Intel has been experimenting with a concept of mixing various types of cores in a single package with a design called Lakefield. With this processor, you would get a package of relatively small dimensions that are 12-by-12-by-1 millimeters withing very low TDP. Thanks to the Twitter user InstLatX64 (@InstLatX64) we have some GeekBench 5 results of the new Lakefield chip. The CPU in question is the Core i5-L15G7, a 5 core CPU without HyperThreading. The 5C/5T would be a weird configuration if only Lakefield wasn't meant for such configs. There are one "big" Sunny Cove core and four "small" Tremont cores built on the 10 nm manufacturing process. This is the so-called compute die, where only the CPU cores are present. The base dies containing other stuff like I/O controllers and PHYs, memory etc. is made on a low-cost node like 22 nm, where performance isn't the primary target. The whole chip is targeting the 5-7 W TDP range.

In the GeekBench 5 result we got, the Core i5-L15G7 is a processor that has a base frequency of 1.4 GHz, while in the test it reached as high as 2.95 GHz speeds. This is presumably for the big Sunny Cove cores, as Tremont cores are supposed to be slower. The cache configuration reportedly puts 1.5 MB of L2$ and 4 MB of L3$ for the CPUs. If we take a look at performance numbers, the chip scores 725 points in single-core tests, while the multi-core result is 1566 points. We don't know what is the targeted market and what it competes with, however, if compared to some offerings from Snapdragon, like the Snapdragon 835, it offers double the single-threaded performance with a similar multi-core score. If this is meant to compete with the more powerful Snapdragon offerings like the 8cx model, comparing the two results in Intel's fail. While the two have similar single-core performance, the Snapdragon 8cx leads by as much as 76.9% in a multi-core scenario, giving this chip a heavy blow.

Intel's upcoming Rocket Lake-S desktop platform is expected to arrive sometime later this year, however, we didn't have any concrete details on what will it bring. Thanks to the exclusive information obtained by VideoCardz'es sources at Intel, there are some more details regarding the RKL-S platform. To start, the RKL-S platform is based on a 500-series chipset. This is an iteration of the upcoming 400-series chipset, and it features many platform improvements. The 500-series chipset based motherboards will supposedly have an LGA 1200 socket, which is an improvement in pin count compared to LGA 1151 socket found on 300 series chipset.

The main improvement is the CPU core itself, which is supposedly a 14 nm adaptation of Tiger Lake-U based on Willow Cove core. This design is representing a backport of IP to an older manufacturing node, which results in bigger die space due to larger node used. When it comes to the platform improvements, it will support the long-awaited PCIe 4.0 connection already present on competing platforms from AMD. It will enable much faster SSD speeds as there are already PCIe 4.0 NVMe devices that run at 7 GB/s speeds. With RKL-S, there will be 20 PCIe 4.0 lanes present, where four would go to the NVMe SSD and 16 would go to the PCIe slots from GPUs. Another interesting feature of the RKL-S is the addition of Xe graphics found on the CPU die, meant as iGPU. Supposedly based on Gen12 graphics, it will bring support for HDMI 2.0b and DisplayPort 1.4a connectors.

2020's Game Developers Conference (GDC), originally set to be live from March 16th through March 20th, was one of the first tech shows to be cancelled in wake of the Sars-Cov-2 outbreak. Now, the organization has announced that the event has been rescheduled a full 5 months later for August 2020. The event has been set for a three-day "GDC Summer" still taking place in Moscone Center in San Francisco, USA, starting August 4th and ending August 6th. Passes for the exhibition are already available, with early takers being offered heavy discounts over the on-floor passes.

GDC has been the stage for a number of high-profile gaming and services announcements, with the 2019 edition seeing announcements for Google's Stadia, EPIC Games detailing new features for its Unreal engine, and AMD taking the lid of their (then) upcoming 3rd generation Ryzen CPUs. Intel was first expected to detail their Xe graphics architecture at GDC 2020. It remains to be seen whether the blue giant will still be doing so in wake of this delay, or if the company will find an in-house (albeit likely online) alternative to get word of mouth flowing on their upcoming high performance graphics architecture.

Microsoft Thursday released the DirectX 12 Ultimate logo. This is not a new API with any new features, but rather a differentiator for graphics cards and game consoles that support four key modern features of DirectX 12. This helps consumers recognize the newer and upcoming GPUs, and tell them apart from some older DirectX 12 capable GPUs that were released in the mid-2010s. For a GPU to be eligible for the DirectX 12 Ultimate logo, it must feature hardware acceleration for ray-tracing with the DXR API; must support Mesh Shaders, Variable Rate Shading (VRS), and Sampler Feedback (all of the four). The upcoming Xbox Series X console features this logo by default. Microsoft made it absolutely clear that the DirectX 12 Ultimate logo isn't meant as a compatibility barrier, and that these games will work on older hardware, too.

As it stands, the "Navi"-based Radeon RX 5000 series are "obsolete", just like some Turing cards from the GeForce GTX 16-series. At this time, the only shipping product which features the logo is NVIDIA's GeForce RTX 20-series and the TITAN RTX, as they support all the above features.

Today, Intel announced the readiness of Pohoiki Springs, its latest and most powerful neuromorphic research system providing the computational capacity of 100 million neurons. The cloud-based system will be made available to members of the Intel Neuromorphic Research Community (INRC), extending their neuromorphic work to solve larger, more complex problems.

"Pohoiki Springs scales up our Loihi neuromorphic research chip by more than 750 times, while operating at a power level of under 500 watts. The system enables our research partners to explore ways to accelerate workloads that run slowly today on conventional architectures, including high-performance computing (HPC) systems." -Mike Davies, director of Intel's Neuromorphic Computing Lab.

Intel and Micron have signed a new agreement for the production of 3D XPoint memory. As currently the only source of 3D XPoint memory solutions, Micron will get a significant increase in cash flow coming from Intel for the memory production. While Intel and Micron ended their partnership on 3D XPoint memory, they have signed a new contract for the production and supply of new 3D XPoint wafers to Intel. This shows that the demand for 3D XPoint memory is strong, so Intel needs production capacity to deliver the memory, and Micron is the obvious choice.

Previously, Intel sold its ownership of Lehi fab based in Utah, which was manufacturing the 3D XPoint memory solutions, so it was left to Micron to use. However, they signed a new deal and now Micron is in charge of manufacturing and addressing the supply issues for Intel's future Optane products. The new agreement comes with changed pricing and forecast of the sales, so Intel is likely paying more cash to Micron this time.

A report via DigiTimes paints a bleak image on shipments for motherboards and GPUs. According to the publication, citing sources close to motherboard makers, the initial impact of the outbreak severely affected production - and the entire supply chain ecosystem needed to ferry these across the world. Alongside reduced demand in China (reported to be down 50% YoY and unlikely to pick up until July at the earliest) and other countries, the stage is set for a record low in some of our most favored hardware pieces.

Market observers had expected a seasonal increase in demand entering Q3 2020 which may never come to fruition, as DigiTimes also mentions AMD, Intel and NVIDIA as being unlikely to achieve their target sales for this time period. The reduced demand could see prices come down on components and various hardware pieces, should it linger for longer than the fabrication bottlenecks factories are currently facing. Some publications are pointing towards this drop in demand as a reason for NVIDIA to delay their expected GTC announcements, which the company's CEO, Jensen Huang, has already come out saying "Could wait".

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the ratification and public release of the Vulkan Ray Tracing provisional extensions, creating the industry's first open, cross-vendor, cross-platform standard for ray tracing acceleration. Primarily focused on meeting desktop market demand for both real-time and offline rendering, the release of Vulkan Ray Tracing as provisional extensions enables the developer community to provide feedback before the specifications are finalized. Comments and feedback will be collected through the Vulkan GitHub Issues Tracker and Khronos Developer Slack. Developers are also encouraged to share comments with their preferred hardware vendors. The specifications are available today on the Vulkan Registry.

Ray tracing is a rendering technique that realistically simulates how light rays intersect and interact with scene geometry, materials, and light sources to generate photorealistic imagery. It is widely used for film and other production rendering and is beginning to be practical for real-time applications and games. Vulkan Ray Tracing seamlessly integrates a coherent ray tracing framework into the Vulkan API, enabling a flexible merging of rasterization and ray tracing acceleration. Vulkan Ray Tracing is designed to be hardware agnostic and so can be accelerated on both existing GPU compute and dedicated ray tracing cores if available.

Stock markets around the world are experiencing a spectacular crash riding on COVID-19 investor fears, wiping out trillions of Dollars in investor wealth worldwide. Prominent indices around the world report some of the highest intra-day falls since the 2008 financial crisis. Tech stocks are hardly immune, with AMD reporting a 14.64% fall in share price settling down at 39.01 (it was over 48 right after the company's 2020 Financial Analyst Day just last week). NVIDIA is another big loser at the markets, with a 12.24% fall and 216.31 share price. Intel is right behind, with a 11.85% fall down to 45.54, and Micron Technology down 11.23% at 38.81.

A new class of security vulnerabilities affect Intel processors, which can cause them to leak out sensitive information if probed in a certain way, but that's not the worst news for Intel and its users. The software- or firmware-level mitigation for this vulnerability can inflict performance reductions "ranging from 2x to 19x," according to a report by The Register. A full mitigation for the new Load Value Injection (LVI) class of vulnerabilities requires Intel to redesign software compilers. The vulnerability is chronicled under CVE-2020-0551 and Intel-SA-00334. It is not a remote code execution threat, however, it puts multi-tenant machines, such as physical servers handling multiple tenants via virtual servers.

"LVI turns previous data extraction attacks around, like Meltdown, Foreshadow, ZombieLoad, RIDL and Fallout, and defeats all existing mitigations. Instead of directly leaking data from the victim to the attacker, we proceed in the opposite direction: we smuggle — "inject" — the attacker's data through hidden processor buffers into a victim program and hijack transient execution to acquire sensitive information, such as the victim's fingerprints or passwords," the reasearchers write in the abstract of their paper describing the vulnerability. Anti-virus manufacturer BitDefender independently discovered LVI and shared its study with Intel. The company could publish its findings in February. Additional technical details are found in the group's website here.Many Thanks to biffzinker for the tip.

Bethesda today released the final system requirements for its upcoming massacre-fest Doom Eternal. The game, which is geared for release just 10 days from now (March 20th), promises to be one of the most impressive (and fluid) games in recent times, if the original, modern Doom is anything to go by.

Bethesda has even gone so far so as to list preferred specs for gamers that want to play in 4K at 60 FPS or in 1440p at 120 FPS: and these are pretty abusive, with an NVIDIA GeForce RTX 2080 Ti being required - likely because of its gargantuan 11 GB VRAM. AMD's Ryzen 7 3700X or Intel's Core i9-9900K are the requirements here, alongside 16 GB of system RAM. Check after the break for a breakdown on recommended specs for other resolutions and quality settings, and for Bethesda's trailer showing off customization options for your DOOM slayer. Do you have what it takes to run the game?

A Dutch website has listed what seems to be the entirety of Intel's upcoming 10th gen CPU lineup, with prices to boot. Of course, we have to take these listings with various grains of salt: e-tailers are known to sometimes display higher pricing than the manufacturer's MSRP when products still haven't been listed on other websites.

The listing below showcases model number and pricing for each Intel processor. Should this pricing actually come to pass in a generalized way, we're looking at Intel's Core i9-10900KF processor (which is currently listed for €567.73 including 21% VAT) competing with AMD's closest-priced CPU Ryzen 9 3800X, which is already street-priced at €449. The Core i5 10400F, on the other hand, is listed at €196.99, which means it currently competes with AMD's Ryzen 5 3600X at €199.99. It remains to be seen which of these CPUs will win in a direct shootout. Remember that for US pricing you typically just swap out the € currency for $, and you've got your price estimate pretty close to final.

Intel is rumored to be aligning its future-generation Xe GPU development with TSMC's node development cycle, with the company reportedly negotiating with the Taiwanese foundry for 6 nm and 3 nm allocation for its large Xe GPUs. Intel's first Xe discrete GPUs for the market, however, are reportedly built on the company's own 10 nm+ silicon fabrication process.

While Intel's fascination with TSMC 3 nm is understandable, seeking out TSMC's 6 nm node raises eyebrows. Internally referred to as "N6," the 6 nm silicon fabrication node at TSMC is expected to go live either towards the end of 2020 or early 2021, which is when Intel's 10 nm+ node is expected to pick up volume production, beginning with the company's "Tiger Lake" processors. Perhaps a decision has been made internally to ensure that Xe doesn't eat too much into Intel's own foundry capacities meant for processor manufacturing, and to instead outsource Xe manufacturing to third-party foundries like TSMC and Samsung eventually. Way back in April 2019 it was rumored that Intel was evaluating Samsung as a foundry partner for Xe.

Here are two of the first pictures of Intel's upcoming Core i5-10400 processor, based on the company's 10th generation, 14 nm "Comet Lake-S" silicon. With its 10th generation, Intel is looking to bolster its Core i5 desktop processor series by introducing HyperThreading and increased L3 cache to existing price-points. The i5-10400 is hence a 6-core/12-thread processor with 12 MB of shared L3 cache at its disposal, compared to 9th and 8th generation Core i5 desktop chips being 6-core/6-thread with 9 MB of L3 cache.

The Core i5-10400 succeeds the popular Core i5-9400/F and its equally popular predecessor, the i5-8400. The iGPU-devoid i5-9400F in particular owed its popularity to Intel pricing it $15-20 less than the standard i5-9400. The upcoming i5-10400 is expected to be priced under the $200 mark, with the i5-10400F being similarly discounted. Both chips feature identical CPU specs: 2.90 GHz nominal clock speeds, up to 4.30 GHz maximum Turbo Boost, and 4.00 GHz all-core Turbo Boost. As the chip lacks an unlocked multiplier, its TDP is reportedly rated at 65 W. The chip will compete with AMD's Ryzen 5 3600 for sub-$200 supremacy. The 10th generation Core desktop processor family is built in the new LGA1200 package, and launches alongside the new Intel 400-series chipset, in April.

Researchers have found another vulnerability Inside Intel's Converged Security and Management Engine (CSME). For starters, the CSME is a tiny CPU within a CPU that has access to whole data throughput and is dedicated to the security of the whole SoC. The CSME system is a kind of a black box, given that Intel is protecting its documentation so it can stop its copying by other vendors, however, researchers have discovered a flaw in the design of CSME and are now able to exploit millions of systems based on Intel CPUs manufactured in the last five years.

Discovered by Positive Technologies, the flaw is lying inside the Read-Only Memory (ROM) of the CSME. Given that the Mask ROM is hardcoded in the CPU, the exploit can not be fixed by a simple firmware update. The researchers from Positive Technologies describe it as such: "Unfortunately, no security system is perfect. Like all security architectures, Intel's had a weakness: the boot ROM, in this case. An early-stage vulnerability in ROM enables control over the reading of the Chipset Key and generation of all other encryption keys. One of these keys is for the Integrity Control Value Blob (ICVB). With this key, attackers can forge the code of any Intel CSME firmware module in a way that authenticity checks cannot detect. This is functionally equivalent to a breach of the private key for the Intel CSME firmware digital signature, but limited to a specific platform."

Late last week, Intel released a public beta of its own low-'cost' game capture and streaming feature that's part of Intel Graphics Command Center (IGCC) application that's distributed through Microsoft Store. At the time, Intel claimed that those gaming on Intel Graphics can yet record or stream their games with negligible performance impact. We now have a couple of under the hood details on how this feature works. The Game Capture and Streaming feature lets people record their gameplay or stream it to popular social networks such as Twitch, YouTube, etc.

Intel's game capture and streaming feature leverages the VDEnc hardware AVC encoder featured in the company's Gen9 (and later) iGPUs, found on "Skylake" (or later) microarchitectures. At default quality settings, the feature only needs VDEnc, and hence offers practically zero iGPU performance impact when rendering 3D. At higher quality settings by the user, however, the feature switches to a dual-pipe encoder that taps into the compute power of the iGPU's execution units (EUs). These hence come with a performance impact on the iGPU when rendering 3D. We've also learned that IGCC game capture tech does not leverage discrete GPUs of other brands.

Intel has decided to restart operations in its previously winded-down Costa Rica facilities. An Intel Product Change Notification (PCN) for their Cascade Lake Xeon Scalable processors shows that the company has added Costa Rica to its three other "Test and Finish" sites - the other three are located in Penang (Malaysia), Kulim (Malaysia) and Vietnam. Intel's aim is to guarantee a "continuous supply" of the affected processors - namely, Cascade Lake second-generation Xeon Scalable processors in the Silver, Gold and Platinum lines (in both boxed and tray SKUs).

This move, which will be done in phases. The first implementation of the Costa Rica operations will be effective on April 19th, with the remaining operations to come online on August 3rd. Intel expects to reduce dependency on their other three Test and Finish sites, while being able to bolster final production capacity by some 25% with this move.

Alleged pictures of the upcoming Intel Core i9-10900K and i7-10700K processors made it to Chinese social media. The blurry-cam pictures of the chips' topside don't reveal much other than the "Intel Confidential" markings, denoting that these chips are engineering samples. The reverse side confirm that these are chips are built in the new LGA1200 package. You can also spot electrical ancillaries laid out unlike any previous-gen Intel package, and different socket key notches.

In the run up to the rumored April 2020 launch we could learn more about these chips. Based on the 14 nm "Comet Lake" silicon, Intel's 10th generation Core desktop processors in the LGA1200 package increase logical processor counts across the board, and increase clock speeds. The i9-10900K is a 10-core/20-thread processor with 20 MB of shared L3 cache, and up to 5.10 GHz boost frequency, with 4.80 GHz all-core boost. The i7-10700K, on the other hand, is an 8-core/16-thread chip with 16 MB L3 cache, and clock speeds of 5.00 GHz boost and 4.50 GHz all-core Turbo. The Core i5 series also gets a shot in the arm, being configured as 6-core/12-thread, with 12 MB of L3 cache. The per-core performance (IPC) is expected to be the same as 6th generation "Skylake."

Intel updated its Graphics Command Center app to feature game video capture and broadcasting features rivaling AMD ReLive and NVIDIA GeForce Experience Share. The feature lets you record your screen or gameplay and either save the recording to disk or stream to various game streaming sites and social networks. You get control over the resolution, format, bit-rate, etc. The Graphics Command Center is unbundled from Intel's Graphics drivers that have switched to the new DCH driver model. It is currently distributed through Microsoft Store as a beta.

DOWNLOAD: Intel Graphics Command Center (beta)

Jon Peddie Research have released their report on the overall market outlook for GPU shipments for Q4'2019, and the news are great for AMD. Due to the launch of more affordable Navi-based 7 nm graphics cards, the company managed to achieve a growth of 22.6% in shipment volume for the last quarter of 2019, compared to Q3 of the same year. This 22.6% volume increase is pretty significant (and is miles ahead of competitors NVIDIA (whose shipments decreased by -1.9%) and Intel (a 0.2% increase), having increased AMD's overall market share by 3%. This means that AMD now commands 19% of the overall GPU market share, surpassing NVIDIA (which counts with 18%) but both being dwarfed by Intel (with a commanding 63% share). It's important to note here that the numbers include integrated- and discrete-GPUs, and AMD's numbers could be assisted by its mobile processor and APU sales, just as iGPUs make up all of Intel's numbers.

Those numbers are skewed, of course, when we look solely at the discrete GPU market share, with NVIDIA commanding a huge, 73% chunk of the market against AMD's paltry (by comparison) 27%. All in all, Jon Peddie Research reports that the overall PC market increased by 1.99% quarter-to-quarter and increased by 3.54% year-to-year, thus resulting a good performance for these "little" chips.

Ahead of their rumored April 2020 availability product codes of Intel's upcoming 10th generation Core "Comet Lake-S" desktop processors leaked to the web, courtesy momomo_us. The lineup includes 22 individual SKUs, although it's unknown if all of these will be available in April. There are four 10-core/20-thread SKUs: the i9-10900K, the i9-10900KF, the i9-10900, and the i9-10900F. The "K" extension denotes unlocked multiplier, while the "F" extension indicates lack of integrated graphics. "KF" indicates a SKU that's both unlocked and lacking an iGPU. Similarly, there are four 8-core/16-thread Core i7 SKUs, the i7-10700K, the i7-10700KF, the i7-10700, and the i7-10700F.

The 6-core/12-thread Core i5 family has several SKUs besides the range-topping i5-10600K and its siblings, i5-10600KF and i5-10600. These include the i5-10500, i5-10400, and i5-10400F. The quad-core Core i3 lineup includes the i3-10320, i3-10300, and i3-10100. The former two have 8 MB L3 cache, while the i3-10100 has 6 MB. Among the entry-level Pentium SKUs are the G6600, G6500, G6400, G5920, and G5900.

At its 2020 IEEE ISSCC keynote, AMD presented two slides that detail the extent of cost savings yielded by its bold decision to embrace the MCM (multi-chip module) approach to not just its enterprise and HEDT processors, but also its mainstream desktop ones. By confining only those components that tangibly benefit from cutting-edge silicon fabrication processes, namely the CPU cores, while letting other components sit on relatively inexpensive 12 nm, AMD is able to maximize its 7 nm foundry allocation, by making it produce small 8-core CCDs (CPU complex dies), which add up to AMD's target core-counts. With this approach, AMD is able to cram up to 16 cores onto its AM4 desktop socket using two chiplets, and up to 64 cores using eight chiplets on its SP3r3 and sTRX4 sockets.

In the slides below, AMD compares the cost of its current 7 nm + 12 nm MCM approach to a hypothetical monolithic die it would have had to build on 7 nm (including the I/O components). The slides suggest that the cost of a single-chiplet "Matisse" MCM (eg: Ryzen 7 3700X) is about 40% less than that of the double-chiplet "Matisse" (eg: Ryzen 9 3950X). Had AMD opted to build a monolithic 7 nm die that had 8 cores and all the I/O components of the I/O die, such a die would cost roughly 50% more than the current 1x CCD + IOD solution. On the other hand, a monolithic 7 nm die with 16 cores and I/O components would cost 125% more. AMD hence enjoys a massive headroom for cost-cutting. Prices of the flagship 3950X can be close to halved (from its current $749 MSRP), and AMD can turn up the heat on Intel's upcoming Core i9-10900K by significantly lowering price of its 12-core 3900X from its current $499 MSRP. The company will also enjoy more price-cutting headroom for its 6-core Ryzen 5 SKUs than it did with previous-generation Ryzen 5 parts based on monolithic dies.

At the Intel Security Day event during RSA Conference 2020, Intel underscored its commitment to security with several announcements, including details on security capabilities coming in future products. At Intel, security is a fundamental and foundational element of all aspects of architecture, design and implementation. Together with customers and partners, Intel is building a more trusted foundation in this data-centric world.

"Hardware is the bedrock of any security solution. Just as a physical structure requires a foundation established on bedrock to withstand the forces of nature, security solutions rooted in hardware will provide the greatest opportunity to provide security assurance against current and future threats," said Tom Garrison, Intel vice president and general manager of Client Security Strategy and Initiatives. "Intel hardware, and the assurance and security technologies it brings, help harden the layers above from attack."

Intel customers build solutions and services that depend on the breadth and depth of technologies in the silicon, vertical integration and substantive reach from edge to cloud. It is Intel's mission to provide common security capabilities across all architectures, to help address the ever-increasing sophistication of user experiences.

According to the DRAMeXchange research division of TrendForce, 4Q19 NAND flash bit shipment increased by nearly 10% QoQ thanks to demand growth from data center clients. On the supply side, contract prices made a successful rebound due to shortages caused by the power outage at Kioxia's Yokkaichi production base in June. In sum, 4Q19 NAND flash revenue reached $12.5 billion, an 8.5% increase QoQ.

The stronger-than-expected 4Q19 performance from the demand side helped improve supplier inventory back to normal levels. In response, NAND suppliers were able to reduce their allocations to the wafer market and instead focus on shipping products with comparatively higher margins.

Apple is currently designing a custom series of CPUs, for its Macbook laptop lineup, based on the Arm Instruction Set Architecture. Having designed some of the most powerful mobile processors that are inside the iPhone series of devices, Apple is preparing to make a jump to an even more powerful device lineup by bringing custom CPUs for MacBook. Tired of the speed by which Intel replaces and upgrades its Core lineup of CPUs, Apple decided to take the matter in its own hands and rumors about the switch to a custom solution have been going on for a while. However, we now have some information about when to expect the first wave of Arm-powered Macs.

According to the analyst Ming-Chi Kuo, who is a well-known insider in the Apple industry, we can expect the first wave of the Arm-powered Macbook in the next 18 months, precisely in the first half of 2021. Supposedly, the first chips for these new Macs are going to be manufactured on a 5 nm manufacturing process, possibly over at TSMC since Apple had a long-lasting history of manufacturing its chips at TSMC foundries. In the meantime, we can expect to see Apple providing developers with tools to transition their x86-64 software to the new Arm ISA. Without a software ecosystem, the hardware platform is essentially worthless. And Apple knows this. We will see how they plan to play it and will report as soon as there is more information.