US lawmakers are moving forward with a proposal requiring high-performance graphics cards and AI processors to carry built-in geotracking technology to keep sensitive chips out of hostile hands. Senator Tom Cotton of Arkansas introduced the Chip Security Act on May 12, 2025. Under this legislation, the Commerce Department would have the authority to mandate location-verification features in any device subject to US export controls, with manufacturers given six months after enactment to comply. The bill applies to a broad set of products classified under export control classification numbers 3A090, 4A090, 4A003.z, and 3A001.z. That includes everything from advanced AI accelerators and rack-scale servers to certain gaming graphics cards like NVIDIA's GeForce RTX 5090. Manufacturers would be required to embed hardware or firmware capable of reporting each device's physical location back to a centralized registry maintained by the Commerce Department.

Exporters must also notify the Bureau of Industry and Security immediately if a unit is diverted, tampered with, or appears at an unauthorized location. To keep pace with evolving security threats, the legislation calls for a joint one-year study by the Commerce Department and the Department of Defense on potential new tracking and safeguard mechanisms. Following that, the two departments would conduct annual reviews for three years. If they determine that additional measures are warranted, they would have two years to draft and finalize rules that outline new requirements and present a detailed implementation roadmap to Congress. NVIDIA has noted that its current architectures are not built for post-sale tracking, and adding such a capability could delay product launch schedules and increase development costs. AMD and Intel are likely to face similar obstacles, as integrating secure location-verification may require redesigning sensitive intellectual property and altering established supply-chain processes.

As AI and high performance computing (HPC) increase the need for powerful data center infrastructure, IT operators are seeking more efficient, scalable and sustainable thermal cooling solutions. Liquid cooling is increasingly popular and expected to account for 36% of data center thermal management revenue by 2028, according to the Dell'Oro Group. However, the adoption and proliferation of liquid immersion cooling, known for its superior performance, has been hindered by a lack of certified immersion solutions that are proven and readily deployable.

In collaboration with Shell Global Solutions (US) Inc., Intel addresses this challenge by validating a full immersion solution for data centers supported by hardware from Supermicro and Submer. This first-of-its-kind solution—Intel Data Center Certified for Immersion Cooling—sets a new industry standard1 for cooling efficiency and long-term performance with the first immersion solution for 4th Gen and 5th Gen Intel Xeon processors.

If you recall NVIDIA's GTX TITAN Z GPU with two GPU dies and an impressive 6 GB of memory, it was a big deal at the time and quite an interesting engineering solution. Today, thanks to sources close to VideoCardz, we learn that Intel's Arc "Battlemage" B580 could get the next dual GPU, dual VRAM treatment. According to the source, an unnamed Intel add-in board partner is preparing to launch a GPU with two B580 dies and 48 GB of VRAM. This means that the 24 GB VRAM version of the Arc B580 we saw in EEC filings is basically confirmed, and that some models will be out for display very soon. While the BMG-G21 chip offers up to 20 Xe cores and 2,560 shader units, a dual BMG-G21 configuration will yield 40 Xe cores and 5,120 shader units working in tandem with 48 GB of VRAM.

Clearly, this model is mostly tailored to AI enthusiasts. No game (thankfully) requires 48 GB of VRAM for now, but it is still nonetheless an interesting solution to see. It has been a while since we got something like a TITAN Z, even in high-end form factors. There is a rumored Intel Arc PRO A60/B60 card carrying a B580 die with 24 GB of VRAM, tailored for local AI workloads and professional visualization. This GPU could be the base for the newly rumored dual B580, 48 GB SKU from an unnamed Intel AIB partner. We expect to hear more details at Computex, which is now just a week away!

Last December, MSI announced the launch of its Intel "Lunar Lake" APU-powered Claw 8 AI+ and Claw 7 AI+ PC gaming handhelds. Almost two months later, international buyers were left puzzled by a seemingly staggered new product rollout. Despite proudly exhibiting finalized "Sandstorm-colored" units at CES 2025, North American buyers missed out on experiencing a (semi-promised) mid-January release. By March, the brand had fired up its new-gen Claw device marketing campaign again. It is not clear whether MSI shipped a lot of stock to international markets, but fresh news reports indicate an upcoming arrival of their "Polar Tempest Edition" 2 TB variant. As disclosed by Notebookcheck, this special model popped up momentarily earlier on last month.

Re-upped listings point to a potential mid-July launch; starting prices in the US are hovering around the $999 mark. Amazon Germany is accepting orders; €1107.21 (including VAT) grants access to MSI's slightly redecorated Core Ultra 7 258V-powered flagship. The manufacturer's dedicated product page states: "(our) Polar Tempest Edition features a new color scheme and MSI's custom-formulated polyurethane coating, evoking ice-blue crystals on a snow-white landscape." Despite Intel's recent boosting of "Lunar Lake" integrated graphics solution performance, the Claw 8 AI+ (and its 7-inch sibling) face strong "next-gen" competition. ASUS seems to be readying a ROG Ally sequel—according to leaks, this portable PC will make use of AMD's Ryzen Z2 Extreme processor. A distant "third-gen" MSI Claw design could be equipped with futuristic Intel gaming chipsets; in "Arrow Lake-H" or "Panther Lake" form.

Maxsun's parent company has quietly registered new 24 GB versions of Intel's Arc B580 graphics card with the EEC. While regulatory filings often cover placeholder or speculative hardware, this submission lines up with ongoing rumors about a high-memory "Battlemage" model aimed at both gamers and professionals. Back in December and January, Intel launched the Arc B580 and B570 GPUs, bringing the Battlemage architecture to desktops just a few months after "Lunar Lake" appeared on laptops. Those first cards came with 12 GB of GDDR6 memory, a surprisingly generous amount for graphics cards selling under $300, and they helped establish Intel as a real contender in the mainstream GPU market. Since then, chatter about a 24 GB version has never died down. The story gained weight when board partner Sparkle briefly hinted at such a variant and then retracted the comment under NDA obligations. Further fueling speculation, a Sparkle representative in China discussed the planned "B580 24 GB" during a March social-media exchange.

Now, Maxsun's EEC filing lists two models called "iCraft 24G" and "iCraft 24G OC," and those names match what Sparkle first mentioned. There's no guarantee these cards will actually hit store shelves, but the matching details and timing suggest Intel may be testing the waters for a memory-heavy Arc B580. That would make sense given recent leaks about an Arc PRO A60 workstation card also packing 24 GB of memory. Under the hood, the Arc B580's BMG-G21 chip offers up to 20 Xe cores and 2,560 shader units, putting it in the same ballpark as NVIDIA's GeForce RTX 4060. With Computex just days away, Intel will finally reveal whether these high-memory Arc B580 cards, or perhaps even bigger Battlemage-based workstation GPUs, are coming our way. Additionally, enthusiasts are keeping an eye on the rumored Arc B770, which is expected next quarter and likely to be detailed at Computex alongside Intel's broader Battlemage and upcoming Xe3 "Celestial" roadmap.

Intel is officially stepping back from its Deep Link suite of technologies. The confirmation came through a company representative on GitHub, confirming that active development has ceased. This follows a period when Intel quietly stopped highlighting Deep Link in newer offerings, such as its "Battlemage" GPUs. While the features might still work for those currently using Deep Link, don't expect any future updates or official assistance from Intel's support channels. If you cast your mind back to late 2020, you might recall Intel launching Deep Link. The core idea was to get Intel CPUs and their dedicated Arc GPUs working more effectively in tandem. To tap into this, you needed a specific setup: an 11th, 12th, or 13th Generation Intel CPU alongside an Arc Alchemist GPU. The package featured key tools: Dynamic Power Share for optimizing power between the CPU and GPU, Stream Assist to offload streaming to integrated graphics, Hyper Encode for faster video encoding, and Hyper Compute to accelerate AI tasks using OpenVINO.

These were designed to give a leg up to applications like OBS, DaVinci Resolve, and Handbrake. However, the writing may have been on the wall for Deep Link. Intel's "Meteor Lake" chips, which arrived in late 2023, weren't on the compatibility list, hinting that development had already wound down. Getting these features to perform reliably wasn't always straightforward, with users, like the one on GitHub who raised the initial question, reporting difficulties even with supported hardware. A user tried running Core Ultra 200S with Battlemage in OBS, facing issues not by the software, but by Intel's drivers. The general thinking is that Intel might have viewed Deep Link as a bit of a niche feature, possibly concluding that the continued effort and investment, especially with the need for validation with each software vendor, wasn't paying off. As for what's next, Intel hasn't announced a direct successor to these specific integrated features.

Earlier in the week, reports indicated the potential introduction of an Intel Xe2 "Battlemage" B770 gaming graphics card at Computex 2025. Last night, a Team Blue tweet confirmed forthcoming product unveilings: "new Intel Arc Pro GPUs are on the way. See you in Taipei!" In the months leading up to this important trade event, industry watchdogs have drummed up speculation about "Battlemage's" future (or fate). Whispers of 24 GB VRAM-equipped variants emerged late last year—around late January, these theories were connected to an official leak: "3 new PCI IDs for BMG."

Unsurprisingly, VideoCardz has weighed in with some new inside track info—they propose that one of Intel's upcoming professional options will be an "Arc Pro B60 24 GB" model, aka "Developer Edition" (an alleged in-house reference). Despite Sparkle HQ downplaying recent "rogue claims," a company rep (in China) alluded to a possible May/June release of their own custom 24 GB "Battlemage" productivity-oriented card. VideoCardz has picked up on rumors, regarding the "Arc Pro B60's" internal setup. They propose Team Blue's selection of the familiar "BMG-G21" GPU; as used by their Arc Xe2 B580 12 GB and B570 10 GB designs. According to an unnamed inside source, this professional/workstation variant will stick with the usual 192-bit memory interface. Intel's Computex 2025 new product teaser provided a big clue about the speculated "B60" model's cooling solution.

Slimbook, a Linux hardware manufacturer based in Europe (Spain) unveiled Kymera Black, a highly configurable desktop computer designed for gamers, content creators and hardware enthusiasts. This latest model focuses on flexibility, performance and durability. Kymera Black comes with options for AMD or Intel processors, capable of housing up to the latest AMD Ryzen 9 or Intel Ultra 9 CPUs. It can support up to 192 GB of DDR5 RAM running at 6000 MHz, as well as a wide variety of storage options up to 4 TB NVMe 5.0 SSDs (NVMe 5.0 optional depending on motherboard) and 80 TB of HDD capacity. For networking, it can feature up to Wi-Fi 7 (depending on motherboard) and 2.5G Ethernet connectivity, and up to 1200 W Platinum power supply units.

This desktop PC features a matte black metal chassis with modular components, removable panels, and washable dust filters. The case uses a combination of tempered glass and metal side panels with an optional 8-inch front display to monitor system temperature, fan speed, and component performance in real time. In terms of software, the Kymera Black offers a wide selection of pre-installed Linux distributions. These include the Ubuntu-based Slimbook OS with GNOME or KDE Plasma, as well as Kubuntu, Xubuntu, Ubuntu MATE, KDE neon, Debian, elementary OS, Pop!_OS, Linux Mint, Fedora, openSUSE, Manjaro, EndeavourOS, and Lliurex.

Dynabook Americas, Inc., the gold standard for long-lasting, professional-grade laptops, today introduced its latest generation of business-class laptops: the Portégé X40-M Series 2, Tecra A40-M Series 2, and Tecra A60-M Series 2. Powered by the new Intel Core Ultra Series 2 processors, and equipped with Wi-Fi 7, and Windows 11 Pro, these premium Copilot-ready devices represent Dynabook's most advanced and AI-enhanced generation of productivity-focused PCs to date.

"These new -M Series 2 laptops give business and education professionals the modern tools they need to thrive in an increasingly AI-driven workplace," said James Robbins, General Manager, Dynabook Americas, Inc. "With smarter architecture, faster connectivity, and Windows 11 Pro paired with Microsoft Copilot, we're delivering powerful, secure devices that unlock productivity in entirely new ways."

More performance, smoother gameplay, and faster responsiveness. This can all be made possible through software enhancements and AI capabilities unlocked with XeSS 2! Since the introduction of XeSS in 2022 alongside the launch of Intel Arc A-Series, over 200 games have been supercharged with greater performance thanks to AI-based super resolution upscaling technology (XeSS-SR). Shortly following launch, support was quickly extended to Intel Core Ultra processors with built-in Intel Arc GPUs, providing a better gaming experience for millions of desktop and laptop gamers around the globe.

XeSS 2 boldly pushes this further with the addition of gameplay-smoothing AI-based frame generation (XeSS-FG) and reduced lag with low latency (XeLL) technologies. Intel's game engineering team recently released the XeSS 2 SDK to enable quick and easy integration by developers, and adoption is picking up with 19 games now offering the new suite of technologies.

GIGABYTE, a global leader in technology, today announced the availability of its flagship ultra-compact mini-PC, the New BRIX Mainstream series, accompanied by an exclusive product video release. This series is powered by the latest Intel Core Ultra processors (Series 2) and boasts an integrated GPU with a remarkable 20% performance increase over the previous generation. Furthermore, it unleashes exceptional AI performance, delivering up to 96 Tera Operations Per Second (TOPS), making it perfectly suited for demanding generative AI tasks and intensive multitasking scenarios.

⁠Designed to meet the growing needs of smart home solutions, commercial deployments, content creation, and edge computing, the BRIX Mainstream series packs this impressive performance into a remarkably compact 0.46-liter chassis with a sleek 3.5 cm profile. Despite its size, it offers top-tier computing power, flexible expansion options, and an eco-conscious, energy-efficient design - delivers performance that exceeds expectation.

MSI, a global leader in industrial computing solutions, proudly announces the release of the MS-C927, a highly compact and fanless embedded Box PC designed to meet the growing demand for power-efficient edge computing in harsh and space-constrained environments. Powered by Intel 's Meteor Lake-U and Arrow Lake-U series Core Ultra processors, the MS-C927 delivers high performance, reliable connectivity, AI acceleration, and rich I/O in an ultra-compact form factor.

Feature-Rich, Future-Ready
With a footprint of only 130 x 155 x 40 mm, the MS-C927 fits seamlessly into tight enclosures while offering exceptional processing power and industrial-grade durability. It features DDR5 memory up to 96 GB, dual 4K DisplayPort outputs, dual LAN including 2.5GbE, and multiple M.2 slots for NVMe storage, wireless connectivity, and cellular communication.

Die shots of Intel's "Arrow Lake" desktop processors have appeared online, confirming the chiplet design we have known about since the launch. The images annotated by the YouTube channel HighYield show a four‑tile arrangement mounted on a base die made with Intel's 22 nm FinFET process. The compute tile sits at the top left, built on TSMC's N3B node and covering 117.24 mm². To its right are the SoC tile on TSMC's N6 node measuring 86.65 mm², and the GPU tile, which houses four Xe cores alongside an Arc Alchemist render slice. The I/O tile, at 24.48 mm² on the same N6 node, completes the group at the bottom left. Intel has redesigned its hybrid core layout for Arrow Lake, moving away from separate P‑core and E‑core clusters. Four of the eight high‑performance P‑cores line the die's outer edges, with the remaining four in the center. In between these lie the four efficiency E‑core clusters, each sharing 3 MB of L2 cache. A unified 36 MB L3 cache ring bus connects to every core, allowing E‑cores to tap into that larger cache pool for the first time. Intel aims to spread heat more evenly and boost background task performance.

The I/O tile integrates Thunderbolt 4 controllers, PCIe buffers and PHYs. The SoC tile carries display engines, media accelerators and DDR5 memory controllers. All tiles are bonded to the base die via Intel's Foveros Omni stacking technology. Arrow Lake also reflects a shift in Intel's manufacturing strategy. Plans to use Intel's 20A node were dropped in favor of TSMC processes, making this the first desktop CPU from Intel that relies almost entirely on external foundries. On the software side, Intel has begun offering its IPO profiles in select prebuilt systems. These presets optimize CPU and memory settings for a hassle‑free performance boost that remains within warranty limits. Meanwhile, the native 200S Boost overclocking option is rolling out via BIOS updates. Early tests suggest that 200S Boost alone yields modest gains unless paired with very high-speed DDR5 modules, while IPO profiles deliver more consistent improvements with mainstream memory configurations.

Intel today released the latest version of the Arc GPU Graphics drivers. Version 101.6790 WHQL comes with a handful of fixes. To beign with, it fixes an issue where "Warhammer 40000: Darktide" shows display corruption and blacked-out textures with Arc B-series GPUs. The drivers also address an issue with "The Last of Us Part 2" where the game puts out flickering on shadows with Arc A-series GPUs. Lastly, a general software issue where Blender experiences compatibility issues when interacting with the camera gizmo on the iGPU of Core Ultra series 2 processors ("Lunar Lake") has been fixed. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6790 WHQL

Intel appears ready to broaden its Arc "Battlemage" lineup with a new, more powerful desktop graphics card likely to be called the Arc B770, potentially arriving as soon as next quarter. Until now, Team Blue has introduced only two Xe2 Battlemage models, the B570 (10 GB) and B580 (12 GB), both of which earned praise for solid performance at accessible price points. Enthusiasts have long speculated about successors like the B750, B770, and even a B780, but Intel shifted its public focus to upcoming AI PC processors after the B570 launch, leaving GPU fans uncertain which designs would materialize. Recent shipping manifests uncovered a "BMG‑G31" GPU die en route to Intel's Vietnam assembly plant, the same site that produced limited‑edition B570 and B580 cards, while insider Haze2K1's documents hint at a "B7XX" special‑edition series. Simultaneously, chatter about a 24 GB Developer Edition based on the earlier BMG‑G21 die suggests Intel is also eyeing workstation and creative‑professional markets.

A well-known tipster, OneRaichu, has further fueled excitement by reporting that the Arc B770 could pack between 24 and 32 Xe2 compute units, a 256‑bit memory interface, and 16 GB of GDDR6, positioning it squarely against rival xx60‑series models and promising a meaningful boost in gaming and compute workloads. Beyond Battlemage, Intel's next‑generation graphics architecture, Xe3 "Celestial," has reached pre‑silicon validation. According to Intel engineer Tom Petersen and corroborating industry leaks, Celestial's core media engines, Xe cores, XMX matrix units, and ray‑tracing hardware are fully designed and are now being tested in a hardware model to fine‑tune power consumption and clock speeds. With Computex 2025 kicking off in late May, Intel may at last clarify both its high‑end Battlemage refresh and the broader Celestial roadmap, potentially reshaping competition in the mainstream and next‑generation GPU markets.

GIGABYTE Technology, a global leader in computing innovation, will return to COMPUTEX 2025 from May 20 to 23 under the theme "Omnipresence of Computing: AI Forward." Demonstrating how GIGABYTE's complete spectrum of solutions spanning the AI lifecycle, from data center training to edge deployment and end-user applications reshapes the infrastructure to meet the next-gen AI demands.

⁠As generative AI continues to evolve, so do the demands for handling massive token volumes, real-time data streaming, and high-throughput compute environments. GIGABYTE's end-to-end portfolio - ranging from rack-scale infrastructure to servers, cooling systems, embedded platforms, and personal computing—forms the foundation to accelerate AI breakthroughs across industries.

Sparkle announced availability of its flagship custom-design Intel Arc B580 graphics card, the Sparkle B580 ROC Luna OC Ultra. The card derives its name from an all-white appearance, with white making up not just the cooler shroud and fan impellers, but also the PCB solder-mask underneath. The card's design appears to balance elements to appeal to both gamers and creators. It comes with a 2.5-slot thick design that's at least an inch taller than what constitutes full-height. It uses an aluminium fin-stack heatsink that's ventilated by a pair of 90 mm fans.

The Sparkle Arc B580 ROC Luna OC Ultra comes with the company's highest factory overclock for the B580, with a max boost frequency of 2800 MHz compared to 2670 MHz reference, and 2740 MHz of its Titan OC graphics card. It also comes with increased power limits of 210 W, compared to 190 W reference. It draws power from two 8-pin PCIe power connectors. The company didn't reveal pricing, but we expect it to be between the $250-300 mark.

ASUS today announced the arrival of TUF Gaming T500, a compact desktop with the power to drive the latest and greatest AAA and esports games. Powered by up to an Intel Core i7-13620H processor, up to an NVIDIA GeForce RTX 5060 Ti GPU, up to 64 GB of DDR5 RAM and 2 TB of PCIe 4.0 storage, T500 is a well-rounded machine for esports and AAA gamers alike. With a compact chassis that features classic TUF Gaming style, T500 is an excellent fit in bedrooms and dorm rooms anywhere.

High-performance components
Powered by up to an Intel Core i7-13620H processor with six Performance cores and eight Efficiency cores and a max boost of 5.0 GHz, T500 can drive incredible gaming experiences alongside a snappy desktop experience. T500 packs up to an NVIDIA GeForce RTX 5060 Ti GPU. Boasting the latest NVIDIA Blackwell architecture, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the GeForce RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4 featuring Super Resolution, Ray Reconstruction, and Multi Frame Generation. The GeForce RTX 5060 Ti is ready to power incredible performance in the games of today and tomorrow.

In the last few weeks, Intel rolled out two new performance‑enhancing presets for its Core Ultra 200S "Arrow Lake" processors: Intel Performance Optimizations (IPO) and the factory‑approved 200S Boost overclocking profile. Independent benchmarks shared by a BiliBili user reveal that IPO delivers a slightly stronger uplift in gaming performance compared with 200S Boost. Testing centered on a Core Ultra 7 265K paired with DDR5‑8000 memory and a GeForce RTX 5090D. Seven modern titles were measured at 4K with DLSS enabled where supported. Three system presets were compared: a baseline with XMP‑enabled DDR5‑8000, Intel's 200S Boost, and Intel IPO. Under 200S Boost, Intel ramps the chip's Die‑to‑Die (D2D) fabric from 2.1 GHz to 3.2 GHz and the Next‑Generation Uncore (NGU) fabric from 2.6 GHz to 3.2 GHz, while maintaining factory CPU clock speeds. By contrast, IPO takes a more holistic approach: P‑core and E‑core boost clocks rise to 5.4 GHz and 4.9 GHz (from 5.2 GHz/4.9 GHz), the ring bus ticks up to 4.0 GHz (from 3.8 GHz), and memory is overdriven to DDR5‑8400 with tightened timings.

IPO's D2D and NGU fabrics run at 3.1 GHz due to power-and-thermal headroom trade-offs. Across the board, IPO edged out 200S Boost by roughly 2% in average frame rates and 1% in the 1% lows. In Forza Horizon 5, IPO delivered 274 FPS versus 269 FPS on 200S Boost, with 1% lows of 198 FPS (+1 FPS). Cyberpunk 2077 saw a 3% jump to 297 FPS average and a 6% gain in 1% lows. Total War: Warhammer III's averages climbed 6%, while 1% lows rose 9% under IPO. The most pronounced advantage appeared in Counter‑Strike 2 (tested at 1080p), where IPO boosted averages by 16% and 1% lows by 20 %. Watch Dogs: Legion also benefited, with an 8% average and 9% low‑end uplift. These results suggest that IPO's balanced tuning of CPU cores, ring bus, interconnects, and memory yields consistent, measurable gains over the simpler fabric‑focused 200S Boost profile. Intel has yet to greenlight the IPO's broader rollout beyond its initial OEM launch in China, but these early figures hint at meaningful real‑world improvements for Arrow Lake gamers.

IBM is the first cloud service provider to make Intel Gaudi 3 AI accelerators available to customers, a move designed to make powerful artificial intelligence capabilities more accessible and to directly address the high cost of specialized AI hardware. For Intel, the rollout on IBM Cloud marks the first major commercial deployment of Gaudi 3, bringing choice to the market. By leveraging Intel Gaudi 3 on IBM Cloud, the two companies aim to help clients cost-effectively test, innovate and deploy GenAI solutions.

According to a recent forecast by research firm Gartner, worldwide generative AI (GenAI) spending is expected to total $644 billion in 2025, an increase of 76.4% from 2024. The research found "GenAI will have a transformative impact across all aspects of IT spending markets, suggesting a future where AI technologies become increasingly integral to business operations and consumer products."

Christoph Schell, Intel's chief commercial officer and executive vice president, plans to step down on June 30, according to a recent Securities and Exchange Commission filing. The notice filed on April 28 states Schell is leaving to "pursue another career opportunity" with Kuka Group where he'll take on the CEO role. "Since joining Intel in 2022, Christoph has poured his heart and soul into our business and worked tirelessly in service of our customers," Intel CEO Lip-Bu Tan wrote. "He has helped to steer our Sales and Marketing Group (SMG) through a challenging period and built a strong team along the way. I am grateful for his contributions and wish him success in his next role". Kuka Group stands out as a world leader in robotics offering robots, manufacturing cells, software, and cloud-based digital services. This exit comes after Intel reported another quarter of losses and more cost-cutting plans. However, it might not affect CEO Lip-Bu Tan's efforts to reshape the company, which include cutting jobs and simplifying management layers.

Since joining Intel in March 2022 from Hewlett-Packard, where he served seven years in senior management positions, Schell has witnessed Intel's continued financial challenges, including the recent first quarter results showing a net loss of US$800 million on revenue of US$12.7 billion. While the revenue met the upper threshold of previous guidance, Lip-Bu Tan acknowledged in the financial results statement that although "the first quarter was a step in the right direction, there are no quick fixes as we work to get back on a path to gaining market share and driving sustainable growth." Schell's tenure at Intel coincided with a period of leadership transition, having been appointed under former CEO Pat Gelsinger, who resigned in December 2024 after assuming the position in February 2021. Following Schell's departure, the head of America sales, Greg Ernst, is stepping in as the interim leader of Intel's Sales and Marketing Group.

Intel has only released two Arc Xe2 "Battlemage" desktop models: the B580 12 GB and B570 10 GB graphics cards. So far, these lower priced options have been warmly welcomed by reviewers and buyers alike—but gaming GPU enthusiasts are still actively clamoring for more potent second-gen "Battlemage" variants. The collective status of theorized "B750, B770, and (fancifully) B780" SKUs is frustratingly unclear. Intel has not generated any official new product noise since the launch of their B570 design, earlier this year—recent big announcements have focused on next-gen "AI PC" processor lines. A series of vague leaks have indicated cancelations and then revivals of speculated mid-to-high-end Arc Xe2 discrete cards.

As of late, a larger "BMG-G31" GPU identifier has appeared in shipping manifests—a previous leak pointed to "prototype" units being moved between company facilities. Yesterday, Haze2K1 shared another extract from NBD inventory documents—crucially, they believe that these items are heading to a crucial manufacturing plant in Vietnam. This location is/was tasked with the assembling of first-party B570 and B580 Limited Edition products. Fresh conjecture suggests that "B7XX" Limited Edition cards are in the pipeline, but current circumstances are still hazy. VideoCardz reckons that a "Developer Edition" 24 GB model is still in active development, but this rumored workstation/productivity-oriented card could be based on Intel's readily available "BMG-G21" GPU die.

Intel is preparing to launch its first "Panther Lake" mobile processor later this year, but only one configuration will arrive in 2025. This SKU features four high-performance P-cores paired with eight E-cores, leaves out the lower-power efficiency cores, and packs four Xe3 GPU cores. With a 45 W TDP, it is clearly aimed at mainstream gaming laptops rather than ultralight notebooks. Panther Lake fills the gap left by "Lunar Lake" with a higher power envelope and a more performance-oriented design. Lunar Lake ranged from 17 W to 28 W, while Panther Lake's 45 W shows Intel is targeting users who need more sustained compute and graphics throughput. Rumors indicate additional Panther Lake variants will arrive in Q1 of 2026, when Intel plans to have more SKUs shipping to OEMs from volume production.

One such SKU is expected to feature 12 Xe3 GPU cores for premium thin-and-light laptops without discrete graphics. All of Panther Lake processors combine "Cougar Cove" performance cores with "Darkmont" efficiency cores, following Intel's hybrid approach introduced with "Meteor Lake". Intel's decision to stagger the rollout reflects supply chain considerations and product segmentation by power and graphics capability. Gaming laptops that can rely on integrated Xe3 graphics will welcome this 45 W chip, while other form factors may wait for next year's lower-power or ultralight 15 W models. Qualification with OEM partners should begin later this year, with laptop shipments expected by late Q4 2025. Until Intel shares more details on the rest of the Panther Lake lineup, much remains speculative.

Intel is exploring a new way to cool its hottest chips by weaving tiny water channels into the processor package itself. At its Foundry Direct Connect showcase, via HardwareLuxx coverage, the company revealed working prototypes for LGA desktop CPUs, BGA servers, and AI modules. Rather than flood the bare silicon, a slim copper block sits on top of the package, its microchannels precisely etched to carry coolant directly over the hottest areas. Intel engineers cooled Core Ultra desktop chips and high-end Xeon processors in live demonstrations. The system moves standard liquid-cooling fluid through those channels at a rate fast enough to whisk away up to 1,000 watts of heat. In the lab, that level of thermal performance isn't standard for everyday PC use, but it matches the demands of AI training, scientific computing, and professional workstations.

This design stands out because of its attention to every layer between the chip and the coolant. Intel carefully controls the thickness of the silicon die, the solder or liquid-metal thermal interface material, the integrated heat spreader, and the water block itself. By reducing or removing traditional barriers, thermal resistance falls, and engineers report roughly 20% better cooling than a standard water block mounted on a delidded die. Those copper blocks measure only a few millimeters in height yet still deliver strong flow rates. During chip layout, teams space out power-hungry blocks or flag-tight clusters so the cooling channels can target critical hotspots. This co-design of package and cooler goes much deeper than any off-the-shelf solution. While the basic research dates back nearly two decades, Intel has been refining the method for years. Still, with processors growing more powerful and densely packed, package-level liquid cooling could move from laboratory demo to essential tool for data centers and enthusiast rigs.

ASUS today announced the latest version of the ASUS V16 (V3607) 16-inch gaming laptop, an entry level model that broadens the appeal of the innovative ASUS laptop portfolio. Featuring futuristic uber-cool design details and unparalleled performance from the new up to Intel Core 7 processor (Series 2) and NVIDIA GeForce RTX 50 Series Laptop GPU, ASUS V16 is built to win - or create - in distinctive style.Its fast 16-inch 16:10 144 Hz FHD IPS display, with an impressive 89% screen-to-body ratio, ensures fluid gaming visuals, while Dirac audio technology and ASUS Audio Booster provide powerful and immersive sound.

Offering an outstanding user experience, the laptop also includes a large touchpad and a comfortable ASUS ErgoSense keyboard. AI noise-cancelation technology and 3DNR for enhanced video conferencing. Designed to deliver an immersive gaming experience with an unparalleled blend of performance and affordability, ASUS V16 also offers military-grade durability, a 63Wh battery, superb power efficiency, and a bundled PC Game Pass Ultimate. It's reliable and cost-effective choice for gaming, creativity, and everyday tasks. Whether conquering virtual realms or unleashing newfound creativity, ASUS V16 is the gateway to limitless possibilities.