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Intel Shares New Roadmap for Optane, NAND, Including 144 Layer QLC and TLC

Intel today at a press event in South Korea announced their plans for future product launches in the memory spaces. Optane is the name of the carriage Intel is pulling here - there's no novelty about that - and the company will be pushing a second generation release of Optane enterprise SSDs and Optane DC Persistent Memory modules. Most interesting for us down-to-earth PC enthusiasts, though - the market launch of 144 Layer QLC NAND in 2020, which should bring even lower pricing to NAND-based devices. Later, the company also plans to launch 144 layer TLC NAND solutions.

The new Optane modules apparently make use of first-generation 3D XPoint memory still - the love child of the now defunct Intel-Micron partnership. Intel's new Optane DC Persistent Memory products will materialize in codename Barlow Pass modules, with a release window around the likes of Cooper Lake (14nm) and Ice Lake (10nm) server processors scheduled for 2020. It seems that Intel's only consumer solution based in Optane - the Optane Memory H10 two-in-one SSD - is a lonely child effort which won't be joined by the previously-planned Optane Memory M15 (a dedicated cache drive for systems with mechanical-based storage, which are already on their way out) and Optane SSD 815P (which would only offer 118 GB of storage, clearly too little for current data storing trends in the overall market.

Shuttle Introduces Whiskey Lake-based P51U XPC All-in-one

Shuttle is expanding its successful XPC all-in-one range, which now comprises four different platforms, to include a model based on Intel's Whiskey Lake processor generation. In addition to the 15.6" capacitive touchscreen, the P51U also features an IP54-certified front panel. The display has Full HD resolution, while an energy-saving Intel Celeron 4205U dual-core processor delivers the required computing power.

Alongside the X50, the P51U is the second Shuttle model in a 15.6" format. It is the first of its size with a capacitive IPS display that has a resolution of 1920×1080 pixels and allows easy, intuitive operation using more than one finger. Its compact dimensions of 39.3×27.3×4.0 cm (W×H×D) mean that it fits easily into a range of different environments. The P51U is less at home in the consumer segment than in the POS segment. The retail sector and restaurant trade are two primary target groups for this all-in-one PC.

Intel's 14nm Chip Shortage Continues

Intel is constantly having troubles with its silicon manufacturing business lately. Firstly the late delivery of 10 nm, then the shortage of 14 nm chips that started all the way back in 2018. Despite the making of $1 Billion investment into extending its 14 nm production capacity, there seems to be no end of troubles in sight.

According to sources close to DigiTimes, 14 nm production has fallen short of demand again and will likely cause many notebook manufacturers to delay their products to 2020. Most likely victim of this delay is the newly announced 10th generation mobile CPUs codenamed Comet Lake. Those CPUs were supposed to be built using Intel's "14nm++" revision of 14 nm technology which targets higher CPU frequencies and improved efficiency, but most likely due to continued shortage of 14nm, there will be only a few notebooks powered by these chips. As the source suggests, many manufacturers are likely to delay the launch of their products to 2020, when this situation is supposed to be resolved.

New Information on Intel's Upcoming i9-9900KS Processor Outed - 127 W TDP

Intel's upcoming 5 GHz-on-all-cores Core i9-9900KS will certainly be a beast of a processor for the company - in more ways than one. The 8-core, 16-thread 5 5 GHz all-core turbo CPU will be Intel's best-performing consumer CPU for a while. The steps taken to ensure that have been the only ones Intel could do with their current CPU design and fabrication process - increase the TDP and improve all-core boost frequency, which should allow the CPU to perform incredibly well in peak performance.

The question that remains, of course, is how long the CPU will actually be able to keep its 5.0 GHz all-core frequency when it's engaged. The 127 W TDP as outed by an ASUS BIOS is a monstrous amount for an 8-core CPU, and I don't envy the heatsinks that will have to keep it in check. All in all, this seems to be nothing more than a CPU binned for Intel's purposes of becoming the best CPU for gaming and "home user relevant applications".

Intel Cascade Lake-X Core i9-10980XE Put Through Its Paces in GeekBench

Intel's upcoming Extreme Edition Core i9-10980XE from the Cascade Lake-X family. Cascade Lake-X (CSL-X) will be Intel's next take on the High End Desktop (HEDT) systems. The Core i9-10980XE is pegged as the flagship on that lineup, sporting an 18-core, 36-thread design, and are still based on Intel's 14 nm process node. These processors will be pin-compatible with Intel's LGA 2066 platform. Caches are expected to be set at 1.125 MB, 18 MB and 24.75 MB of L1, L2 and L3.

Base clocks set in the Geekbench 4 entry are set at 4.1 GHz, with a maximum boost of 4.7 GHz. That's a lot of frequency on a 14 nm CPU with 18 cores; if previous entries on the Intel HEDT family (such as the i9-9980XE) sported a 165 W TDP with clocks of 3.0 GHz and 4.4 GHz respectively, it seems highly unlikely that Intel will keep the same TDP for the i9-10980XE - and even if they do, power consumption will certainly be higher. Those reported clocks for the i9-10980XE may not be right, however - we don't know the conditions of the test run.

AMD Confirms: Ryzen 9 3950X and Threadripper 3rd Generation Coming in November

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.
AMD's full statement is quoted below.

Compute Express Link Consortium (CXL) Officially Incorporates

Today, Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft announce the incorporation of the Compute Express Link (CXL) Consortium, and unveiled the names of its newly-elected members to its Board of Directors. The core group of key industry partners announced their intent to incorporate in March 2019, and remain dedicated to advancing the CXL standard, a new high-speed CPU-to-Device and CPU-to-Memory interconnect which accelerates next-generation data center performance.

The five new CXL board members are as follows: Steve Fields, Fellow and Chief Engineer of Power Systems, IBM; Gaurav Singh, Corporate Vice President, Xilinx; Dong Wei, Standards Architect and Fellow at ARM Holdings; Nathan Kalyanasundharam, Senior Fellow at AMD Semiconductor; and Larrie Carr, Fellow, Technical Strategy and Architecture, Data Center Solutions, Microchip Technology Inc.

Intel "Cascade Lake-X" HEDT CPU Lineup Starts at 10-core, Core i9-10900X Geekbenched

With its 10th generation Core X "Cascade Lake-X" HEDT processor series, Intel will not bother designing models with single-digit core-counts. The series is likely to start at 10 cores with the Core i9-10900X. This 10-core/20-thread processor features a quad-channel DDR4 memory interface, and comes with clock speeds of 3.70 GHz base, a 200 MHz speed-bump over the Core i9-9900X. The chip retains the mesh interconnect design and cache hierarchy of Intel's HEDT processors since "Skylake-X," with 1 MB of dedicated L2 cache per core, and 19.3 MB of shared L3 cache.

Geekbench tests run on the chip show it to perform roughly on par with the i9-9900X, with the 200 MHz speed-bump expected to marginally improve multi-threaded performance. Where the "Cascade Lake-X" silicon is expected to one-up "Skylake-X" is its support for DLBoost, an on-die fixed function hardware that multiplies matrices, improving AI DNN building and training; and pricing. Intel is expected to price its next-generation HEDT processors aggressively, to nearly double cores-per-Dollar.

Intel Adds More L3 Cache to Its Tiger Lake CPUs

InstLatX64 has posted a CPU dump of Intel's next-generation 10 nm CPUs codenamed Tiger Lake. With the CPUID of 806C0, this Tiger Lake chip runs at 1000 MHz base and 3400 MHz boost clocks which is lower than the current Ice Lake models, but that is to be expected given that this might be just an engineering sample, meaning that production/consumer revision will have better frequency.

Perhaps one of the most interesting findings this dump shows is the new L3 cache configuration. Up until now Intel usually put 2 MB of L3 cache per each core, however with Tiger Lake, it seems like the plan is to boost the amount of available cache. Now we are going to get 50% more L3 cache resulting in 3 MB per core or 12 MB in total for this four-core chip. Improved cache capacity can result in additional latency because of additional distance data needs to travel to get in and out of cache, but Intel's engineers surely solved this problem. Additionally, full AVX512 support is present except avx512_bf which supports bfloat16 floating-point variation found in Cooper Lake Xeons.

Wi-Fi Alliance Officially Launches the Wi-Fi Certified 6 Program

The Wi-Fi CERTIFIED 6 certification program from Wi-Fi Alliance is now available and delivers the best user experience with devices based on IEEE 802.11ax. The certification program brings new features and capabilities that enable substantially greater overall Wi-Fi network performance in challenging environments with many connected devices such as stadiums, airports, and industrial parks. With adoption of the latest Wi-Fi generation increasing, product vendors and service providers can trust Wi-Fi CERTIFIED will distinguish Wi-Fi 6 products and networks that meet the highest standards for security and interoperability. Wi-Fi CERTIFIED 6 provides significant capacity, performance, and latency improvements to the entire Wi-Fi ecosystem, while ensuring products across vendors to work well together to deliver greater innovation and opportunity.

Wi-Fi CERTIFIED 6 supports a more diverse set of devices and applications, from those requiring peak performance in demanding enterprise environments to those requiring low power and low latency in smart homes or industrial IoT scenarios. Wi-Fi CERTIFIED 6 delivers nearly four times the capacity of Wi-Fi 5, and is an evolutionary advancement for Wi-Fi's ability to deliver high-performance infrastructure and optimized connectivity to all devices on a network simultaneously - bringing noticeable improvements in densely connected Wi-Fi environments. Wi-Fi CERTIFIED 6 delivers critical connectivity that supports cellular networks, and leverages high speeds, low latency, power efficiency, greater capacity, and enhanced coverage to deliver many advanced 5G services.

Microsoft to Reportedly Use AMD Silicon on Its Next Gen Surface Devices

Microsoft has been using Intel hardware exclusively on its Surface lineup ever since it came out with the first Surface device. The choice was clear - Intel offered much better energy efficiency than anything AMD could offer at the time, besides the strong bond between the two companies. However, it seems that AMD might have done enough with its Ryzen 3000 series to sway big Microsoft into using some of its hardware (Ryzen 3000H or U) on upcoming Surface devices, if reports are to be believed.

Microsoft should be refreshing its Surface Laptop 2 with a 15-inch variant packing AMD hardware. It's uncertain if this will happen, and much less likely to happen for the entirety of Microsoft's Surface product stack (which includes potential refreshes for Surface Pro 6, Surface Book 2, Surface Go or Surface Studio 2). However, that AMD is now being considered alongside Intel in what can be said to be the ultimate Windows experience in Microsoft's usually excellently-designed products is a prestige in and of itself, and means an empowered brand standing for the red camp. Oh and Microsoft might finally be introducing that dual-screen device we've been hearing rumblings about for a while. Project "Centaurus" has already been seeded among Intel insiders, it seems, so it might see the light of day in the upcoming Microsoft Surface event taking place in New York on October 2nd.

MAINGEAR Launches ELEMENT Gaming Notebook: 9th Gen Intel, NVIDIA RTX

MAINGEAR — an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations — today launched the MAINGEAR ELEMENT, their new ultimate gaming notebook designed in collaboration with Intel. Custom engineered from the ground up, the ELEMENT features best-in-class hardware housed in a sleek machined magnesium alloy body, making it MAINGEAR's most professional notebook ever released.

The all-new ELEMENT fuses MAINGEAR's passion for design and performance into a truly modern gaming notebook with a thin, minimalist profile that doesn't compromise on raw power. The ELEMENT is optimized for the most demanding gamers and content creators, pairing a 9th Gen Intel i7-9750H processor and an NVIDIA GeForce RTX 2070 with Max-Q design GPU to hit peak performance in today's latest games. An ultra-smooth 144hz 15.6" IPS display with a narrow bezel delivers an incredibly immersive gaming experience. An RGB keyboard with individually-lit silent mechanical switches and a glass touchpad ensure users have precise control of the on-screen action. 32 GB of DDR4 memory and 2 TB of blazing-fast NVMe storage top off the ELEMENT's high-end specs.

Intel Says Its Upcoming Gen12 GPUs Will Feature Biggest Architecture Change In A Decade

Intel is slowly realizing plans to "one up" its GPU game starting from first 10 nm Ice Lake CPUs that feature Gen11 graphics, equipping users of integrated GPUs with much more performance than they previously got. Fortunately, Intel doesn't plan to stop there. Thanks to the recent pull request found on GitLab Mesa repository, we can now expect to receive biggest GPU performance bump in over a decade with the arrival of Gen12 based GPUs, found on next generation Tiger Lake processors.

In this merge request, Francisco Jerez, member of Intel's open source Linux graphics team, stated the following: "Gen12 is planned to include one of the most in-depth reworks of the Intel EU ISA since the original i965. The encoding of almost every instruction field, hardware opcode and register type needs to be updated in this merge request. But probably the most invasive change is the removal of the register scoreboard logic from the hardware, which means that the EU will no longer guarantee data coherency between register reads and writes, and will require the compiler to synchronize dependent instructions anytime there is a potential data hazard..."

New NetCAT Vulnerability Exploits DDIO on Intel Xeon Processors to Steal Data

DDIO, or Direct Data I/O, is an Intel-exclusive performance enhancement that allows NICs to directly access a processor's L3 cache, completely bypassing the a server's RAM, to increase NIC performance and lower latencies. Cybersecurity researchers from the Vrije Universiteit Amsterdam and ETH Zurich, in a research paper published on Tuesday, have discovered a critical vulnerability with DDIO that allows compromised servers in a network to steal data from every other machine on its local network. This include the ability to obtain keystrokes and other sensitive data flowing through the memory of vulnerable servers. This effect is compounded in data centers that have not just DDIO, but also RDMA (remote direct memory access) enabled, in which a single server can compromise an entire network. RDMA is a key ingredient in shoring up performance in HPCs and supercomputing environments. Intel in its initial response asked customers to disable DDIO and RDMA on machines with access to untrusted networks, while it works on patches.

The NetCAT vulnerability spells big trouble for web hosting providers. If a hacker leases a server in a data-center with RDMA and DDIO enabled, they can compromise other customers' servers and steal their data. "While NetCAT is powerful even with only minimal assumptions, we believe that we have merely scratched the surface of possibilities for network-based cache attacks, and we expect similar attacks based on NetCAT in the future," the paper reads. We hope that our efforts caution processor vendors against exposing microarchitectural elements to peripherals without a thorough security design to prevent abuse." The team also published a video briefing the nature of NetCAT. AMD EPYC processors don't support DDIO.
The video detailing NetCAT follows.

Intel Sourgrapes AMD's Creator Performance Leadership with Laughably Dubious Data

Intel as part of its IFA Berlin client-segment presentation resorted to some very juvenile marketing tactics, inviting criticism from noted PC enthusiast Der8auer. Intel scampered to reclaim its market position in the PC gaming space with the announcement of the Core i9-9900KS 8-core processor, which armed with a 5.00 GHz all-core Turbo Boost frequency, is expected to cement the company's gaming performance leadership. The company didn't leave it at that, and went on to attack AMD's creator performance leadership.

Der8auer observed something curious about a few slides in particular that Intel used to discredit AMD's high-end desktop processors, relating to its Creator performance as tested in Maxon Cinema 4D's benchmark program, Cinebench. Intel claimed that AMD cannot use Cinebench data to represent "real-world" performance as "only 0.22 percent" of users polled by Intel's "Software Improvement Program" respondents use Maxon Cinema 4D. And who are these respondents? Close to 11 million of them, _all_ of whom are notebook and tablet users, and a majority of whom have Software Improvement Program part of OEM bloatware. This, according to Der8auer, is fundamentally dishonest on Intel's part as Maxon Cinema 4D is less likely to be used on portable computers, and more likely on premium desktops or HEDTs. You can watch Der8auer's vlog here (English) or here (German).
The complete slide-deck follows.

Intel Core i9-9900KS to be Available from October

Intel's panic response to the 3rd generation Ryzen processor series, the Core i9-9900KS, will be generally available in October. The company will extensively market it as the best processor money can buy for gaming, and the specs to support that claim are formidable - 8-core/16-thread, with an all-core Turbo Boost frequency of 5.00 GHz. Intel will also actively publicize the growing clamor against real-world boost frequencies of 3rd gen Ryzen processors falling short of what's advertised, as detailed in the slide below. "5 GHz means 5 GHz" could be a prominent catchphrase of the chip's marketing, highlighting the all-core boost clocks. This chip is based on the existing 14 nm++ "Coffee Lake Refresh" silicon, but is likely its topmost bin.

Intel didn't, however, specify the TDP or pricing of the processor. The TDP is bound to be higher than that of the i9-9900K, as it would take a lot more power to sustain 5.00 GHz across all 8 cores. Intel may also try to retake the $499 price-point. The company may time the launch of this chip to closely follow AMD's flagship Ryzen 9 3950X 16-core/32-thread processor launch, which is due later this month. Intel's performance numbers for the i9-9900KS focus squarely on gaming and applications relevant to home users or PC enthusiasts. The i9-9900KS ships in a similar-looking acrylic case as the i9-9900K, with "Special Edition" branding on the front face. The retail package continues to lack a cooling solution.

TP-Link Launches the Wi-Fi 6 Router Archer AX50 Powered by Intel Technology

TP-Link, a leading global provider of consumer and business networking products, today announced its revolutionary AX3000 Wi-Fi 6 router—Archer AX50. Targeted at the mainstream and equipped with the Intel Home Wi-Fi Chipset, Archer AX50 will deliver a premium Wi-Fi 6 Gig+ experience to more families at an affordable price point. Wi-Fi 6 (802.11ax) is expected to be the most significant leap in Wi-Fi technology, developed in response to the ever growing demands on home Wi-Fi. With Intel's Wi-Fi 6 (Gig+) technology, Archer AX50 is capable of delivering a huge boost in speed and total capacity by utilizing a cutting-edge Wi-Fi 6 foundation.

Mainstream adoption of Wi-Fi 6 is growing with the introduction of more and more AX clients. Archer AX50 is estimated to be a major router product to hit the mass market. "Intel was the first to introduce Wi-Fi 6 for the PC and multiple PCs are now being introduced with the technology worldwide. Embedded with Intel's Wi-Fi 6 technology, TP-Link Archer AX50 can deliver Gig+ speeds to new PCs with Intel Wi-Fi 6 Gig+," said Pingji Li, VP & GM of TP-Link Networking BU. "Intel is devoted to bringing Wi-Fi 6 Gig+ to more people for a better experience. The close collaboration with Intel helps TP-Link as we continuously strive for better connectivity, anywhere, at any time, for more people to deliver better experiences."

LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs

TE Connectivity, the maker of various kinds of connectivity solutions for computer systems, has released its latest iteration of the LGA socket for the next generation of Xeon Scalable CPUs. Being validated by Intel, the LGA 4189-4 and LGA 4189-5 are going to power the next generation of 10 nm Xeon CPUs, based on the Ice Lake architecture, and up to 56-core 2nd generation Xeon Scalable CPUs. While there are two models of the socket, TE Connectivity didn't reveal what the differences are between them. Socket P4 (LGA 4189-4) and P5 (LGA 4189-5) also feature exactly the same pin count, 0.9906 mm hex pitch and 2.7 mm SP height, so we can only speculate that the "4" or "5" in the revision is supposed to indicate details like higher power delivery capability or support for Ice Lake CPUs.

In addition to providing a new socket for Ice Lake, these sockets have support for PCI-Express Gen 4.0 and eight-channel memory (supported memory configurations are vendor dependent), meaning that we are getting two more memory channels than previous Xeon CPUs with a faster and newer PCIe standard.

Intel Releases Graphics Drivers with Integer Upscaling - Only Available on Ice Lake

Intel over the weekend posted Graphics Software 25.20.100.7155, which delivers the much touted integer upscaling feature, branded as "Retro Scaling" by the company. The feature is a global toggle in the Graphics Command Center, which when enabled, upscales low-resolution retro games in a nearest-neighbor pixel multiplication model that looks better, when compared to classic bilinear upscaling, which alters the color data of multiplied pixels, causing the upscaled image to look blurry. This is a godsend for those playing old games on emulators, or even some of the newer indie games that retain a retro aesthetic.

Here's the catch - the feature is only available for Intel's Gen11 iGPU, found in the company's 10 nm "Ice Lake" processors. Intel currently ships "Ice Lake" only in its low-voltage and very low z-height packages, targeting notebooks and convertibles. The older Gen9.5 GPUs don't get access to the feature. The only other company with such a feature is NVIDIA, and even it restricts integer upscaling to only its latest "Turing" GPUs. Both NVIDIA and Intel leverage programmable scaling filters, instead of taking the programmable shader route. Intel is marking the feature as "beta" for now. Grab the drivers from the link below.

DOWNLOAD: Intel Graphics Software 25.20.100.7155 DCH

Intel Ships First 10nm Agilex FPGAs

Intel today announced that it has begun shipments of the first Intel Agilex field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom. These customers are using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.

"The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These unmatched assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link," said Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group.

AMD Makes Gains in GPU Shipments in Q2-2019: Jon Peddie Research

The PC GPU market sequentially increased by 0.6% in Q2'19, decreased year-to-year by -10.4% This is the latest report from Jon Peddie Research on the GPUs used in PCs. It is reporting on the results of Q2'19 GPU shipments world-wide. AMD shipments increased 9.8% NVIDIA was flat and Intel's shipments, decreased -1.4% as indicated in the following chart.

Even though there is uncertainty in the notebook supply chain, there has been a record number of new notebook announcements, and systems with amazing specifications in performance, battery life, and screen resolution. Specialized notebooks that sit somewhere between workstations and enthusiast PCs are arriving on the market for creative professionals. Strong graphics subsystems are an important selling point for these machines.

Phanteks Announces Glacier Gigabyte Aorus Xtreme Kit and C360-series Blocks

Phanteks today announced the release of three new Glacier products, the Gigabyte Aorus C621 Xtreme Kit, C360i, and C360a water blocks. Like all Glacier Series products, the blocks are made from premium materials and have a high standard of quality to ensure maximum cooling performance. The water blocks feature a nickel-plated copper cold plate and acrylic top for an elegant look and optimal cooling for your extreme hardware.

The kit includes a VRM water block for Gigabyte's Aorus Xtreme motherboard and CPU water block for Intel's LGA 3647 Narrow Socket P processors. Providing the perfect combination of premium design and optimal cooling solution for Gigabyte's Aorus Xtreme motherboard.

Lenovo Launches Project Athena ThinkPads

Today, Lenovo announced its latest ThinkPad laptops providing smarter productivity, connectivity and security experiences built for the future workforce. With the latest X1 Carbon running Intel's 10th Generation CPU's, Lenovo unleashes its first commercial platform part of the Project Athena program, ready to take on a full day's work with all day battery life and the latest Wi-Fi 6 connectivity. The updated commercial laptop line-up also includes a 10th Gen Intel Core processor refresh on the premium ThinkPad X1 Yoga, the ThinkPad X390 and the ThinkPad T490. Also announced are new ThinkPad L13 and L13 Yoga laptops for those who seek ThinkPad attributes in an affordable, high-value package.

Designed and engineered around ThinkPad's core foundational principles, these new laptops address the needs of a new generation workforce and their dynamic workspaces. People are seeking devices that offer intuitive, secure features and faster, higher performance to improve their workday, and ThinkPad is here to help them accomplish their most important goals. ThinkPad features industry-leading security with ThinkShield, the ability to stay connected with LTE-A Wireless WAN and Wi-Fi 6 in the latest select models. The ThinkPad line-up continues to offer premium usability experience through vivid high-definition displays, immersive Dolby Audio, and the renowned ThinkPad keyboard.

AMD Ryzen 5 3500 to Lack SMT, Takes on Core i5-9400

As AMD's Ryzen 5 3500 processor is inching closer to launch, we learn more possible specifications of the chip AMD is designing to take on Intel's popular Core i5-9400/9400F processor. Late July, we learned that the chip will be a 6-core model, breaking away from convention set by past generations, of the x500 Ryzen SKU being 4-core/8-thread. Thai PC enthusiast TUM_APISAK, who has a fairly high hit-rate on unreleased products, predicts that the 3500 will be six-core, but lack SMT (it will be 6-core/6-thread).

The Ryzen 5 3500 will be clocked at 3.60 GHz nominal, with a boost frequency of 4.10 GHz. There's no word on other specs, such as L3 cache amount. A single "Zen 2" chiplet normally has 32 MB of it (16 MB per CCX). The main competitor from the Intel stable is the Core i5-9400 / i5-9400F, which ticks at 2.90 GHz with 4.10 GHz boost. The i5-9400F in particular has had a big impact in the sub-$200 segment, as it's been aggressively priced under promotions by various DIY retailers. The chip lacks an iGPU, but has the specs to pull a fairly powerful gaming PC. With the Ryzen 5 3600 at $199, AMD could price the new chip around $169-179.

Intel Says AMD Did a Great Job (with Ryzen 3000), But Intel CPUs are Still Better

It is no secret that AMD has made a huge success with its long awaited "Zen" CPUs and returned to PC market stronger than ever. Intel however has neglected AMD's presence and only recently admitted what an impact AMD made. At this year's Gamescon, Intel started a new campaign against AMD with a point that Intel's CPUs are still better performers with "real world benchmarks" backing that claim.

"A year ago when we introduced the i9 9900K," says Intel's Troy Severson, "it was dubbed the fastest gaming CPU in the world. And I can honestly say nothing's changed. It's still the fastest gaming CPU in the world. I think you've heard a lot of press from the competition recently, but when we go out and actually do the real-world testing, not the synthetic benchmarks, but doing real-world testing of how these games perform on our platform, we stack the 9900K against the Ryzen 9 3900X. They're running a 12-core part and we're running an eight-core," he adds. "I'll be very honest, very blunt, say, hey, they've done a great job closing the gap, but we still have the highest performing CPUs in the industry for gaming, and we're going to maintain that edge."
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