AAEON, a global leader in embedded computing, has introduced the GENESYSM-ADN6, a slimline SubCompact System powered by Intel Core Processor N-series CPUs. Measuring just 178 mm x 134.1 mm x 43 mm, the GENESYSM-ADN6 is a compact option built to satisfy demand for mini PCs suitable for smart retail, industrial automation, and edge gateway applications. The PC's connectivity and scalability clearly align it with the latter of these vertical markets, with a standout feature being its three LAN ports, configured for Intel Ethernet Controller I226 running at 2.5GbE speed. Alongside this is extensive expansion options for Wi-Fi, 5G, and additional storage through the system's M.2 2230 E-Key, M.2 3052 B-Key, and mSATA slots respectively.

In addition to its compact size, the GENESYSM-ADN6 is well-suited to deployment in industrial settings, with a wide power input range of 9 V to 36 V and fanless operation. Moreover, the system boasts two COM ports for RS-232/422/485, with the option of two additional ports for RS-232. Elsewhere, two USB 3.2 Gen 2 ports, an 8-bit GPIO, and SMBus/I2C are available for integrating sensors, actuators, and other peripheral devices, making it an excellent option when it comes to PLCs, robotic arms, and SCADA systems. The system's interfaces are bolstered by high-bandwidth, SODIMM-based DDR5 system memory for expedited data processing and optional TPM 2.0 for added data security.

According to Tom's Hardware, AMD has confirmed that its upcoming FidelityFX Super Resolution 4 (FSR 4.0) graphics upscaling solution will harness the power of AI for frame generation and frame interpolation. This update marks a significant shift from the company's previous analytical-based approaches, as revealed by Jack Huynh, AMD's senior vice president and general manager of the Computing and Graphics Business Group. Initially, FSR4's primary focus is addressing the persistent challenge of battery life in handheld gaming devices. Huynh emphasized the need for extended playtime, stating, "I need to play a Wukong for three hours, not 60 minutes." To achieve this, AMD has been working on AI-based upscaling techniques for nearly a year. As a reminder, FSR 1.0 used spatial upscaling, version 2.0 used temporal upscaling, and FSR 3.0 also used temporal upscaling with optional frame generation.

While the initial context for FSR4 centers on handheld devices, AMD's work with developing open-source, architecture-agnostic algorithms suggests broader applications. FSR4 might be compatible with a wide range of GPU solutions, including non-handheld devices, benefiting desktop and laptop users as well. This move to AI-based technology aligns AMD with competitors like Intel, who have implemented similar approaches in their XeSS technology, and NVIDIA with its DLSS solution. Although the release date for FSR4 remains unannounced, its year-long development suggests it may be nearing completion. However, as with previous upscaling solutions, widespread adoption in games may take time following its release.

ASUS today announced that the Zenbook DUO (2024) (UX8406) and ProArt PZ13 (HT5306) laptops won Silver Awards in the Consumer Technology category at the International Design Excellence Awards (IDEA) 2024. Additionally, eight more ASUS products were named as finalists, marking 2024 as the company's most successful year at IDEA. This strong showing underlines the company's dedication to redefining user experiences through innovative design that balances aesthetics and technological excellence.

ASUS Zenbook DUO (2024) also earned a spot in the permanent collection of the Henry Ford Museum of American Innovation, highlighting the ingenuity of the world's first AI-powered 14-inch dual-screen laptop. The museum, a longstanding partner of the IDEA awards, adds select award-winning products to its permanent collection every year.

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

Intel's upcoming Core Ultra 200 "Arrow Lake-S" desktop processors will herald a new wave of overclocking memory kits as the architecture is expected to support even higher memory speeds than the current 14th Gen Core. The product page of an ASRock Z890 motherboard lists out maximum memory speeds for various DIMM configurations. The most overclocker-friendly config—1 single-rank DIMM per channel—sees ASRock mention support for DDR5-9200+ (OC). The fastest DDR5 OC memory kits in the market are DDR5-8600, and over the Summer, JEDEC announced standardization of high frequency DDR5 configurations, including the likes of DDR5-8800. Such high frequencies require the DIMM to feature a clock driver.

Those looking for high capacity memory configurations have big reason to cheer. For two single-rank DIMMs per channel, or one dual-rank DIMM per channel, the motherboard's product page mentions an OC speed of DDR5-6800+. This should be a boon for those wanting large memory capacities such as 96 GB or 128 GB using dual-rank DIMMs at reasonably high speeds. Even the densest memory configuration, two dual-rank DIMMs per channel, has a maximum OC speed of DDR5-5800+. This should allow users to approach the platform's maximum memory capacity, such as 256 GB using four 64 GB dual-rank DIMMs, or 192 GB using four 48 GB DIMMs, but at much higher speeds that what the current platforms are capable of.

ASUS and GIGABYTE have registered a large number of Intel Z890 motherboards with the Eurasian Economic Commission (EEC). For ASUS, the registrations suggest that these will be released on October 10, followed by an official market launch on October 24. ASUS has added no less than 29 Z890 motherboards to its ROG MAXIMUS, ROG STRIX, TUF GAMING, PRIME, and other series, while GIGABYTE has added 18 models to both its AORUS and non-AORUS series.

ASUS Z890 Motherboards

• ROG MAXIMUS Series
  • ROG MAXIMUS Z890 EXTREME
  • ROG MAXIMUS Z890 FORMULA
  • ROG MAXIMUS Z890 APEX
  • ROG MAXIMUS Z890 APEX ENCORE
  • ROG MAXIMUS Z890 HERO
  • ROG MAXIMUS Z890 DARK HERO
  • ROG MAXIMUS Z890 HERO BTF

Synnex Technology International is a major Hong Kong-based distributor of PC components, which also retails directly. PC enthusiasts in Hong Kong have been trying to avail replacements for their Intel Core i9-14900K processors under Intel's laid down procedure, including extended warranties for the processor, which has been hit by the notorious physical degradation issue. A customer sent in their i9-14900K to find that they are not getting a replacement chip, because Synnex ran out of chips to send customers as replacements.

The retailer sent in a template response that the chip sent by the customer cannot be repaired or replaced, but the customer can avail a cash refund of HKD $4,200 (around $540), which is close to the street price of the processor. The processor itself has been running out of stock in many places, partly because inventory in the channel is being directed toward honoring warranty claims. The only practical way to honor a processor warranty claim is replacement, since there is very little that can be repaired by a distributor (except maybe the stock cooler). HKEPC reports that the user took Synnex up on its offer for refund, sold everything in their machine except the SSD, and is now planning to build a new machine based on the Ryzen 9 9950X.

ASUS today announced Zenbook S 14 (UX5406), one of the thinnest and most portable 14-inch new-era ASUS AI PCs on the market, blending performance with sophistication. The premium Zenbook S 14 showcases a new functional aesthetic, and has been completely redesigned inside and out. The chassis features the new, innovative ASUS Ceraluminum, a high-tech ceramic hybrid material available in a range of nature-inspired colors. This industry-first material offers exceptional strength, effortlessly resisting scratches and wear.

Zenbook S 14 is powered by up to the latest AI-enabled Intel Core Ultra 9 processor (Series 2) and Intel Arc graphics, delivering up to 48 NPU TOPS. Advanced CNC milling enables the integration of an ultraslim vapor chamber in the ultra-quiet ambient cooling system—unique for such a thin device—ensuring up to 28-watt CPU TDP performance with minimal noise. The functional design features a dedicated Copilot key and an enlarged 16:10 seamless touchpad that supports smart gestures.

The $8.5 billion in CHIPS Act assistance intended for Intel from the US government is expected to be delayed due to the company's ongoing financial struggles. According to a Bloomberg report, the Department of Commerce rejected the initial allocation request, requiring Intel to meet specific objectives and complete a comprehensive due diligence process before the funds are released.

Intel has committed to remaining engaged in discussions despite the additional requirements, though it encountered regulatory and timing challenges. The terms of the funding include $8.5 billion in direct assistance to Intel, along with $11 billion in low-cost credit, and a 25 percent tax credit worth up to $100 billion for Intel's investments in Arizona, New Mexico, Ohio, and Oregon.

Intel has reportedly delayed the launch of its next-generation Core Ultra 200K series "Arrow Lake-S" desktop processors by a week. Originally slated for an October 17, 2024 launch, these chips are now releasing on October 24, according to HKEPC. There's no reason cited for the delay, it probably has to do with retailer stocking. The delay isn't significant. The Core Ultra 200K introduce a new CPU socket, the LGA1851, which means these chips need to launch alongside new motherboards based on the Intel 800-series.

The initial wave of processors is expected to include only SKUs targeting overclockers and enthusiasts. These include the Core Ultra 9 285K (8P+16E), the Core Ultra 7 265K (8P+12E), and the Core Ultra 5 245K (6P+8E), and their "KF" variants that lack integrated graphics. It's also expected that the first wave of compatible motherboards will only come with the premium Intel Z890 chipset, which supports CPU overclocking. Intel will likely expand its processor model selection, along with more affordable chipsets, such as the B860, around the 2025 International CES.

Intel over the weekend released the latest version of Arc GPU Graphics Drivers. Version 101.5989 Beta comes with Game-On optimization for "Arena Breakout: Infinite," "Deadlock," "NBA 2K25," "Test Drive: Unlimited Solar Crown," and "Warhammer 40,000: Space Marine 2." The drivers should prove especially important for "Deadlock," where Intel claims performance improvements of up to 17% at 1080p, and up to 13% at 1440p. In "Test Drive: Unlimited Solar Crown," you can expect up to 19% performance improvements in both the 1080p and 1440p resolutions. "Warhammer 40K: Space Marine 2" players can expect up to 7% performance improvements at 1080p, and up to 8% improvements at 1440p. Intel hasn't included any fixes with this release, but identified a handful new issues. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5989 Beta

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Global technology brand HONOR today announced its groundbreaking AI-enabled hardware capabilities and a collaborative AI privacy protection architecture, showcasing its commitment to innovative empowerment in an AI-driven world, at IFA 2024. The HONOR MagicBook Art 14 represents a groundbreaking leap in laptop industry, transforming conventional laptop experience by infusing human-centric innovation with robust capabilities.

Showcasing the Vine-leaf Curves Design and Satin Enamel Spraying Technology, this laptop is a marvel of lightweight engineering, incorporating cutting-edge platform-level AI features alongside robust hardware and software solutions, ensuring unmatched productivity and user experience. Translating the lightweight and slim characteristics synonymous with smartphones to laptops, HONOR is introducing the so far lightest and slimmest AIPC to the market. The HONOR MagicBook Art 14 showcases the pioneering Topology Lightweight Structure, weighing just approximately 1 kg and measuring a slim thickness of 10 mm. Boasting an alloy body crafted from magnesium and a keyboard constructed with titanium, this laptop epitomizes a perfect balance of lightweight design and durability.

Lenovo, a global leader in technology innovation, announced its latest advancements at Lenovo Innovation World 2024, unveiling a series of AI PC devices, including ThinkPad, ThinkBook, Yoga, and IdeaPad laptops, designed to transform both enterprise and consumer user experiences.

AI PC Era
AI PCs are set to revolutionize computing as their relevance grows, with 60% of PCs shipped by 2027 anticipated to be AI-capable. Lenovo's AI PCs are at the forefront of this transformation, leveraging natural interactions, personalized large language models, and advanced computing architectures. These innovations make computing more personal by tailoring experiences to individual users, more productive by enhancing workflow efficiency, and more protected by integrating robust security features into AI-driven systems.

Taipei, Taiwan－September 5th, 2024－Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to announce that a total of 71 cooling products are fully compatible with the latest Intel Arrow Lake-S and AMD Ryzen 9000 series processors. The upcoming Intel 15th Gen CPUs feature the new LGA 1851 socket and retain compatibility with the LGA 1700 socket.

Meanwhile, the AMD Ryzen 9000 series is continually designed with the AM5 socket. This indicates that users can seamlessly upgrade to the brand-new Intel and AMD CPUs while pairing up with the existing Thermaltake coolers. Regardless of air coolers, all-in-one liquid coolers, or water blocks, Thermaltake offers a wide range of superior cooling solutions to these next-gen processors.

SCHENKER is updating the KEY series with three new models for 2024. As the most powerful laptop in the portfolio, the 17.3-inch KEY 17 Pro desktop replacement workstation receives a significant upgrade to its comprehensive features: two Thunderbolt 5 ports allow for maximum flexibility. With the fastest laptop processor, the Intel Core i9-14900HX, and graphics cards up to the NVIDIA GeForce RTX 4090, the Varjo-Ready-certified KEY 17 Pro excels as a powerful, professional VR and content creation workstation. New additions to the product range include the 14-inch SCHENKER KEY 14 with an Intel Core Ultra 7 155H and the 16-inch KEY 16 Pro with an Intel Core i9-14900HX. Both models feature graphics cards up to the GeForce RTX 4070 and are NVIDIA GeForce RTX Studio certified.

SCHENKER KEY 17 Pro: Desktop Replacement Workstation with Two Thunderbolt 5 Ports, PCIe 5.0 SSD, Optional UHD Display, and Varjo-Ready Certification
The SCHENKER KEY 17 Pro (M24) succeeds its predecessor with a crucial upgrade: two Thunderbolt 4 ports have been replaced by two Thunderbolt 5 ports with a total bandwidth of 80 Gbps (shared by both ports, depending on the bandwidth requirement per connection) for the best display experience. This laptop provides maximum performance with the next generation of Thunderbolt 5 peripherals, such as multifunctional docking stations and high-performance external storage solutions or the newest DP2.1 based displays. One of these multi-purpose ports can also support charging the workstation with up to 100 watts. The significantly increased bandwidth compared to the previous generation allows for the operation of up to three external 4K monitors at 144 Hz or dual 6K displays. Thunderbolt 5 technology offers maximum flexibility, being backwards compatible with existing Thunderbolt 4, Thunderbolt 3 and USB peripherals. Additionally, Thunderbolt Share enables direct data exchange and ultra-low-latency screen sharing between two computers.

ASUS today announced ExpertBook B1, a durable, reliable and versatile laptop that's ready for the rigors of the modern business world. ExpertBook B1's lineup of powerful features includes up to an Intel Core 7 processor with Intel Iris Xe Graphics, up to 64 GB of memory and ample storage, plus a vibrant screen with a tall 16:9 aspect ratio - all encased in a sleek 1.4 kg chassis. ExpertBook B1 is designed for seamless connectivity, featuring up to WiFi 6E and a comprehensive array of I/O ports. In addition, it offers military-grade durability and incorporates an eco-friendly design that reflects a commitment to sustainability and accountability.

Robust performance
ExpertBook B1 is engineered to enhance business capabilities, providing the fast and responsive performance essential for today's demands—enabling seamless multitasking, advanced data handling, and streamlined operations. Powered by up to an Intel Core 7 processor with Intel Iris Xe Graphics, ExpertBook B1 delivers the robust performance needed to get the job done.

Intel has announced the cancellation of its 20A node for Foundry customers, as well as shifting majority of Arrow Lake production to external foundries. The tech giant will instead focus its resources on the more advanced 18A node while relying on external partners for Arrow Lake production, likely tapping TSMC or Samsung for their 2 nm nodes. The decision follows Intel's successful release of the 18A Process Design Kit (PDK) 1.0 in July, which garnered positive feedback from the ecosystem, according to the company. Intel reports that the 18A node is already operational, booting operating systems and yielding well, keeping the company on track for a 2025 launch. This early success has enabled Intel to reallocate engineering resources from 20A to 18A sooner than anticipated. As a result, the "Arrow Lake processor family will be built primarily using external partners and packaged by Intel Foundry".

The 20A node, while now cancelled for Arrow Lake, has played a crucial role in Intel's journey towards 18A. It served as a testbed for new techniques, materials, and transistor architectures essential for advancing Moore's Law. The 20A node successfully integrated both RibbonFET gate-all-around transistor architecture and PowerVia backside power delivery for the first time, providing valuable insights that directly informed the development of 18A. Intel's decision to focus on 18A is also driven by economic factors. With the current 18A defect density already at D0 <0.40, the company sees an opportunity to optimize its engineering investments by transitioning now. However, challenges remain, as evidenced by recent reports of Broadcom's disappointment in the 18A node. Despite these hurdles, Intel remains optimistic about the future of its foundry services and the potential of its advanced manufacturing processes. The coming months will be crucial as the company works to demonstrate the capabilities of its 18A node and secure more partners for its foundry business.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new flagship GIGABYTE G593 series servers supporting direct liquid cooling (DLC) technology to advance green data centers using NVIDIA HGX H200 GPU. As DLC technology is becoming a necessity for many data centers, GIGABYTE continues to increase its product portfolio with new DLC solutions for GPU and CPU technologies, and for these new G593 servers the cold plates are made by CoolIT Systems.

G593 Series - Tailored Cooling
The GPU-centric G593 series is custom engineered to house an 8-GPU baseboard, and its design had foresight for both air and liquid cooling. The compact 5U chassis leads the industry in its readily scalable nature, fitting up to sixty-four GPUs in a single rack and supporting 100kW of IT hardware. This helps to consolidate the IT hardware, and in turn, decrease the data center footprint. The G593 series servers for DLC are in response to the rising customer demand for greater energy efficiency. Liquids have a higher thermal conductivity than air, so they can rapidly and effectively remove heat from hot components to maintain lower operating temperatures. And by relying on water and heat exchangers, the overall energy consumption of the data center is reduced.

ASUS today announced ExpertBook P5 (P5405), a groundbreaking Copilot+ PC1 designed to empower modern professionals. Powered by the latest Intel Core Ultra processor (Series 2) with up to 48 NPU TOPS2, delivering an up to 3X AI performance boost over the prior generation and featuring ASUS AI ExpertMeet, this AI-driven powerhouse streamlines workflows and enhances collaboration. Its sleek, durable aluminum chassis houses a stunning 2.5K 144 Hz display, delivering exceptional visuals. With a 1.29 kg3 feather-light design, robust security features, and a focus on sustainability, ExpertBook P5 is the perfect companion for on-the-go professionals seeking peak performance and efficiency.

The future of work
Crafted with meticulous attention to detail, ExpertBook P5 boasts a premium aluminum design that seamlessly blends aesthetics and ergonomics. Despite its lightweight construction, at just 1.29 kg, P5 offers exceptional durability — meeting the exacting US MIL-STD 810H military standard. Its thoughtfully designed workspace, featuring conveniently placed function keys and a spacious mouse area, optimizes productivity and comfort during video conferences and multitasking. Engineered with the ASUS ExpertCool thermal structure, a newly-enhanced cooling design, the ExpertBook P5 ensures consistent, optimal cooling whether the lid is open or closed, guaranteeing peak performance even during extended usage. It is a productivity powerhouse designed to elevate professional performance, empowering users to achieve their full potential.

According to a recent Reuters report, Intel's 18A node doesn't seem to be production-ready. As the sources indicate, Broadcom has been reportedly testing Intel's 18A node on its internal company designs, which include an extensive range of products from AI accelerators to networking switches. However, as Broadcom received the initial production run from Intel, the 18A node seems to be in a worse state than initially expected. After testing the wafers and powering them on, Broadcom reportedly concluded that the 18A process is not yet ready for high-volume production. With Broadcom's comments reflecting high-volume production, it signals that the 18A node is not producing a decent yield that would satisfy external customers.

While this is not a good sign of Intel's Fundry contract business development, it shows that the node is presumably in a good state in terms of power/performance. Intel's CEO Pat Gelsinger confirmed that 18A is now at 0.4 d0 defect density, and it is now a "healthy process." However, alternatives exist at TSMC, which proves to be a very challenging competitor to take on, as its N7 and N5 nodes had a defect density of 0.33 during development and 0.1 defect density during high-volume production. This leads to better yields and lower costs for the contracting party, resulting in higher profits. Ultimately, it is up to Intel to improve its production process further to satisfy customers. Gelsinger wants to see Intel Foundry as "manufacturing ready" by the end of the year, and we can see the first designs in 2025 reach volume production. There are still a few more months to improve the node, and we expect to see changes implemented by the end of the year.

ASUS today announced that it showcased its latest technological innovations at the Always Incredible Media Day for IFA 2024 in Berlin, Germany. The company highlighted its commitment to its Ubiquitous AI. Incredible Possibilities vision by unveiling a new portfolio of next-generation ASUS Copilot+ PCs. Equipped with the latest Intel Core Ultra processors (Series 2), they deliver style, robust features and functionality, robust connectivity and heighten levels of performance alongside AI capabilities. ASUS has harnessed the full potential of Intel Core Ultra processors (Series 2) in the latest ASUS NUC mini PC. This new model outperforms the competition with superior performance, while maintaining an impressively compact design and robust array of connections and expansion support. With an integrated NPU delivering up to 48 TOPS, it enabled on-device AI capabilities. The NUC 14 Pro Ai will receive a free update to Copilot+ PC experiences when available.

The company's collaboration with Intel has been key in bringing these cutting-edge devices to life. "The powerful Intel Core Ultra processors at the heart of our latest Zenbook, Vivobook, ExpertBook laptops, and NUC Mini PC deliver unmatched performance and enable a wide range of AI experiences," said Rangoon Chang, ASUS Corporate Vice President, Consumer Business Unit. "With these new devices, together we are empowering users to harness the full potential of AI to enjoy smarter, more intuitive computing."

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable.

Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.