Intel China through its Weibo (Twitter-equivalent) handle put out more official-looking renders of its Xe graphics card. The Weibo post doesn't cite an author, leading us to speculate that the company's industrial design team is close to finalizing a product-design for at least the client-segment derivative of Xe. The swanky-looking card apparently has a stamped metal cooler shroud, a cooling solution that's based on a fin-stack heatsink that's ventilated by three fans, and quite some LED embellishment. An interesting design detail is the exponent symbol projected on the center fan. The power inputs are located at the tail end of the card, which is where most professional graphics cards have them; and consist of a pair of 8-pin PCIe inputs. Display inputs include three DisplayPorts, and an HDMI. The first Xe graphics card bound for 2020 will be built on Intel's 10 nm silicon fabrication process, which offers comparable transistor-densities to current 7 nm nodes.

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

El Chapuzas Informático has posted an early review of the AMD Ryzen 5 3600 which was tested on a Gigabyte Aorus Gaming 7 WiFi motherboard, G.Skill FlareX DDR4 @ 3200 MHz and an NVIDIA GeForce RTX 2080 Ti FE graphics card. Looking at the data presented, it becomes clear the performance on offer if real looks to be quite impressive. The site compared AMD's latest offering to the Intel Core i9-9900K and the AMD Ryzen 7 2700X with the Ryzen 5 3600 typically slotting in between the two and in some cases beating both. This is interesting to note as the Ryzen 7 2700X offers similar clock speeds to the Ryzen 5 3600 but the former has a 2C/4T advantage. Even so, the newer AMD CPU tends to outpace the Zen+ based Ryzen 7 2700X in multiple tests. In Cinebench R15, for example, the Ryzen 5 3600 had the lead in single-core performance while multi-core was held by the Ryzen 7 2700X. Cinebench R20 roughly mimics these results as well.

While memory latency was quite high 80.5 ns, it didn't seem to impact performance to any serious degree. In fact, in wPrime 2.10 32M running on a single core showed the Ryzen 5 3600 coming in just behind the Intel Core i9-9900K while being faster than the previous generation Intel Core i7-8700K, i7-8600K, and AMD Ryzen 7 2700X and 1700X. That said, the previous generation Ryzen processors were far slower here were as the Intel chips were still competitive. In the multi-core test, the Ryzen 7 2700X took a slight lead while the Ryzen 7 1700X was a bit slower than the Ryzen 5 3600. One interesting quirk of note was the lack of write speed on the memory with the Ryzen 5 3600 only hitting 25.6 GB/s which is quite a drop from the 47 GB/s seen on the Ryzen 7 1700X and Ryzen 7 2700X. However this could be due to the X470 motherboard being used or maybe an issue with sub timings on the memory, something that will need to be verified in future reviews.

Intel is embattled in the client-segment desktop processor business, with AMD's imminent launch of its 3rd generation Ryzen desktop processors. Intel's 9th generation Core processors may lose their competitiveness to AMD's offerings, and are expected to get relieved by the company's "Ice Lake" desktop processors only in 2020. Until then, Intel will market its processors through price-cuts, promotions, bundles, and focusing on their gaming prowess. The company will refresh its HEDT (high-end desktop) processor lineup some time in Q3-2019. According to Taiwan-based industry observer DigiTimes citing sources in the motherboard industry, Intel's immediate response to 3rd generation Ryzen will be a series of price-cuts to products in its client-segment DIY retail channel.

According to these sources, prices of 9th generation Core processors could be cut by a minimum of 10 percent, and a maximum of 15 percent, varying by SKUs. This could see prices of popular gaming/enthusiast SKUs such as the Core i9-9900K, the i7-9700K, and the i5-9600K, drop by anywhere between $25 to $75. AMD is launching the Ryzen 9 3900X to compete with the i9-9900K, the Ryzen 7 3800X to compete with the i7-9700K, and the Ryzen 5 3600X to take on the i5-9600K. The three SKUs, according to AMD's internal testing, match the Intel chips at gaming, and beat them at content-creation tasks. At the heart of 3rd generation Ryzen processors is AMD's new Zen 2 microarchitecture, which brings significant IPC gains. AMD is also increasing core-counts on its mainstream desktop platform with the introduction of the Ryzen 9 family of 12-core and 16-core processors in the AM4 package.

Intel has launched a software overclocking utility tool for their latest 9th Gen, unlocked CPUs that promises to take the guesswork and BIOS delving out of the overclocking equation. The Intel Performance Maximizer tries to do exactly what the name implies by automagically overclocking your unlocked (read, K-suffix CPU for unlocked multipliers) with no further user intervention needed. Intel describe this tool as the one that "(...) makes it easier than ever to dynamically custom-tune an unlocked Intel processor based upon its individual performance potential."

Intel says they will offer you a one-time, free CPU replacement in addition to your usual 3-year warranty on a company CPU, should anything wrong arise during this method of overclocking. Intel say's this is a way to maximize your CPU performance on a per-sample basis, so results may vary according to your CPU's thermal properties (as we know, some CPUs perform and overclock better than others due to slight variations in the manufacturing process). But if you don't want to get inside your BIOS for a dirty, hands-on approach, you can always use Intel's software, which has been released at a very conspicuous time indeed, considering AMD's Ryzen 3000 series release.

Intel has seemingly partnered with Samsung, one of the largest manufacturers of Integrated Circuits, in order to help reduce the CPU shortage currently affecting the PC market. It is the first time ever that Intel turned to Samsung for it's CPU manufacturing given that, historically, Intel's Client Computing Group (CCG) has always relied on Intel's internal fab to manufacture all of its components. But as resources in those fabs became constrained, Intel CCG started looking at other resources, such as TSMC, to manufacture the chipsets used in Intel-based motherboards.

In a report prepared by Sedialy, a South Korean news media, Intel turned to Samsung specifically to meet demand on its 14 nm products. This unexpected move came after negotiations which, if you believe the rumors before the news, were in progress for quite some time already. Samsung has formally agreed to manufacture Intel's CPUs of the microarchitecture code-named 'Rocket Lake', which will serve as processors for mini PCs, planned to be released in 2021.

Intel late-May made its first major disclosure of the per-core CPU performance gains achieved with its "Ice Lake" processor that packs "Sunny Cove" CPU cores. Averaged across a spectrum of benchmarks, Intel claims a best-case scenario IPC (instructions per clock) uplift of a massive 40 percent over "Skylake," and a mean uplift of 18 percent. The worst-case scenario sees its performance negligibly below that of "Skylake." Intel's IPC figures are derived entirely across synthetic benchmarks, which include SPEC 2016, SPEC 2017, SYSMark 2014 SE, WebXprt, and CineBench R15. The comparison to "Skylake" is relevant because Intel has been using essentially the same CPU core in the succeeding three generations that include "Kaby Lake" and "Coffee Lake."

A Chinese tech-forum member with access to an "Ice Lake" 6-core/12-thread sample put the chip through the CPU-Z internal benchmark (test module version 17.01). At a clock-speed of 3.60 GHz, the "Ice Lake" chip allegedly achieved a single-core score of 635 points. To put this number into perspective, a Ryzen 7 3800X "Matisse" supposedly needs to run at 4.70 GHz to match this score, and a Core i7-7700K "Kaby Lake" needs to run at 5.20 GHz. Desktop "Ice Lake" processors are unlikely to launch in 2019. The first "Ice Lake" processors are 4-core/8-thread chips designed for ultraportable notebook platforms, which come out in Q4-2019, and desktop "Ice Lake" parts are expected only in 2020.

In recent conversations with Intel customers, two words kept coming up: disruption and opportunity. Disruption because almost every single executive I talk with has seen business disrupted in one way or another or is worried about keeping up with new technology trends and keeping a competitive edge. And opportunity because when these customers discuss their needs -- be it how to better leverage data, how to modernize their infrastructure for 5G or how to accelerate artificial intelligence (AI) and analytics workloads -- they realize the massive prospects in front of them.

To help our customers capitalize on the opportunities ahead, Intel has created a new organization that combines our network infrastructure organization with our programmable solutions organization under my leadership. This new organization is called the Network and Custom Logic Group.
Both original organizations executed on record design wins and revenues in 2018. Their merger allows Intel to bring maximum value to our customers by delivering unprecedented and seamless access to Intel's broad portfolio of products, from Intel Xeon processors SoC, FPGA, eASIC, full-custom ASIC, software, IP, and systems and solutions across the cloud, enterprise, network, embedded and IoT markets. To that end, FPGA and custom silicon will continue to be important horizontal technologies. And this is just the beginning of a continuum of Custom Logic Portfolio of FPGA, eASIC, and ASIC to support our customers' unique needs throughout their life cycles. No other company in the world can offer that.

When we said AMD was readying a presentation on their Ryzen 9 3950X CPUs to awe crowds at E3, we weren't thinking of something of this magnitude. But apparently, it's true: a Geekbench test result has shown AMD's $750, 16 core, 32 thread Ryzen 9 9 3950X beating Intel's 18 core, 36 thread $2,000 i9-9980XE monster. Now, you may be thinking: ok, it beat it because of AMD's announced 4.7 GHz boost, and did so only on single threaded performance, obviously... but you would be wrong.

The Geekbench scores show AMD's Ryzen 9 3950X delivering 5,868 points in single, and 61,072 points in multicore workloads. Intel's i9-9980XE, on the other hand, scores just 5,391 single core, and 46,876 multicore points (on average and at stock clocks of 3,000 MHz base and 3,400 MHz boost). This is an incredible performance difference (particularly in the multicore score), and was apparently done with an engineering sample for AMD's upcoming chip that didn't even run at its announced 4.3 GHz base and 4.7 GHz boost clocks, but at 3.3 GHz and 4.3 GHz respectively. AMD's 105 W TDP, 16 core chip beats Intel's 185 W TDP, 18 core one... Where has the world come? Take the usual dosage of NaCl, and let's keep things in perspective - even if AMD's Ryzen 9 3950X equals, and doesn't beat, Intel's i9-9980XE, it's still a huge win for the red company. Almost as big a win as that huge stone on Lisa's hand.

Intel has announced that Sandra Rivera will take on a new role as the company's chief people officer and executive vice president, reporting to CEO Bob Swan. She will lead the human resources organization and serve as steward of Intel's culture evolution as it transforms to a data-centric company. Previously, Rivera was responsible for the Network Platforms Group, and served as Intel's 5G executive sponsor.

"Sandra is a role model for an Intel that is customer obsessed, collaborative and fearless while firmly grounded in trust, transparency and inclusivity. I am thrilled that Sandra will lead this critical part of our strategy to power a data-centric world," Swan said. "In a company driven by deep, technical talent, Sandra is an excellent technical leader who builds successful businesses by first building great teams. I am confident Sandra, as chief people officer, will help us accelerate our transformation and position our Intel team to play a bigger role in our customers' success."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce that 23 overclocking records in various benchmark categories were broken during the Computex 2019 time frame, including the world record for the fastest memory frequency, all using G.SKILL DDR4 memory kits built with high performance Samsung 8Gb components, the latest Intel processors, and high performance motherboards.

This week at the G.SKILL Computex booth, a new world record for fastest memory frequency was set by Toppc, a renowned professional extreme overclocker, reaching an incredible DDR4-5886MHz using the Trident Z Royal memory on a MSI MPG Z390I GAMING EDGE AC motherboard and an Intel Core i9-9900K processor. At the end of Computex 2019, the top two results for the fastest memory frequency are set by team MSI using an identical hardware setup.

Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

ASUS today rolled out the latest in its series of M.2 NVMe RAID add-on cards, the Hyper M.2 x16 Card V2. A successor to a similar card ASUS released back in 2017, this one comes with improved electrical components, so each of its four slots is guaranteed to put out 14 Watts of power. The card splits a PCI-Express 3.0 x16 link to four M.2-22110 slots, each with PCI-Express 3.0 x4 wiring. There's no PCIe switch logic involved, so your motherboard is required to support PCIe lane segmentation (most HEDT motherboards since 2016 do). The card supports Intel VROC (virtual RAID on CPU), and is tested to work on AMD Ryzen Threadripper processors. ASUS didn't change the thermal solution. You still get a chunky aluminium shroud covering the whole card, and lateral-flow fan pushing air across the drives, which can be turned off. The company didn't reveal pricing.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

Intel laid rest to speculation that post 9th generation, it could replace its Core brand with something else. The 10th generation Core processors, built around the 10 nm "Ice Lake" microachitecture, will feature the first noteworthy IPC increments since "Skylake" thanks to their new "Sunny Cove" CPU cores. These will also feature DLBoost, a fixed-function matrix-multiplication hardware that speeds up deep-neural net building and training by 5x, as well as certain AVX-512 instructions. The cores will be optimized to cope with 2.4 Gbps 802.11ax Wi-Fi and faster Ethernet standards. The first of these chips will target mobile computing platforms, and will be quad-core parts like the dies pictured below. To save notebook PCB real-estate, Intel will put the processor and PCH dies into a multi-chip module. It will be quite a wait for the desktop implementation, but at least you know what their case-badges look like.

While its honestly staggering see how many products ASUS had on display at Computex this year, I think the number of laptops might take the cake. They had just about everyone imaginable on hand except a kitchen sink. The ROG lineup was represented by the Zephyrus M GU502, Zephyrus S GX502, Zephyrus G GA502, Strix Hero III, Strix SCAR III, and last but not least the Mothership. Meanwhile, the TUF Gaming brand demoed the FX705DU and FX505DU. More surprising is the fact AMD's Ryzen 3750H makes an appearance not only in the TUF Gaming laptops but in the Zephyrus series as well bringing a bit more selection to the once Intel dominated mobile market.

Taking a closer look at the Republic of Gamers lineup and our attention is immediately drawn to the ROG Mothership which due to its design is the most unique laptop on display here. Featuring a detachable keyboard with RGB lighting, eight heat pipes, liquid metal cooling, 4K G-SYNC display, Intel i9-8950H CPU overclocked, NVIDIA GeForce RTX 2080, and NVMe SSDs, it stands out from the crowd. Gone is the traditional clamshell if you so choose without sacrificing performance. It definitely proves to be an eye-catching product.

ASUS is aware that a new sub-class of speculative execution side-channel vulnerabilities in Intel CPUs, called Microarchitectural Data Sampling (MDS), also known as ZombieLoad, RIDL, and Fallout, may allow information disclosure. Intel states that selected 8th and 9th Generation Intel Core processors, as well as the 2nd Generation Intel Xeon Scalable processor family, are not vulnerable to MDS. If you are using one of these processors, no further action is necessary.

For other Intel processors, ASUS is working closely with Intel to provide a solution in a forthcoming BIOS update. We recommend owners of affected products update both the BIOS and operating system as soon as these mitigations are available. Please find our first-wave model list below and download the appropriate BIOS update from the ASUS Support website. More details, including affected systems, will be added to this document as they become available.

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

Remember that ludicrous Gigabyte bundle that mixed the company's most outrageously expensive motherboard with a cherry-picked Intel Core i9-9900K overclocked to 5.1 GHz? Well, it's finally available, if that's your particular kind of beach, and the pricing is better than was expected. Solo, the motherboard sets you back $999, while a cherry-picked Intel Core i9-9900K at 5.1 GHz would set you back some $939 in houses such as Silicon Lottery. However, Gigabyte have confirmed that the bundle pricing for these components for the US stands at $1,699 - which really isn't too shabby, if you consider the motherboard to have sufficient bang for your buck.

As if the mother of all ironies, prior to its effective death-sentence dealt by the U.S. Department of Commerce, Huawei's server business developed an ambitious product roadmap for its Fusion Server family, aligning with Intel's enterprise processor roadmap. It describes in great detail the key features of these processors, such as core-counts, platform, and I/O. The "Sapphire Rapids" processor will introduce the biggest I/O advancements in close to a decade, when it releases sometime in 2021.

With an unannounced CPU core-count, the "Sapphire Rapids-SP" processor will introduce DDR5 memory support to the data-center, which aims to double bandwidth and memory capacity over the DDR4 generation. The processor features an 8-channel (512-bit wide) DDR5 memory interface. The second major I/O introduction is PCI-Express gen 5.0, which not only doubles bandwidth over gen 4.0 to 32 Gbps per lane, but also comes with a constellation of data-center-relevant features that Intel is pushing out in advance as part of the CXL Interconnect. CXL and PCIe gen 5 are practically identical.

The trade ban imposed on Chinese tech giant Huawei by the U.S. Department of Commerce, and ratified through an Executive Order by President Donald Trump, is cutting both ways. Not only are U.S. entities banned from importing products and services from Huawei, but also engaging in trade with them (i.e. selling to them). U.S. tech firms stare at a $11 billion revenue loss by early estimates. Wall Street firm Goldman Sachs compiled a list of companies impacted by the ban, and the extent of their revenue loss. It turns out that AMD isn't a small player, and in fact, stands to lose more revenue in absolute terms than even Microsoft. It earns RMB 268 million (USD $38.79 million) from Huawei, compared to Microsoft's RMB 198 million ($28.66 million). Intel's revenue loss is a little over double that of AMD at RMB 589 million ($84 million), despite its market-share dominance.

That's not all, AMD's exposure is higher than that of Intel, since sales to Huawei make up a greater percentage of AMD's revenues than it does Intel's. AMD exports not just client-segment products such as Ryzen processors and Radeon graphics, but possibly also EPYC enterprise processors for Huawei's server and SMB product businesses. NVIDIA is affected to a far lesser extent than Intel, AMD, and Microsoft. Qualcomm-Broadcom take the biggest hit in absolute revenue terms at RMB 3.5 billion ($508 million), even if their exposure isn't the highest. The duo export SoCs and cellular modems to Huawei, both as bare-metal and licenses. Storage hardware makers aren't far behind, with the likes of Micron, Seagate, and Western Digital taking big hits. Micron exports DRAM and SSDs, while Seagate and WDC export hard drives.

Intel was the historic leader in silicon manufacturing and sales from 1993 through 2016, the year it lost its lead to Samsung. The issue wasn't so much to do with Intel, but more to do with market demands at the time - if you'll remember, it was the time of booming DRAM pricing alongside the smartphone demand increase that propagated stiff competition and manufacturers trying to outgun one another in the form of specs. The DRAM demand - and its ridiculous prices, at the time - propelled Samsung towards the top spot in terms of revenue, leaving Intel in the dust.

However, with the decrease in DRAM pricing following the reduce in smartphone demand and increased manufacturing capabilities of semiconductor manufacturers, which flooded the market with product that is being more slowly digested, has led to the drop of the previously-inflated Dram pricing, thus hitting Samsung's revenues enough for Intel to again become "top dog" in the silicon manufacturing world - even as the company struggles with its 10 nm rollout and faced supply issues of their own. As IC Insights puts it, "Intel replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17. (...) With the collapse of the DRAM and NAND flash markets over the past year, a complete switch has occurred, with Samsung having 23% more total semiconductor sales than Intel in 1Q18 but Intel having 23% more semiconductor sales than Samsung just one year later in 1Q19!".

The United States tech industry has overnight dealt a potentially fatal blow to Chinese electronics giant Huawei, by boycotting the company. The companies are establishing compliance with a recent Executive Order passed by President Donald Trump designed to "stop the import, sale, and use of equipment and services by foreign companies based in countries that are potential adversaries to U.S. interests," particularly information technology security. Google has announced that it will no longer allow Huawei to license Android, and will stop updates and Google Play access to Huawei smartphones. Huawei can still equip its phones with open-source Android, but it cannot use Google's proprietary software, including Google Play Store, Chrome, and all the other Google apps. Intel decided to no longer supply processors and other hardware to Huawei, for use in its laptops and server products. Sales of AMD processors will stop, too. Qualcomm-Broadcom have decided to stop supply of mobile SoCs and network PHYs, respectively. Microsoft decided to stop licensing Huawei to use Windows and Office products.

The ban is a consequence of the U.S. Government placing Huawei on a list of banned entities, forcing all U.S. companies to abandon all trade with it, without prior approval from the Department of Commerce. Trade cuts both ways, and not only are U.S. firms banned from buying from Huawei, they're also banned from selling to it. Huawei "buys from" over 30 U.S. companies, (for example, Windows licenses from Microsoft). CNN reports that U.S. firms could lose up to $11 billion in revenues.

ZOTAC Technology, a global manufacturer of innovation, today introduced the more capable ZBOX Q Series Mini Creator PC featuring the advanced NVIDIA Quadro GPU and powerful workstation focused Intel Xeon processor. The new addition to the ZBOX Q Series leverages the ZBOX Mini PC's sleek and minimal design without compromising the powerful hardware components inside. From stunning industrial design and advanced special effects, to complex scientific visualization and sophisticated data modeling, to creating and editing images and videos, the ZBOX Q Series enables limitless creations.

The new ZBOX Q Series features the industry certified NVIDIA Quadro with up to 16GB GDDR5 memory. It's a tested and certified fully compatible hardware on many major professional design applications. The new Q Series models come equipped with an Intel Xeon processor to deliver fast and responsive performance.