The European cooling brand SilentiumPC, presents its newest line-up of enthusiast-level all-in-one CPU liquid cooling solutions with major improvements and addressable RGB illumination! The Navis EVO ARGB series distinguishes itself from the Navis RGB series by providing an all new ceramic bearing, sleeved tubes and superb lighting effects thanks to addressable RGB LEDs. In addition to these premium upgrades, the Navis EVO ARGB comes with an extended 3 years warranty to further underline the quality of the series. Enthusiasts are going to love the Navis EVO ARGB even more, as the models with 240, 280 and 360 radiators offer socket TR4 support for AMD Threadripper Processors out of the box.

With the ambitious goal to make the much acclaimed Navis RGB AIO even better for enthusiasts, SilentiumPC combined all the enhancements in the new Navis EVO ARGB series. Improvements have been made to the water block, which is now based on a 9-pole motor pump with professional-grade ceramic bearing and offers amazing color gradients thanks to addressable RGB LEDs. The long and flexible tubes have been wrapped in high-quality sleeves for better esthetics. Users have now even more options, when choosing the right AIO for their system, since the Navis EVO ARGB series is available with radiator sizes 120, 240, 280 and 360. The combination of the very efficient water block with copper-baseplate and the all-aluminium radiators with densely packed fin-matrix, allows for superb cooling efficiency with high overclocking potential. Yet another advantage of the Navis EVO ARGB 240, 280 and 360 models is the out-of-the-box support for AMD Threadripper Processors.

ASUS today rolled out of the WS C246-ACE, a sober-looking workstation motherboard in the ATX form-factor based on the Intel C246 chipset, which supports not just Intel Xeon E-series processors in the LGA1151 package, but also 8th and 9th generation Core processors. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the processor with a 9-phase VRM that's cooled by heavy ridged heatsinks. The CPU socket is wired to four DDR4 DIMM slots that support up to 128 GB of dual-channel DDR4 memory, and two metal-reinforced PCI-Express 3.0 x16 slots (x16/NC or x8/x8). Two open-ended PCIe 3.0 x1 and a PCI-Express x16 (electrical gen 3.0 x4) make for the rest of the expansion area.

Storage connectivity on the ASUS WS C246-ACE include two M.2-22110 slots with PCI-Express 3.0 x4 and SATA 6 Gbps wiring, a U.2 port, and four SATA 6 Gbps ports. Networking is care of two 1 GbE interfaces, driven by a combination of Intel i211-AT and i219-LM controllers. The onboard audio solution combines a Realtek ALC1220S CODEC with EMI shielding, ground-layer isolation, and a headphones amp circuit. USB connectivity includes four 10 Gbps USB 3.1 gen 2 ports, all on rear panel, one of which is a type-C port; and six 5 Gbps USB 3.1 gen 1 ports, of which two are via headers. Display connectivity include HDMI and DisplayPort. The company didn't reveal pricing.

During Fortune's Brainstorm Tech conference in Aspen, Colorado, Intel's CEO Bob Swan took stage and talked about the company, about where Intel is now and where they are headed in the future and how the company plans to evolve. Particular focus was put on how Intel became "data centric" from "PC centric," and the struggles it encountered.

However, when asked about the demise of Moore's Law, Swan detailed the aggressiveness that they approached the challenge with. Instead of the regular two times improvement in transistor density every two years, Swan said that Intel has always targeted better and greater densities so that it would stay the leader in the business.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the latest B365 series motherboard supporting the newest 9th and 8th Generation Intel Core Processor in a compact Micro ATX form factor, the BIOSTAR B365MHC. It is perfect for running office tasks to browsing the web and watching videos online.

The Micro ATX form factor allows the motherboard to fit in most PC cases making it perfect for office space saving while being packed with features including supporting up to 32 GB of DDR4 memory at 2666 MHz GbE LAN with Super LAN surge protection for enhanced bandwidth capacity, stability and superior performance. HDMI offers up to a 4K resolution with highly detailed content, while the PCIe M.2 expansion slot offers up to 32 Gb/s and supports for Intel Optane Technology which reduces boot times and improves overall performance. The BIOSTAR B365MHC is designed to offer unanimity with Intel's B365 chipset to give the power and performance needed for office and home multimedia uses.

Intel's next-generation Pentium Silver "Snow Ridge" SoC, featuring "Tremont" CPU cores, could see the debut of an L3 cache to the segment. Intel CPU cores in this segment, such as the "Goldmont Plus," only feature shared L2 caches across 4-core modules. The introduction of L3 cache was indicated by a new performance counter "MEM_LOAD_UOPS_RETIRED_L3_HIT," with a description clearly mentioning a "level 3 cache." The introduction of L3 cache as the SoC's LLC (last level cache) could mean Intel is trying to improve inter-component communication by introducting the L3 cache as "town-square" for the various components of the SoC, such as the CPU cores, the iGPU, and the integrated chipset. The company could deploy a ring-bus interconnect that has ring-stops at the various components, and slices of this L3 cache. Intel is building the "Snow Ridge" silicon on its swanky new 10 nm silicon fabrication process, and the chip could see a 2020 debut targeting network infrastructure devices.

Intel's Lisa Pearce today announced on Twitter, that the company has listened to user feedback from Reddit and will add nearest neighbor integer scaling to their future graphics chips. Integer scaling is the holy grail for gamers using console emulators, because it will give them the ability to simply double/triple or quadruple existing pixels, without any loss in sharpness that is inherent to traditional upscaling algorithms like bilinear or bicubic. This approach also avoids ringing artifacts that come with other, more advanced, scaling methods.

In her Twitter video, Lisa explained that this feature will only be available on upcoming Gen 11 graphics and beyond - previous GPUs lack the hardware required for implementing integer scaling. In terms of timeline, she mentioned that this will be part of the driver "around end of August", which also puts some constraints of the launch date of Gen 11, which seems to be rather sooner than later, based on that statement.

Earlier this week, news of Intel's 10th generation Core "Comet Lake" processors did rounds as the company's short-term response to AMD's 3rd generation Ryzen processors. According to slides leaked to the web by Hong Kong-based tech publication XFastest, "Comet Lake" isn't Intel's short-term reaction to "Zen 2," but rather all it has left to launch. These processors won't launch before 2020, the slide suggests, meaning that AMD will enjoy a free rein over the processor market until the turn of the year, including the all-important Holday shopping season.

More importantly, the slide suggests that "Comet Lake" will have a market presence spanning Q1 and Q2 2020, meaning that the 10 nm "Ice Lake" won't arrive on the desktop platform until at least Q3 2020. It's likely that the LGA1200 platform which debuts with "Comet Lake" will extend to "Ice Lake," so consumers aren't forced to buy a new motherboard within a span of six months. The platform diagram put out in another slide junks the idea of an on-package MCM of the processor and PCH dies (which was likely ripped off from the "Ice Lake-Y" MCM platform diagram).

Intel Corporation today announced the appointment of Claire Dixon as corporate vice president and chief communications officer (CCO), effective July 1. Dixon will oversee Intel's global communications organization, including corporate communications and events, product public relations, employee communications and analyst relations. "Claire is a world-class communications leader and team-builder," said Bob Swan, Intel CEO. "She brings with her a wealth of global experience across enterprise technology and consumer industries and will be a tremendous addition to Intel's leadership team."

"I'm delighted to be joining the management team at this critical moment in the company's history," Dixon said. "Intel has an amazing heritage and a tremendous opportunity ahead. Communications has a vital role to play in Intel's continuing transformation, from evolving the culture to building reputation and trust with key stakeholders and creating a compelling narrative. "

Intel China through its Weibo (Twitter-equivalent) handle put out more official-looking renders of its Xe graphics card. The Weibo post doesn't cite an author, leading us to speculate that the company's industrial design team is close to finalizing a product-design for at least the client-segment derivative of Xe. The swanky-looking card apparently has a stamped metal cooler shroud, a cooling solution that's based on a fin-stack heatsink that's ventilated by three fans, and quite some LED embellishment. An interesting design detail is the exponent symbol projected on the center fan. The power inputs are located at the tail end of the card, which is where most professional graphics cards have them; and consist of a pair of 8-pin PCIe inputs. Display inputs include three DisplayPorts, and an HDMI. The first Xe graphics card bound for 2020 will be built on Intel's 10 nm silicon fabrication process, which offers comparable transistor-densities to current 7 nm nodes.

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

El Chapuzas Informático has posted an early review of the AMD Ryzen 5 3600 which was tested on a Gigabyte Aorus Gaming 7 WiFi motherboard, G.Skill FlareX DDR4 @ 3200 MHz and an NVIDIA GeForce RTX 2080 Ti FE graphics card. Looking at the data presented, it becomes clear the performance on offer if real looks to be quite impressive. The site compared AMD's latest offering to the Intel Core i9-9900K and the AMD Ryzen 7 2700X with the Ryzen 5 3600 typically slotting in between the two and in some cases beating both. This is interesting to note as the Ryzen 7 2700X offers similar clock speeds to the Ryzen 5 3600 but the former has a 2C/4T advantage. Even so, the newer AMD CPU tends to outpace the Zen+ based Ryzen 7 2700X in multiple tests. In Cinebench R15, for example, the Ryzen 5 3600 had the lead in single-core performance while multi-core was held by the Ryzen 7 2700X. Cinebench R20 roughly mimics these results as well.

While memory latency was quite high 80.5 ns, it didn't seem to impact performance to any serious degree. In fact, in wPrime 2.10 32M running on a single core showed the Ryzen 5 3600 coming in just behind the Intel Core i9-9900K while being faster than the previous generation Intel Core i7-8700K, i7-8600K, and AMD Ryzen 7 2700X and 1700X. That said, the previous generation Ryzen processors were far slower here were as the Intel chips were still competitive. In the multi-core test, the Ryzen 7 2700X took a slight lead while the Ryzen 7 1700X was a bit slower than the Ryzen 5 3600. One interesting quirk of note was the lack of write speed on the memory with the Ryzen 5 3600 only hitting 25.6 GB/s which is quite a drop from the 47 GB/s seen on the Ryzen 7 1700X and Ryzen 7 2700X. However this could be due to the X470 motherboard being used or maybe an issue with sub timings on the memory, something that will need to be verified in future reviews.

Intel is embattled in the client-segment desktop processor business, with AMD's imminent launch of its 3rd generation Ryzen desktop processors. Intel's 9th generation Core processors may lose their competitiveness to AMD's offerings, and are expected to get relieved by the company's "Ice Lake" desktop processors only in 2020. Until then, Intel will market its processors through price-cuts, promotions, bundles, and focusing on their gaming prowess. The company will refresh its HEDT (high-end desktop) processor lineup some time in Q3-2019. According to Taiwan-based industry observer DigiTimes citing sources in the motherboard industry, Intel's immediate response to 3rd generation Ryzen will be a series of price-cuts to products in its client-segment DIY retail channel.

According to these sources, prices of 9th generation Core processors could be cut by a minimum of 10 percent, and a maximum of 15 percent, varying by SKUs. This could see prices of popular gaming/enthusiast SKUs such as the Core i9-9900K, the i7-9700K, and the i5-9600K, drop by anywhere between $25 to $75. AMD is launching the Ryzen 9 3900X to compete with the i9-9900K, the Ryzen 7 3800X to compete with the i7-9700K, and the Ryzen 5 3600X to take on the i5-9600K. The three SKUs, according to AMD's internal testing, match the Intel chips at gaming, and beat them at content-creation tasks. At the heart of 3rd generation Ryzen processors is AMD's new Zen 2 microarchitecture, which brings significant IPC gains. AMD is also increasing core-counts on its mainstream desktop platform with the introduction of the Ryzen 9 family of 12-core and 16-core processors in the AM4 package.

Intel has launched a software overclocking utility tool for their latest 9th Gen, unlocked CPUs that promises to take the guesswork and BIOS delving out of the overclocking equation. The Intel Performance Maximizer tries to do exactly what the name implies by automagically overclocking your unlocked (read, K-suffix CPU for unlocked multipliers) with no further user intervention needed. Intel describe this tool as the one that "(...) makes it easier than ever to dynamically custom-tune an unlocked Intel processor based upon its individual performance potential."

Intel says they will offer you a one-time, free CPU replacement in addition to your usual 3-year warranty on a company CPU, should anything wrong arise during this method of overclocking. Intel say's this is a way to maximize your CPU performance on a per-sample basis, so results may vary according to your CPU's thermal properties (as we know, some CPUs perform and overclock better than others due to slight variations in the manufacturing process). But if you don't want to get inside your BIOS for a dirty, hands-on approach, you can always use Intel's software, which has been released at a very conspicuous time indeed, considering AMD's Ryzen 3000 series release.

Intel has seemingly partnered with Samsung, one of the largest manufacturers of Integrated Circuits, in order to help reduce the CPU shortage currently affecting the PC market. It is the first time ever that Intel turned to Samsung for it's CPU manufacturing given that, historically, Intel's Client Computing Group (CCG) has always relied on Intel's internal fab to manufacture all of its components. But as resources in those fabs became constrained, Intel CCG started looking at other resources, such as TSMC, to manufacture the chipsets used in Intel-based motherboards.

In a report prepared by Sedialy, a South Korean news media, Intel turned to Samsung specifically to meet demand on its 14 nm products. This unexpected move came after negotiations which, if you believe the rumors before the news, were in progress for quite some time already. Samsung has formally agreed to manufacture Intel's CPUs of the microarchitecture code-named 'Rocket Lake', which will serve as processors for mini PCs, planned to be released in 2021.

Intel late-May made its first major disclosure of the per-core CPU performance gains achieved with its "Ice Lake" processor that packs "Sunny Cove" CPU cores. Averaged across a spectrum of benchmarks, Intel claims a best-case scenario IPC (instructions per clock) uplift of a massive 40 percent over "Skylake," and a mean uplift of 18 percent. The worst-case scenario sees its performance negligibly below that of "Skylake." Intel's IPC figures are derived entirely across synthetic benchmarks, which include SPEC 2016, SPEC 2017, SYSMark 2014 SE, WebXprt, and CineBench R15. The comparison to "Skylake" is relevant because Intel has been using essentially the same CPU core in the succeeding three generations that include "Kaby Lake" and "Coffee Lake."

A Chinese tech-forum member with access to an "Ice Lake" 6-core/12-thread sample put the chip through the CPU-Z internal benchmark (test module version 17.01). At a clock-speed of 3.60 GHz, the "Ice Lake" chip allegedly achieved a single-core score of 635 points. To put this number into perspective, a Ryzen 7 3800X "Matisse" supposedly needs to run at 4.70 GHz to match this score, and a Core i7-7700K "Kaby Lake" needs to run at 5.20 GHz. Desktop "Ice Lake" processors are unlikely to launch in 2019. The first "Ice Lake" processors are 4-core/8-thread chips designed for ultraportable notebook platforms, which come out in Q4-2019, and desktop "Ice Lake" parts are expected only in 2020.

In recent conversations with Intel customers, two words kept coming up: disruption and opportunity. Disruption because almost every single executive I talk with has seen business disrupted in one way or another or is worried about keeping up with new technology trends and keeping a competitive edge. And opportunity because when these customers discuss their needs -- be it how to better leverage data, how to modernize their infrastructure for 5G or how to accelerate artificial intelligence (AI) and analytics workloads -- they realize the massive prospects in front of them.

To help our customers capitalize on the opportunities ahead, Intel has created a new organization that combines our network infrastructure organization with our programmable solutions organization under my leadership. This new organization is called the Network and Custom Logic Group.
Both original organizations executed on record design wins and revenues in 2018. Their merger allows Intel to bring maximum value to our customers by delivering unprecedented and seamless access to Intel's broad portfolio of products, from Intel Xeon processors SoC, FPGA, eASIC, full-custom ASIC, software, IP, and systems and solutions across the cloud, enterprise, network, embedded and IoT markets. To that end, FPGA and custom silicon will continue to be important horizontal technologies. And this is just the beginning of a continuum of Custom Logic Portfolio of FPGA, eASIC, and ASIC to support our customers' unique needs throughout their life cycles. No other company in the world can offer that.

When we said AMD was readying a presentation on their Ryzen 9 3950X CPUs to awe crowds at E3, we weren't thinking of something of this magnitude. But apparently, it's true: a Geekbench test result has shown AMD's $750, 16 core, 32 thread Ryzen 9 9 3950X beating Intel's 18 core, 36 thread $2,000 i9-9980XE monster. Now, you may be thinking: ok, it beat it because of AMD's announced 4.7 GHz boost, and did so only on single threaded performance, obviously... but you would be wrong.

The Geekbench scores show AMD's Ryzen 9 3950X delivering 5,868 points in single, and 61,072 points in multicore workloads. Intel's i9-9980XE, on the other hand, scores just 5,391 single core, and 46,876 multicore points (on average and at stock clocks of 3,000 MHz base and 3,400 MHz boost). This is an incredible performance difference (particularly in the multicore score), and was apparently done with an engineering sample for AMD's upcoming chip that didn't even run at its announced 4.3 GHz base and 4.7 GHz boost clocks, but at 3.3 GHz and 4.3 GHz respectively. AMD's 105 W TDP, 16 core chip beats Intel's 185 W TDP, 18 core one... Where has the world come? Take the usual dosage of NaCl, and let's keep things in perspective - even if AMD's Ryzen 9 3950X equals, and doesn't beat, Intel's i9-9980XE, it's still a huge win for the red company. Almost as big a win as that huge stone on Lisa's hand.

Intel has announced that Sandra Rivera will take on a new role as the company's chief people officer and executive vice president, reporting to CEO Bob Swan. She will lead the human resources organization and serve as steward of Intel's culture evolution as it transforms to a data-centric company. Previously, Rivera was responsible for the Network Platforms Group, and served as Intel's 5G executive sponsor.

"Sandra is a role model for an Intel that is customer obsessed, collaborative and fearless while firmly grounded in trust, transparency and inclusivity. I am thrilled that Sandra will lead this critical part of our strategy to power a data-centric world," Swan said. "In a company driven by deep, technical talent, Sandra is an excellent technical leader who builds successful businesses by first building great teams. I am confident Sandra, as chief people officer, will help us accelerate our transformation and position our Intel team to play a bigger role in our customers' success."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce that 23 overclocking records in various benchmark categories were broken during the Computex 2019 time frame, including the world record for the fastest memory frequency, all using G.SKILL DDR4 memory kits built with high performance Samsung 8Gb components, the latest Intel processors, and high performance motherboards.

This week at the G.SKILL Computex booth, a new world record for fastest memory frequency was set by Toppc, a renowned professional extreme overclocker, reaching an incredible DDR4-5886MHz using the Trident Z Royal memory on a MSI MPG Z390I GAMING EDGE AC motherboard and an Intel Core i9-9900K processor. At the end of Computex 2019, the top two results for the fastest memory frequency are set by team MSI using an identical hardware setup.

Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

ASUS today rolled out the latest in its series of M.2 NVMe RAID add-on cards, the Hyper M.2 x16 Card V2. A successor to a similar card ASUS released back in 2017, this one comes with improved electrical components, so each of its four slots is guaranteed to put out 14 Watts of power. The card splits a PCI-Express 3.0 x16 link to four M.2-22110 slots, each with PCI-Express 3.0 x4 wiring. There's no PCIe switch logic involved, so your motherboard is required to support PCIe lane segmentation (most HEDT motherboards since 2016 do). The card supports Intel VROC (virtual RAID on CPU), and is tested to work on AMD Ryzen Threadripper processors. ASUS didn't change the thermal solution. You still get a chunky aluminium shroud covering the whole card, and lateral-flow fan pushing air across the drives, which can be turned off. The company didn't reveal pricing.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

Intel laid rest to speculation that post 9th generation, it could replace its Core brand with something else. The 10th generation Core processors, built around the 10 nm "Ice Lake" microachitecture, will feature the first noteworthy IPC increments since "Skylake" thanks to their new "Sunny Cove" CPU cores. These will also feature DLBoost, a fixed-function matrix-multiplication hardware that speeds up deep-neural net building and training by 5x, as well as certain AVX-512 instructions. The cores will be optimized to cope with 2.4 Gbps 802.11ax Wi-Fi and faster Ethernet standards. The first of these chips will target mobile computing platforms, and will be quad-core parts like the dies pictured below. To save notebook PCB real-estate, Intel will put the processor and PCH dies into a multi-chip module. It will be quite a wait for the desktop implementation, but at least you know what their case-badges look like.

While its honestly staggering see how many products ASUS had on display at Computex this year, I think the number of laptops might take the cake. They had just about everyone imaginable on hand except a kitchen sink. The ROG lineup was represented by the Zephyrus M GU502, Zephyrus S GX502, Zephyrus G GA502, Strix Hero III, Strix SCAR III, and last but not least the Mothership. Meanwhile, the TUF Gaming brand demoed the FX705DU and FX505DU. More surprising is the fact AMD's Ryzen 3750H makes an appearance not only in the TUF Gaming laptops but in the Zephyrus series as well bringing a bit more selection to the once Intel dominated mobile market.

Taking a closer look at the Republic of Gamers lineup and our attention is immediately drawn to the ROG Mothership which due to its design is the most unique laptop on display here. Featuring a detachable keyboard with RGB lighting, eight heat pipes, liquid metal cooling, 4K G-SYNC display, Intel i9-8950H CPU overclocked, NVIDIA GeForce RTX 2080, and NVMe SSDs, it stands out from the crowd. Gone is the traditional clamshell if you so choose without sacrificing performance. It definitely proves to be an eye-catching product.