For those wanting 802.11ax Wi-Fi 6 on their desktops without an M.2 E-key slot on their motherboards, ASUS came up with the PCE-AX3000, a low-profile capable (half-height) NIC that provides up to 3000 Mbps (2.4 Gbps over 5 GHz and 600 Mbps over 2.4 GHz) wireless connectivity, and the added convenience of Bluetooth 5.0 for short-range communications. A set of MU-MIMO antennae come included. Besides MU-MIMO, the card supports OFDMA for better collision-prevention with other devices in the same channel, and WPA3 security protocol. The NIC is essentially a PCI-Express 3.0 x1 add-on card with an M.2 E-key slot that holds an Intel AX200 "Cyclone Peak" WLAN card. We expect the AX3000 to be priced well under $50 given that the "Cyclone Peak" card at the heart of it costs just $10-17 in volume pricing.

At Supercomputing 2019, Intel unveiled its vision for extending its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and an ambitious new software initiative that represents a paradigm shift from today's single-architecture, single-vendor programming models.

Addressing the increasing use of heterogeneous architectures in high-performance computing, Intel expanded on its existing technology portfolio to move, store and process data more effectively by announcing a new category of discrete general-purpose GPUs optimized for AI and HPC convergence. Intel also launched the oneAPI industry initiative to deliver a unified and simplified programming model for application development across heterogenous processing architectures, including CPUs, GPUs, FPGAs and other accelerators. The launch of oneAPI represents millions of Intel engineering hours in software development and marks a game-changing evolution from today's limiting, proprietary programming approaches to an open standards-based model for cross-architecture developer engagement and innovation.

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from customers and distributors. The boxed SKU of the E-2274G, which includes a stock cooling solution, has been marked as "discontinued" and "end of life." Intel is offering an E-2274G tray processor (chip-only) as replacement for the returned inventory. The cause for the recall is the cooling solution included in the boxed SKU, which has been found to be insufficient to cool the E-2274G, a 4-core/8-thread processor based on the 14 nm++ "Coffee Lake" microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is supplied by Foxconn, and has been known to be bundled with Intel's entry-level client-segment processors, such as the Pentium Gold series and Core i3 series (chips with TDP typically rated 65 W or less). It features a thin, circular, all-aluminium heatsink, which lacks a copper core that certain other LGA115x-compatible stock coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium surface, with spirally-projecting fins dissipating heat under the fan's airflow. It could be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that's designed for the rigors of mission-critical use-cases such as workstations and small-business servers.Heatsink images courtesy: AndyKingParts (Amazon seller)

Intel's first Xe GPU built on the company's 7 nm silicon fabrication process will be codenamed "Ponte Vecchio," according to a VideoCardz report. These are not gaming GPUs, but rather compute accelerators designed for exascale computing, which leverage the company's CXL (Compute Express Link) interconnect that has bandwidth comparable to PCIe gen 4.0, but with scalability features slated to come out with future generations of PCIe. Intel is preparing its first enterprise compute platform featuring these accelerators codenamed "Project Aurora," in which the company will exert end-to-end control over not just the hardware stack, but also the software.

"Project Aurora" combines up to six "Ponte Vecchio" Xe accelerators with up to two Xeon multi-core processors based on the 7 nm "Sapphire Rapids" microarchitecture, and OneAPI, a unifying API that lets a single kind of machine code address both the CPU and GPU. With Intel owning the x86 machine architecture, it's likely that Xe GPUs will feature, among other things, the ability to process x86 instructions. The API will be able to push scalar workloads to the CPU, and and the GPU's scalar units, and vector workloads to the GPU's vector-optimized SIMD units. Intel's main pitch to the compute market could be significantly lowered software costs from API and machine-code unification between the CPU and GPU.Image Courtesy: Jan Drewes

All Intel CPU microarchitectures since 2013 are vulnerable to a new class of "Zombieload," attacks, chronicled under "Zombieload v2" (CVE-2019-11135). This is the fifth kind of microarchitectural data sampling (MDS) vulnerability, besides the four already disclosed and patched against in Q2-2019. The vulnerability was kept secret by the people who discovered it, as Intel was yet to develop a mitigation against it. There is no silicon-level hardening against it, and Intel has released a firmware-level mitigation that will be distributed by motherboard manufacturers as BIOS updates, or perhaps even OS vendors. While Intel's latest enterprise and HEDT microarchitecture, "Cascade Lake" was thought to be immune to "Zombieload," it's being reported that "Zombieload v2" attacks can still compromise a "Cascade Lake" based server or HEDT that isn't patched.

"Zombieload v2" is an exploitation of the Asynchronous Abort operation of Transactional Synchronization Extensions (TSX), which occurs when malware creates read operation conflicts within the CPU. This reportedly leaks data about what else is being processed. "The main advantage of this approach is that it also works on machines with hardware fixes for Meltdown, which we verified on an i9-9900K and Xeon Gold 5218," reads the latest version of the Zombieload whitepaper that's been updated with "Zombieload v2" information. TSX is a requisite for "Zombieload v2," and all Intel microarchitectures since "Haswell" feature it. AMD processors are inherently immune to "Zombieload v2" as they lack TSX. Intel downplayed the severity or prevalence of "Zombieload v2," but dispatched microcode updates flagged "critical" nevertheless.

Here are some of the first pictures of Intel's new generation "Frost Canyon" NUC based on the company's 10th generation Core "Comet Lake-U" SoC. The top-spec variant, NUC10i7FN, is powered by a Core i7-10710U SoC, which packs a 6-core/12-thread CPU with 12 MB L3 cache, up to 4.70 GHz Turbo Boost, UHD Graphics clocked at 1.15 GHz, and 25 W cTDP (configurable TDP). The middle variant, NUC10i5FN, is powered by the 4-core/8-thread Core i5-10210U (up to 4.20 GHz CPU Turbo Boost, UHD Graphics with up to 1.00 GHz clocks, 8 MB L3 cache, and 25 W cTDP). At the entry level is the NUC10i3FN powered by the Core i3-10110U (2-core/4-thread CPU clocked up to 4.10 GHz, 4 MB L3 cache, UHD Graphics clocked up to 1.00 GHz, and 25 W cTDP).

Physically, these 10th generation NUCs look similar to their "Coffee Lake" powered predecessors codenamed "Bean Canyon," with the exception of just one each type-C and type-A USB 3.2 front panel ports. Other connectivity includes possible Wi-Fi 6 (802.11ax WLAN), 1 GbE, HDMI 2.0, Thunderbolt 3 with DP output on the top model, and an additional pair of 10 Gbps USB 3.2 ports. Intel is likely to launch "Frost Canyon" on December 12.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which now comes in a white edition along with new frequencies of 3,200 MHz and 3,600 MHz 2x 8 GB. TOUGHRAM is supported by Intel and AMD platforms and features 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB white edition is not only visually appealing, but is also high in performance. The TOUGHRAM RGB White Edition is built with premium fine coating that reveals true elegance from inside out.

The TOUGHRAM RGB DDR4 Memory Series 3,200 MHz and 3,600 MHz white edition is now available for pre-order at the TT Premium website. Please refer to the Thermaltake website or contact your local Thermaltake sales or PR representative for more information on pricing for the Thermaltake TOUGHRAM RGB DDR4 3,200 MHz and 3,600 MHz white edition memory kits.

Intel has today announced the Stratix 10 GX 10M - a Field Programmable Gate Array (FPGA) built on 14 nm technology that has an astonishing 43.3 Billion transistors, making it the largest FPGA in the world, dethroning the Xilinx with their previously largest Virtex VU19P FPGA which had a "mere" 35 Billion transistors. The Stratix 10 GX 10M is a home to over 10.2 million logic cells housed inside two large dies, connected by Intel's own Embedded Multi-die Interconnect Bridge (EMIB).

The 10M model is packing four additional dies besides the two for logic, also connected by EMIB, that feature 48 transceivers in total which have a combined bandwidth of up to 4.5Tb/s. If you are wondering about the bandwidth between all dies, then judging by EMIB's 25,920 connections, there is 6.5 Tb/s of inner-die bandwidth, meaning that components will not be starving for additional speeds to transfer the data. Additionally there are 2,304 user I/O pins, allowing for some creative integration solutions that involve plenty of ports for development purposes.

Intel CFO George Davis in an interview with Barron's commented on the company's financial health, and some of the reasons behind its rather conservative gross margin guidance looking forward to at least 2023. Intel's current product stack is moving on to the company's 10 nm silicon fabrication process in a phased manner. The company is allocating 10 nm to mobile processors and enterprise processors, while brazening it out with 14 nm on the client-desktop and HEDT platforms until they can build 10 nm desktop parts. AMD has deployed its high-IPC "Zen 2" microarchitecture on TSMC's 7 nm DUV process, with plans to go EUV in the coming months.

"We're still keenly focused on gross margin. Everything from capital efficiency to the way we're designing our products. What we've said though, the delay in 10 nanometer means that we're going to be a little bit disadvantaged on unit cost for a period of time. We actually gave guidance for gross margin out in 2021 to help people understand. 2023 is the period that we were ultimately guiding [when] we're going to see very strong revenue growth and margin expansion. We've got to get through this period where we have the 10 nanometer being a little bit late [as] we're not optimized on a node that we're on. But [by] then we're moving to a two to two and a half year cadence on the next nodes. So we're pulling in the spending on 7 nanometer, which will start up in the second half of 2021 because we think it's the right thing to do competitively," he said.

Intel announced its 10th generation Core i9 XE "Cascade Lake-X" HEDT processor family in October. At the time, market availability of these chips was slated for November 2019, although a date wasn't specified. A report by Chinese tech publication PCDIY sheds more light. According to the report, market availability of these chips could begin from 25th November, 2019, which would be 49 days or 7 weeks following its October 7 product announcement. Intel's lean 10th gen Core HEDT processor lineup includes 10-core, 12-core, 14-core, and 18-core SKUs at price-points ranging from roughly-$600 to $1,000.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which comes in new frequencies of 4,000 MHz, 4,266 MHz and 4,400 MHz 2x8 GB modules, supported by Intel and AMD platforms. Featuring 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB enhances overclocking performance and betters gaming experiences. The high-frequency memory kits are constructed with higher standard chips, which have been tested to achieve higher and more stable overclocks. Our latest module 4,400 MHz and 4,000 MHz was tested with Intel's Core i7 platform, ASUS ROG MAXIMUS XI GENE and MAXIMUS XI HERO motherboards and remained stable under load.

Thermaltake CEO Kenny Lin is excited to launch the newest addition to the TOUGRAM RGB Series. "We are glad to embrace the new era of high-frequency memory. With the rapid rise of esports, higher frequency ram is essential for faster and smoother performance. Level up your gameplay with the next level TOUGHRAM RGB DDR4 16 GB Memory Kit in 4,000 MHz, 4,266 MHz, 4,400 MHz." stated Thermaltake CEO Kenny Lin.

Brainbox, a Korean media outlet, has gathered information on Intel's newest Ice Lake and Cooper Lake server processors from a presentation ASUS held for its server lineup. With Cooper Lake-SP paving the way for the first server CPU model to be released on the new "Whitley" platform, it is supposed to launch in Q2 of 2020. Cooper Lake-SP comes with TDP of 300 W and will be available with configurations of up to 48 cores, but there also should be a 56 core model like the Xeon Platinum 9282, that has a TDP of 400 W. Cooper Lake-SP supports up to 64 PCIe 3.0 lanes, 8 channel memory (16 DIMMs in total) that goes up to 3200 MHz and four Ultra Path Interconnect (UPI) links.

Ice Lake-SP, built on the new 10 nm+ manufacturing process, is coming in soon after Cooper Lake-SP release, with a launch window in Q3 of 2020. That is just few months apart from previous CPU launch, so it will be a bit hard to integrate the launches of two rather distinct products. As far as the specifications of Ice Lake-SP goes, it will have up to 38 core for the top end model, within 270 W TDP. It supports 64 PCIe 4.0 lanes with three UPI links. There is also 8 channel memory support, however this time there is an option to use 2nd generation Optane DC Persistent Memory. Both CPU uArches will run on the new LGA 4189 on the P+ socket.

GIGABYTE expanded its AORUS RGB DDR4 memory family with two new kits that introduce a proprietary performance enhancement dubbed AORUS Memory Boost. Exclusive to GIGABYTE's AORUS-branded motherboards (listed below), and requiring a BIOS update to use, AORUS Memory Boost is a toggle that runs the memory at a clock-speed and timing combination that's a notch above its highest Intel XMP profile. For example, the memory kits debuting with the feature today feature an XMP 2.0 profile for DDR4-3600. Flicking on AORUS Memory Boost runs them at DDR4-3733, in essence making it an additional memory profile that's exclusive to GIGABYTE motherboards.

The memory kits being launched today are GP-AR36C18S8K2HU416R and GP-AR36C18S8K2HU416RD. The former is 2x 8 GB (16 GB) dual-channel, while the latter is 2x 8 GB (16 GB) with two dummy modules. These dummy modules fill up vacant DIMM slots, look and light up like real modules, and could boost the aesthetics of your build without having you spend on two additional real modules. Out of the box, the memory modules (real ones) in these kits run at DDR4-2667 with 19-19-19-43 on Intel processors and 20-19-19-43 on AMD ones. The included DDR4-3600 XMP profile has timings of 18-19-19-39. GIGABYTE didn't mention how AORUS Memory Boost affects timings. Out of the box, the module voltage is 1.2 V, and the XMP profile dials it up to 1.35 V. The dummies work with whatever module voltage you specify in the BIOS, and interface with GIGABYTE RGB Fusion software. The company didn't reveal pricing.

Today, MAINGEAR is pleased to announce that the all-new Intel 9th Gen Core i9-9900KS flagship processor is now available across its product line of award-winning custom gaming PCs and workstations. Created to be the ultimate gaming processor, the i9-9900KS features up to 5.0 GHz all-core turbo frequency across 8 cores and 16 threads — gamers looking for the ultimate power boost need look no further. MAINGEAR products featuring the i9-9900KS offer an unmatched level of performance that takes your gaming and streaming experience to the next level!

To celebrate this amazing achievement in processing power, MAINGEAR is offering the i9-9900KS in select desktop configurations, like the award-winning VYBE, with a Limited Edition VYBE 9900KS Edition — in extremely limited quantities. Powered by an 8-core Intel Core i9-9900KS, this special offering is a top-tier gaming machine and the best way to experience the incredible performance the i9-9900KS has to offer. The VYBE 9900KS Edition combines this monstrous processor with an NVIDIA GeForce RTX 2080 Ti, ASUS ROG Ryujin 360 RGB AiO CPU Liquid Cooler with color display that helps users keep temperatures low and all-white VYBE chassis.

Samsung Electronics today introduced Galaxy Book Flex and Galaxy Book Ion at the Samsung Developer Conference 2019 (SDC19), two premium laptops offering ultra-portable and ultra-powerful computing experiences to meet the unique needs of modern professionals for their always on-the-go lifestyles. Today's on-the-go consumers need PCs that deliver maximum productivity, while being mobile enough to take wherever you're going. Galaxy Book Flex and Galaxy Book Ion were built for that and more, offering a seamless continuity across multiple devices.

"Consumers often have to choose between mobility and high-performance hardware when choosing a laptop," said YoungGyoo Choi, Senior Vice President of, Mobile Communications Business at Samsung Electronics. "Galaxy Book Flex and Galaxy Book Ion eliminate the need to compromise by offering powerful performance with unparalleled portability and display innovation."

If you're one to pay more bucks for the same silicon in a bid to decrease risk of having a lower-performing overclocker than is possible with the latest AMD and Intel chips, this post is for you. Silicon Lottery has announced (absolutely expected) plans to bin AMD and Intel's latest high-performance processors starting this November.

AMD's Ryzen 9 3950X and Intel's Core i9 9900KS will be up for grabs in the website with guaranteed maximum clocks for you to peruse and then seat in your motherboard of choice. Just wait a little while longer for them to become available, since AMD's own Ryzen 9 3950X isn't yet available in the retail channel. Intel's own Core i9 9900KS has just been announced though, with availability just two days from now, on October 30th. So if you want to skip the hassle (or fun, as you see it) of finding just the right settings for your CPU of choice, keep refreshing Silicon Lottery's page. Availability is expected to be extremely limited on either part.

Intel today announced full details and availability for the new 9th Gen Intel Core i9-9900KS Special Edition processor. Delivering up to 5.00 GHz all-core turbo frequency out of the box for the ultimate gaming experience, the 9th Gen Intel Core i9-9900KS will be available beginning Oct. 30, with recommended customer price starting at $513. This special edition processor will be available for a limited time only and can be found at retailers worldwide.

"Intel has raised the bar for desktop gaming with the new 9th Gen Intel Core i9-9900KS Special Edition processor. Based on the 9th Gen Intel Core i9-9900K architecture, it's the world's best gaming desktop processor made even better and created specifically for extreme gamers who want the most performance possible. This processor demonstrates another innovation milestone for Intel, following last year's limited edition 8th Gen Intel Core i7-8086K," said Frank Soqui, Intel vice president and general manager of the Desktop, Workstation and Channel Group. The i9-9900KS processor is unlocked and boasts eight cores and 16 threads, up to 4.00 GHz base frequency, 127 W TDP, 16 MB Intel Smart Cache, and up to 40 platform PCIe lanes for gaming and overclocking.

Intel is working hard to bring its first discrete GPU lineup triumphantly, after spending years with past efforts to launch the new lineup resulting in a failure. During its Q3 earnings call, some exciting news was presented, with Intel's CEO Bob Swan announcing that "This quarter we've achieved power-on exit for our first discrete GPU DG1, an important milestone." By power on exit, Mr. Swan refers to post-silicon debug techniques that involve putting a prototype chip on a custom PCB for testing and seeing if it works/boots. With a successful test, Intel now has a working product capable of running real-world workloads and software, that is almost ready for sale.

Additionally, the developer kit for the "DG1" graphics card is supposedly being sent to various developers over the world, according to European Economy Commission listings. Called the "Discrete Graphics DG1 External FRD1 Accessory Kit (Alpha) Developer Kit" this bundle is marked as a prototype in the alpha stage, meaning that the launch of discrete Xe GPUs is only a few months away. This confirming previous rumor that Xe GPUs will launch in 2020 sometime mid-year, possibly in July/August time frame.

Intel's Core "Tiger Lake" microarchitecture could be a point of transition between DDR4 and DDR5 for the company. Prototypes of devices based on the ultra-compact "Tiger Lake-Y" SoC were earlier shown featuring LPDDR4X memory, although a new device, possibly a prototyping platform, in the regulatory queue with the Eurasian Economic Commission describes itself as featuring a "Tiger Lake-U" chip meant for thin and light notebooks and convertibles. This device features newer LPDDR5 memory, according to its regulatory filing.

LPDDR5 succeeds LPDDR4X as the industry's next low-power memory standard, offering data-rates of up to 6,400 MT/s (versus up to 4,266 MT/s of LPDDR4X), and consumes up to 30 percent less power. This prototype at the EEC is sure to be using unreleased LPDDR5 memory chips as DRAM majors Samsung and SK Hynix plan to ship their DDR5-based memory solutions only by the end of this year, although mass-production of the chips have already started at Samsung, in PoP form-factors. A successor to the 10th generation Core "Ice Lake," "Tiger Lake" will be Intel's second CPU microarchitecture designed for its 10 nm silicon fabrication node.

TSMC has been very aggressive with its approach to silicon manufacturing, with more investments into its R&D that now match or beat the capex investments of Intel. That indicates a strong demand for new technologies and TSMC's strong will not drop out of the never-ending race for more performance and smaller node sizes.

According to the sources over at DigiTimes, TSMC has acquired as much as 30 hectares of land in the Southern Taiwan Science Park to begin the construction of its fabs that are supposed to start high-volume manufacturing 3 nm node in 2023. Construction of 3 nm manufacturing facilities are set to begin in 2020 when TSMC will lay the groundwork for the new fab. The 3 nm semiconductor node is expected to be TSMC's third attempt at EUV lithography, right after the 7 nm+, and 5 nm nodes which are also based on EUV technology.

In a bid to clear out inventories of its 7th and 9th generation Core X HEDT processors based on the "Skylake-X" silicon, Intel is preparing to halve prices of leftover inventory in the retail channel. The move is triggered by the company's own recent launch of the 10th generation Core i9 "Cascade Lake-X" processors that are compatible with existing socket LGA2066 motherboards. With "Cascade Lake-X," Intel halved the Dollars-per-core metric across the board (i.e. doubled the performance-per-Dollar), resulting in its top 18-core i9-10980XE being priced under the $1000-mark, half of what the i9-9980XE once commanded.

With prices of Core X "Skylake-X" chips being halved, you can expect the market to be flooded with 7th and 9th generation chips that are priced marginally lesser than their 10th gen "Cascade Lake-X" siblings. The single-thread performance (IPC) is identical between the three generations. All that's changed with "Cascade Lake-X" is the introduction of the DLBoost instruction-set that speeds up AI applications (irrelevant to gamers), and an improved Turbo Boost algorithm that spreads boost clocks across more cores, including Favored Cores capability that will come alive with Windows 10 2H19 update. If you've been on one of the cheaper 8-core or 10-core LGA2066 chips, your upgrade options just increased.

Intel filed an anti-trust lawsuit against Fortress Investment Group, a firm owned by Japan's SoftBank, over alleged malpractices with their patents. Intel alleges that the company stockpiled patents to make a living out of IP disputes with other companies, including Intel. The complaint filed with the U.S. District Court for the Northern District of California in San Jose alleges that Fortress bought up over 1,000 U.S. technology patents, some of which include patents from NXP Semiconductors. It's now using these patents to get Intel to pay up a royalty on every processor sold since 2011. SoftBank bought Fortress in 2017 for USD $3.3 billion as part of a massive takeover of the tech world. One of SoftBank's other priced possessions include ARM.

The lawsuit alleges a motive behind Fortress's behavior. "One way in which Fortress has tried to turn around its performance and justify SoftBank's investment in it is through increased speculation on patent assertions," the lawsuit says. Intel accused Fortress of patent-trolling, alleging that the company's move to soak up tech patents constitutes anti-competitive behavior as it's driven by the idea that the patents would cost less than what other tech companies would pay up to avert an IP lawsuit.

There were many rumors about Intel's 10 nm CPUs, many of them indicating that Intel will not manufacture 10 nm CPUs for desktop users, due to the 10 nm manufacturing process being in a bad shape. Those rumors were later countered by Intel, claiming that 10 nm is doing very well on improving yields and that we will see desktop CPUs based on the new node very soon.

Thanks to the Linux kernel mailing list (LKML), we now know that support for Ice Lake desktop and server CPUs has been added. A Patch titled "Add more CPU model number for Ice Lake" has many details about variants of Ice Lake with names like Ice Lake X for server Xeon CPU, Ice Lake D for Xeon D CPUs, Ice Lake L for mobile, and regular Ice Lake for desktop series of CPUs. This confirms Intel's claims that Ice Lake is on its way to desktop and server users in the near future. Possible launch date on these CPUs would be sometime in 2020, when Xe graphics cards are launched in July/August, so Intel could bundle both processors on the same 10 nm node.

Intel is preparing to debut its next generation Pentium Silver and Celeron "Gemini Lake Refresh" low-power processors in November 2019. The latest company roadmap slide detailing low-power SoC rollout, sourced by FanlessTech, pinned their launch sometime between week 45-47 (November). These are two key variants of this silicon, J and N. The J variant targets low-power desktops and AIOs, while the N variant targets notebooks, tablets, and other portables.

"Gemini Lake Refresh" SoCs are built on Intel's latest 14 nm node, and pack up to four "Goldmont Plus" CPU cores, and the same Intel UHD graphics, but offer significantly higher clock-speeds on both the CPU cores and the iGPU. Leading the pack is the Pentium Silver J5040, clocked at 2.00 GHz with up to 3.20 GHz boost. This chip succeeds the J5005, which ticks at 1.50 GHz with 2.80 GHz boost. The table below details the other J and N series models with the clock-speeds and core-counts.

AMD's upcoming Ryzen 9 3950X socket AM4 processor beats Intel's flagship 18-core processor, the Core i9-10980XE, by a staggering 24 percent at 3DMark Physics, according to a PC Perspective report citing TUM_APISAK. The 3950X is a 16-core/32-thread processor that's drop-in compatible with any motherboard that can run the Ryzen 9 3900X. The i9-10980XE is an 18-core/36-thread HEDT chip that enjoys double the memory bus width as the AMD chip, and is based on Intel's "Cascade Lake-X" silicon. The AMD processor isn't at a tangible clock-speed advantage. The 3950X has a maximum boost frequency of 4.70 GHz, while the i9-10980XE isn't much behind, at 4.60 GHz, but things differ with all-core boost.

When paired with 16 GB of dual-channel DDR4-3200 memory, the Ryzen 9 3950X powered machine scores 32,082 points in the CPU-intensive physics tests of 3DMark. In comparison, the i9-10980XE, paired with 32 GB of quad-channel DDR4-2667 memory, scores just 25,838 points as mentioned by PC Perspective. Graphics card is irrelevant to this test. It's pertinent to note here that the 3DMark physics test scales across practically any number of CPU cores/threads, and the AMD processor could be benefiting from a higher all-core boost frequency than the Intel chip. Although AMD doesn't mention a number in its specifications, the 3950X is expected to have an all-core boost frequency that's north of 4.00 GHz, as its 12-core sibling, the 3900X, already offers 4.20 GHz all-core. In contrast, the i9-10980XE has an all-core boost frequency of 3.80 GHz. This difference in boost frequency, apparently, even negates the additional 2 cores and 4 threads that the Intel chip enjoys, in what is yet another example of AMD having caught up with Intel in the IPC game.