The "Willow Cove" CPU core design succeeds "Sunny Cove," Intel's first truly new CPU core design in close to 5 years. "Sunny Cove" is implemented in the 10 nm "Ice Lake" microarchitecture, and "Willow Cove" cores are expected to debut with the 10 nm+ "Tiger Lake." It turns out that Intel is working to adapt "Willow Cove" CPU cores onto a 14 nm microarchitecture, and "Rocket Lake" could be it.

Twitter user @chiakokhua, a retired VLSI engineer with high hit-rate on CPU microarchitecture news, made sense of technical documents to point out that "Rocket Lake" is essentially a 14 nm adaptation of "Tiger Lake," but with the iGPU shrunk significantly, to make room for the larger CPU cores. The Gen12 iGPU on "Rocket Lake-S" will feature just 32 execution units (EUs), whilst on "Tiger Lake," it has three times the muscle, with 96 EUs. "Rocket Lake" also replaces "Tiger Lake's" FIVR (fully-integrated voltage regulation) with a conventional SVID VRM architecture.

An independent study conducted by the European Hardware Association (EHA) has revealed that AMD now ranks higher than Intel in the CPU space. While we have seen this as recently as last week, where we reported on top sellers across some Amazon webstores in Europe, with AMD scoring most of the top sellers in both Germany and the UK, this is the first time a comprehensive study has put some verifiable, science-generated numbers for us to see.

According to the EHA, 60% of the European PC enthusiasts (in a sample of 10,000 respondents) showed a strong sentiment towards AMD as their favored manufacturer of CPUs, and would choose any sort of system with an AMD CPU over an Intel one (including APU, AMD + Radeon graphics cards and AMD + NVIDIA graphics cards). This is a far cry from the same time around last year, where AMD only held 40% of a similar sample's preferred buying intention, and up from the 50% shown in the same study, carried out in 2H2019. The same survey also shows a slightly increased preference for AMD's graphics cards, with the 1H2019 showing 19% preference compared to 23% in this latest study.

The leading global motherboard & graphics card manufacturer, ASRock, a pleasure to launch brand new compact Mini PC - Mars Series. Supports up to Intel Core i5 Quad-Core processor, 32 GB DDR4-2666 MHz, PCIe NVMe M.2 SSD, 2.5-inch hard drive, and wireless connectivity; all implies into 0.7-liter chassis with 26 mm height.

ASRock Mars offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs to provide more productive and convenience.

Samsung has reportedly secured a "PC CPU" manufacturing order from Intel. This would entail Intel using Samsung's fabs to manufacture its processors. "PC CPU" is a broad term, interchangeable with "client CPU," and could include both notebook and desktop processors, spanning the "S," "H," "U," and "Y" silicon variants (mainstream desktop, mainstream notebook, ultrabook, and ultra low-power, respectively). Samsung's bouquet of contract-manufacturing covers not just silicon fabrication across 14 nm, but also sub 10 nm nodes, but also provides other key stages of processor manufacturing, including bumping and packaging. Intel would want minimal expenditure in adapting its chip designs to Samsung's nodes

In her November 20 letter addressed to Intel's customers, executive V-P and GM for sales, marketing, and communications, Michelle Johnston Holthaus, mentioned that in addition to Intel's own manufacturing facilities, the company is roping in "foundries" (third-party silicon fabrication companies) to meet demand. Samsung and TSMC lead the foundry business, followed by the likes of GlobalFoundries, UMC, etc.Many Thanks to biffzinker for the tip.

Intel's 11th generation Core "Rocket Lake-S" desktop processor will come in core-counts only up to 8, even as its predecessor, "Comet Lake-S," goes up to 10. Platform descriptors for Intel's next four microarchitectures surfaced on the web, detailing maximum values of their "S" (mainsteam desktop), "H" (mainstream notebook), "U" (ultrabook), and "Y" (low power portable) flavors. Both "Comet Lake-S" and "Rocket Lake-S" are 14 nm chips. "Comet Lake-S" comes with core counts of up to 10, a TDP of up to 125 Watts, Gen 9LP iGPU with 48 execution units, and native support for up to 128 GB of DDR4-2667.

The "Rocket Lake-S" silicon is interesting. Rumored to be yet another derivative of "Skylake," it features up to 8 CPU cores, the same 125 W maximum TDP, but swanky Gen12 iGPU with 32 execution units. The memory controller is also upgraded, which supports DDR4-2933 natively. There is no "Ice Lake-H" or "Ice Lake-S" in sight (no mainstream notebook or mainstream desktop implementations), ditto "Tiger Lake." For the foreseeable future, Intel will only make quad-core designs of the two 10 nm microarchitectures. "Rocket Lake-S" is slated for 2021 when, hopefully, we'll see Intel escape the 14 nm black hole.

Will Intel even make client-segment gaming discrete GPUs now? Because the GPU marketing gurus Intel snatched from AMD to sell them, Chris Hook and Heather Lennon, are reportedly no longer with the company. The two are on their way to an unnamed startup. This, according to a sensational Charlie Demerjian report citing company sources. These exits closely follow that of another valuable chip marketing honcho, John Carvill, who joined Austin-based startup Nuvia, which is designing ASICs and SoCs for the data-center of the future.

Hook and Lennon were responsible for the PR dexterity AMD RTG enjoyed through its ups and downs this decade. With RTG head Raja Koduri leaving for Intel to head its GPU development project, his former comrades at RTG soon followed. The flight of GPU marketing talent out of Intel at this stage could be the first of many hints that Intel has made a big decision with regards to how it plans to monetize Raja's work. "Ponte Vecchio" is Intel's ambitious GPU compute processor designed primarily for HPC and AI workloads. There's tumbleweed coming out of Intel on "Arctic Sound" since Q2-2019, a contraption that more closely resembles graphics cards as you know it.

PC major Dell in its quarterly results call blamed Intel for cuts in its revenue forecast for 2019 (full year) sales. "Intel CPU shortages have worsened qtr-over-qtr, impacting our commercial PC and premium consumer PC Q4 forecasted shipments," said Dell COO Jeffrey Clarke. Intel's CPU shortages are caused due to demand in the PC and server markets significantly outpacing supply, and not because Intel is supplying below its capacity. The company increased its capex toward manufacturer by $1 billion YoY, retrofitting its manufacturing facilities to make 14 nm processors, all while juggling resources to execute its 10 nm rollout for high-volume mobile and high-margin server processors.

The company hasn't launched 10 nm desktop or HEDT processors, yet, and is reportedly preparing yet another 14 nm line of processors for these platforms, codenamed "Comet Lake." This microarchitecture has also seen a mobile rollout for mainstream mobile form-factors, while Intel focused 10 nm "Ice Lake" for ultraportables and ultra low-power form-factors. Intel executive VP for sales Michelle Johnston Holthaus recently wrote a letter to its customers (primarily companies like Dell,) informing them that despite their best efforts, demand continues to beat supply, and that they hadn't managed to solve their supply issues.

Intel is readying a microcode update specially for its X299 Express chipset, to enhance the overclocking capabilities of its 10th generation Core i9 XE "Cascade Lake-X" processors. News of the update was put out in an MSI press release that speaks of the company encapsulating the new microcode in BIOS updates for its entire socket LGA2066 motherboard lineup.

"To enhance the overclocking capability for the newly launched Intel Core X-series Processors (Intel Core i9-10980XE, 10940X, 10920X, 10900X), Intel will provide a new microcode update," the statement from MSI reads. Besides "overclocking capability," the new microcode also helps to "maximize the overall performance" of "Cascade Lake-X" processors," says MSI. The company does not describe what specifically these changes are. The microcode update will be released to end-users as BIOS updates by motherboard manufacturers, so be on the lookout for one, if you're using "Cascade Lake-X."

Intel is reportedly looking to sell its connected home devices division, a company unit used for designing semiconductors that enable WiFi connection in all kinds of devices and SoCs made for managing network devices like WiFi routers. Following a previous deal, where Intel sold its modem division to Apple for 1 billion USD, Intel is now looking to "get rid of" another unit that is not doing any data-centric design workload.

The Connected Home division had around 450 million USD last year in annual sales, but it seems that competition is getting good with competing offers from Broadcom Inc. and Qualcomm Inc. If the unit is potentially sold to another company, Intel could rewire its R&D funds to other groups inside the company. Additionally, it is worth to mention that a financial advisor has reportedly been hired to evaluate any possible offers that Intel receives.

The European cooling and PC Case brand SilentiumPC presents the improved version of its Fortis 3 CPU cooler. For the Fortis 3 RGB HE1425, SilentiumPC has applied nickel-plating of the whole heat sink, which on the one hand visually enhances the tower cooler and on the other hand protects the material from corrosion. The tower cooler is also equipped with the brand-new Stella HP RGB 140 mm SE PWM fan, which not only enables modern RGB lighting, but is also more powerful at the same time. SilentiumPC is able to enrich the market with an improved and powerful tower cooler, which is particularly suitable for PC upgrades as well as new PC systems with modern RGB lighting.

In the course of the modernization of the Fortis 3, SilentiumPC gives the Fortis 3 RGB a finishing touch. The difference to the predecessor model can be seen right away, due to the fact that the Fortis 3 RGB has all copper elements as well as the aluminium fins carefully nickel-plated. This gives the tower cooler a uniform, high-quality look and protects the material from corrosion. The black coated top plate features covers for the heatpipe end pieces and the embossed SilentiumPC logo. Thanks to the five 6 mm copper heat pipes that form the base plate contact surface on the Fortis 3 RGB and the large cooling surface, the tower cooler is capable of effectively cooling modern high-end processors.

Intel late Monday released its SSD 665p "Neptune Harbor Refresh" line of client-segment M.2 NVMe SSDs. The series was announced in September at the company's Storage Day event in South Korea. Built in the M.2-2280 form-factor, the drives feature PCI-Express 3.0 x4 host interface. They combine a Silicon Motion SMI2263 series controller with Intel's new 96-layer 3D QLC NAND flash memory. The previous-generation SSD 660p series use 64-layer chips. The SMI2263 controller is cushioned by an LPDDR3 DRAM cache.

Intel is debuting the SSD 665p series with just two models, 1 TB and 2 TB, skipping sub-terabyte capacities such as 500 GB. The 2 TB variant offers sequential transfer speeds of up to 2000 MB/s reads and up to 2000 MB/s writes; and random access speeds of up to 250,000 IOPS on both reads and writes. The 1 TB variant offers up to 2000 MB/s sequential reads, up to 1925 MB/s sequential writes, up to 160,000 IOPS random reads, and up to 200,000 IOPS random writes. The company didn't reveal endurance ratings for the drives. The 1 TB variant is priced at USD $125, while the 2 TB variant hasn't yet been priced. Both drives are backed by 5-year warranties.

G.SKILL, the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms, including the high-capacity DDR4-3600 CL16-19-19-39 256 GB (32 GB x8), DDR4-4000 CL18-22-22-42 256 GB (32 GB x8), and the high-speed, low-latency DDR4-4000 CL15-16-16-36 64 GB (8 GB x8) specifications. By bringing ultra-high 32 GB memory module capacity into the realm of HEDT computing, powerful workstations are now truly able to achieve a complete combination of high core count processor with high-speed, high-capacity memory for heavy workloads or for running more virtual machines than ever.

Intel is partnering with MediaTek on the development, certification and support of 5G modem solutions for the next generation of PC experiences. As part of the partnership, Intel will define a 5G solution specification, including a 5G modem to be developed and delivered by MediaTek. Intel will also provide optimization and validation across the platform and lend system integration and co-engineering support to further enable its OEM partners.

"5G is poised to unleash a new level of computing and connectivity that will transform the way we interact with the world. This partnership with MediaTek brings together industry leaders with deep engineering, system integration and connectivity expertise to deliver 5G experiences on the next generation of the world's best PCs." -Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.

Intel has today launched a new product called Data Streaming Accelerator known as Intel DSA shortly. The new device is going to be present inside every future Intel processor with a goal of "optimizing streaming data movement and transformation operations common with applications for high-performance storage, networking, persistent memory, and various data processing applications."

The DSA processor will replace an existing solution that is Intel QuickData Technology, which was previously used for data movement. This new dedicated processor has a much-needed purpose to free up CPU cycles from doing IO work like moving data to/from volatile memory, persistent memory, memory-mapped I/O, and through a Non-Transparent Bridge (NTB) device to/from remote volatile and persistent memory inside a chip. In addition to the usual data movement operations, the DSA processor can create and test CRC checksums for any errors in storage and networking applications.

The HEDT or high-end desktop platform occupies the gray area between desktops and workstations. It has been originally meant for power-users, enthusiasts, and creative professionals. Over the years, with ballooning core-counts, memory bandwidth, and I/O connectivity, the target-audience of the HEDT evolved. Now these processors are useful for people who need a lot of multi-threaded CPU performance with more I/O connectivity than what traditional desktop platforms offer; and who have not use for "workstation" features such as ECC memory, or simply don't want to spend the money.

AMD doubled CPU core counts for its traditional Ryzen desktop platform this year with the introduction of 12-core and 16-core parts; forcing its 3rd gen Threadripper family to begin with even higher core-counts, starting with the 3960X 24-core part at $1,399. Intel, on the other hand, is in a bit of a pickle. Intel's 10 nm silicon fabrication node development isn't benefiting its desktop or HEDT platforms. Allocations of its 10 nm node are mopped up by its high-volume mobile processor and high-margin enterprise processor businesses, leaving too little allocation to roll out desktop or HEDT 10 nm chips at scale.

Intel is set to become the world's largest semiconductor supplier of 2019, according to the research from IC Insights. Intel held a crown for the largest semiconductor supplier since 1992, until 2018 when Samsung overtook it because of the booming DRAM business driven by high demand and not enough supply. Being Samsung's main business, any DRAM price/demand fluctuation was having a massive impact on its business. Due to high demand and high pricing, Samsung saw a massive revenue jump which resulted in a new king of the world's largest semiconductor supplier.

However, having seen predictions for a fall of 34% for this year, the decrease in demand will result in lower revenue for all DRAM market suppliers. SK Hynix, Micron and Samsung are expecting their revenues to decline around 29% on a year-over-year basis given the situation. This is resulting in lower revenue for Samsung than Intel has, and makes Intel the king of semiconductors once more. Intel's revenue is expected to reach around 70 billion USD, which is similar to last year's numbers.

With its "Skylake" microarchitecture, Intel significantly re-balanced the cache hierarchy of its HEDT and enterprise multi-core processors to equip CPU cores with larger amounts of faster L2 caches, and lesser amounts on slower shared L3 cache. The company retained its traditional cache balance for its mobile and desktop processor derivatives. This could change with the company's "Tiger Lake" microarchitecture, particularly the "Willow Cove" CPU cores they use, according to a Geekbench online database listing for a prototype quad-core "Tiger Lake-Y" mobile processor.

According to this listing, assuming Geekbench is reading the platform correctly; the "Tiger Lake-Y" processor features a 4-core/8-thread CPU, with a massive 1,280 KB (1.25 MB) of L2 cache per core, and 12 MB of L3 cache. Intel also enlarged the L1D (data) cache to be 48 KB in size, while the L1I (instruction) cache remains 32 KB. This amounts to a 400% increase in L2 cache size, and a 50% increase in L3 cache size. Unlike with "Skylake-X," the increase in L2 cache size doesn't come with a decrease in shared L3 cache size (per core). The "Tiger Lake-Y" processor is being tested on a "Corktown" prototyping platform (a specialized motherboard that has all possible I/O connectivity available with the platform, for testing. "Tiger Lake" is expected to make its debut some time in 2020-21 as a successor to "Ice Lake," and will be built on Intel's refined 10 nm++ silicon fabrication node. Find the Geekbench entry in the source link below.

Intel executive vice-president and general manager for sales, marketing, and communications, Michelle Johnston Holthaus, in a letter addressing the company's customers and partners, expressed regret that the company hasn't been able to resolve the challenge of PC CPU supply falling behind market growth (demand) despite its "best efforts." She elaborated on these efforts by summarizing additional billions of dollars in capital-expenditure the company spent in retrofitting its facilities to 14 nm fabs. The added capacity increased Intel's output in 2H 2019 by a "double digit" percentage compared to 1H, however, even that proved insufficient to cope with market demand. "Sustained market growth in 2019 has outpaced [Intel's] efforts and exceeded third-party forecasts," she said.

"Supply remains extremely tight in our PC business where we are operating with limited inventory buffers. This makes us less able to absorb the impact of any production variability, which we have experienced in the quarter. This has resulted in the shipment delays you are experiencing, which we appreciate is creating significant challenges for your business," she added, probably referring to the vast portfolio of dozens of SKUs of products that aren't yet EOL, but share the same 14 nm node. Intel deployed its product representatives to proactively reach out to all their customers to "answer their questions." This is probably another way of saying "retaining your businesses." Intel is embattled on two fronts: to make its 14 nm supply keep pace with demand; and to quantitatively transition to the newer 10 nm process.

ASUS today announced the new ProArt StudioBook Pro X (W730), which provides a wide range of features designed for professional creators. It's the first Quadro laptop that is powered by 9th Gen Intel Xeon processor with NVIDIA Quadro RTX 5000 graphics. This combination of cutting edge graphics and portability makes it perfect for creative professionals to achieve their goals on-the-go or in office.

ProArt StudioBook Pro X delivers the needed performance to create, edit, and render multilayered files using the latest NVIDIA Quadro RTX 5000 graphics. These NVIDIA RTX Studio laptops utilize NVIDIA Turing architecture, allowing creative and technical professionals to take advantage of the power of hardware-accelerated ray tracing, deep learning, and advanced shading techniques when creating amazing content. Intel Xeon processors are designed to handle complex, multithreaded applications, and takes mobile computing to another level by making it incredibly smooth and responsive.

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

MATLAB is a popular math computing environment in use by engineering firms, universities, and other research institutes. Some of its operations can be made to leverage Intel MKL (Math Kernel Library), which is poorly optimized for, and notoriously slow on AMD Ryzen processors. Reddit user Nedflanders1976 devised a way to restore anywhere between 20 to 300 percent performance on Ryzen and Ryzen Threadripper processors, by forcing MATLAB to use advanced instruction-sets such as AVX2. By default, MKL queries your processor's vendor ID string, and if it sees anything other than "GenuineIntel...," it falls back to SSE, posing a significant performance disadvantage to "AuthenticAMD" Ryzen processors that have a full IA SSE4, AVX, and AVX2 implementation.

The tweak, meant to be manually applied by AMD Ryzen users, forces MKL to use AVX2 regardless of the CPU Vendor ID query result. The tweak is as simple as it is powerful. A simple 4-line Windows batch file with a set of arguments starts MKL in AVX2 mode. You can also make the tweak "permanent" by creating a system environment variable. The environment variable will apply to all instances of MATLAB, and not just those spawned by the batch file. Nedflanders1976 also posted a benchmark script that highlights the performance impact of AVX2, however you can use your own scripts and post results.

For those wanting 802.11ax Wi-Fi 6 on their desktops without an M.2 E-key slot on their motherboards, ASUS came up with the PCE-AX3000, a low-profile capable (half-height) NIC that provides up to 3000 Mbps (2.4 Gbps over 5 GHz and 600 Mbps over 2.4 GHz) wireless connectivity, and the added convenience of Bluetooth 5.0 for short-range communications. A set of MU-MIMO antennae come included. Besides MU-MIMO, the card supports OFDMA for better collision-prevention with other devices in the same channel, and WPA3 security protocol. The NIC is essentially a PCI-Express 3.0 x1 add-on card with an M.2 E-key slot that holds an Intel AX200 "Cyclone Peak" WLAN card. We expect the AX3000 to be priced well under $50 given that the "Cyclone Peak" card at the heart of it costs just $10-17 in volume pricing.

At Supercomputing 2019, Intel unveiled its vision for extending its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and an ambitious new software initiative that represents a paradigm shift from today's single-architecture, single-vendor programming models.

Addressing the increasing use of heterogeneous architectures in high-performance computing, Intel expanded on its existing technology portfolio to move, store and process data more effectively by announcing a new category of discrete general-purpose GPUs optimized for AI and HPC convergence. Intel also launched the oneAPI industry initiative to deliver a unified and simplified programming model for application development across heterogenous processing architectures, including CPUs, GPUs, FPGAs and other accelerators. The launch of oneAPI represents millions of Intel engineering hours in software development and marks a game-changing evolution from today's limiting, proprietary programming approaches to an open standards-based model for cross-architecture developer engagement and innovation.

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from customers and distributors. The boxed SKU of the E-2274G, which includes a stock cooling solution, has been marked as "discontinued" and "end of life." Intel is offering an E-2274G tray processor (chip-only) as replacement for the returned inventory. The cause for the recall is the cooling solution included in the boxed SKU, which has been found to be insufficient to cool the E-2274G, a 4-core/8-thread processor based on the 14 nm++ "Coffee Lake" microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is supplied by Foxconn, and has been known to be bundled with Intel's entry-level client-segment processors, such as the Pentium Gold series and Core i3 series (chips with TDP typically rated 65 W or less). It features a thin, circular, all-aluminium heatsink, which lacks a copper core that certain other LGA115x-compatible stock coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium surface, with spirally-projecting fins dissipating heat under the fan's airflow. It could be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that's designed for the rigors of mission-critical use-cases such as workstations and small-business servers.Heatsink images courtesy: AndyKingParts (Amazon seller)

Intel's first Xe GPU built on the company's 7 nm silicon fabrication process will be codenamed "Ponte Vecchio," according to a VideoCardz report. These are not gaming GPUs, but rather compute accelerators designed for exascale computing, which leverage the company's CXL (Compute Express Link) interconnect that has bandwidth comparable to PCIe gen 4.0, but with scalability features slated to come out with future generations of PCIe. Intel is preparing its first enterprise compute platform featuring these accelerators codenamed "Project Aurora," in which the company will exert end-to-end control over not just the hardware stack, but also the software.

"Project Aurora" combines up to six "Ponte Vecchio" Xe accelerators with up to two Xeon multi-core processors based on the 7 nm "Sapphire Rapids" microarchitecture, and OneAPI, a unifying API that lets a single kind of machine code address both the CPU and GPU. With Intel owning the x86 machine architecture, it's likely that Xe GPUs will feature, among other things, the ability to process x86 instructions. The API will be able to push scalar workloads to the CPU, and and the GPU's scalar units, and vector workloads to the GPU's vector-optimized SIMD units. Intel's main pitch to the compute market could be significantly lowered software costs from API and machine-code unification between the CPU and GPU.Image Courtesy: Jan Drewes