Intel's development of their Core architecture in the post-Ryzen world has been slow, with solutions slowly creeping up in core counts with every new CPU release - but much slowly than rival AMD's efforts. Before Intel can capitalize on a new, more scalable and power-efficient architecture, though, it has to deliver performance and core count increases across its product line to stay as relevant as possible against a much revitalized rival. Enter Comet Lake-S: the desktop parts of Intel's new round of consumer CPUs, which will reportedly see an increase in the maximum core count to a 10-core design. This 10-core design, however, comes with an increase in power consumption (up to 135 W), and the need, once again, for beefier power delivery systems in a new, LGA 1200 package (with 9 more pins that the current LGA 1151).

The move to a new socket and the more stringent power requirements give Intel the opportunity to refresh its chipset offerings once again. If everything stays the same (and there's no reason it should change), new Z470 and Z490 chipsets should be some of the higher tier offerings for builders to pair with their motherboards. The new Comet Lake-S CPUs will still be built in the now extremely refined 14 nm process, and allegedly keep the same 16 PCIe 3.0 lanes as current Coffee Lake Refresh offerings. The new CPU offerings from Intel are expected to roll out in Q1 2020.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to launch an edgy addition to its 4th generation of RACING motherboards with the gaming ready BIOSTAR RACING B365GTA. Built for gamers who want an A-Grade motherboard equipped with A+ gaming features, the RACING B365GTA is equipped with premium quality components that ensure professional level performance without compromising on durability. While remaining affordable, the new motherboard features a refreshing and futuristic new design that pushes the conventional norm, enthusiasts will be able to build a PC that outshines the others and set a new standard for PC design.

The BIOSTAR RACING B365GTA, equipped with the latest Intel B365 chipset, brings support for the 9th & 8th Generation Intel Core processors for the most modern features available on the market. Namely, PCI-E M.2 32 Gb/s (with Intel Optane Technology Ready) for faster boot time as well as a bandwidth boost to your traditional stored device for rapid access to your game, USB 3.1 Gen1 support (5 Gb/s) for an easy plug-and-play experience with your external devices and faster transfer speed (compared with USB 2.0), and HDMI 4K resolution for a better than life visual gameplay. Up to 64 GB of DDR4 memory spread over 4-DIMMs give the user plenty of RAM to multitask without compromise, and with such a bold grey and black design and futuristic heatsink, it is sure to make heads turn and eyes sparkle with envy.

We originally covered Intel's work on the (more) energy-efficient version of their Core i9-9900 processor back in January. However, it seems that the company has improved the i9-9900T's performance before final release. Initial specifications for the processor were expected to deliver a 1.70 GHz base clock (down from 3.60 GHz of the original i9-9900K), with 1~2 core Turbo Boost frequency down to 3.80 GHz. However, the Geekbench benchmarks show a different story, one that's much more appealing to users: Intel managed to keep the 35 W TDP target, but base clocks stand at a much more interesting 2.1 GHz and much improved Boost clocks of 4.4 GHz.

This is good news, as performance is sure to be better than initially expected. However, this seems like a necessary move from Intel - AMD's Ryzen 3000 processors would be staring hungrily to Intel's 9900T otherwise (and likely still are). The eight cores, 16 threads, 16 MB of cache and Intel UHD Graphics 630 are kept from the original part. The test scores pitting it against an Intel i9-9900KS show an expected drop in performance compared to the faster processor. The Core i9-9900T has an Intel-set pricing of $439.

Today, Intel introduced eight additional 10th Gen Intel Core processors for modern laptop computing. The new mobile PC processors (formerly code-named "Comet Lake") are tailor-made to deliver increased productivity and performance scaling for demanding, multi-threaded workloads while still enabling thin-and-light laptop and 2 in 1 designs with uncompromising battery life. These processors are performance powerhouses that bring double digit performance gains compared with the previous generation. The lineup also includes Intel's first 6-core processor in the U-series, faster CPU frequencies, faster memory interfaces and the industry redefining connectivity with Intel Wi-Fi 6 (Gig+) and broader scaling of Thunderbolt 3. More than 90 additional designs based on the 10th Gen Intel Core processor family will hit the shelves for the holiday season.

"Our 10th Gen Intel Core mobile processors provide customers with the industry-leading range of products that deliver the best balance of performance, features, power and design for their specific needs. From multitasking to everyday content creation, the newest additions to the family scale performance for even higher levels of productivity -- in addition to offering best-in-class platform connectivity via Wi-Fi 6 (Gig+) and Thunderbolt 3 that people expect with 10th Gen," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group.

NVIDIA, with its GeForce 436.02 Gamescom-special drivers. among several new features and performance updates, introduced integer scaling, a resolution upscaling algorithm that scales up extremely low-resolution visuals to a more eye-pleasing blocky pixellated lines by multiplying pixels in a "nearest-neighbor" pattern without changing their color, as opposed to bilinear upscaling, that blurs the image by attempting to add details where none exist, by altering colors of multiplied pixels.

Intel originally announced an integer upscaler this June that will be exclusive to the company's new Gen11 graphics architecture, since older generations of its iGPUs "lack the hardware requirements" to pull it off. Intel's driver updates that add integer-scaling are set to arrive toward the end of this month, and even when they do, only a tiny fraction of Intel hardware actually benefit from the feature (notebooks and tablets that use "Ice Lake" processors).

Intel is working on its next generation gaming-grade NUC, codenamed "Phantom Canyon." When it comes out some time in 2020-21, it will feature Intel's 10 nm+ "Tiger Lake" SoC. Intel detailed this and more in a leaked presentation to industry partners. It describes the launch of of the company's "Ghost Canyon" NUC in Fall 2019 to succeed the current "Hades Canyon" gaming NUC. This box features a Core i9-9980HK processor and discrete graphics options. It will be succeeded in 2020-21 (late 2020 or sometime 2021), by the "Phantom Canyon" NUC that's in development.

The "Phantom Canyon" NUC is powered by a 28 W 10 nm+ "Tiger Lake-U" SoC that features PCI-Express gen 4. The package also implements Intel's "Gen 12" graphics processor that's derived from the Xe architecture it's currently working on, according to Chinese publication PTTWeb. The NUC will also feature discrete graphics options in the price-range of the current GTX 1660 Ti and RTX 2060 ($299 to $349). In related news, we see subtle hints that Intel will give its chipset bus a major update in future generations of its desktop and mobile platforms. Apparently, future platforms could feature DMI spread over 8 lanes as opposed to 4 on current platforms, besides the update to PCIe gen 4. This quadrupling in bandwidth compared to DMI 3.0 (PCIe 3.0 x4) is necessitated by the growth in bandwidth-hungry devices such as NVMe SSDs, external Thunderbolt 3 graphics cards, USB 3.2 flash drives, etc.

Intel announced that laptops verified through its innovation program, code-named "Project Athena," will feature the visual identifier "Engineered for Mobile Performance." PC manufacturers and retailers can use the identifier across promotional activities and in-store and online retail environments to draw consumers to the laptops that meet the high standards of the program's target specification and key experience indicators (KEI).

The new identifier can be found for the first time today with the new Dell XPS 13 2-in-1, one of the initial systems verified through Project Athena and now available for U.S. customers to purchase from Dell.com. Over the coming weeks, the identifier will also be visible in marketing efforts for the HP Elitebook 1040 and HP Elitebook 830, which are also among the initial laptops verified through the program. Additional laptops are expected from Acer, ASUS, Dell, HP, Lenovo and Samsung for the holiday season.

AMD invited TechPowerUp to their launch event and editor's day coverage of Zen 2 EPYC processors based on the 7 nm process. The event was a day-long affair which included product demos and tours, and capped off with an official launch presentation which we are able to share with you live as the event goes on. Zen 2 with the Ryzen 3000-series processors ushered in a lot of excitement, and for good reason too as our own reviews show, but questions remained on how the platform would scale to the other end of the market. We already knew, for example, that AMD secured many contracts based on their first-generation EPYC processors, and no doubt the IPC increase and expected increased core count would cause similar, if not higher, interest here. We also expect to know shortly about the various SKUs and pricing involved, and also if AMD wants to shed more light on the future of the Threadripper processor family. Read below, and continue past the break, for our live coverage.21:00 UTC: Lisa Su is on the stage at the Palace of Fine Arts events venue in San Francisco to present AMD's latest developments on EPYC for datacenters, using the Zen 2 microarchitecture.21:10 UTC: AMD focuses not just on delivering a single chip, but it's goal is to deliver a complete solution for the enterprise.

Yet another CPU vulnerability was discovered today, called SWAPGS, revealed under the code CVE-2019-1125, as it is referred to in the industry. The vulnerability was discovered twelve months ago and got privately reported to Intel by a security researcher. It's supposedly present on both AMD and Intel CPUs, but was only proven to work on Intel platforms by Bitdefender security researchers. Red Hat issued a statement which states that both platforms are affected and that users should upgrade their systems as soon as possible. Microsoft already implemented a fix with its "Patch Tuesday" update for last month, so if you updated your OS recently, you are already protected against SWAPGS.

AMD issued as statement as well, in which it says: "AMD is aware of new research claiming new speculative execution attacks that may allow access to privileged kernel data. Based on external and internal analysis, AMD believes it is not vulnerable to the SWAPGS variant attacks because AMD products are designed not to speculate on the new GS value following a speculative SWAPGS. For the attack that is not a SWAPGS variant, the mitigation is to implement our existing recommendations for Spectre variant 1."

Intel today announced its future Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in a standard, socketed CPU as part of its mainline Intel Xeon Scalable platforms, with availability in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series, which today is gaining momentum among the world's most demanding HPC customers, including HLRN, Advania, 4Paradigm, and others.

"The Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family generated a lot of excitement among our customers who are deploying the technology to run their high-performance computing (HPC), advanced analytics, artificial intelligence and high-density infrastructure. Extended 56-core processor offerings into our mainline Intel Xeon Scalable platforms enables us to serve a much broader range of customers who hunger for more processor performance and memory bandwidth."
-Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

During interview with Russian YouTube channel called PRO Hi-Tech, Raja Koduri, Intel's chief architect and senior vice president of architecture, software and graphics, talked about his career, why he left AMD, and where Intel is going with its discrete GPU attempts. However, one of the most notable things Mr Koduri said was regarding upcoming GPU lineup code-named Arctic Sound. He noted that Intel plans to release first GPU as a mid-range model at a price of $200, while enterprise solutions that utilize HBM memory will follow that.

Koduri said that he wants to replicate AMD's strategy of capturing high-volume price-points, such as the $199 Radeon RX 480. The plan here is to bring an affordable, good performing GPU to the masses - "GPUs for everyone" as he calls them. Additionally, he states that Intel's current strategy revolves around price, not performance, providing best possible value to consumers. Intel's approach for the next two or three years is to launch a complete lineup of GPUs, with a common architecture being used for everything from iGPUs found inside consumer CPUs to data-center GPUs.Update: PRO Hi-Tech has posted a snippet of Raja Koduri interview, without the Russian overlay commentary. What he said was actually: "...Eventually our architecture, as publicly said, has to get from mainstream, which is starting at around $100, all the way to data-center class graphics with HBM memory...". This means that the previous speculation about $200 graphics card is false, as he didn't say that. All he said is that Intel wants to enter the "mainstream" GPU market and work its way up to data center.

Today, Intel officially launched 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics for stunning entertainment and enable the best connectivity with Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season.

"These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 - all integrated onto the SoC, thanks to Intel's 10nm process technology and architecture design - we're opening the door to an entirely new range of experiences and innovations for the laptop."
-Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

During its second quarter earnings call, Intel announced that it has started shipping of 10th generation "Core" CPUs to OEMs. Making use of 10 nm lithography, the 10th generation of "Core" CPUs, codenamed Ice Lake, were qualified by OEMs earlier in 2019 in order to be integrated into future products. Ice Lake is on track for holiday season 2019, meaning that we can expect products on-shelves by the end of this year. That is exciting news as the 10th generation of Core CPUs is bringing some exciting micro-architectural improvements along with the long awaited and delayed Intel's 10nm manufacturing process node.

The new CPUs are supposed to get around 18% IPC improvement on average when looking at direct comparison to previous generation of Intel CPUs, while being clocked at same frequency. This time, even regular mobile/desktop parts will get AVX512 support, alongside VNNI and Cryptography ISA extensions that are supposed to bring additional security and performance for the ever increasing number of tasks, especially new ones like Neural Network processing. Core configurations will be ranging from dual core i3 to quad core i7, where we will see total of 11 models available.

The Japanese DIY PC market has developed a strong appetite for AMD Ryzen processors, with PC Watch reporting sales data aggregated by BCN across leading retailers. In the DIY space, AMD processors now hold a monstrous 68.6 percent market share. Data was collected from Amazon Japan, Bic Camera, EDION, etc., and distributors who supply to brick-and-mortar PC hardware stores. AMD's market share started its upward trend from September 2018, when it stood at 20 percent, propelled mainly by shortages of Intel processors in the DIY channel, overpricing of Intel processors, discounts on AMD 2nd generation Ryzen processors; and the recent introduction of 3rd generation Ryzen processors which are both priced reasonably and outperform Intel at every price-point.

AMD's problem area continues to be OEMs and the pre-built PC market, which makes up a bulk of processor sales for Intel. Despite the upperhand with pricing, performance, and efficiency, the company isn't able to match Intel in design-wins. Intel is able to retain its stranglehold over the OEM space with volume pricing and prioritizing the OEM channel over the DIY retail channel. In Japan, pre-built desktops and notebooks with AMD processors make up a paltry 14.7 percent of the market, although that number is still crawling upward. Perhaps AMD needs faster processor models with integrated graphics to appease OEMs?

The European cooling brand SilentiumPC, presents its newest line-up of enthusiast-level all-in-one CPU liquid cooling solutions with major improvements and addressable RGB illumination! The Navis EVO ARGB series distinguishes itself from the Navis RGB series by providing an all new ceramic bearing, sleeved tubes and superb lighting effects thanks to addressable RGB LEDs. In addition to these premium upgrades, the Navis EVO ARGB comes with an extended 3 years warranty to further underline the quality of the series. Enthusiasts are going to love the Navis EVO ARGB even more, as the models with 240, 280 and 360 radiators offer socket TR4 support for AMD Threadripper Processors out of the box.

With the ambitious goal to make the much acclaimed Navis RGB AIO even better for enthusiasts, SilentiumPC combined all the enhancements in the new Navis EVO ARGB series. Improvements have been made to the water block, which is now based on a 9-pole motor pump with professional-grade ceramic bearing and offers amazing color gradients thanks to addressable RGB LEDs. The long and flexible tubes have been wrapped in high-quality sleeves for better esthetics. Users have now even more options, when choosing the right AIO for their system, since the Navis EVO ARGB series is available with radiator sizes 120, 240, 280 and 360. The combination of the very efficient water block with copper-baseplate and the all-aluminium radiators with densely packed fin-matrix, allows for superb cooling efficiency with high overclocking potential. Yet another advantage of the Navis EVO ARGB 240, 280 and 360 models is the out-of-the-box support for AMD Threadripper Processors.

ASUS today rolled out of the WS C246-ACE, a sober-looking workstation motherboard in the ATX form-factor based on the Intel C246 chipset, which supports not just Intel Xeon E-series processors in the LGA1151 package, but also 8th and 9th generation Core processors. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the processor with a 9-phase VRM that's cooled by heavy ridged heatsinks. The CPU socket is wired to four DDR4 DIMM slots that support up to 128 GB of dual-channel DDR4 memory, and two metal-reinforced PCI-Express 3.0 x16 slots (x16/NC or x8/x8). Two open-ended PCIe 3.0 x1 and a PCI-Express x16 (electrical gen 3.0 x4) make for the rest of the expansion area.

Storage connectivity on the ASUS WS C246-ACE include two M.2-22110 slots with PCI-Express 3.0 x4 and SATA 6 Gbps wiring, a U.2 port, and four SATA 6 Gbps ports. Networking is care of two 1 GbE interfaces, driven by a combination of Intel i211-AT and i219-LM controllers. The onboard audio solution combines a Realtek ALC1220S CODEC with EMI shielding, ground-layer isolation, and a headphones amp circuit. USB connectivity includes four 10 Gbps USB 3.1 gen 2 ports, all on rear panel, one of which is a type-C port; and six 5 Gbps USB 3.1 gen 1 ports, of which two are via headers. Display connectivity include HDMI and DisplayPort. The company didn't reveal pricing.

During Fortune's Brainstorm Tech conference in Aspen, Colorado, Intel's CEO Bob Swan took stage and talked about the company, about where Intel is now and where they are headed in the future and how the company plans to evolve. Particular focus was put on how Intel became "data centric" from "PC centric," and the struggles it encountered.

However, when asked about the demise of Moore's Law, Swan detailed the aggressiveness that they approached the challenge with. Instead of the regular two times improvement in transistor density every two years, Swan said that Intel has always targeted better and greater densities so that it would stay the leader in the business.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the latest B365 series motherboard supporting the newest 9th and 8th Generation Intel Core Processor in a compact Micro ATX form factor, the BIOSTAR B365MHC. It is perfect for running office tasks to browsing the web and watching videos online.

The Micro ATX form factor allows the motherboard to fit in most PC cases making it perfect for office space saving while being packed with features including supporting up to 32 GB of DDR4 memory at 2666 MHz GbE LAN with Super LAN surge protection for enhanced bandwidth capacity, stability and superior performance. HDMI offers up to a 4K resolution with highly detailed content, while the PCIe M.2 expansion slot offers up to 32 Gb/s and supports for Intel Optane Technology which reduces boot times and improves overall performance. The BIOSTAR B365MHC is designed to offer unanimity with Intel's B365 chipset to give the power and performance needed for office and home multimedia uses.

Intel's next-generation Pentium Silver "Snow Ridge" SoC, featuring "Tremont" CPU cores, could see the debut of an L3 cache to the segment. Intel CPU cores in this segment, such as the "Goldmont Plus," only feature shared L2 caches across 4-core modules. The introduction of L3 cache was indicated by a new performance counter "MEM_LOAD_UOPS_RETIRED_L3_HIT," with a description clearly mentioning a "level 3 cache." The introduction of L3 cache as the SoC's LLC (last level cache) could mean Intel is trying to improve inter-component communication by introducting the L3 cache as "town-square" for the various components of the SoC, such as the CPU cores, the iGPU, and the integrated chipset. The company could deploy a ring-bus interconnect that has ring-stops at the various components, and slices of this L3 cache. Intel is building the "Snow Ridge" silicon on its swanky new 10 nm silicon fabrication process, and the chip could see a 2020 debut targeting network infrastructure devices.

Intel's Lisa Pearce today announced on Twitter, that the company has listened to user feedback from Reddit and will add nearest neighbor integer scaling to their future graphics chips. Integer scaling is the holy grail for gamers using console emulators, because it will give them the ability to simply double/triple or quadruple existing pixels, without any loss in sharpness that is inherent to traditional upscaling algorithms like bilinear or bicubic. This approach also avoids ringing artifacts that come with other, more advanced, scaling methods.

In her Twitter video, Lisa explained that this feature will only be available on upcoming Gen 11 graphics and beyond - previous GPUs lack the hardware required for implementing integer scaling. In terms of timeline, she mentioned that this will be part of the driver "around end of August", which also puts some constraints of the launch date of Gen 11, which seems to be rather sooner than later, based on that statement.

Earlier this week, news of Intel's 10th generation Core "Comet Lake" processors did rounds as the company's short-term response to AMD's 3rd generation Ryzen processors. According to slides leaked to the web by Hong Kong-based tech publication XFastest, "Comet Lake" isn't Intel's short-term reaction to "Zen 2," but rather all it has left to launch. These processors won't launch before 2020, the slide suggests, meaning that AMD will enjoy a free rein over the processor market until the turn of the year, including the all-important Holday shopping season.

More importantly, the slide suggests that "Comet Lake" will have a market presence spanning Q1 and Q2 2020, meaning that the 10 nm "Ice Lake" won't arrive on the desktop platform until at least Q3 2020. It's likely that the LGA1200 platform which debuts with "Comet Lake" will extend to "Ice Lake," so consumers aren't forced to buy a new motherboard within a span of six months. The platform diagram put out in another slide junks the idea of an on-package MCM of the processor and PCH dies (which was likely ripped off from the "Ice Lake-Y" MCM platform diagram).

Intel Corporation today announced the appointment of Claire Dixon as corporate vice president and chief communications officer (CCO), effective July 1. Dixon will oversee Intel's global communications organization, including corporate communications and events, product public relations, employee communications and analyst relations. "Claire is a world-class communications leader and team-builder," said Bob Swan, Intel CEO. "She brings with her a wealth of global experience across enterprise technology and consumer industries and will be a tremendous addition to Intel's leadership team."

"I'm delighted to be joining the management team at this critical moment in the company's history," Dixon said. "Intel has an amazing heritage and a tremendous opportunity ahead. Communications has a vital role to play in Intel's continuing transformation, from evolving the culture to building reputation and trust with key stakeholders and creating a compelling narrative. "

Intel China through its Weibo (Twitter-equivalent) handle put out more official-looking renders of its Xe graphics card. The Weibo post doesn't cite an author, leading us to speculate that the company's industrial design team is close to finalizing a product-design for at least the client-segment derivative of Xe. The swanky-looking card apparently has a stamped metal cooler shroud, a cooling solution that's based on a fin-stack heatsink that's ventilated by three fans, and quite some LED embellishment. An interesting design detail is the exponent symbol projected on the center fan. The power inputs are located at the tail end of the card, which is where most professional graphics cards have them; and consist of a pair of 8-pin PCIe inputs. Display inputs include three DisplayPorts, and an HDMI. The first Xe graphics card bound for 2020 will be built on Intel's 10 nm silicon fabrication process, which offers comparable transistor-densities to current 7 nm nodes.

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

El Chapuzas Informático has posted an early review of the AMD Ryzen 5 3600 which was tested on a Gigabyte Aorus Gaming 7 WiFi motherboard, G.Skill FlareX DDR4 @ 3200 MHz and an NVIDIA GeForce RTX 2080 Ti FE graphics card. Looking at the data presented, it becomes clear the performance on offer if real looks to be quite impressive. The site compared AMD's latest offering to the Intel Core i9-9900K and the AMD Ryzen 7 2700X with the Ryzen 5 3600 typically slotting in between the two and in some cases beating both. This is interesting to note as the Ryzen 7 2700X offers similar clock speeds to the Ryzen 5 3600 but the former has a 2C/4T advantage. Even so, the newer AMD CPU tends to outpace the Zen+ based Ryzen 7 2700X in multiple tests. In Cinebench R15, for example, the Ryzen 5 3600 had the lead in single-core performance while multi-core was held by the Ryzen 7 2700X. Cinebench R20 roughly mimics these results as well.

While memory latency was quite high 80.5 ns, it didn't seem to impact performance to any serious degree. In fact, in wPrime 2.10 32M running on a single core showed the Ryzen 5 3600 coming in just behind the Intel Core i9-9900K while being faster than the previous generation Intel Core i7-8700K, i7-8600K, and AMD Ryzen 7 2700X and 1700X. That said, the previous generation Ryzen processors were far slower here were as the Intel chips were still competitive. In the multi-core test, the Ryzen 7 2700X took a slight lead while the Ryzen 7 1700X was a bit slower than the Ryzen 5 3600. One interesting quirk of note was the lack of write speed on the memory with the Ryzen 5 3600 only hitting 25.6 GB/s which is quite a drop from the 47 GB/s seen on the Ryzen 7 1700X and Ryzen 7 2700X. However this could be due to the X470 motherboard being used or maybe an issue with sub timings on the memory, something that will need to be verified in future reviews.