have been weighing Apollo's proposal.

Apollo is not a newcomer to the chipmaking industry; in 2023, the New York-based company made a $900 million investment in Western Digital buying convertible preferred stock. As for Intel and Apollo, they are no strangers to each other. Just this past June, Intel agreed to sell a stake in a joint venture that controls Intel's Fab 34 plant in Ireland to Apollo for $11 billion. While rumors come and go, one thing is for sure: Intel's short-term future relies on the success of its upcoming products like Arrow Lake desktop architecture to be released on October 24, and its foundry business division.

Canadian Retailer Lists Intel Core Ultra 200 Series "Arrow Lake-S" Desktop Processors

Canadian online retailer ShopRBC put up listings of unreleased Intel Core Ultra 200-series "Arrow Lake-S" desktop processors. While the availability listed is zero, you can backorder these chips at the prices listed, so they are shipped when available. The flagship Intel Core Ultra 9 285K (8P+16E) processor is listed at CAD $852 (around USD $628). There is no "KF" variant of this part unlike with past generations of Intel flagship SKUs. The Core Ultra 7 265K (8P+12E) is next up, at CAD $589 (USD $435). Its KF variant, which lacks integrated graphics, is up for CAD $22 less than that (CAD $567 or USD $418).

Intel's middle-of-the-market part for this generation, the Core Ultra 5 245K (6P+8E) is next up, listed at CAD $450, or USD $331. You can back-order its KF variant for CA $23 less, at CA $427 (USD $315). The Core Ultra 200 "Arrow Lake-S" introduces the new Socket LGA1851, and so online retailers around the world should begin putting up compatible motherboards based on the Intel Z890 chipset, which is rumored to be the only chipset option available with these chips until Q1-2025, when Intel fleshes out the series with non-K SKUs and value chipsets such as the B860.

MSI's Upcoming MEG Z890 Unify-X Motherboard Leaks Ahead of Launch

Detailed specifications and a somewhat blurry slide showing off all the details of MSI's upcoming high-end MEG Z890 Unify-X motherboard have leaked courtesy of @ChamberTech_ on X/Twitter. The motherboard is likely to appeal to those looking to squeeze every extra bit of performance out of their new Ultra 200K series CPU when they launch next month. You get support for memory speeds of up to 10,000 MT/s and with only two DIMM slots, it might be able to go even higher with the latest DDR5 CUDIMMs. The board also sports a 110 Ampere 20+1+1+1 VRM design on an eight layer PCB, and it also ships with what MSI calls an OC Tuning Controller, suggesting the board is targeting overclockers.

MSI has included a pair of PCIe 5.0 x16 slots for GPUs that presumably operate in dual x8 mode when both slots are in use, and a third PCIe 4.0 x16 slot that operates in x4 mode, as well as a single PCIe 4.0 x1 slot. There's also no less than six M.2 slots, of which two are PCIe 5.0 and one PCIe 4.0, as well as six SATA ports. Where things get a bit interesting is in the network connectivity, as the slide claims that the board features a 5 Gbps Intel Killer Ethernet interface, which is the first we've heard of such a thing, as well as an Intel Killer Wi-Fi 7 and Bluetooth 5.4 module for wireless connectivity.

Intel Releases Arc GPU Graphics Drivers 101.6078 WHQL

Intel late Friday released the latest version of the Arc GPU Graphics drivers. Version 101.6078 WHQL is essentially the same set of drivers as the 101.6077 Beta drivers Intel released on September 18, but with the added WHQL signing. As such the drivers don't introduce any new Game On optimization from 101.6077 Beta, which had them for "Dead Rising Deluxe" Remaster, "Final Fantasy XVI," "Frostpunk 2," and "God of War Ragnarök," nor do these drivers introduce any fixes from the previous release. The "known issues" list, which lets you know if Intel has identified a new issue that will be fixed in a future driver release, remains the same for Arc A-series discrete GPUs, but has been expanded for Arc integrated graphics found with Core Ultra processors. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6078 WHQL

Qualcomm Said to Have Approached Intel About Takeover Bid

This is not an April fool, as Qualcomm has apparently approached Intel with a takeover bid, according to the Wall Street Journal. The news follows earlier rumours about Qualcomm having eyed the opportunity to buy parts of Intel's client PC business, especially the parts related to chip design. Now it looks like Qualcomm has decided it might as well give it a go and take over Intel entirely, if the WSJ's sources can be trusted. It's still early days though and no official offers appear to have been proposed by Qualcomm so far and it doesn't appear to be a hostile takeover offer at this point in time. As such, this could turn out to be nothing, or we could see a huge change in the chip market if something comes of it.

It's worth keeping in mind that Intel's share price has dropped by around 57 percent so far this year—not taking into account today's small jump for Intel—and Qualcomm's market cap stands at over twice that of Intel's at 188 vs 93 billion US dollars. Even if Intel was to agree to a takeover offer from Qualcomm, there are several antitrust hurdles in multiple countries to get around for the two giants as well. This is despite the two not being direct competitors, but with Qualcomm recently having entered the Windows laptop market, the two are at least competing for some market share there. It's also unclear what Qualcomm would do with Intel's x86 legacy if it acquired Intel, as Qualcomm might not be interested in keeping it, at least not on the consumer side of its business. Time will tell if this is just some advanced speculation or a serious consideration by Qualcomm.

Intel "Arrow Lake-HX" Leaks: Up to 24 Cores and 5.5 GHz in Laptop Form

While the upcoming desktop versions of Intel's "Arrow Lake" processors are stealing all the hype, we are getting a leak about the high-performance "Arrow Lake-HX" chips for laptop space. Thanks to Jaykihn on X, we learn that Intel has prepared six SKUs for laptop enthusiasts to power workstations and gaming. The upcoming Core Ultra 200 series SKUs are 285HX, 275HX, 265HX, 255HX, 245HX, and 235HX. Starting with the lower-end Core Ultra Core Ultra 5 245HX / 235HX, we get six P-cores running at 3.1 and 2.9 GHz base speeds, respectively. For both SKUs, E-cores are clocked at 2.6 GHz at the base. Boosing the P-cores yields a maximum of 5.1 GHz, while E-cores top out at 4.5 GHz. For graphics, the 48 EUs inside the iGPU are clocked at 1.8 GHz on the 235 HX, while 245 HX runs at 1.9 GHz. THese models don't support Thermal Velocity Boost and Turbo Boost Max 3.0, while of the remaining SKUs support both features.

Moving to the middle of the stack, there are two SKUs: Core Ultra 7 265HX / 255HX. Both feature eight P-cores and twelve E-cores. The differentiator here is the clock speed. P-cores on the 255HX run at 2.4 GHz base and 5.2 GHz boost, while the P-cores on 265HX run at 2.6 GHz base and 5.3 GHz boost. E-cores have a wider gap with the 255HX running at 1.8 GHz base and 4.5 GHz boost, while 265HX has E-cores pinned at 2.3 GHz base and 4.6 GHz boost. Both of these SKUs have iGPU with 64 EUs set at 1.9 GHz.

Intel Core Ultra 7 and Ultra 5 200-series "Arrow Lake" Retail Boxes Pictured, Too

Hot on the heels of yesterday's leak of the Core Ultra 9 285K "Arrow Lake" retail box, we have pictures of the boxes the Core Ultra 7 265K/KF, and the Core Ultra 5 245K/KF. These are simpler paperboard boxes that retain essential box-art design of the 285K, but lack the fancy jewel-case. The processor comes in the usual plastic blister inside the box, along with the case badge. This time around, Intel is not releasing a "KF" variant of the Core Ultra 9 285K, but if down the line it does, you can expect it to come in a similar simple retail package as the 265K/KF.

The Intel Core Ultra main brand is positioned prominently on the front face. Much like the 14th Gen Core, the Intel brand is displayed in the same font size as Core. Below the two, is the Unlocked designation, followed by "Series 2," which indicates the 200 processor model numbering sequence. The top-right corner has the brand extension (3, 5, 7, 9). Intel is expected to launch its Core Ultra 200-series "Arrow Lake-S" desktop processors in late-October, 2024.

Intel Core Ultra 9 285K Flagship "Arrow Lake" CPU Box Leaks

Intel's Core Ultra 200 series "Arrow Lake" CPU generation is bringing a complete P/E core redesign and, allegedly, a new package. According to VideoCardz, Intel's flagship SKU—Core Ultra 9 285K—features a completely redesigned box with new accent colors. Colors of choice include blue, black, and gray tones with a futuristic look. At the center of the new box is grey plastic packaging that protects and holds the actual processor. As the recent leaks suggested, this SKU will boast 8 "Lion Cove" P-Cores and 16 "Skymont" E-Cores without Hyper-Threading and with a maximum boost of 5.7 GHz. All of this will be packed inside a 125-watt power envelope. While we await the official launch, supposedly scheduled for October 10 and released on October 24, we can preview the new packaging box that Intel prepared for its new CPU family.

MSI Introduces Intel vPro-Enabled Cubi NUC 13MQ Mini PC

MSI is pleased to announce the launch of the MSI Cubi NUC 13MQ, the latest addition to its esteemed Cubi NUC series, winner of the Red Dot Award 2024. Expanding on the robust features of the MSI Cubi NUC 1M, the new Cubi NUC 13MQ integrates the powerful Intel vPro platform, providing businesses with enhanced security, manageability, performance, stability, and sustainability within a small form factor.

The MSI Cubi NUC 13MQ is a significant advancement in the mini PC market, tailored to meet the intricate demands of contemporary businesses. With the integration of Intel vPro technology, the Cubi NUC 13MQ offers advanced functionalities such as remote management, robust security provisions, exceptional performance, and superior stability. As a result, this product is an optimal choice for IT administrators aiming to implement secure, efficient, and scalable computing solutions across their organizations.

ASRock Industrial Launches IMB-X1900 Motherboard Driven by Intel Xeon W Series Processors

In today's fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial's commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel Xeon W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency and speed.

Key Features of the IMB-X1900 Motherboard:
  • Unrivaled Processing Power: Featuring Intel Xeon W-3500/3400 and W-2500/2400 Series Processors with W790 chipset, the IMB-X1900 supports up to 60 cores, making it a powerhouse for computationally intensive workloads. This capability is crucial for industries such as 3D rendering, product simulation, and large-scale AI models training and inference.
  • Expansive Memory Capacity: With support for up to 2 TB of DDR5 RDIMM ECC memory across 8 slots, the IMB-X1900 ensures seamless management of extensive datasets and complex simulations. This inclusion of ECC memory further enhances system reliability and data integrity, essential for industries like financial analysis, scientific research, and mission-critical applications.

Intel Releases Arc GPU Graphics Drivers 101.6077 Beta

Today Intel released its latest Arc GPU graphics drivers, with version 101.6077 beta hitting our servers. This latest version brings game-ready support for titles like Dead Rising Deluxe Remaster, Final Fantasy XVI, Frostpunk 2, and God of War Ragnarok. Besides adding support for latest titles, the 101.6077 beta drivers also fixed issues like corruption on certain reflective surfaces during gameplay of The Last of Us Part I (DX12), and corrupted lines on certain textures during gameplay of Age of Empires IV (DX12). Interestingly, few issues persist like Diablo IV (DX12) intermittently crashing while toggling Ray Tracing settings during gameplay, and Doom Eternal (VK) exhibiting intermittent flickering corruption in the game menu and during gameplay. Few more notes are included in the changelog and known issues, which can be seen below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6077 Beta.

Pat Gelsinger Writes to Employees on Foundry Momentum, Progress on Plan

All eyes have been on Intel since we announced Q2 earnings. There has been no shortage of rumors and speculation about the company, including last week's Board of Directors meeting, so I'm writing today to provide some updates and outline what comes next. Let me start by saying we had a highly productive and supportive Board meeting. We have a strong Board comprised of independent directors whose job it is to challenge and push us to perform at our best. And we had deep discussions about our strategy, our portfolio and the immediate progress we are making against the plan we announced on August 1.

The Board and I agreed that we have a lot of work ahead to drive greater efficiency, improve our profitability and enhance our market competitiveness—and there are three key takeaways from last week's meeting that I want to focus on:
  • We must build on our momentum in Foundry as we near the launch of Intel 18A and drive greater capital efficiency across this part of our business.
  • We must continue acting with urgency to create a more competitive cost structure and deliver the $10B in savings target we announced last month.
  • We must refocus on our strong x86 franchise as we drive our AI strategy while streamlining our product portfolio in service to Intel customers and partners.
We have several pieces of news to share that support these priorities.

Intel to Produce Custom AI Chips and Xeon 6 Processors for AWS

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies' longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.

As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company's most advanced process node. Intel will also produce a custom Xeon 6 chip on Intel 3, building on the existing partnership under which Intel produces Xeon Scalable processors for AWS.

AAEON Release GENESYSM-ADN6, a Slim Mini PC Designed for the Edge

AAEON, a global leader in embedded computing, has introduced the GENESYSM-ADN6, a slimline SubCompact System powered by Intel Core Processor N-series CPUs. Measuring just 178 mm x 134.1 mm x 43 mm, the GENESYSM-ADN6 is a compact option built to satisfy demand for mini PCs suitable for smart retail, industrial automation, and edge gateway applications. The PC's connectivity and scalability clearly align it with the latter of these vertical markets, with a standout feature being its three LAN ports, configured for Intel Ethernet Controller I226 running at 2.5GbE speed. Alongside this is extensive expansion options for Wi-Fi, 5G, and additional storage through the system's M.2 2230 E-Key, M.2 3052 B-Key, and mSATA slots respectively.

In addition to its compact size, the GENESYSM-ADN6 is well-suited to deployment in industrial settings, with a wide power input range of 9 V to 36 V and fanless operation. Moreover, the system boasts two COM ports for RS-232/422/485, with the option of two additional ports for RS-232. Elsewhere, two USB 3.2 Gen 2 ports, an 8-bit GPIO, and SMBus/I2C are available for integrating sensors, actuators, and other peripheral devices, making it an excellent option when it comes to PLCs, robotic arms, and SCADA systems. The system's interfaces are bolstered by high-bandwidth, SODIMM-based DDR5 system memory for expedited data processing and optional TPM 2.0 for added data security.

AMD Confirms FidelityFX Super Resolution 4.0 will be AI-powered, Focused on Efficiency

According to Tom's Hardware, AMD has confirmed that its upcoming FidelityFX Super Resolution 4 (FSR 4.0) graphics upscaling solution will harness the power of AI for frame generation and frame interpolation. This update marks a significant shift from the company's previous analytical-based approaches, as revealed by Jack Huynh, AMD's senior vice president and general manager of the Computing and Graphics Business Group. Initially, FSR4's primary focus is addressing the persistent challenge of battery life in handheld gaming devices. Huynh emphasized the need for extended playtime, stating, "I need to play a Wukong for three hours, not 60 minutes." To achieve this, AMD has been working on AI-based upscaling techniques for nearly a year. As a reminder, FSR 1.0 used spatial upscaling, version 2.0 used temporal upscaling, and FSR 3.0 also used temporal upscaling with optional frame generation.

While the initial context for FSR4 centers on handheld devices, AMD's work with developing open-source, architecture-agnostic algorithms suggests broader applications. FSR4 might be compatible with a wide range of GPU solutions, including non-handheld devices, benefiting desktop and laptop users as well. This move to AI-based technology aligns AMD with competitors like Intel, who have implemented similar approaches in their XeSS technology, and NVIDIA with its DLSS solution. Although the release date for FSR4 remains unannounced, its year-long development suggests it may be nearing completion. However, as with previous upscaling solutions, widespread adoption in games may take time following its release.

ASUS Zenbook DUO (2024) and ASUS ProArt PZ13 Laptops Win Silver at IDEA 2024

ASUS today announced that the Zenbook DUO (2024) (UX8406) and ProArt PZ13 (HT5306) laptops won Silver Awards in the Consumer Technology category at the International Design Excellence Awards (IDEA) 2024. Additionally, eight more ASUS products were named as finalists, marking 2024 as the company's most successful year at IDEA. This strong showing underlines the company's dedication to redefining user experiences through innovative design that balances aesthetics and technological excellence.

ASUS Zenbook DUO (2024) also earned a spot in the permanent collection of the Henry Ford Museum of American Innovation, highlighting the ingenuity of the world's first AI-powered 14-inch dual-screen laptop. The museum, a longstanding partner of the IDEA awards, adds select award-winning products to its permanent collection every year.

Intel Core Ultra 200 Arrow Lake CPUs Specifications Leaked

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

Prepare for Over 9000 MT/s DDR5 Speeds with Intel Z890 and "Arrow Lake"

Intel's upcoming Core Ultra 200 "Arrow Lake-S" desktop processors will herald a new wave of overclocking memory kits as the architecture is expected to support even higher memory speeds than the current 14th Gen Core. The product page of an ASRock Z890 motherboard lists out maximum memory speeds for various DIMM configurations. The most overclocker-friendly config—1 single-rank DIMM per channel—sees ASRock mention support for DDR5-9200+ (OC). The fastest DDR5 OC memory kits in the market are DDR5-8600, and over the Summer, JEDEC announced standardization of high frequency DDR5 configurations, including the likes of DDR5-8800. Such high frequencies require the DIMM to feature a clock driver.

Those looking for high capacity memory configurations have big reason to cheer. For two single-rank DIMMs per channel, or one dual-rank DIMM per channel, the motherboard's product page mentions an OC speed of DDR5-6800+. This should be a boon for those wanting large memory capacities such as 96 GB or 128 GB using dual-rank DIMMs at reasonably high speeds. Even the densest memory configuration, two dual-rank DIMMs per channel, has a maximum OC speed of DDR5-5800+. This should allow users to approach the platform's maximum memory capacity, such as 256 GB using four 64 GB dual-rank DIMMs, or 192 GB using four 48 GB DIMMs, but at much higher speeds that what the current platforms are capable of.

ASUS and GIGABYTE Register Z890 Motherboards Ahead of October Launch

ASUS and GIGABYTE have registered a large number of Intel Z890 motherboards with the Eurasian Economic Commission (EEC). For ASUS, the registrations suggest that these will be released on October 10, followed by an official market launch on October 24. ASUS has added no less than 29 Z890 motherboards to its ROG MAXIMUS, ROG STRIX, TUF GAMING, PRIME, and other series, while GIGABYTE has added 18 models to both its AORUS and non-AORUS series.

ASUS Z890 Motherboards
  • ROG MAXIMUS Series
    • ROG MAXIMUS Z890 EXTREME
    • ROG MAXIMUS Z890 FORMULA
    • ROG MAXIMUS Z890 APEX
    • ROG MAXIMUS Z890 APEX ENCORE
    • ROG MAXIMUS Z890 HERO
    • ROG MAXIMUS Z890 DARK HERO
    • ROG MAXIMUS Z890 HERO BTF

Hong Kong Distributor Runs Out of Replacement Core i9-14900K, Offers Refunds

Synnex Technology International is a major Hong Kong-based distributor of PC components, which also retails directly. PC enthusiasts in Hong Kong have been trying to avail replacements for their Intel Core i9-14900K processors under Intel's laid down procedure, including extended warranties for the processor, which has been hit by the notorious physical degradation issue. A customer sent in their i9-14900K to find that they are not getting a replacement chip, because Synnex ran out of chips to send customers as replacements.

The retailer sent in a template response that the chip sent by the customer cannot be repaired or replaced, but the customer can avail a cash refund of HKD $4,200 (around $540), which is close to the street price of the processor. The processor itself has been running out of stock in many places, partly because inventory in the channel is being directed toward honoring warranty claims. The only practical way to honor a processor warranty claim is replacement, since there is very little that can be repaired by a distributor (except maybe the stock cooler). HKEPC reports that the user took Synnex up on its offer for refund, sold everything in their machine except the SSD, and is now planning to build a new machine based on the Ryzen 9 9950X.

ASUS Announces All-New AI-Powered Zenbook S 14 (UX5406)

ASUS today announced Zenbook S 14 (UX5406), one of the thinnest and most portable 14-inch new-era ASUS AI PCs on the market, blending performance with sophistication. The premium Zenbook S 14 showcases a new functional aesthetic, and has been completely redesigned inside and out. The chassis features the new, innovative ASUS Ceraluminum, a high-tech ceramic hybrid material available in a range of nature-inspired colors. This industry-first material offers exceptional strength, effortlessly resisting scratches and wear.

Zenbook S 14 is powered by up to the latest AI-enabled Intel Core Ultra 9 processor (Series 2) and Intel Arc graphics, delivering up to 48 NPU TOPS. Advanced CNC milling enables the integration of an ultraslim vapor chamber in the ultra-quiet ambient cooling system—unique for such a thin device—ensuring up to 28-watt CPU TDP performance with minimal noise. The functional design features a dedicated Copilot key and an enlarged 16:10 seamless touchpad that supports smart gestures.

US Government Could Delay $8.5 Billion CHIPS Act Funding for Intel

The $8.5 billion in CHIPS Act assistance intended for Intel from the US government is expected to be delayed due to the company's ongoing financial struggles. According to a Bloomberg report, the Department of Commerce rejected the initial allocation request, requiring Intel to meet specific objectives and complete a comprehensive due diligence process before the funds are released.

Intel has committed to remaining engaged in discussions despite the additional requirements, though it encountered regulatory and timing challenges. The terms of the funding include $8.5 billion in direct assistance to Intel, along with $11 billion in low-cost credit, and a 25 percent tax credit worth up to $100 billion for Intel's investments in Arizona, New Mexico, Ohio, and Oregon.

Intel Pushes Core Ultra 200K "Arrow Lake-S" Desktop Processor Launch by a Week

Intel has reportedly delayed the launch of its next-generation Core Ultra 200K series "Arrow Lake-S" desktop processors by a week. Originally slated for an October 17, 2024 launch, these chips are now releasing on October 24, according to HKEPC. There's no reason cited for the delay, it probably has to do with retailer stocking. The delay isn't significant. The Core Ultra 200K introduce a new CPU socket, the LGA1851, which means these chips need to launch alongside new motherboards based on the Intel 800-series.

The initial wave of processors is expected to include only SKUs targeting overclockers and enthusiasts. These include the Core Ultra 9 285K (8P+16E), the Core Ultra 7 265K (8P+12E), and the Core Ultra 5 245K (6P+8E), and their "KF" variants that lack integrated graphics. It's also expected that the first wave of compatible motherboards will only come with the premium Intel Z890 chipset, which supports CPU overclocking. Intel will likely expand its processor model selection, along with more affordable chipsets, such as the B860, around the 2025 International CES.

Intel Releases Arc GPU Graphics Drivers 101.5989 Beta

Intel over the weekend released the latest version of Arc GPU Graphics Drivers. Version 101.5989 Beta comes with Game-On optimization for "Arena Breakout: Infinite," "Deadlock," "NBA 2K25," "Test Drive: Unlimited Solar Crown," and "Warhammer 40,000: Space Marine 2." The drivers should prove especially important for "Deadlock," where Intel claims performance improvements of up to 17% at 1080p, and up to 13% at 1440p. In "Test Drive: Unlimited Solar Crown," you can expect up to 19% performance improvements in both the 1080p and 1440p resolutions. "Warhammer 40K: Space Marine 2" players can expect up to 7% performance improvements at 1080p, and up to 8% improvements at 1440p. Intel hasn't included any fixes with this release, but identified a handful new issues. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5989 Beta

MSI Intros MS-CF13 Mini-ITX Fanless, Ultra Low-Power Motherboard

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:
  • Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
  • High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
  • Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
  • Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.
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