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Flex Announces Liquid-Cooled Rack and Power Solutions for AI Data Centers at 2024 OCP Global Summit

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

ASUS today unveiled a lineup of Z890 motherboards from the ROG Maximus, ROG Strix, TUF Gaming, Prime and ProArt families, supporting Intel Core Ultra processors (Series 2). ASUS is marking the occasion with all-new motherboard features that accelerate performance and streamline the build process. ASUS AI Advisor is a new natural-language build assistant powered by AI. AEMP III, NitroPath DRAM Technology and DIMM Fit unleash DDR5 memory kits. NPU Boost provides overclocking of the integrated NPU in an Intel Core Ultra (Series 2) CPU for accelerated AI performancei. ROG M.2 PowerBoost provides more M.2 slots on a motherboard than ever before. On top of all that, there is Thunderbolt 5, WiFi 7 and new PC DIY features to discuss.

Primed to perform with Intel Core Ultra processors (Series 2) in a new socket
Intel Core Ultra processors (Series 2) use the new LGA 1851 socket. Users of these processors will need an Intel 800 series motherboard to use one, and a Z890 motherboard specifically to take advantage of CPU overclocking. These options feature up to 24 cores in a new disaggregated architecture. Performance-cores, aka P-cores, take center stage with their high clock rates, while a cluster of Efficient-cores, aka E-cores, provide high-end multithreaded performance.

Lenovo Introduces ThinkSmart Core Gen 2

Lenovo Group announced today the Lenovo ThinkSmart Core Gen 2, one of the first AI-optimized compute device purpose built to run video conferencing room systems. Powered by the Intel Core Ultra processor with an integrated NPU, the ThinkSmart Core Gen 2 is ready for AI-heavy meeting room workloads to deliver unparalleled performance for intuitive collaboration and enhanced productivity, all in a protected and user-friendly solution.

Smarter AI for All Means Smarter Collaboration
Under Lenovo's vision of Smarter AI for All, the company is dedicated to empowering organizations and individuals to put AI to work for them. While the role of collaboration technology has never been more critical, many customers are continuing to redefine meeting spaces and how work is done. The integration of AI into collaboration tools presents a transformative opportunity to connect people and improve productivity. Lenovo, the global leader in PCs, is bringing more compute power to collaboration.

Could the Core i9-14900KS Successor be the Core Ultra 9 295K?

Intel's new Core Ultra processor model nomenclature is significantly different from the Core i7 series that held for 14 generations, since its 2008 debut. The desktop Core Ultra 2-series "Arrow Lake-S" desktop processor family is led by the Core Ultra 9 285K, which is positioned as a successor to the Core i9-14900K. The choice of numbering the top SKU "285K" instead of something like the "290K," which even caused the top Core Ultra 7 SKU to be numbered the "265K," raises a few questions. The biggest of these is if Intel is creating room for a near-future SKU to go with "295K."

In the classic Intel Core series nomenclature, the digit following the first two, designates a position in the product stack. For example, in the i9-14900K, "14" points to the processor generation, followed by "9" as the top-spec SKU. If you wind the clocks back to the 10th Gen Core "Comet Lake," there was a top-spec Core i9-10900K, but there was also a Core i9-10850K. Both the i9-10900K and the i9-10850K are unlocked 10-core/20-thread parts with identical TDP, set apart only by their stock clock speeds. Could it be possible that the Core Ultra 9 285K is a distant descendant of the i9-10850K, and that Intel's top "Arrow Lake-S" part is the "295K?" Momomo_us recently dug out an inconspicuous Intel Support webpage listing out Core Ultra desktop processors without an included fan-heatsink. This is very likely a typo, but the page mentions a "295K" SKU instead of the Core Ultra 9 285K. This caused us to wonder if the "295K" is being reserved for an i9-14900KS successor.

MSI OCLab Reveals Ryzen 9000X3D 11-13% Faster Than 7000X3D, AMD Set to Dominate "Arrow Lake" in Gaming

MSI OCLab made some groundbreaking disclosures about the gaming performance of upcoming AMD Ryzen 9000X3D processors. It looks like AMD is set to dominate the Intel Core Ultra 2-series "Arrow Lake-S" desktop processors in gaming performance, if these numbers hold up. In the games that MSI tested, namely "Far Cry 6," "Shadow of the Tomb Raider," and "Black Myth: Wukong," the "8-core 9000X3D" processor, or the Ryzen 7 9800X3D, is found to be 11% faster on average than the Ryzen 7 7800X3D. The "16-core 9000X3D" processor, which is expected to be the Ryzen 9 9950X3D, is an impressive 13% faster than its predecessor, the Ryzen 9 7950X3D.

Normally we'd expect bigger gen-on-gen gains for the 8-core part than the 16-core part, but the 16-core 9000X3D pulling ahead by that much over its predecessor hints at the possibility of AMD either giving it significantly higher clock speeds, or the rumor about AMD deploying both 3D V-cache on both its CCDs could be true after all. The 9950X3D could end up roughly on-par with the 9800X3D if this turns out to be true, given that the gaming performance delta between the 7800X3D and 7950X3D is roughly that much—2-3 percentage points. Intel earlier this week officially announced the Core Ultra 2-series desktop processors. As part of the announcement, the company put out some first-party gaming performance numbers, which put the top Core Ultra 9 285K either on-par with the Core i9-14900K, or faster by 2-3%, which means it should land behind even the 7950X3D in gaming performance, and AMD is set to dominate Intel in gaming performance with the 9000X3D series.

AMD EPYC "Turin" with 192 Cores and 384 Threads Delivers Almost 40% Higher Performance Than Intel Xeon 6

AMD has unveiled its latest EPYC processors, codenamed "Turin," featuring Zen 5 and Zen 5C dense cores. Phoronix's thorough testing reveals remarkable advancements in performance, efficiency, and value. The new lineup includes the EPYC 9575F (64-core), EPYC 9755 (128-core), and EPYC 9965 (192-core) models, all showing impressive capabilities across various server and HPC workloads. In benchmarks, a dual-socket configuration of the 128-core EPYC 9755 Turin outperformed Intel's dual Xeon "Granite Rapids" 6980P setup with MRDIMM-8800 by 40% in the geometric mean of all tests. Surprisingly, even a single EPYC 9755 or EPYC 9965 matched the dual Xeon 6980P in expanded tests with regular DDR5-6400. Within AMD's lineup, the EPYC 9755 showed a 1.55x performance increase over its predecessor, the 96-core EPYC 9654 "Genoa". The EPYC 9965 surpassed the dual EPYC 9754 "Bergamo" by 45%.

These gains come with improved efficiency. While power consumption increased moderately, performance improvements resulted in better overall efficiency. For example, the EPYC 9965 used 32% more power than the EPYC 9654 but delivered 1.55x the performance. Power consumption remains competitive: the EPYC 9965 averaged 275 Watts (peak 461 Watts), the EPYC 9755 averaged 324 Watts (peak 500 Watts), while Intel's Xeon 6980P averaged 322 Watts (peak 547 Watts). AMD's pricing strategy adds to the appeal. The 192-core model is priced at $14,813, compared to Intel's 128-core CPU at $17,800. This competitive pricing, combined with superior performance per dollar and watt, has resonated with hyperscalers. Estimates suggest 50-60% of hyperscale deployments now use AMD processors.

ENERMAX Announces CPU Coolers Support for the New-Gen Intel LGA1851 Socket

ENERMAX, an industry-leading force dedicated to designing high-performance computer hardware and cooling solutions, announced that its CPU cooler product line now supports the new generation Intel processor socket, LGA1851. The new generation of Intel CPUs utilizes the LGA1851 socket, which is compatible with existing LGA1700 CPU coolers. Therefore, users with ENERMAX CPU coolers can directly upgrade to the new generation Intel platform.

ENERMAX provides a comprehensive range of CPU cooling solutions with a maximum thermal design power (TDP) of up to 420 W, successfully unleashing CPU performance and enabling fast processing capabilities during multitasking.

Team Group Launches T-Force Xtreem CKD DDR5-8800 Gaming Memory

As a global leader in memory solutions, Team Group Inc. today unveiled its latest T-Force CKD (Client Clock Driver) DDR5 Gaming Memory. Following the worldwide attention received for the 7200 MHz T-CREATE EXPERT Ai CKD DDR5 showcased at COMPUTEX 2024, the T-Force gaming brand takes performance to new heights with the upcoming T-Force XTREEM CKD DDR5 8200 to 9000 (Gear 2) 2x24GB, featuring overclocking capabilities reaching up to 9600 MHz (Gear 4). Consumers can now push the limits of CUDIMM overclocking on the Intel Z890 platform with next-generation CKD DDR5 overclocking memory, achieving unprecedented performance breakthroughs.

Team Group continues to lead the industry in pushing boundaries by crafting the T-Force XTREEM CKD DDR5, which breaks beyond JEDEC frequency specifications. Utilizing CKD components and Intel XMP profiles on the Intel Z890 motherboard, users can effortlessly overclock to DDR5 speeds beyond 9000 MHz with a single click. Unlike JEDEC-compliant memory modules, the T-Force XTREEM CKD DDR5 leverages CKD components to enhance and buffer high-frequency signals from the CPU, ensuring more stable signal transmission to the memory modules. This enables DDR5 to push overclocking performance to even higher frequencies, surpassing traditional U-DIMM overclocking limitations.

Intel Officially Launches Core Ultra 200S Series Desktop Processors

Today, Intel launched the new Intel Core Ultra 200S series processor family that will scale AI PC capabilities to desktop platforms and usher in the first enthusiast desktop AI PCs. Led by the Intel Core Ultra 9 processor 285K, the latest generation of enthusiast desktop processors includes five unlocked desktop processors equipped with up to 8 next-gen Performance-cores (P-cores), the fastest cores available for desktop PCs, and up to 16 next-gen Efficient-cores (E-cores) that altogether result in up to 14% more performance in multi-threaded workloads than the previous generation. The new family are the first NPU-enabled desktop processors for enthusiasts and come with a built-in Xe GPU with state-of-the-art media support.

"The new Intel Core Ultra 200S series processors deliver on our goals to significantly cut power usage while retaining outstanding gaming performance and delivering leadership compute. The result is a cooler and quieter user experience elevated by new AI gaming and creation capabilities enabled by the NPU, and leadership media performance that leverages our growing graphics portfolio." - Robert Hallock, vice president and general manager of AI and Technical Marketing, Client Computing Group.

Our preview of the Intel Core Ultra 2-series Arrow Lake-S desktop processor family is also live

NZXT Announces New Intel Z890 N9 and N7 Motherboards

NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is thrilled to announce the launch of the N9 Z890 and the N7 Z890 Intel ATX motherboards. Offering two new motherboards that are optimized to support the latest Intel Core Ultra desktop processors, each providing a robust feature set suited to give gamers the performance they desire while also sleekly fitting into any PC build.

The N9 Z890 is designed for enthusiast PC gamers looking to build a high-end Intel -based gaming PC and push its performance to the limit. It enables gamers to unlock their peak performance by providing the thermal headroom and tools needed to reliably achieve higher overclocks for the new Intel Core Ultra desktop processors and memory. Meanwhile, the N7 Z890 refreshes NZXT's existing N7 lineup with a well-balanced ATX motherboard, offering the power and stability required to run any Intel Core Ultra desktop processor, making it an ideal choice for most PC gamers.

MSI Offers Free LGA 1851 Offset Kit Enhancer-I for MAG CORELIQUID I Series

MSI's latest MAG CORELIQUID I Series Liquid Cooler receives high praise for its DIY-friendly features, designed to simplify the assembly process. With pre-installed fans, streamlined cables, and UNI bracket, users can save time and effort while enjoying their assembly experience. MSI continues to prioritize delivering the best cooling solutions for our users. To support the latest Intel Core Ultra desktop processors (series 2), our engineering team has developed the LGA 1851 Offset Kit Enhancer-I for the MAG CORELIQUID I Series, engineered to optimize cooling performance. As a token of appreciation for our users, MSI is offering the LGA 1851 Offset Kit Enhancer-I to users free of charge. We invite you to apply and enhance your cooling experience.

Boosting Cooling Efficiency with LGA 1851 OFFSET KIT ENHANCER-I
The new MSI MAG CORELIQUID I Series is tailor-made for Intel Core Ultra desktop processors (series 2) platform. The enhanced LGA 1851 OFFSET KIT ENHANCER-I addresses the heat source shifting of the LGA 1851 socket. This upgraded mounting bracket precisely targets the core heat source, boosting cooling efficiency by approximately 3% when overclocking and ensuring stable operation even under heavy loads. For gamers pushing the limits of performance, this upgrade is about improved cooling performance and a fundamental breakthrough in system stability. MSI's optimized cooling design lets you enjoy top-tier performance output and stable system performance even during intense overclocking or extended operation, fully satisfying the ultimate desire for extreme performance.

Enter The New Era of Taichi with ASRock Z890 Series Motherboards

ASRock has unveiled a full lineup of Z890 motherboards, led by the new Taichi series flagship models. This series offers a powerful mix of options for extreme enthusiasts, including the ASRock Z890 Taichi AQUA, Taichi OCF, Taichi, and Taichi Lite. Other ASRock Z890 motherboards include the gaming-focused Phantom Gaming series, featuring the Nova, Riptide, and Lightning models, as well as the popular Steel Legend, LiveMixer, and Pro series for mainstream users. The new Z890 motherboards support the latest Intel Core Ultra 200 series processors, offering more high-speed expansion such as PCI-Express 5.0 support for a graphics card, as well as M.2 SSD, and more importantly up to two Thunderbolt 4 ports for all Z890 motherboards.

The New Era of Taichi
The white-styled ASRock Z890 Taichi AQUA introduces a unique hybrid thermal design developed in collaboration with Alphacool, which combines air and water cooling for the VRM and M.2 block. The Z890 Taichi AQUA also features the first detachable M.2 water block for Gen-5 SSDs, simplifying and streamlining installation.

MSI Liquid Coolers Support Intel's LGA1851 Sockets

MSI liquid coolers are fully compatible with Intel's Core Ultra Processors. As Intel's latest CPU approach promises unprecedented power and innovation, we understand that many users are looking into system upgrades. MSI liquid coolers are equipped to support this latest development, ensuring users are prepared for Intel's latest processors without the need for a complete liquid cooler replacement.

If you upgrade to Intel Core Ultra CPUs, consider MSI liquid coolers for a seamless transition. All MSI liquid coolers will support Intel's LGA1851 socket, which will be already prepared in the box.

BOXX Unveils S-Class Workstations with New Intel Core Ultra Processors

BOXX Technologies, the leading innovator of high-performance computer workstations, rendering systems, and servers, today announced that its best-selling APEXX S-Class workstations now feature Intel Core Ultra 7 and Ultra 9 processors. The new CPUs deliver outstanding performance for CAD, 3D design, motion media, and other professional software applications. BOXX is first to market with workstations featuring the new Intel Core Ultra processors and is accepting orders now.

"Intel Core Ultra processors unlock new levels of performance with features like AI optimization, increased PCIe lanes, and maximized peripheral connectivity," said BOXX founder and Chief Technology Officer Tim Lawrence. "Whether you're 3D modeling, video editing, engineering, designing, or utilizing AI enhancements, BOXX APEXX S-class systems powered by Intel Core Ultra processors will accelerate your creative applications and render engines through their most demanding tasks."

MSI Unveils Next-Generation AI Gaming Desktops Powered by Intel's Arrow Lake-S

MSI unveils its new lineup of AI gaming desktops, following the introduction of Intel's Arrow Lake-S desktop processors. The lineup features two advanced models: the MPG Infinite X3 AI and the MEG Vision X. These desktops harness the power of Intel Core Ultra processors (Series 2) with built-in Neural Processing Units (NPUs), coupled with NVIDIA GeForce RTX graphics cards. This powerful combination delivers enhanced performance in both AI-accelerated gaming and complex processing tasks, aiming to optimize the gaming experiences.

These new desktops are equipped with up to Intel Core Ultra 9 processor 285K, boasting 8 P-Cores, 16 E-Cores, and an integrated 13 trillion operations per second (TOPS) NPU. When paired with up to a GeForce RTX 4090 graphics card, the systems achieve an impressive total of over 1300 TOPS, enabling them to handle advanced AI tasks effortlessly while enhancing gaming performance and AI-generated content (AIGC) efficiency. The integrated NPU significantly enhances processing capabilities, particularly for AI-related tasks. In applications like DIGIME software, it boosts AI inference efficiency while simultaneously reducing GPU load. This optimization not only improves performance in specific applications but also benefits overall AI computation across various tasks.

Noctua Confirms Intel LGA1851 Heatsink Compatibility and Announces Free-of-Charge Upgrades for Older Models

Noctua today confirmed that all its CPU coolers and mounting-kits that support Intel LGA1700 also support the new LGA1851 socket of the upcoming Core Ultra desktop processors (Series 2), also known under the code name Arrow Lake-S. Mounting upgrade kits for older heatsink models that do not yet support LGA1700 and LGA1851 will be provided to customers free of charge.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Intel Core Ultra Series 2 processors and their new LGA1851 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support LGA1851 out of the box and don't require any updates, customers will be able to upgrade most older coolers at no additional cost, so even the very first Noctua coolers from 2005 can be used on the latest Intel processors!"

COLORFUL Presents Intel Z890 Motherboard Lineup for the Intel Core Ultra 200 Series

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, introduces its lineup of Intel Z890 motherboards to the newly launched Intel Core Ultra 200 Series processors. The new Intel Z890 motherboards feature several technological improvement including 40 Gbps USB4 connectivity, Wi-Fi 7, and higher DDR5 memory support among others. Upon launch, COLORFUL presents seven Z890 motherboards designed to cater a wide range of users from casual desktop users to more demanding users such as gamers and content creators.

For high-end PC builders, COLORFUL introduces the iGame Z890 VULCAN X/W, iGame Z890 FLOW and iGame Z890 ULTRA motherboards. The iGame Z890 VULCAN X/W is the flagship motherboard, packed with premium features designed to deliver performance and aesthetics - available in black and white models. For mainstream users, the CVN Z890 ARK FROZEN, CVN Z890M GAMING FROZEN and BATTLE-AX Z890M-PLUS motherboard offer a great balance of features and latest technologies.

BIOSTAR Introduces Its New Z890 Valkyrie Motherboard

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today unveils the all-new Z890 VALKYRIE flagship motherboard built to empower next-generation AI enthusiasts.

Designed to harness the full power of Intel Core Ultra processors (series 2), the Z890 VALKYRIE is tailor-made for high-performance gaming, content creation, and advanced AI applications. The Intel Core Ultra processors offers unparalleled AI capabilities, delivering exceptional speed and multi-core performance. When paired with BIOSTAR's flagship Z890 VALKYRIE motherboard, this combination becomes the ultimate platform for creators and tech enthusiasts to explore the world of generative AI without needing a dedicated graphics card. From image generation to real-time data processing, the Z890 VALKYRIE provides speed and efficiency with limitless possibilities.

Gigabyte Unveils AORUS WATERFORCE AlO Cooler Support Socket LGA 1851 (Arrow Lake-S) CPU

GIGABYTE Technology a leader in innovative cooling solutions, proudly announces the launch of the AORUS WATERFORCE AIO cooler, meticulously engineered to meet the demanding cooling needs of Intel Socket LGA 1851 CPU. With significant changes in hotspot locations and thermal requirements across the new CPU lineup, ensuring optimal cooling performance across all model configurations has become imperative. The AORUS WATERFORCE AIO cooler is designed with three key features that significantly enhance cooling efficiency for Socket LGA 1851 CPU.

Optimal Mounting Pressure Design
In alignment with Intel Socket LGA 1851 (Arrow Lake-S) Thermal Design Guide, the new socket LGA 1851 requires increased mounting pressure for optimal thermal performance. The AORUS WATERFORCE X II series & non-X II series cooler provides maximum mounting pressure, ensuring a firm fit that enhances heat transfer from the CPU to the cooler.

Gigabyte Unveils Ground Breaking Z890 Motherboards

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

Global PC Shipments Dip Slightly Despite Recovery Economy, But AI Integration is the Key to Future Market Success

Even though the global economy shows signs of recovery, worldwide shipments of traditional PCs dipped 2.4% year-over-year (YoY) to 68.8 million units, during the third quarter of 2024 (3Q24), according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Factors including rising costs and inventory replenishment led to a surge in shipments in the previous quarter, resulting in a slightly slower sales cycle.

"Demand, without a doubt, has returned for PCs amongst consumers and commercial buyers," said Jitesh Ubrani, research manager with IDC's Worldwide Mobile Device Trackers. "However, much of the demand was still concentrated at the entry-level thanks to a recovering economy and the back-to-school season in North America. That said, newer AI PCs such as Copilot+ PCs from Qualcomm along with Intel and AMD's equivalent chips as well as Apple's expected M4-based Macs are expected to drive the premium segment in coming months."

Intel's Arrow Lake-S Launch Line-up Confirmed in New Leak

Intel's Arrow Lake-S launch line-up has been confirmed courtesy of serial leaker @9550pro on X/Twitter and although the leaked Intel product slide doesn't contain any real surprises by now, it does confirm that Intel will launch five different SKUs later this month. The Core 200S-series should be unveiled on Thursday by Intel, but retail availability isn't expected until the 24th of October. The Initial five CPU SKUs will be the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF and finally the Core Ultra 5 245K and 245KF. As noted earlier today in the performance leak of the Core Ultra 9 285K, the entire Arrow Lake-S series will lack Hyper-Threading in favour of more E-cores. The Core Ultra 9 285K features eight Lion Cove P-cores and 16 Skymont E-cores, followed by the Core Ultra 7 265 SKUs which retain the Lion Cove core count, but ends up with only 12 Skymont cores. Finally, the Core Ultra 5 SKUs have six Lion Cove P-cores and eight Skymont E-cores. All the upcoming SKUs feature Intel's Thermal Velocity Boost, a feature that used to be exclusive to the Core i9 tier of CPUs in the past, but only the Core Ultra 9 and Ultra 7 SKUs support Intel Turbo Boost Max Technology 3.0. The Core Ultra 9 and Ultra 7 SKUs have a maximum TDP of 250 W, with the Core Ultra 5 SKUs peaking at 159 W. All five processors have a base power of 125 W.

As such, we're looking at boost speeds of up to 5.7 GHz for the Core Ultra 9, 5.5 GHz for the Core Ultra 7 and 5.2 GHz for the Core Ultra 5 processors. The Core Ultra 5 has the highest base frequency of the three SKUs with the P-cores clocking in at 4.2 GHz and the E-cores at 3.6 GHz. The Core Ultra 7 follows at 3.9 GHz for the P-Cores and 3.3 GHz for the E-cores and finally the Core Ultra 9 has a base frequency of 3.7 GHz for the P-Cores and 3.2 GHz for the E-cores. Intel has upped the JEDEC memory support to DDR5-6400, which is an 800 MHz jump in the officially supported memory speed from its 14th Gen Core i processors. Up to 192 GB of RAM is supported, which is the same as the previous generation of desktop CPUs from Intel. The IGP sports four Xe-cores across the board of the K SKU CPUs, with a base clock of 300 MHz and a boost clock of up to 2 GHz, although the Core Ultra 5 SKUs end up with an IGP that only boosts to 1.9 GHz. All SKUs also feature a third generation NPU capable of 13 TOPS, which is a lot weaker than the mobile Core Ultra 200V Lunar Lake CPUs which have an NPU capable of up to 48 TOPS, depending on the SKU. As this leak appears to be from the same original source as the performance figures that leaked earlier, we'd assume the information is correct, especially as it lines up with earlier leaks, but it should still be taken with a pinch of salt until everything has been confirmed by Intel.

Intel Releases Arc GPU Graphics Drivers 101.6083 Beta

Intel has released the latest version of its Arc GPU Graphics drivers, the version 101.6083 Beta. The new driver update brings Game On support on Intel Arc A-series GPUs and Intel Core Ultra CPUs with Intel Arc GPUs for Diablo IV: Vessel of Hatred Expansion, DRAGON BALL: Sparking! ZERO, and Silent Hill 2 games, increases performance in games like God of War Ragnarök, as well as fixes an issue seen in FC25, where Arc A-series GPUs may exhibit intermittent green corruption in the game menu and during gameplay.

According to Intel's release notes, the new driver update improves performance in God of War Ragnarök game by up to 9 percent average at 1080p resolution with Ultra settings and up to 34 percent average at 1440p resolution with Ultra settings. There are still several known issues which will hopefully be fixed with the next WHQL driver update.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6083 Beta

Inflection AI and Intel Launch Enterprise AI System

Today, Inflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers. Inflection AI is launching Inflection for Enterprise, an industry-first, enterprise-grade AI system powered by Intel Gaudi and Intel Tiber AI Cloud (AI Cloud), to deliver empathetic, conversational, employee-friendly AI capabilities and provide the control, customization and scalability required for complex, large-scale deployments. This system is available presently through the AI Cloud and will be shipping to customers as an industry-first AI appliance powered by Gaudi 3 in Q1 2025.

"Through this strategic collaboration with Inflection AI, we are setting a new standard with AI solutions that deliver immediate, high-impact results. With support for open-source models, tools, and competitive performance per watt, Intel Gaudi 3 solutions make deploying GenAI accessible, affordable, and efficient for enterprises of any size." -Justin Hotard, Intel executive vice president and general manager of the Data Center and AI Group

MSI Unveils MS-CF17 Fanless SBC for Embedded systems

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.
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