Intel's three upcoming processor microarchitectures, namely the next-generation Xeon "Sapphire Rapids," Core "Alder Lake," and low-power "Tremont" cores found in Atom, Pentium Silver, Celeron, and even Core Hybrid processors, will feature a new instruction set that aims to speed up processor cache performance, called CLDEMOTE "cache line demote." This is a means for the operating system to tell a processor core that a specific content of a cache (a cache line), isn't needed to loiter around in a lower cache level (closer to the core), and can be demoted to a higher cache level (away from the core); though not flushed back to the main memory.

There are a handful benefits to what CLDEMOTE does. Firstly, it frees up lower cache levels such as L1 and L2, which are smaller in size and dedicated to a CPU core, by pushing cache lines to the last-level cache (usually L3). Secondly, it enables rapid load movements between cores by pushing cache lines to L3, which is shared between multiple cores; so it could be picked up by a neighboring core. Dr. John McCalpin from UT Austin wrote a detailed article on CLDEMOTE.

Intel's 11th generation Core i7-1165G7 "Tiger Lake-U" processor armed with 4 "Willow Cove" cores and Gen12 Xe graphics fights a pitched battle against AMD Ryzen 7 4800U "Renoir" (8 "Zen 2" cores and Radeon Vega 8 graphics), courtesy of some digging by Thai PC enthusiast TUM_APISAK. The 4800U beats the i7-1165G7 by a wafer-thin margin of 1.9% despite double the CPU core-count and a supposedly advanced iGPU, with 6331 points as against 6211 points of the Intel chip, in 3DMark 11. A breakdown of the score reveals fascinating details of the battle.

The Core i7-1165G7 beats the Ryzen 7 4800U in graphics tests, with a graphics score of 6218 points, against 6104 points of the 4800U, resulting in a 1.9% lead. In graphics tests 1, 2, and 3, the Gen12 Xe iGPU is 7.3-8.9% faster than the Radeon Vega 8, through translating to 2-4 FPS. The Intel iGPU crosses the 30 FPS mark in these three tests. With graphics test 4, the AMD iGPU ends up 8.8% faster. Much of AMD's performance gains come from its massive 55.6% physics score lead thanks to its 8-core/16-thread CPU, which ends up beating the 4-core/8-thread "Willow Cove," with the 4800U scoring 12494 points compared to 8028 points for the i7-1165G7. This CPU muscle also plays a big role in graphics test 4. This battle provides sufficient basis to speculate that "Tiger Lake-U" will have a very uphill task matching "Renoir-U" chips such as the Ryzen 7 4800U, and the upcoming Ryzen 9 4900U (designed to compete with the i7-1185G7).

A roadmap slide from an Intel Partner Connect presentation suggests that the company's client-segment processor lineup will be unchanged for the rest of 2020, with the company briskly launching its 10th generation "Comet Lake-S" desktop processor lineup through May-June, and "Comet Lake-H" a month prior. The Core X "Cascade Lake-X" processor lineup will continue to lead the company in the high core-count HEDT segment, with no indications of new models, at least none higher than 18 cores.

More importantly, this slide dulls expectations of the company refreshing its desktop process segment just before Holiday 2020 with the 11th generation "Rocket Lake-S" silicon that has next-gen "Willow Cove" CPU cores, Gen12 Xe integrated graphics, and PCIe gen 4.0 connectivity, especially with engineering samples of the chips already hitting the radar. Intel is expected to launch 10 nm "Ice Lake-SP" Xeon enterprise processors in 2020, and there was hope for some of this IP to power Intel's next HEDT platform, the fabled "Ice Lake-X," especially with AMD's "Castle Peak" 3rd gen Threadrippers dominating this segment. While there's little doubt that the slide may have originated from Intel, its context must be studied. Partner Connect is a platform for Intel to interact with its channel partners (distributors, retailers, system integrators, etc), and information about future products is far more restricted on these slides, than presentations intended for large OEMs, motherboard manufacturers, etc. Then again, with the COVID-19 pandemic throwing supply chains off rails, it wouldn't surprise us if this slide spells Gospel.

The "Rocket Lake-S" microarchitecture by Intel sees the company back-port its next-generation "Willow Cove" CPU core to the existing 14 nm++ silicon fabrication process in the form of an 8-core die with a Gen12 Xe iGPU. An engineering sample of one such processor made it to the Futuremark database. Clocked at 3.20 GHz with 4.30 GHz boost frequency, the "Rocket Lake-S" ES was put through 3DMark "Fire Strike" and "Time Spy," with its iGPU in play, instead of a discrete graphics card.

In "Fire Strike," the "Rocket Lake-S" ES scores 18898 points in the physics test, 1895 points in the graphics tests, and an overall score of 1746 points. With "Time Spy," the overall score is 605, with a CPU score of 4963 points, and graphics score of 524. The 11th generation Core "Rocket Lake-S" processor is expected to be compatible with existing Intel 400-series chipset motherboards, and feature a PCI-Express gen 4.0 root complex. Several 400-series chipset motherboards have PCIe gen 4.0 preparation for exactly this. The increased IPC from the "Willow Cove" cores is expected to make the 8-core "Rocket Lake-S" a powerful option for gaming and productivity tasks that don't scale across too many cores.

Intel is planning to introduce its first NUC (next unit of computing) device based on the 11th generation Core "Tiger Lake" processor by the end of 2020, according to leaked company roadmaps covering NUCs. These point to Intel refreshing its "Hades Canyon" performance-segment NUC mini-PC with a "Tiger Lake-U" processor, a 3rd party discrete GPU, and slightly bigger device size (1.35 L vs. 1.2 L of the original "Hades Canyon"). At the very top, the "Ghost Canyon" NUC 9 Extreme with "Coffee Lake-HR" processors will continue to hold the fort into 2021.

The mainstream NUC mini-PC lineup will continue to be "Frost Canyon," powered by "Comet Lake-U" 10th generation Core processors. Q2-Q3 2020 will see Intel launch significant updates to its NUC Compute Element lineup, with "West Cove," "Ghost Canyon," and "Quartz Canyon" holding the mainstream, performance-segment, and professional segment, respectively; while are likely based on "Comet Lake-H" processors; and "Austin Beach" low-power compute element based on "Comet Lake-U."

Intel CEO Bob Swan, in his Virtual Computex YouTube stream, advocated that the industry should focus less on benchmarks, and more on the benefits of technology, a line of thought strongly advocated by rival AMD in its pre-Ryzen era, before the company began getting competitive with Intel again. "We should see this moment as an opportunity to shift our focus as an industry from benchmarks to the benefits and impacts of the technology we create," he said, referring to technology keeping civilization and economies afloat during the COVID-19 global pandemic, which has thrown Computex among practically every other public gathering out of order.

"The pandemic has underscored the need for technology to be purpose-built so it can meet these evolving business and consumer needs. And this requires a customer-obsessed mindset to stay close, anticipate those needs, and develop solutions. In this mindset, the goal is to ensure we are optimizing for a stronger impact that will support and accelerate positive business and societal benefits around the globe," he added. An example of what Swan is trying to say is visible with Intel's 10th generation Core "Cascade Lake XE" and "Ice Lake" processors, which feature AVX-512 and DL-Boost, accelerating deep learning neural nets; but lose to AMD's flagship offerings on the vast majority of benchmarks. Swan also confirmed that the company's "Tiger Lake" processors will launch this Summer.The Computex video address by CEO Bob Swan can be watched below.

Intel today issued a product change notice announcing the discontinuation of its 8th generation Core desktop processor family, and models of Pentium Gold and Celeron processors based on the 14 nm "Coffee Lake" silicon. The PCN covers every 8th gen SKU in the retail- and OEM channels. The company set key dates for the discontinuation. The lineup is discontinued as of June 1, 2020. Suppliers and OEM customers can last order their products on December 18, 2020. The last product shipment is slated for June 4, 2021. It's likely that the 9th generation Core desktop processor family will be follow next year. The 8th generation Core "Coffee Lake" saw the first increase in core counts for Intel's mainstream desktop processor family in close to a decade.

Intel has recently released 4 new Atom C3000 chips now sporting "R" and "L" suffixes, these chips join the lineup as it enters its third year of service. The dual-core C3338R chip comes in at 38 USD and gains a 300 MHz base clock boost along with QAT support for just a $1 premium over the C3338. The quad-core C3436 comes in at 64 USD and features the lowest per-core pricing of the entire lineup at just 16 USD per core and with a 10.75 W TDP. The 96 USD quad-core C3558R gains a 200 MHz base clock boost and DDR4-2400 support for a 10 USD and 1 W TDP premium over the C3558. Finally, the 209 USD octa-core C3758R gains a 200 MHz base clock boost for a 16 USD and 1 W TDP increase over the Intel Atom C3758.

Today, during the VR/AR Global Summit Online Conference, Lenovo announced the latest addition to its portfolio of commercial virtual reality (VR) solutions - the Lenovo Mirage VR S3 headset with ThinkReality. The new VR solution for enterprise was unveiled during the keynote speech by Nathan Pettyjohn, Commercial AR/VR Lead, Intelligent Devices Group, Lenovo.

The Lenovo Mirage VR S3 is an all-in-one headset developed in conjunction with Pico Interactive, a global technology company that develops innovative VR and enterprise solutions. Specifically designed for enterprise, the Lenovo Mirage VR S3 features a 4K display for clearer visuals, hands-free control for utilization with or without the provided controller, and an easy to clean, hygienic face plate suitable for mass use. Built with integrated audio and up to three hours of battery life, the new VR headset is rugged, light weight and ready to scale within the enterprise.

Intel is discontinuing the special dodecahedron LDPE retail packaging for its previous-generation flagship desktop processor, the Core i9-9900K. The processor itself is still an active SKU, but its retail packaging will likely now revert to a more conventional-looking paperboard cuboid package, resembling that of the Core i9-9900KF. There is no mention of any change to the "limited edition" Core i9-9900KS. The product change notification (PCN) may have been triggered by the i9-9900K getting succeeded by the 10-core i9-10900K processor that ships in a simpler (though still premium-looking) hard paperboard package with a large front-face window; and the fact that the dodecahedron LDPE package presented logistics problems for distributors, as crates of these processors could pack fewer units than with smaller cuboid boxes, and needed additional styrofoam cushioning to prevent transit damage.

To support its efforts to build a competitive consumer GPU lineup under the Xe brand, which Intel likes to call its "Odyssey," the company scored another higher-up from AMD, this time Ali Ibrahim. He joined Intel this month as a vice-president within the Architecture, Graphics and Software group, although the company didn't specify his responsibilities. "We are thrilled that Ali has joined Intel as Vice President, Platform Architecture and Engineering - dGPUs to be part of the exciting Intel Xe graphics journey," said an Intel spokesperson in a comment to CRN.

During his 13-year tenure at AMD, Ali Ibrahim was the chief-architect of the company's cloud gaming and console SoC businesses, which provides valuable insight into Intel's breakneck efforts to build high-end discrete GPUs (something it lacked for the past two decades). Intel is the only other company that is capable of building semi-custom chips for someone like Microsoft or Sony as the inventor of x86, provided it has a GPU that can match AMD's in the console space. Likewise, with gaming taking baby steps to the cloud as big players such as Google betting on it, Intel sees an opportunity for cloud gaming GPUs that aren't too different from its "Ponte Vecchio" scalar processors. The transfer of talent isn't one-way, as AMD recently bagged Intel's server processor lead Dan McNamara to head the EPYC brand.

Antec Inc., the leading provider of high-performance computer components and accessories for the gaming, PC upgrade, and Do-It-Yourself market, is happy to announce that all current 115x compatible CPU water blocks and air coolers are also compatible with the new Intel LGA 1200 socket, utilized on motherboards supporting the 10th generation of Intel Core processors. The new socket was very recently launched along with the Z490 motherboards that support the latest Comet Lake-S Intel processors.

LGA 1200 was designed as a replacement for the LGA 1151. The LGA 1200 has 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151 with 49 extra pins on it, improving power delivery and enabling support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors.

Intel is packing a slightly improved stock heatsink-fan (HSF) cooling solution with some of its higher-end 10th generation Core desktop and select Xeon-W processors. The cooler, while nowhere close in size or weight to the TS15A, features a slightly thicker heatsink with a copper core, compared to the one included with lower-end parts such as the i5-10400. This heatsink's primary material is black anodized aluminium, with a copper core. The fan's cable is now black sleeved, instead of being a loose bunch of four ketchup-and-mustard wires. The hub of the fan, which usually had a white or blue label with ugly regulatory markings, now has a solid grey sticker with just the Intel logo.

There are no performance numbers, but the cooler looks physically similar to the copper core coolers Intel used to include with some of its oldest LGA115x processors, such as "Lynnfield" and " Sandy Bridge," capable of handling 95 W TDP. Intel is including the cooler with the Core i9-10900, the i9-10900F, i7-10700F, i7-10700; and Xeon W-1290, W-1270, and W-1250 boxed processors in the DIY retail channel.

There are apparently two steppings of the 10th generation Intel Core i5 desktop processor in circulation, and the two have major physical differences, even if their specifications are identical per SKU. These are Q0 and G1. The Q0 stepping of the 10th gen Core i5 is based on the 10-core variant of "Comet Lake-S" silicon, the 200-odd mm² die, which comes with Intel's die-thinning innovation, and more importantly, soldered thermal interface material (STIM). For these chips, four cores on the 10-core die are disabled by Intel to carve out the 6-core/12-thread Core i5 SKU. The G1 stepping, on the other hand, is based on the 6-core variant of "Comet Lake-S," which is similar in design to the 6-core "Coffee Lake" die. The G1-stepping chips lack STIM, and use a thermal paste.

What's more, Q0 and G1 steppings have different SPEC codes. For the Core i5-10400F, the Q0 stepping variant's SPEC code is "SRH79" and the G1 stepping variant's code is "SRH3D." The underside of the processor's package looks different between the two steppings (pictured below). You won't be able to tell the underside of the package through the little window in your processor's retail package, but the SPEC code is printed on the IHS. There's no geographic marker as to which stepping is found in what particular market. Both steppings appear to be distributed uniformly, wherever available. Since Intel is using this stepping-level differentiation only among non-K SKUs, we don't expect the two to have any different performance, but possibly different thermals.

ASUS with its Intel 400-series chipset motherboards is introducing APE, or ASUS Performance Enhancement, a feature rivaling ASRock Base Frequency Boost (BFB). What it essentially does is override PL1 (power level 1) for 65 W-rated on non-K Core processors, allowing the processor to sustain higher clock speeds after the Turbo Boost algorithm has exhausted Tau (a timing variable that allows the processor to stay within elevated boost states, before having to fall back to base frequency). Several of ASUS's Intel B460 chipset motherboards feature APE with maximum PL1 override values set at 125 W for most of the motherboard models listed in the slide below, except for the top ROG Strix B460-F Gaming, which allows you to dial the value all the way up to 210 W.

ASUS is introducing this feature through BIOS updates for boards that don't have it. The slide details the minimum BIOS version for each of the board that debuts APE. ASRock, on the other hand, introduced BFB for not just its entire Intel 400-series motherboard lineup, but also most of its Z390 and B365 lineups. To be fair to ASUS, this feature is more relevant to chipsets such as the B460, H470, and B365, since Z490 already features options that let you play with power limits. Intel gives motherboard vendors the freedom to set power limits and Tau value, but non-K processors would still be limited by their nameplate base- and boost frequencies, so raising PL1 beyond a point has no impact.

Intel sells a beefed up sibling of its stock heatsink-fan separately in the DIY retail channel, called the Thermal Solution TS15A, which was originally released when Intel launched its LGA115x socket. With the new LGA1200 socket retaining cooler compatibility with LGA115x, Intel issued a PCN (product change notification) apprising its retail supply chain that a newer batch of the cooler will come with updated packaging to reflect that the cooler supports LGA1200 in addition to LGA1151. The TS15A features a copper core making contact with the processor's IHS at the base, from which aluminium fins project radially. A high power fan ventilates the cooler axially, while the cooler's design spreads some of the air onto the CPU VRM and memory.

New details have surfaced on Intel's next-generation NUC systems - built with the intention to carry the highest performance density per available chassis capacity in the computer market (the aim is a 1.35 L case). We already knew Intel's Panther Canyon NUC would bring about their Tiger Lake-U designs would be carrying the company's Tiger Lake-U CPUs, which should combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture. A new piece of data here, as has been reported, is that Intel is also working on an enthusiast-class NUC under the "Phantom Canyon" moniker, which should bring about increased graphics performance.

Even if Intel's graphics architecture is a mindblowing performance improvement over their current graphics technologies, there's only so much an integrated graphics solution can do. Now, we seemingly have confirmation, via a 3D Max Benchmark, that Intel's Panther Canyon will be paired with an NVIDIA GeForce 1660 Ti graphics card (scoring 5,355 points). The 3D Mark TimeSpy test system uses a TigerLake-U engineering sample clocked at 2.3 GHz base and 4.4 GHz boost, alongside an 80 W NVIDIA GTX 1660 Ti (Notebook) and 8 GB of RAM.

One of the first Intel "Lakefield" heterogenous processor-powered devices, a Samsung Galaxy Book S model, is listed by Samsung on its Canadian online store. The Galaxy Book series typically consists of Arm-powered clamshell/convertible notebooks that use Windows 10 (Arm version). The device in question is a Galaxy Book S 13.3-inch notebook bearing model number NP767XCM-K01CA, and comes in two color trims - "Mercury Gray" and "Earthy Gold."

Under the hood is an Intel Core i5-L16G7 "Lakefield" heterogenous processor that has four "Tremont" low-power cores, and a "Sunny Cove" high-performance cores, in an arrangement rivaling Arm big.LITTLE, the first of many such chips from the company, as it taps into new technologies such as heterogenous cores and advanced Foveros chip packaging to design its future processors. The notebook offers Full HD resolution, 8 GB of RAM, 256 GB or 512 GB of solid-state NVMe storage, 802.11ax 2x2 WLAN, and a 42 Wh battery, possibly with double-digit hour battery life. All of this goes into a 6.2 mm (folded) device weighing under a kilogram.

We have been hearing a lot about Intel's Rocket Lake lineup of processors. They are supposed to be a backport of Willow Cove 10 nm core, adapted to work on a 14 nm process for better yielding. Meant to launch sometime around late 2020 or the beginning of 2021, Rocket Lake is designed to work on the now existing LGA1200 socket motherboards, which were launched just a few days ago along with Intel Comet Lake CPUs. Rocket Lake is there to supply the desktop segment and satisfy user demand, in light of lacking 10 nm offers for desktop users. The 10 nm node is going to present only on mobile/laptop and server solutions before it comes to the desktop.

In the latest report on 3D Mark, the hardware leaker TUM APISAK has found a Rocket Lake CPU running the benchmark and we get to see first specifications of the Rocket Lake-S platform. The benchmark ran on 6 core model with 12 threads, that had a base clock of 3,5 GHz. The CPU managed to boost up to 4,09 GHz, however, we are sure that these are not final clocks and the actual product should have even higher frequencies. Paired with Gen12 Xe graphics, the Rocket Lake platform could offer a very nice alternative to AMD offerings if the backport of Willow Cove goes well. Even though it is still using a 14 nm node, performance would be good. The only things that would be sacrificed (from backporting) are die space and efficiency/heat.

Intel is preparing to launch its next-generation Tiger Lake lineup of processors for the middle of 2020. The processors are based on the new "Willow Cove" CPU core, which supposedly brings even more IPC gains compared to previous "Golden Cove" CPU cores found in Ice Lake processors. The Tiger Lake lineup will use Intel's advanced 10 nm+ manufacturing process. This alone should bring some gains in frequency compared to the 10 nm Ice Lake processor generation, which was spotting a maximum of 4.1 GHz boost frequency on 28 W TDP model named Core i7-1068NG7. This processor is labeled as the highest-performing Ice Lake parts available today and the best 10 nm products available so far from Intel.

Thanks to the popular hardware leaker Rogame, we have evidence that the gains from 10 nm+ manufacturing process are real and that Tiger Lake will show us an amazing boost frequency of 5 GHz. In the benchmark, an unknown OEM laptop was spotted running the benchmark with a Tiger Lake CPU. This CPU is a 4 core, 8 threaded model with a base frequency of 2.3 GHz and a surprising boost frequency of 5 GHz. This information should, of course, be taken with a grain of salt until we get more information about the Tiger Lake lineup and their specifications.

Intel has today released the 43rd edition of its x86/x64 ISA developer manual designed to help developers see what's new in x86 world and make software optimizations for Intel's platform. In the latest edition of the manual, Intel has revealed the details of its low-power x86 "Tremont" architecture designed for 10 nm efficient, low-power computing. Announced last year in October, Intel promised to deliver a big IPC increase compared to the previous generation low-power CPU microarchitecture like the Goldmont Plus family. To achieve extra performance, Intel has implemented a lot of new solutions.

For starters, Tremont boasts better branch prediction unit, with increased capacity for instruction queue and better path-based conditional and indirect prediction. The front-end fetch and decode pipeline have been updated as well. Now the design is a 6-wide Out of Order Execution (OoOE) pipeline which can process 6 instructions per cycle. The Data cache is now upgraded to 32 KB. The load and store execution pipelines are now doubled and they are capable of two loads and two stores, or one load and one store, depending on the application. Tremont also updates on one important point and that is a dedicated store data port for integer and vector integer/floating-point data. Another big improvement is happening in the cryptography department. Tremont now features Galois-field instructions labeled as the GFNI family of instructions. There are two AES units for faster AES encryption and decryption. The already implemented SHA-NI cryptography standard was enhanced and it now is much faster as well. For mode in-depth report please check out Intel's x86/x64 manual.

As we reported earlier this week, the release of Adobe Premiere Pro 14.2 brought GPU acceleration to select NVIDIA and AMD GPUs taking advantage of NVIDIA's NVENC chips to boost encoding and decoding speeds. Intel has now showcased the improvements to encoding and decoding with Intel Quick Sync Video (QSV) on 11th generation iGPUs found in mobile Ice Lake chips with Adobe Premiere Pro 14.2.

Compared to the previous 9th generation graphics found in Skylake and Kabylake CPUs the new 11th generation iGPUs perform anywhere from 49-82% better. While impressive, these performance gains can only be found on limited low power 10 nm mobile chips with a maximum of four cores and are yet to arrive on desktop platforms.

MSI, the world-leading motherboard manufacturer, proudly announces Intel B460 series motherboards. Since the current Intel 10th Gen processor has doubled the efficiency of the thread, it is an excellent match with the B460 series chipset on the mainstream i5 / i7 processor, this time MSI launched 4 models of MAG series at a time, including MAG B460 TOMAHAWK in ATX size and three mATX size models including MAG B460M MORTAR, MAG B460M MORTAR WIFI, and MAG B460M BAZOOKA. This completes an enriching amount of choices for mainstream gamers.

MAG B460 TOMAHAWK is equipped with MSI Extended Heatsink Design, which is well-prepared for the potential rise in temperature. Turbo M.2 with M.2 shield Frozr allows for maximum performance without throttling condition. Adopted ASMedia 3241 controller chip brings up to 20 Gbps transfer speed with Type-C connector. 2.5G Gigabit LAN with the LAN manager offers faster networking experiences. 12+1+1 Duet Rail Power System gives more stability for entry-level gamers.

AMD marshaled its retailer ecosystem to cut the pricing of its 12-core/24-thread Ryzen 9 3900X processor down to USD $410. At this price, the 3900X is poised to threaten both the 10-core/20-thread Core i9-10900K and the 8-core/16-thread Core i7-10700K. Although bearing a $489 MSRP, the i9-10900K is seen going for upwards of $510. The i7-10700K, on the other hand, is being priced around the $410 mark. The iGPU-devoid i9-10900KF is expected to be around $20 cheaper, which should put its retail pricing around $480, while the i7-10700KF could go for around $380.

Pricing of both chips are along expected lines, as retail pre-tax prices typically end up 5% above the 1,000-unit tray pricing Intel announces for its processors. The Hardware Unboxed review of the i9-10900K shows it taking a roughly 7% lead in gaming performance over the 3900X (averaged), while falling 12% behind in multi-threaded compute performance. The i7-10700K is expected to be slightly faster than the i9-9900K. Adding value to the AMD chip is the fact that it includes a cooling solution in the retail package, which Intel doesn't, for the i9-10900K/KF and the i7-10700K/KF. A February 2020 report postulated that AMD has significant headroom to cut prices of its 3rd generation Ryzen processors to maintain competitiveness against Intel, until they are relieved by the "Zen 3" based 4th gen Ryzen "Vermeer" processors in September 2020.

Intel Xe graphics architecture makes its commercial debut as an iGPU solution in the company's upcoming "Tiger Lake" mobile processors. The iGPU can be configured along three tiers, with GT1 featuring 48 execution units (EUs), GT2 80 EUs, and GT3 leading the pack with 96 EUs, all within a 15 W envelope (for the total chip). There's a higher tier still of GT3 that comes with higher boost frequencies, tapping into the chip's overall increased 28 W TDP, but this variant of "Tiger Lake" could likely be an Apple-exclusive like its "Ice Lake" based predecessor.

NotebookCheck compiled a 3DMark FireStrike comparison between the various tiers of the Xe iGPU, and compared it to the Gen11 iGPU found with current-generation "Ice Lake-U" processors. The graph doesn't put out scores, but relative performance. Apparently, the 48 EU version of Gen12 Xe is a little over twice as fast as Gen11 GT1, and faster than even the 64 EU Gen11 GT2. The Gen12 GT2 with 80 EUs is around 1.7x faster than the Gen11 GT2 (64 EU). The 96 EU GT3 trim is over twice as fast, and its 28 W variant faster still. These performance give Gen12 a shot against AMD's Radeon Vega-based iGPU solution found in "Renoir." AMD has slimmed the number of CUs down to 8 (512 SP) with "Renoir," down from 11 CUs in the previous generation, compensating for it with higher GPU engine clocks.