ADLINK Technology Inc., a global leader in edge computing, and a global supplier of industrial PCs and motherboards, announces the launch of the new IMB-C Value Series of ATX motherboards, extending the IMB series motherboard range with new, more affordable, options for users seeking high-performance at a lower price point. The IMB-C value series comes with processor options ranging from Gen 10 to Gen 14 Intel Core i9/i7/i5/i3 and includes features such as 2.5 Gbe, PCIe 4.0, DDR4, and USB 3.0, to suit applications in warehousing, industrial automation, smart manufacturing, and new energy.

The IMB-C series expands the IMB ATX motherboard range, providing a cost-effective alternative to the high-performance IMB-M series. Tailored for budget-sensitive projects without sacrificing essential features, the IMB-C models support DDR4 and PCIe 4.0, catering to applications that require solid performance with cost efficiency. Conversely, the IMB-M series is designed for top-tier performance, supporting DDR5 and PCIe 5.0, ideal for cutting-edge industrial use. The IMB-C series offers a comprehensive portfolio from Intel's 10th to 14th gen processors. Specifically, the IMB-C46 and IMB-C46H models come equipped with the Q470 and H420E chipsets respectively, optimized for 10th Gen Intel Core processors. Meanwhile, the IMB-M47 with the Q670 chipset, and the IMB-M47H with the H610 chipset, both support the 12th to 14th gen Intel Core processors, aligning with advanced system requirements and higher performance expectations.

CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of the new CTL Chromebook PX141E Series. This series equips educators, staff, and students with the powerful performance and connectivity they need for all-day productivity. Easy ChromeOS device manageability combined with CTL's lifecycle services reduces the burden on IT departments.

"We are excited to refresh our product line with the next-generation 14" Chromebook. As the new powerhouse performer in our Chromebook lineup, we know our education and enterprise customers will appreciate the upgraded power, Wi-Fi, memory, and storage to support all day teaching and learning, while new conveniences such as the webcam privacy shutter and additional USB-A port enhance useability," said Erik Stromquist, CEO of CTL.

The much-anticipated revolution in AI-powered personal computing seems to be off to a slower start than expected. Qualcomm's Snapdragon X CPUs, touted as game-changers in the AI PC market, have struggled to gain significant traction since their launch. Recent data from PassMark, a popular benchmarking software, reveals that Snapdragon X CPUs account for a mere 0.3% of submissions in the past 30 days. This is a massive contrast to the 99.7% share held by traditional x86 processors from Intel and AMD, which raises questions about the immediate future of ARM-based PCs. The underwhelming adoption comes despite bold predictions from industry leaders. Qualcomm CEO Cristiano Amon had projected that ARM-based CPUs could capture up to 50% of the Windows PC market by 2029. Similarly, ARM's CEO anticipated a shift away from x86's long-standing dominance.

However, it turns out that these PCs are primarily bought for the battery life, not their AI capabilities. Of course, it's premature to declare Arm's Windows venture a failure. The AI PC market is still in its infancy, and upcoming mid-tier laptops featuring Snapdragon X Elite CPUs could boost adoption rates. A lot of time still needs to pass before the volume of these PCs reaches millions of units shipped by x86 makers. The true test will come with the launch of AMD's Ryzen AI 300 and Intel's Lunar Lake CPUs, providing a clearer picture of how ARM-based options compare in AI performance. As the AI PC landscape evolves, Qualcomm faces mounting pressure. NVIDIA's anticipated entry into the market and significant performance improvements in next-generation x86 processors from Intel and AMD pose a massive challenge. The coming months will be crucial in determining whether Snapdragon X CPUs can live up to their initial hype and carve out a significant place in the AI PC ecosystem.

In a surprising development, Intel plans to extend the longevity of its Socket LGA1700 platform even as the newer LGA1851 platform led by the Core Ultra 200 "Arrow Lake" remains on track for a late-Q3/early-Q4 2024 debut. This, according to a sensational leak by Jaykihn. It plans to do this with a brand-new silicon for LGA1700, codenamed "Bartlett." This should particularly interest gamers for what's on offer. Imagine the "Raptor Lake-S" die, but with four additional P-cores replacing the four E-core clusters, making a 12-core pure P-core processor—that's "Bartlett." At this point we're not sure which P-core is in use—whether it's the current "Raptor Cove," or whether an attempt will be made by Intel to backport a variant of "Lion Cove" to LGA1700.

This wouldn't be the first pure P-core client processor from Intel after its pivot to heterogeneous multicore—the "Alder Lake" H0 die has six "Golden Cove" P-cores, and lacks any E-core clusters. Intel is planning to give launch an entire new "generation" of processor SKUs for LGA1700 which use the newer client processor nomenclature by Intel, which is Core 200-series, but without the "Ultra" brand extension. There will be SKUs in the Core 3, Core 5, Core 7, and Core 9 brand extensions. Some of these will be Hybrid, and based on the rehashed "Raptor Lake-S" 8P+16E silicon, and some "Alder Lake-S" 8P+8E; but "Bartlett" will be distinctly branded within the series, probably using a letter next to the numerical portion of the processor model number. There will not be any Core 3 series chips based on "Bartlett," but Core 5, Core 7, and Core 9.

Simply NUC, Inc., a leading custom computing company, proudly announced the launch of the Scorpion Canyon NUC 14 Performance device across their global websites, a revolutionary PC workstation designed to meet diverse computing needs. Featuring the latest Intel Core Ultra "Meteor Lake" CPUs, Intel Arc integrated graphics, and optional NVIDIA RTX 4060 or 4070 graphics, the NUC 14 Performance redefines computing in a compact form factor.

"Introducing the NUC 14 Performance is a significant milestone for us," said Aaron Rowsell, Founder & President of Simply NUC. "This product family ushers in advanced AI capabilities and top-tier graphics in computing power. With unmatched performance, AI-readiness, and a sleek tool-less design, the NUC 14 Performance sets a new standard for compact workstations."

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

Intel is preparing a complete refresh of its desktop platform this year, with the introduction of the Core Ultra 200 series processors based on the "Arrow Lake" microarchitecture. The company skipped a desktop processor based on "Meteor Lake," probably because it didn't meet the desired multithreaded performance targets for Intel as it maxed out at 6P+8E+2LP, forcing Intel to come up with the 14th Gen Core "Raptor Lake Refresh" generation to see it through 2H-2023 and at least three quarters of 2024. The company, in all likelihood, will launch the new "Arrow Lake-S" Core Ultra 200 series toward late-Q3 or early-Q4 2024 (September-October). The first wave will include the overclocker-friendly K- and KF SKUs, alongside motherboards based on the top Intel Z890 chipset. 2025 will see the series ramp to more affordable processor models, and mainstream chipsets, such as the B860. These processors require a new motherboard, as Intel is introducing the new Socket LGA1851 with them.

Core configurations of the "Arrow Lake-S" chip surfaced on the web thanks to Jaykihn, a reliable source with Intel leaks. In its maximum configuration, the chip is confirmed to feature 8 P-cores, and 16 E-cores. There are no low-power island E-cores. Each of the 8 P-cores is a "Lion Cove" featuring 3 MB of dedicated L2 cache; while each the E-cores are "Skymont," arranged in 4-core modules that share 4 MB L2 caches among them. Intel claims that the "Lion Cove" P-core offers a 14% IPC increase over the "Redwood Cove" P-core powering "Meteor Lake," which in turn had either equal or a 1% IPC regression compared to "Raptor Cove." This would put "Lion Cove" at a 13-14% IPC advantage over the "Raptor Cove" cores. It's important to note here, that the "Lion Cove" P-cores lack HyperThreading, so Intel will be banking heavily on the "Skymont" E-cores to shore up generational multithreaded performance increase. "Skymont" was a show-stopper at Intel's Computex event, with a nearly 50% IPC gain over previous generations of Intel E-cores, which puts it at par with the "Raptor Cove" cores in single-thread performance.

HP Inc. today introduced two new innovations—the world's highest performance AI PC and the first integration of a trust framework into an AI model development platform. Both announcements expand HP's efforts to make AI real for companies and people with new and transformative AI experiences across the company's PCs, software, and partner ecosystem.

HP is empowering everyone, from corporate knowledge workers to freelancers and students, to unlock the power of AI. Users can connect with anyone in the world with real time translation to 40 languages, become master presenters with their personal communication coach, and quickly create videos like a pro.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to introduce the MS-1315UE/MS-1315URE/MS-1345UE/MS-1345URE industrial application systems. The MS-1315UE/MS-1315URE/MS-1345UE/MS-1345URE systems are versatile solutions, offering two specifications with Intel Raptor Lake SoC Core i3 and i5 processors. They are designed to cater to a wide range of audiences, including system integration businesses, AIoT machines, industrial automation, edge computing, HMI, and digital signage Industries, ensuring superior adaptability to any specific requirements.

These application systems provide effective platforms for CRM SI builds. Users can utilize the efficient computing power they provide to seamlessly manage customer contact details, transaction history, accounts, and communications. BIOSTAR's MS-1315UE/MS-1315URE/MS-1345UE/MS-1345URE also support diverse processors for real-time control tasks and ensure reliable, high-speed communication for edge computing.

ASUS today announced ASUS NUC 14 Performance, a business-friendly barebones mini PC that offers a dynamic fusion of efficiency and raw power. Featuring Intel Core Ultra 9 or 7 processors and NVIDIA GeForce RTX 4070 or 4060 graphics, ASUS NUC 14 Performance delivers the computing prowess enterprises need for AI-based workloads.

New AI-enabled performance
The latest Intel Core 9 and 7 series CPUs employ new Intel processor technology that enhances computing performance by approximately 21.5% (versus previous-generation processors) while reducing power consumption by up to 40%. An integrated Neural Processing Unit (NPU) helps boost AI applications, giving the processor exceptional energy-efficiency and endurance for sustained AI computing tasks like image generation and facial recognition.

AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and mechanical strength. These characteristics make them well-suited for advanced SiPs containing multiple chiplets, especially in data center applications where performance and durability are critical. The adoption of glass substrates aligns with the industry's broader trend towards more complex chip designs. As leading-edge process technologies become increasingly expensive and yield gains diminish, manufacturers turn to multi-chiplet designs to improve performance. AMD's current EPYC server processors already incorporate up to 13 chiplets, while its Instinct AI accelerators feature 22 pieces of silicon. A more extreme testament is Intel's Ponte Vecchio, which utilized 63 tiles in a single package.

Glass substrates could enable AMD to create even more complex designs without relying on costly interposers, potentially reducing overall production expenses. This technology could further boost the performance of AI and HPC accelerators, which are a growing market and require constant innovation. The glass substrate market is heating up, with major players like Intel, Samsung, and LG Innotek also investing heavily in this technology. Market projections suggest explosive growth, from $23 million in 2024 to $4.2 billion by 2034. Last year, Intel committed to investing up to 1.3 trillion Won (almost one billion USD) to start applying glass substrates to its processors by 2028. Everything suggests that glass substrates are the future of chip design, and we await to see first high-volume production designs.

Taiwanese semiconductor giant TSMC is reportedly planning to increase its wafer prices by up to 10% in 2025, according to a Morgan Stanley note cited by investor Eric Jhonsa. The move comes as demand for cutting-edge processors in smartphones, PCs, AI accelerators, and HPC continues to surge. Industry insiders reveal that TSMC's state-of-the-art 4 nm and 5 nm nodes, used for AI and HPC customers such as AMD, NVIDIA, and Intel, could see up to 10% price hikes. This increase would push the cost of 4 nm-class wafers from $18,000 to approximately $20,000, representing a significant 25% rise since early 2021 for some clients and an 11% rise from the last price hike. Talks about price hikes with major smartphone manufacturers like Apple have proven challenging, but there are indications that modest price increases are being accepted across the industry. Morgan Stanley analysts project a 4% average selling price increase for 3 nm wafers in 2025, which are currently priced at $20,000 or more per wafer.

Mature nodes like 16 nm are unlikely to see price increases due to sufficient capacity. However, TSMC is signaling potential shortages in leading-edge capacity to encourage customers to secure their allocations. Adding to the industry's challenges, advanced chip-on-wafer-on-substrate (CoWoS) packaging prices are expected to rise by 20% over the next two years, following previous increases in 2022 and 2023. TSMC aims to boost its gross margin to 53-54% by 2025, anticipating that customers will absorb these additional costs. The impact of these price hikes on end-user products remains uncertain. Competing foundries like Intel and Samsung may seize this opportunity to offer more competitive pricing, potentially prompting some chip designers to consider alternative manufacturing options. Additionally, TSMC's customers could reportedly be unable to secure their capacity allocation without "appreciating TSMC's value."

Intel has released its latest version of Arc GPU Graphics drivers for A-series discrete GPUs and Arc Graphics iGPUs, version 101.5762 Beta. The new drivers bring Game On Driver support on Intel Arc A-series GPUs and Intel Core Ultra with Intel Arc GPUs for Once Human and Zenless Zone Zero games, as well as improve performance in Diablo IV under DirectX 12 by up to 35 percent at 1440p resolution and by up to 30 percent at 1080p resolution with Ray Tracing Ultra settings.

The new drivers also fix the issue seen in Plants vs. Zombies Game of the Year Edition when 3D acceleration is enabled on Intel Arc A-series GPUs and Core Ultra CPUs with Intel Arc GPUs, as well as issues with Endurance Gaming in games on Intel Core Ultra CPUs with Intel Arc GPUs. Intel also fixed an issue With Intel Arc Control where it may report incorrect Shader Model version in System Capabilities.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5762 Beta

The PC market gathered momentum in Q2 2024, with worldwide shipments of desktops and notebooks up 3.4% year-on-year, reaching 62.8 million units. Shipments of notebooks (including mobile workstations) hit 50 million units, growing 4%. Desktops (including desktop workstations), which constitute 20% of the total PC market, experienced a slight 1% growth, totaling 12.8 million units. The stage is now set for accelerated growth as the refresh cycle driven by the Windows 11 transition and AI PC adoption ramps up over the next four quarters.

"The PC industry is going from strength to strength with a third consecutive quarter of growth," said Ishan Dutt, Principal Analyst at Canalys. "The market turnaround is coinciding with exciting announcements from vendors and chipset manufacturers as their AI PC roadmaps transition from promise to reality. The quarter culminated with the launch of the first Copilot+ PCs powered by Snapdragon processors and more clarity around Apple's AI strategy with the announcement of the Apple Intelligence suite of features for Mac, iPad and iPhone. Beyond these innovations, the market will start to benefit even more from its biggest tailwind - a ramp-up in PC demand driven by the Windows 11 refresh cycle. The vast majority of channel partners surveyed by Canalys in June indicated that Windows 10 end-of-life is likely to impact customer refresh plans most in either the second half of 2024 or the first half of 2025, suggesting that shipment growth will only gather steam in upcoming quarters."

The recent launch of Copilot+ PCs, a collaboration between Microsoft and Qualcomm, has taken an unexpected turn in the market. While these devices were promoted for their artificial intelligence capabilities, a Bloomberg report reveals that consumers are primarily drawn to them for their impressive battery life. The Snapdragon X-powered Copilot+ PCs have made a significant impact, securing 20% of global PC sales during their launch week. However, industry analyst Avi Greengart points out that the extended battery life, not the AI features, is driving these sales. Microsoft introduced three AI-powered features exclusive to these PCs: Cocreator, Windows Studio Effects, and Live Captions with Translation. Despite these innovations, many users find these features non-essential for daily use. The delay of the anticipated Recall feature due to privacy concerns has further dampened enthusiasm for the AI aspects of these devices.

The slow reception of on-device AI capabilities extends beyond consumer preferences to the software industry. Major companies like Adobe, Salesforce, and SentinelOne declined Microsoft's request to optimize their apps for the new hardware, citing resource constraints and the limited market share of AI-capable PCs. Gregor Steward, SentinelOne's VP for AI, suggests it could take years before AI PCs are widespread enough to justify app optimization. Analysts project that by 2028, only 40% of new computers will be AI-capable. Despite these challenges, Qualcomm remains optimistic about the future of AI PCs. While the concept may currently be more on the marketing side, the introduction of Arm-based Windows laptops offers a welcome alternative to the Intel-AMD duopoly. As the technology evolves and adoption increases, on-device AI features may become more prevalent and useful. The imminent arrival of AMD Ryzen AI 300 series and Intel Lunar Lake chips promises to expand the Copilot+ PC space further. For now, however, it appears that superior battery life remains the primary selling point for consumers.

DFI, the world's leading brand in embedded motherboards and industrial computers, introduces its latest innovation: the ASL9A2 System-on-Module (SoM). With an Intel Atom processor, the ASL9A2 achieves speeds up to 3.6 GHz and is based on Intel's Gracemont architecture. Designed for high-performance, low-power, and ruggedized edge applications, the ASL9A2 is perfect for continuous 24/7 operation, supporting a wide range of Internet of Things (IoT) solutions at the edge.

As reported by The Business Research Company, the SoM market has experienced robust growth, increasing from 2.22 billion in 2023 to 2.43 billion in 2024, with a CAGR of 9.6%. From DFI's business viewpoint, a variety of SoM projects are yielding positive results. Furthermore, DFI enhances its Intel x86 COM Express modules with value-added enhancements to improve customers' applications efficiency, earning praise from customers.

ASUS today announced the ASUS NUC 14 Pro+, an ultracompact PC that offers best-in-class performance thanks to the power of the new Intel Core Ultra processor, which gives it the ability to locally run generative AI workloads. The machine's robust computing capabilities are further boosted by certified Bluetooth dongle-free connectivity, energy-efficient WiFi Sensing, and three AI engines (GPU, NPU, and CPU) that enable high throughput, low power consumption, and fast response. The eye-catching 5 x 4-inch anodized aluminium chassis is perfect for corporate or home office settings, and it features toolless access for fast, safe, and easy upgrades.

Style meets AI-driven performance
Available with Intel Core Ultra 9, 7, or 5 CPUs, the Intel Arc GPU for enhanced graphics, and Intel AI Boost (NPU), the ASUS NUC 14 Pro+ meets most computing needs and combines style with powerful performance. Together, its three AI engines - GPU, NPU, and CPU - enable higher throughput, lower power consumption, and faster response to locally run generative AI workloads. The Intel Core Ultra processors represent Intel's most power-efficient client processors to date. Compared to its predecessor, the NUC 13 Pro Mini PC, the ASUS NUC 14 Pro+ offers significantly enhanced AI processing performance, offering unmatched stability and up to 35% faster local computing, especially noticeable in tasks such as text-to-image generation using stable-diffusion software.

Intel has reportedly chosen the TSMC 4 nm EUV foundry node for its next generation Arc Xe2 discrete GPUs based on the "Battlemage" graphics architecture. This would mark a generational upgrade from the Arc "Alchemist" family, which Intel built on the TSMC 6 nm DUV process. The TSMC N4 node offers significant increases in transistor densities, performance, and power efficiency over the N6, which is allowing Intel to nearly double the Xe cores on its largest "Battlemage" variant in numerical terms. This, coupled with increased IPC, clock speeds, and other features, should make the "Battlemage" contemporary against today's AMD RDNA 3 and NVIDIA Ada gaming GPUs. Interestingly, TSMC N4 isn't the most advanced foundry node that the Xe2 "Battlemage" is being built on. The iGPU powering Intel's Core Ultra 200V "Lunar Lake" processor is part of its Compute tile, which Intel is building on the more advanced TSMC N3 (3 nm) node.

Intel's upcoming Arrow Lake "S" Desktop and "HX" laptop CPUs are reported to launch without dedicated NPU hardware. NPUs will be limited to Arrow Lake-H/U and Lunar Lake chips, with Core Ultra 200V chips offering up to 48 TOPS of AI performance. Currently, AMD is the only manufacturer offering desktop chips with dedicated NPUs in their Ryzen 8000G "Hawk Point" series for the AM5 platform. However, according to Jaykihn, an active Intel-related leaker, Intel may be planning to incorporate NPUs in future Arrow Lake-S and Arrow Lake-HX refreshes.

The potential refresh could include an NPU within the SOC tile, possibly increasing the die size by 2.8 mm compared to current Arrow Lake designs. The package size is expected to remain unchanged, maintaining socket compatibility, however, motherboard manufacturers would need to enable Fast Voltage Mode (FVM) on VccSA rails to support the NPU functionality. While it's early to discuss an Arrow Lake refresh before the initial launch, this development could impact Intel's roadmap and the "AI PC" market segment. Also, it could have possible implications for the release schedule of future architectures like Panther Lake.

ASUS Republic of Gamers today announced the launch of the ROG NUC gaming PC. The first-ever ROG NUC PC is packed with cutting-edge technology and performance for AAA gaming and more.

Gaming, redefined
Featuring Intel Core Ultra 9 or Intel Core Ultra 7 processors and NVIDIA GeForce RTX 4070 or 4060 discrete graphics, the ROG NUC PC is a compact powerhouse that delivers unmatched gaming experiences. The high-performance hybrid architecture of Intel Core Ultra processors provides gamers with the power needed to stream, edit, record and play without skipping a beat. The 2.5-liter chassis is designed for quick system access to make upgrades and cleaning easy. Plus, the compatible ROG Raikiri Pro controller can be used to deliver a console-like experience for gamers seeking uncompromised performance and flexibility in a compact form factor.

What appears to be the full details of all of Intel's upcoming 800-series chipsets have leaked and although we've already seen what the Z890 chipset will offer, no details of the other SKUs have leaked to date. Maybe the biggest news is that there won't be an H870 chipset this time around, according to the leaker @jaykihn0 over at X/Twitter. The full range appears to be Z890, B860 and H810 for consumers, W880 for workstations and Q870 for corporate desktops. That said, the Z890 and W880 are identical in terms of slots and ports, but whereas the W880 gains full ECC support and Intel vPro and remote management, it loses the CPU and bus overclocking features of the Z890. The Q870 loses four chipset PCIe 4.0 lanes, one 20 Gbps or two 10 Gbps USB 3.2 ports, but is otherwise similar to the Z890, minus all the overclocking features, but with Intel vPro and remote management.

The B860 ends up on the chopping block as always and loses not only 10 chipset PCIe lanes compared to the Z890 chipset, but also four lanes from the CPU and four lanes on the DMI interface to the chipset. On top of that bifurcation goes out the window toigether with PCIe RAID and the chipset is only capable of having two 20 Gbps or four 10 Gbps USB 3.2 ports, but at least memory overclocking is still on the table. Finally, the H810 chipset is as basic as it gets, with no extra CPU PCIe lanes beyond the 16 lanes for a graphics card, but they are at least PCIe 5.0 this time around. The chipset itself is only equipped with a mere eight PCIe 4.0 lanes and it gets zero 20 Gbps and two 10 Gbps USB 3.2 ports. Note that all platforms support one or two Thunderbolt 4 / USB4 ports, but it's unclear if this is native support or via an add-on chip. Also note that the USB ports are shared and the maximum count is that for the 5 Gbps ports in the details below, so the Z890 for example, doesn't have 25 USB 3.2 ports in total, but rather only 10. All in all, we'll see a migration to PCIe 5.0 for the x16 slot across the entire 800-series chipset range and from the B860 and up, all chipsets will have a dedicated PCIe 5.0 x4 interface that will most likely be used for an M.2 slot. Also, the PCIe lane count is the maximum, but due to Intel's HSIO layout, some resources will be shared with SATA and Ethernet, which means not all PCIe lanes will be accessible.

Minisforum, a leader in mini PC innovation, today announces the launch of the UH125 Pro, a game-changing mini PC that redefines what's possible in compact computing. The UH125 Pro delivers a powerful blend of performance, efficiency, and versatility, making it the ultimate solution for professionals, gamers, and creators alike.

Unleashing the Power of Intel Core Ultra 5:
UH125 Pro lies the lightning-fast Intel Core Ultra 5 processor, featuring Intel 4 technology and a 3D high-performance hybrid architecture. This cutting-edge processor delivers a remarkable 65 W TDP 4, resulting in a dual improvement in performance and efficiency. With 14 cores (4 Performance Cores + 8 Efficiency Cores + 2 LP Efficiency Cores), 18 threads, 18 MB L3 Cache, and a maximum Turbo Frequency of 4.5 GHz, the UH125 Pro effortlessly handles even the most demanding tasks.

Intel very much does intend to make discrete gaming GPUs based on its Xe2 "Battlemage" graphics architecture, which made its debut with the Core Ultra 200V "Lunar Lake-MX" processor as an iGPU. With its next generation, Intel plans to capture an even bigger share of the gaming graphics market, both on the notebook and desktop platforms. "Battlemage" will be crucial for Intel, as it will be able to make its case with Microsoft and Sony for semi-custom chips, for their next-generation consoles. Intel has all pieces of the console SoC puzzle that AMD does. A Xe2 "Battlemage" discrete GPU sample, codenamed "Churchill Falls," has been spotted making its transit in and out of locations known for Intel SoC development, such as Bangalore in India, and Shanghai in China.

Such shipping manifests tend to be incredibly descriptive, and speak of an Arc "Battlemage" X3 and Arc "Battlemage" X4 SKUs, each with 448 execution units (EU), across 56 Xe cores. Assuming an Xe core continues to have 128 unified shaders in the "Battlemage" architecture, you're looking at 7,168 unified shaders for this GPU, a staggering 75% increase in just the numerical count of the shaders, and not accounting for IPC increase and other architecture-level features. The descriptions also speak of a 256-bit wide memory bus, although they don't specify memory type or speed. Given that at launch, the Arc A770 "Alchemist" was a 1440p-class GPU, we predict Intel might take a crack at a 4K-class GPU. Besides raster 3D performance, Intel is expected to significantly improve the ray tracing and AI performance of its Xe2 discrete GPUs, making them powerful options for creative professionals.

Researchers from the University of California, San Diego, have unveiled a significant security vulnerability affecting Intel Raptor Lake and Alder Lake processors. The newly discovered flaw, dubbed "Indirector," exposes weaknesses in the Indirect Branch Predictor (IBP) and Branch Target Buffer (BTB), potentially allowing attackers to execute precise Branch Target Injection (BTI) attacks. The published study provides a detailed look into the intricate structures of the IBP and BTB within recent Intel processors, showcasing Spectre-style attach. For the first time, researchers have mapped out the size, structure, and precise functions governing index and tag hashing in these critical components. Particularly concerning is the discovery of previously unknown gaps in Intel's hardware defenses, including IBPB, IBRS, and STIBP. These findings suggest that even the latest security measures may be insufficient to protect against sophisticated attacks.

The research team developed a tool called "iBranch Locator," which can efficiently identify and manipulate specific branches within the IBP. This tool enables highly precise BTI attacks, potentially compromising security across various scenarios, including cross-process and cross-privilege environments. One of the most alarming implications of this vulnerability is its ability to bypass Address Space Layout Randomization (ASLR), a crucial security feature in modern operating systems. By exploiting the IBP and BTB, attackers could potentially break ASLR protections, exposing systems to a wide range of security threats. Experts recommend several mitigation strategies, including more aggressive use of Intel's IBPB (Indirect Branch Prediction Barrier) feature. However, the performance impact of this solution—up to 50% in some cases—makes it impractical for frequent domain transitions, such as those in browsers and sandboxes. In a statement for Tom's Hardware, Intel noted the following: "Intel reviewed the report submitted by academic researchers and determined previous mitigation guidance provided for issues such as IBRS, eIBRS and BHI are effective against this new research and no new mitigations or guidance is required."

Intel has released its latest version of Arc GPU Graphics drivers for A-series discrete GPUs and Arc Graphics iGPUs, version 101.5594 Beta. The new drivers bring a fix for Citrix Workspace application on both Intel Arc A-Series and Intel Core Ultra CPU with Intel Arc GPUs that have exhibited sluggish behavior when interacting with a virtual desktop.

Unfortunately, there are no further fixes or optimizations as the previous Arc GPU Graphics drivers version 101.5593 Beta already brought optimizations for Final Fantasy XIV: Dawntrail and The First Descendant games. There are still plenty of known issues on Intel Arc A-Series graphics products including ones with games like No Man's Sky, Enshrouded, Doom Eternal and application like Topaz Video AI. There are also known issues with Intel Arc Control Studio as well with corruption of the recording file when the mouse cursor is enabled during HDR capture and issues with schedule updates for drivers.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5594 Beta