Thermaltake, a global leader in PC gaming hardware, proudly introduces its latest line of high-performance pre-built gaming desktops. Powered by the new Intel Core Ultra Series 2 processors and NVIDIA GeForce RTX 40 and RTX 40 Super series graphics cards, these five new systems are engineered to set new gaming and content creation standards. With unrivaled speed, AI-enhanced performance, and intelligent resource management, the new desktops promise to deliver next-level experiences for enthusiasts and creators alike.

Equipped with advanced AI capabilities, the Intel Core Ultra Series 2 processors optimize system performance in real-time, learning user patterns to deliver smoother gameplay, faster rendering, and superior multitasking. Combined with Thermaltake's sleek design and top-tier PC cases and components, the new gaming desktops offer a perfect blend of performance, reliability, and style, catering to the needs of pro gamers, content creators, and PC enthusiasts. These systems are available at the Thermaltake Webstore, Amazon, and Best Buy.

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring Vcolor CUDIMM 24 GB x 2 modules, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-10600. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. Featuring the latest D5 Bionic Corsa, an AI-enhanced overclocking technology that seamlessly integrates software, hardware, and firmware, overclockers can now leverage AI technology to unlock groundbreaking DDR5 speeds with ease.
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Corsair is excited to announce the launch of the Corsair NAUTILUS RS and NAUTILUS RS ARGB family of liquid CPU Coolers. These innovative coolers deliver high-performance CPU cooling with easy installation and outstanding compatibility with modern CPU sockets. The NAUTILUS RS family is available in black in both 240 mm and 360 mm sizes, while the NAUTILUS RS ARGB is available in both black and white in the same sizes, with added ARGB lighting to enhance your build.

GET COOLER WITH A NEW COLD PLATE
The NAUTILUS RS series features an efficient, low-noise pump and a slightly convex cold plate pre-applied with thermal paste in an optimized pattern, improving contact with the processor's integrated heat spreader for superior thermal transfer. Available in 240 mm or 360 mm radiator sizes and equipped with RS120 fans, NAUTILUS RS coolers effectively maintain optimal temperatures for high-end CPUs.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.

Collaborating closely with Intel, Renesas has developed an innovative new customized power management IC (PMIC) that covers the entire power management needs for this newest generation of Intel processors. This advanced and highly integrated PMIC, combined with a pre-regulator and a battery charger, offers a complete solution for PCs leveraging the new Intel processor. The three new devices work together to provide a purpose-built power solution targeted at client laptops, particularly those running AI applications that tend to consume a lot of power.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.

AAEON, a leader in industrial PC solutions, has released the OMNI-ADP series, a range of Modular HMI Panel PCs featuring seven display sizes ranging from 10.4" to 21.5", powered by 12th Generation Intel Core processors. The OMNI-ADP series follows the same modular design as its predecessors, offering users the freedom to select different display sizes and upgrade or customize components based on project requirements. Across the series is a choice of either PCAP and 5-wire resistive touchscreens, IP65 aluminium front bezel design, and both panel and VESA mounting options. Depending on the model, the OMNI-ADP PCs offer resolutions from 1024 x 768 at the lowest end to 1920 x 1080 for the 21.5" screen model.

The OMNI-ADP series is equipped with a number of features conducive to deployment in various industrial computing markets, including wide power input ranges of 9 V to 30 V, a temperature tolerance of -20°C to 50°C, an IP65 aluminium front bezel for dust and water resistance, and passive heat dissipation for fanless operation. It is therefore no surprise that AAEON view the series as well-position to power applications such as human-machine interface (HMI) and building management solutions.

Last time we reported on Samsung Foundry, the company publicly apologized for its setbacks in the memory and foundry divisions, especially as its 3 nm GAA FET node has failed to attract new customers. On the other hand, Intel has also been struggling with its Foundry unit bleeding billions of Dollars in a bid to secure its spot as one of the best foundries for companies to manufacture their chips. There is no better pair than two struggling foundries looking for customers and new ways to conduct research than Intel and Samsung. According to an exclusive by South Korean media outlet "MK," it has reportedly been confirmed that Intel approached Samsung to form a "Foundry Alliance" to boost their foundry business units.

According to the source, Intel CEO Pat Gelsinger is reportedly eager to meet with Samsung Electronics Chairman Lee Jae-yong face-to-face to discuss "comprehensive collaboration in the foundry sector." What exactly will happen between the two is still unclear. Back in 2014, GlobalFoundries and Samsung formed a partnership for 14 nm FinFET offerings, and that was a wide success. Jointly developing a node and offering it in their foundry units could be the target goal for Intel and Samsung. At some level, research and development, as well as sharing valuable manufacturing information on yield improvements, should be beneficial for both to put together the final pieces of the semiconductor puzzle.

As Intel's Core Ultra "Arrow Lake-S" desktop processors near their launch, ASUS China put out a video presentation about its Z890 chipset motherboards ready for these processors, which included a technical run-down of Intel's first tile-based desktop processor, which included detailed die-shots of the various tiles. This is stuff that would require not just de-lidding the processor (removing the integrated heat-spreader), but also clearing up the top layers of the die to reveal the various components underneath.

The whole-chip die-shot gives us a bird's eye view of the four key logic tiles—Compute, Graphics, SoC, and I/O, sitting on top of the Foveros base tile. Our article from earlier this week goes into the die areas of the individual tiles, and the base tile. The Compute tile is built on the most advanced foundry node among the four tiles, the 3 nm TSMC N3B. Unlike the older generation "Raptor Lake-S" and "Alder Lake-S," the P-cores and E-core clusters aren't clumped into the two ends of the CPU complex. In "Arrow Lake-S," they follow a staggered layout, with a row of P-cores, followed by a row of E-core clusters, followed by two rows of P-cores, and then another row of E-core clusters, before the final row of P-cores, to achieve the total core-count of 8P+16E. This arrangement reduces concentration of heat when the P-cores are loaded (eg: when gaming), and ensures each E-core cluster is just one ringbus stop away from a P-core, which should improve thread-migration latencies. The central region of the tile has this ringbus, and 36 MB of L3 cache shared among the P-cores and E-core clusters.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, is excited to introduce the all-new Z890A-SILVER motherboard designed for the latest Intel Core Ultra series-2 processors. Based on Intel Z890 single-chip architecture, this new SILVER series motherboard brings cutting-edge features, fine-tuned to deliver top-notch performance tailored for gamers, content creators, and casual users.

The BIOSTAR Z890A-SILVER motherboard supports up to 192 GB of DDR5 memory across 4 DIMM slots, providing exceptional bandwidth and enhanced performance for multitasking, which is ideal for high-performance computing setups. Furthermore, the Z890A-SILVER motherboard supports PCIe 5.0 M.2, delivering blazing-fast storage speeds for faster load times and overall system responsiveness. With 2.5 GbE LAN support, it ensures high-speed and stable network connectivity, while the inclusion of USB 3.2 Gen 2 Type-C provides versatile and fast data transfer options. The motherboard is also ready for Wi-Fi 7 and 6E modules (no Wi-Fi card included), allowing for the latest wireless connectivity standards.

As a quick follow-up to last week's "Arrow Lake-S" de-lidding by Madness727, we now have a line-up of a de-lidded Core Ultra 9 285K "Arrow Lake-S" processor placed next to a Core i9-14900K "Raptor Lake-S," and the Core i9-12900K "Alder Lake-S." The tile-based "Arrow Lake-S" is visibly larger than the two, despite being made on more advanced foundry nodes. Both the 8P+16E "Raptor Lake-S" and 8P+8E "Alder Lake-S" chips are built on the Intel 7 node (10 nm Enhanced SuperFin). The "Raptor Lake-S" monolithic chip comes with a die-area of 257 mm². The "Alder Lake-S" is physically smaller, at 215 mm². What sets the two apart isn't just the two additional E-core clusters on "Raptor Lake-S," but also larger caches—2 MB of L2 per P-core, increased form 1.25 MB/core, and 4 MB per E-core cluster, increased from 2 MB/cluster.

Thanks to high quality die-shots of the "Arrow Lake-S" by Madness727, we have our first die-area estimations by A Hollow Knight on Twitter. The LGA1851 fiberglass substrate has the same dimensions as the LGA1700 substrate. This is to ensure the socket retains cooler compatibility. Using geometrical measurements, the base tile of the "Arrow Lake-S" is estimated to be 300.9 mm² in area. The base-tile is a more suitable guideline for "die-area," since Intel uses filler tiles to ensure gaps in the arrangement of logic tiles are filled, and the chip aligns with the base-tile below. The base tile, built on an Intel 22 nm foundry node, serves like a silicon interposer, facilitating high-density microscopic wiring between the various logic tiles stacked on top, and an interface to the fiberglass substrate below.

As we await the launch of Intel's "Arrow Lake-S" Core Ultra 200S series of processors for desktops, we are getting some new leaks about Intel's mainstream mobile "Arrow Lake-H" update. A month ago, we got the specification table of the high-end mobile "Arrow Lake-HX," and now, thanks to Jaykihn X, we have the mainstream laptop chip specifications as well. The top-of-the-line includes Intel Core Ultra 9 285H, a 45 W TDP SKU with six P-cores, eight E-cores, and two LPE cores. The CPU packs integrated Xe2 graphics with eight cores and 24 MB of total L3 cache and has a maximum boost of 5.4 GHz for P-cores.

Moving down the stack, there are Core Ultra 7 265H and Core Ultra 5 255H SKUs, which feature the same P/E/LPE core configuration. However, these SKUs are rated for 28 W TDP, having lower maximum frequencies and the same iGPU configuration. This time, we also have two Core Ultra 3 SKUs, with Core Ultra 3 235H and 225H bringing four P-cores, eight E-cores, and two LPE-cores in the 28 W package. The Core Ultra 3 235H has eight Xe2 cores in its iGPU, while the lowest-end Core Ultra 3 225H has only seven Xe2 iGPU cores. For a complete set of specifications, including all clock speeds in base and boost, please check out the table below.

Hot on the heels of Gigabyte, ASUS has also put its Thunderbolt 5 card up on its website, although there are some differences between the two. Obviously the physical appearance differs somewhat, but that's largely cosmetic. However, the one key difference is that the ASUS ThunderboltEX 5 only sports a single 6-pin PCIe power connector. ASUS still claims USB PD support of up to 130 W—a feature the company calls Flexible FastCharge—however, a single USB Type-C port is limited to a maximum of 96 W, which means you can charge your MacBook Pro at full tilt, but not some other laptops. Admittedly the 4 W discrepancy compared to the Gigabyte card is fairly minor, but the second port gets left with only 34 W, although that's still enough for charging most phones. Oddly enough, ASUS ThunderboltEX 4 card, allowed for up to 100 W on a single port.

ASUS has also implemented a single Thunderbolt 5 pin-header for the GPIO, SPI I2C and UART interfaces, plus a standard USB 2.0 header, for adding USB 2.0 support to the Thunderbolt 5 ports. Just as with the Gigabyte card, we find Intel's JHL9580 Thunderbolt 5 controller at the heart of the card and once again it uses a PCIe 4.0 x4 interface and supports up to three DP 2.1 8K displays at 60 Hz, although ASUS mentions that this requires DSC. The card features three mini DP inputs and comes with three DP to mini DP adapters, as well as the two aforementioned USB Type-C ports. Note that if you use tree displays, you can only use two Thunderbolt devices with the card. ASUS only mentions Windows 11 64-bit support, so it looks like Windows 10 won't be getting a driver and so far it would seem neither is Linux.

Intel has released the latest version of its Arc GPU Graphics drivers, the version 101.6127/6044 Beta. The new driver update brings Game On support on Intel Arc A-series GPUs and Intel Core Ultra CPUs with Intel Arc GPUs for No More Room in Hell 2 game. It also improves game performance on Intel Arc A-series GPUs in Core Keeper and Metaphor: ReFantazio games under DirectX 11. Intel also improved performance on Intel Core Ultra Series 2 CPUs with built-in Intel Arc GPUs in Marvel's Spider-Man Remastered and Assassin's Creed Mirage games under DirectX 12.

Intel also fixed a couple of issues on Intel Core Ultra Series 1 and Series 2 CPUs with built-in Intel Arc GPUs, including a fix for issue when enabling or disabling Endurance Gaming preset, issue with visual corruption in Chaos Enscape Benchmark 4.1, issue with lower performance in 3DMark Wildlife Extreme benchmark, and fix for issue with corruption during gameplay in Final Fantasy XVI.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6127/6044 Beta

Ahead of its October 23 release, PC enthusiast and Twitch streamer Madness727 released some of the first pictures of a de-lidded Core Ultra "Arrow Lake-S" desktop processor. There's no word on which processor model this is, but it shouldn't matter—all models being released this month are based on the same exact configuration of tiles of the "Arrow Lake-S," which means a Compute tile with an 8P+16E core CPU complex, a Graphics tile with 4 Xe cores, and the larger version of the breakout I/O tile that features an integrated Thunderbolt 4 controller.

Intel already released information on its Core Ultra "Arrow Lake-H" mobile processor that comes out in Q1-2025, which is shown featuring a physically smaller Compute tile that has a 6P+8E core CPU complex, a larger Graphics tile with 8 Xe cores, and a smaller breakout I/O tile. You can see where this is going for some of the cheaper Core Ultra 5 and Core Ultra 3 desktop processor models that release in Q1-2025. De-lidding is the process of removing the integrated heatspreader of a desktop processor to enable direct contact between the chip below, and the cooling solution. It is preferred by professional overclockers that use extreme cooling solutions.

Intel's taking a different path with its Gaudi 3 accelerator chips. It's staying away from the high-demand market for training big AI models, which has made NVIDIA so successful. Instead, Intel wants to help businesses that need cheaper AI solutions to train and run smaller specific models and open-source options. At a recent event, Intel talked up Gaudi 3's "price performance advantage" over NVIDIA's H100 GPU for inference tasks. Intel says Gaudi 3 is faster and more cost-effective than the H100 when running Llama 3 and Llama 2 models of different sizes.

Intel also claims that Gaudi 3 is as power-efficient as the H100 for large language model (LLM) inference with small token outputs and does even better with larger outputs. The company even suggests Gaudi 3 beats NVIDIA's newer H200 in LLM inference throughput for large token outputs. However, Gaudi 3 doesn't match up to the H100 in overall floating-point operation throughput for 16-bit and 8-bit formats. For bfloat16 and 8-bit floating-point precision matrix math, Gaudi 3 hits 1,835 TFLOPS in each format, while the H100 reaches 1,979 TFLOPS for BF16 and 3,958 TFLOPS for FP8.

Intel has released an updated version of its eXtreme Tuning Utility (XTU). The newest version, officially carrying the v10.0.0.76 moniker, is available to download. However, this version is designed exclusively for Intel's upcoming Core Ultra 200S series "Arrow Lake" processors. There are now two versions of Intel XTU: version 7.14.2.14, which supports unlocked Intel 14th Core and older processors, and version 10.x, which supports unlocked Intel Core Ultra Processors (Series 2) and newer. The XTU clocking utility only works on high-end Z-series boards like Z690, Z790, and the upcoming Z890 for "Arrow Lake-S." Below is a list of changes with XTU drivers now being replaced with Intel Innovation Platform Framework (IPF), which we are still trying to figure out what it is supposed to do. Many more features are listed below. However, we cannot decipher them until "Arrow Lake" reviews appear.

At Lenovo Tech World 2024, we announced new Supercomputing servers for HPC and AI workloads. These new water-cooled servers use the latest processor and accelerator technology from Intel and NVIDIA.

ThinkSystem SC750 V4
Engineered for large-scale cloud infrastructures and High Performance Computing (HPC), the Lenovo ThinkSystem SC750 V4 Neptune excels in intensive simulations and complex modeling. It's designed to handle technical computing, grid deployments, and analytics workloads in various fields such as research, life sciences, energy, engineering, and financial simulation.

Intel CEO Pat Gelsinger was a special guest at Lenovo Tech World 2024, the computing giant's annual showcase of its latest innovations. The opening keynote address saw Gelsinger make a special appearance to greet Lenovo CEO Yang Yuanqing, but he wasn't alone. In his pocket was a next-generation "Panther Lake" processor. This chip appears to be an H-segment package for mainstream notebooks, which makes the chip a direct successor to the "Arrow Lake-H" mobile processor that comes out in Q1-2025.

According to leaks from reliable sources, "Panther Lake-H" is said to come in CPU core-counts of up to 18. That's 6P+8E+4LP. It sees the reintroduction of low-power island E-cores located in the SoC tile. The six P-cores are "Cougar Cove," which could feature a generational IPC uplift over the current "Lion Cove," while the current "Skymont" E-cores are carried forward into "Panther Lake." The SoC tile could see an upgrade to a newer foundry node from its current 6 nm on "Arrow Lake," to accommodate the low-power island E-cores, and possibly a faster NPU. The iGPU of "Panther Lake" is allegedly based on the next-generation Xe3 "Celestial" graphics architecture. This faster iGPU, along with a faster NPU, low-power island E-cores, and slightly faster P-cores, could be what "Panther Lake-H" brings to the table. Given that "Arrow Lake-H" sees an early-2025 introduction, we don't expect "Panther Lake-H" out till at least 2026.

AVX-512 was proposed by Intel more than a decade ago—in 2013 to be precise. A decade later, the implementation of this instruction set on CPU cores remains wildly spotty—Intel implemented it first on an HPC accelerator, then its Xeon server processors, then its client processors, before realizing that hardware hasn't caught up with the technology to execute AVX-512 instructions in an energy-efficient manner, before deprecating it on the client. AMD implemented it just a couple of years ago with Zen 4 with a dual-pumped 256-bit FPU on 5 nm, before finally implementing a true 512-bit FPU on 4 nm. AVX-512 is a microcosm of what's wrong with the x86 ecosystem.

There are only two x86 CPU core vendors, the IP owner Intel, and its only surviving licensee capable of contemporary CPU cores, AMD. Any new additions to the ISA introduced by either of the two have to go through the grind of their duopolistic competition before software vendors could assume that there's a uniform install base to implement something new. x86 is a net-loser of this, and Arm is a net-winner. Arm Holdings makes no hardware of its own, except continuously developing the Arm machine architecture, and a first-party set of reference-design CPU cores that any licensee can implement. Arm's great march began with tiny embedded devices, before its explosion into client computing with smartphone SoCs. There are now Arm-based server processors, and the architecture is making inroads to the last market that x86 holds sway over—the PC. Apple's M-series processors compete with all segments of PC processors—right from the 7 W class, to the HEDT/workstation class. Qualcomm entered this space with its Snapdragon Elite family, and now Dell believes NVIDIA will take a swing at client processors in 2025. Then there's RISC-V. Intel finally did something it should have done two decades ago—set up a multi-brand Ecosystem Advisory Group. Here's what it is, and more importantly, what it's not.

Call of Duty: Black Ops 6 is fast approaching its October 25 launch date on the PC Microsoft Store, Battle.net and Steam. In partnership with Treyarch Studios, Call of Duty PC lead developer Beenox is developing a cutting-edge PC experience with 4K graphics and Ultrawide support plus a huge number of options across a variety of settings so players can dial in the best playing experience possible.

Get the Ultimate Performance Boost with AMD FSR 3.1
Some of the major features include:

• AMD FidelityFX Super Resolution
  • AMD FidelityFX Super Resolution 3 transforms your gaming experience with faster, more responsive framerates in Black Ops 6 using super resolution temporal upscaling and advanced frame generation.
• Advanced Frame Generation Technologies
  • The FSR Frame Generation toggle found in your graphics settings allows you to enable Frame Generation, which significantly increases your framerate and works seamlessly with other upscaling solutions.
• AMD FidelityFX Contrast Adaptive Sharpening (CAS)
  • An overhead sharpening slider can help bring more details to edges of weapons, players, and environments.

AMD FSR 3.1 is compatible with a wide range of graphics cards from AMD and other vendors, delivering exceptional upscaling image quality and massive performance boosts when gaming at 4K or 1440p.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

Micro Center, a leading national computer and electronic device retailer, has relaunched the online presence of its PowerSpec brand, a trusted name in high-performance desktop PCs. The newly redesigned PowerSpec.com offers an enhanced user experience tailored to meet the needs of gamers, professionals, and tech enthusiasts alike.

Since 1992, PowerSpec has been at the forefront of delivering powerful, adaptable, and upgradeable PCs backed by Micro Center's industry-leading customer service. The revamped website reflects PowerSpec's commitment to quality, innovation, and customer satisfaction by offering streamlined navigation, detailed product information, and easy access to essential drivers and support resources.

Intel Corp. (INTC) and AMD (NASDAQ: AMD) today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world's most widely used computing architecture. x86 is uniquely positioned to meet customers' emerging needs by delivering superior performance and seamless interoperability across hardware and software platforms. The group will focus on identifying new ways to expand the x86 ecosystem by enabling compatibility across platforms, simplifying software development, and providing developers with a platform to identify architectural needs and features to create innovative and scalable solutions for the future.

For over four decades, x86 has served as the bedrock of modern computing, establishing itself as the preferred architecture in data centers and PCs worldwide. In today's evolving landscape - characterized by dynamic AI workloads, custom chiplets, and advancements in 3D packaging and system architectures - the importance of a robust and expanding x86 ecosystem is more crucial than ever.

According to TechNews Taiwan, Intel has made significant progress in implementing ASML's cutting-edge High-NA EUV lithography technology. The company has successfully completed the assembly of its second High-NA "Twinscan EXE" EUV system at its Portland facility, as confirmed by Mark Phillips, Intel's Director of Lithography Hardware. Christophe Fouquet, CEO of ASML, highlighted that the new assembly process allows for direct installation at the customer's site, eliminating the need for disassembly and reassembly, thus saving time and resources. Phillips expressed enthusiasm about the technology, noting that the improvements offered by High-NA EUV machines have surpassed expectations compared to standard EUV systems. Given the massive $380 million price point of these High-NA systems, any savings are valuable in the process.

The rapid progress in installation and implementation of High-NA EUV technology at Intel's facilities positions the company strongly for production transition. With all necessary infrastructure in place and inspections of High-NA EUV masks already underway, Intel aims to have its Intel 14A process in mass production by 2026-2027. As Intel leads in High-NA EUV adoption, other industry giants are following suit. ASML plans to deliver High-NA EUV systems to TSMC by year-end, with rumors suggesting that TSMC's first system will possibly arrive in September. Samsung has also committed to the technology, although recent reports indicate a potential reduction in their procurement plans. Additionally, this development has sparked discussions about the future of photoresist technology, with Phillips suggesting that while Chemically Amplified Resist (CAR) is currently sufficient, future advancements may require metal oxide photoresists. This provides a small insight into Intel's future nodes.