The specsheet of a Lenovo IdeaPad S530-13IWL has allowed us to know the existence of the new Intel 9000 series mobile CPUs. These are the Core i7-9550U, i5-9250U and i3-9130U. The laptop datasheet, spotted on Twitter by @momomo_us, confirms new members of that family , with "IWL" at the end of the model name meaning "Intel Whiskey Lake", a family launched last October with the Core i7-8565U, Core i5-8265U and Core i3-8145U. There is no confirmation from Intel on this rumor, and there aren't much details about the CPUs either: clock speeds and core counts are not specified, though should remain quite similar to the previous members of the 8000 series.

This information points to a light rebadge of Whiskey Lake CPUs according to NotebookCheck given that there is no mention of the 9th generation of processors. This is weird because the 8000 series is basically a synonym of the 8th Gen and the same happens with the 9000 series and the 9th generation. It seems the Core i7 will be a quad-core CPU with Hyper Threading support and 8 MB of L3 cache, while the Core i5, with the same core count, will have 6 MB of L3 cache. The Core i3 CPU would be a dual-core chip with 4 MB of L3 cache. We'll have to wait for an official confirmation to confirm the specs and advantages over the older models.

If Intel's now-defunct "tick-tock" product development cadence held its ground, the 14 nm silicon fabrication node should have seen just two micro-architectures, "Broadwell" and "Skylake," with "Broadwell" being an incrementally improved optical shrink of 22 nm "Haswell," and "Skylake" being a newer micro-architecture built on a then more matured 14 nm node. Intel's silicon fabrication node advancement went off the rails in 2015-16, and 14 nm would go on to be the base for three more "generations," including the 7th generation "Kaby Lake," the 8th generation "Coffee Lake," and 9th generation "Coffee Lake Refresh." The latter two saw Intel increase core-counts after AMD broke its slumber. It turns out that Intel won't let the 8-core "Coffee Lake Refresh" die pull the weight of Intel's competitiveness and prestige through 2019, and is planning yet another stopgap, codenamed "Comet Lake."

Intel's next silicon fabrication node, 10 nm, takes off only toward the end of 2019, and AMD is expected to launch its 7 nm "Zen 2" architecture much sooner than that (debuts in December 2018). Intel probably fears AMD could launch client-segment "Zen 2" processors before Intel's first 10 nm client-segment products, to cash in on its competitive edge. Intel is looking to blunt that with "Comet Lake." Designed for the LGA115x mainstream-desktop platform, "Comet Lake" is a 10-core processor die built on 14 nm, and could be the foundation of the 10th generation Core processor family. It's unlikely that the underlying core design is changed from "Skylake" (circa 2016). It could retain the same cache hierarchy, with 256 KB per core L2 cache, and 20 MB shared L3 cache. All is not rosy in the AMD camp. The first AMD 7 nm processors will target the enterprise segment and not client, and CEO Lisa Su in her quarterly financial results calls has been evasive about when the first 7 nm client-segment products could come out. There was some chatter in September of a "Zen+" based 10-core socket AM4 product leading up to them.

ZADAK is thrilled to announce the whole new custom water cooling system, SHIELD II Water Cooled PC. Starting in 2015 ZADAK first dipped our toes into custom computers that were built for modding competition displays. In late 2017 ZADAK decided to mass produce our first fully water-cooled PC known as MOAB I. MOAB I managed to push boundaries within the industry and get us excited to start work on the successor MOAB II Water Cooled PC. These two smallest custom water-cooled PCs gained attention from enthusiasts around the world along with ZADAK's other products.

Microsoft has blocked rollout of the Windows 10 October 2018 Update on systems using Intel Integrated Graphics with specific driver versions. Apparently audio playback, when using a monitor connected to the IGP, will no longer work after the upgrade to October Update.

According to Microsoft, the underlying reason for the issue is that "Intel inadvertently released versions of its display driver [...] to OEMs that accidentally turned on unsupported features in Windows."

If you want to work around this, then check your Intel driver version using GPU-Z. If you see "24.20.100.6344" or "24.20.100.6345", just upgrade your graphics drivers and you should be good to go.

The "sustained chill in the crypto mining sector" is, according to Taiwan-based sources cited at DigiTimes, one of the leading reasons motherboard and graphics cards makers will face a bleak scenario in the next few months. According to those sources, other factors such as the US-China trade war doesn't help a situation on which NVIDIA new RTX family hasn't helped due to the high price of those GPUs. ASUSTeK Computer and Gigabyte Technology have seen their inventory levels drive up, "causing their revenues for the peak season to fall under expectations".

These problems now join the ones Intel is facing with its shortage of processors, and according to DigiTimes, revenue prospects for the fourth quarter are further dimmed by lingering sluggish demand from the DIY market among other things. To counteract these problems those companies could actually be could be further adversely affected: "Nvidia and Intel likely to raise their chip prices to maintain profitability", a move that could lead to a bleak profitability period starting in 2019.

Intel is reportedly working tirelessly to launch its "Cascade Lake" Xeon Scalable 48-core enterprise processor before year-end, according to a launch window timeline slide leaked by datacenter hardware provider QCT. The slide suggests a late-Q4 thru Q1-2019 launch timeline for the XCC (extreme core count) version of "Cascade Lake," which packs 48 CPU cores across two dies on an MCM. This launch is part of QCT's "early shipment program," which means select enterprise customers can obtain the hardware in pre-approved quantities. In other words, this is a limited launch, but one that's probably enough to upstage AMD's 7 nm EPYC "Rome" 64-core processor launch.

It's only by late-Q1 thru Q2-2019 that the Xeon "Cascade Lake" family would be substantially launched, including lower core-count variants that are still 2-die MCMs. This aligns to preempt or match AMD's 7 nm EPYC family rollout through 2019. "Cascade Lake" is probably Intel's final enterprise microarchitecture to be built on the 14 nm++ node, and consists of 2-die multi-chip modules that feature 48 cores, and a 12-channel memory interface (6-channel per die); with 88-lane PCIe from the CPU socket. The processor is capable of multi-socket configurations. It will also be Intel's launch platform for substantially launching its Optane Persistent Memory product series.

Prices of retail versions of several 8th and 9th generation Intel Core processor SKUs dropped down to MSRP-levels Friday, in the US. Newegg currently lists the Core i5-9600K at USD $249.99, and the Core i7-8700K at $369.99, while the i7-8700 goes for $319.99, matched with AMD's Ryzen 7 2700X. The Core i5-8600K is listed at $239.99, which is just $20 above the consumer-favorite i5-8400. Newegg's pricing is still riddled with mark-up anomalies for SKUs in high demand. The Core i7-9700K is listed at $487.99, which is about $10 cheaper than Intel's MSRP for the Core i9-9900K, which is selling for an obnoxious $850.

Prices of retail packages of Intel Core desktop processors could continue to rise over Q4-2018, as the company has reportedly cut their supply, in favor of tray/reel shipments to OEMs. This could mean DIY favorites such as the Core i5-8400, the i5-8600K, i5-9600K, or even Core i7 models such as the i7-8700K, i7-9700K, and the flagship i9-9900K could be severely in short supply, or heavily marked up wherever available. Intel recently devised a strategy to increase its Core processor volumes by pumping in an additional $1 billion to its usually-$15 billion capital expenditure, to fire up small-scale manufacturing facilities around the world, to augment its bigger fabs located in Malaysia and Vietnam.

Sites like Mexico, Israel, and Ireland are beneficiaries of this move, and are being expanded. Much of Intel's efforts appear to be focused on making sure notebook and pre-built PC manufacturers aren't starved of processor inventory. The DIY retail channel, which consists of boxed processors, will foot the bill for this move. A good example of understocked retail channel would be the $499 Core i9-9900K processor being sold for upwards of $900 in some online stores. AMD is in an enviable position to fill the void, comments PCGamesN. Prices of its Ryzen desktop processor PIBs are either flat, or marginally cut; and socket AM4 motherboards are generally cheaper than LGA1151 ones.

A few weeks ago we talked about Intel problems in the production chain. The semiconductor giant was facing a shortage of 14 nm CPUs probably due to Intel allocating volumes from the same 14 nm++ node for its upcoming 9th Generation Core processors. That caused a clear rise in the prices of processors like the Core i7-8700K, which had a launch price of $359 and was hard to find for less than $400 a month ago. Prices have relaxed since then, but are still higher than their launch ones.

Intel's processor shortage could continue in the coming months, and in fact Jerry Shen, CEO of Asustek Computer, explained how the problem will continue until at least the second quarter of 2019. In his words, "the continued CPU supply crunch, escalating US-China trade disputes, and increasing competition in the notebook segment in Europe have pressed down Asustek's "operational visibility" for the fourth quarter of 2018 to the lowest level of 20% compared to an over 50% seen in previous years".

Intel is hosting its first artificial intelligence (AI) developer conference in Beijing on Nov. 14 and 15. The company kicked off the event with the introduction of the Intel Neural Compute Stick 2 (Intel NCS 2) designed to build smarter AI algorithms and for prototyping computer vision at the network edge. Based on the Intel Movidius Myriad X vision processing unit (VPU) and supported by the Intel Distribution of OpenVINO toolkit, the Intel NCS 2 affordably speeds the development of deep neural networks inference applications while delivering a performance boost over the previous generation neural compute stick. The Intel NCS 2 enables deep neural network testing, tuning and prototyping, so developers can go from prototyping into production leveraging a range of Intel vision accelerator form factors in real-world applications.

"The first-generation Intel Neural Compute Stick sparked an entire community of AI developers into action with a form factor and price that didn't exist before. We're excited to see what the community creates next with the strong enhancement to compute power enabled with the new Intel Neural Compute Stick 2," said Naveen Rao, Intel corporate vice president and general manager of the AI Products Group.

GIGABYTE today introduced the C246-WU4, a workstation-grade socket LGA1151 motherboard based on Intel C246 chipset, with support for the recently announced Xeon E-2100 series, in addition to 8th and 9th generation Core processors. With Xeon processors installed, it supports up to 128 GB ECC memory. 9th Generation Core processors let you use up to 128 GB non-ECC memory. 8th generation ones cap out at 64 GB non-ECC. The board also supports many of the vPro enterprise features that the Q370 Express chipset offers.

Built in the standard ATX form-factor, the board draws power from a combination of 24-pin ATX, 8-pin EPS, and optional 4-pin ATX, and uses an 8+2 phase VRM to condition power for the CPU. Expansion slots include four PCI-Express 3.0 x16, from which slots 1 and 3 are wired to the CPU, and share an x16 link (x16/NC or x8/x8), while slots 2 and 4 are gen 3.0 x4, and wired to the PCH. There's also a legacy PCI slot driven by a bridge chip. Storage connectivity includes two M.2 PCIe with gen 3.0 x4 wiring, each; and ten SATA 6 Gbps ports, from which eight are driven by the PCH, and two from an ASMedia ASM1061 chip. Network connectivity includes two 1 GbE interfaces, one driven by an Intel i219-V, and the other by i211-AT, with vPro support. USB connectivity includes USB 3.1 gen 2, including type-C rear-panel ports. The onboard audio features a Realtek ALC1220VB, which is EMI shielded, and wired to WIMA capacitors. Expect this board to be priced around $350.

Intel late last week put out additional real-world HPC and AI compute performance numbers of its upcoming "Cascade Lake" 2x 48-core (96 cores in total) machine, compared to AMD's EPYC 7601 2x 32-core (64 cores in total) machine. You'll recall that on November 5th, the company put out Linpack, System Triad, and Deep Learning Inference numbers, which are all synthetic benchmarks. In a new set of slides, the company revealed a few real-world HPC/AI application performance numbers, including MIMD Lattice Computation (MILC), Weather Research and Forecasting (WRF), OpenFOAM, NAMD scalable molecular dynamics, and YaSK.

The Intel 96-core setup with 12-channel memory interface belts out up to 1.5X performance in MILC, up to 1.6X in WRF and OpenFOAM, up to 2.1X in NAMD, and up to 3.1X in YASK, compared to an AMD EPYC 7601 2P machine. The company also put out system configuration and disclaimer slides with the usual forward-looking CYA. "Cascake Lake" will be Intel's main competitor to AMD's EPYC "Rome" 64-core 4P-capable processor that comes out by the end of 2018. Intel's product is a multi-chip module of two 24~28 core dies, with a 2x 6-channel DDR4 memory interface.

Intel Corporation released model legislation designed to inform policymakers and spur discussion on personal data privacy. Prompted by the rapid rise of new technologies like artificial intelligence (AI), Intel's model bill is open for review and comment from privacy experts and the public on an interactive website. The bill's language and comments received should provide useful insight for those interested in meaningful data privacy legislation.

"The collection of personal information is a growing concern. The US needs a privacy law that both protects consumer privacy and creates a framework in which important new industries can prosper. Our model bill is designed to spur discussion that helps inspire meaningful privacy legislation," said David Hoffman, Intel associate general counsel and global privacy officer.

Data are the lifeblood for many critical new industries, including precision medicine, automated driving, workplace safety, smart cities and others. But the growing amount of personal data collected, sometimes without consumers' awareness, raises serious privacy concerns.

ZOTAC Technology, a global manufacturer of innovation, is excited to officially announce the VR GO 2.0, the world's first VR Backpack PC refreshed from the ground up. The VR GO 2.0 improves the untethered VR experience with high-end performance repackaged into a more compact, ergonomic chassis.

UNLEASH NEW REALITY
The VR GO 2.0 is designed for unlocking the potential of VR across industries and businesses in entertainment, product development, medical practice, design, education, customer service, eSports, and much more. Integrating mobility and high-performance hardware, the revamped backpack solution empowers life-like immersion with zero compromises to latency and reduction in visual quality with today's leading VR headsets.

The system comes with the powerful and efficient NVIDIA GeForce GTX 1070 graphics with 8GB memory while an Intel Core i7 processor and 16GB DDR4 memory provides the horsepower and bandwidth to sail through intensive tasks, delivering an ultra-smooth experience. The VR GO 2.0 is further equipped with centralized ports and top mounted I/O ports dedicated for easy VR HMD connectivity.

Intel today announced to press that they've scheduled an event for December 11th. The scheduled event should take the form of a small gathering of both Intel and press professionals, where Intel will be giving insights into its thought process and technologies with some in-depth presentations for technicians and engineers from the blue giant. Intel has become more and more secluded when it comes to the workings and architecture details of its technology advances, with the company even going so far as to cancel the (previously annual) Intel Developer Forums.

The event is apparently focusing on "architecture" considerations for future Intel products, so information shared could be strung with NDAs, and could fall under any product family Intel is working on (CPU, GPU, FPGA, AI...). We'll see what Intel has to share, and what kind of details (or watercolor ideas) can be painted on any future Intel products.

Intel today announced two new members of its Intel Xeon processor portfolio: Cascade Lake advanced performance (expected to be released the first half of 2019) and the Intel Xeon E-2100 processor for entry-level servers (general availability today). These two new product families build upon Intel's foundation of 20 years of Intel Xeon platform leadership and give customers even more flexibility to pick the right solution for their needs.

"We remain highly focused on delivering a wide range of workload-optimized solutions that best meet our customers' system requirements. The addition of Cascade Lake advanced performance CPUs and Xeon E-2100 processors to our Intel Xeon processor lineup once again demonstrates our commitment to delivering performance-optimized solutions to a wide range of customers," said Lisa Spelman, Intel vice president and general manager of Intel Xeon products and data center marketing.

The shadow of a ARM-based MacBook has been there for years. Rumors have been adding up, and the performance of their own mobile processors is more and more convincing with each new generation of devices. The recent launch of the iPad Pro has reinforced those signs after knowing its Apple A12X Bionic' Geekbench 4 results. According to this benchmark, the new iPad Pro isn't that far in raw performance from what we have with a Core i9-8950HK-based MacBook Pro (2018). We have a Single-Core/Multi-Core score of 5020/18217 in the iPad Pro vs the 5627/21571 on the MacBook Pro. If this seems nuts it's because it really is.

This comparison is pretty absurd in itself: TDPs are quite different on both (7 W vs 45 W) but there are also important distinctions in areas such as the memory used in those devices (most Apple laptops still use DDR-2133 modules) and, of course, the operating system on which they are based. Those numbers are just a tiny reference, but if we pay attention to Apple's recent keynote, that Photoshop CC demo can really speak for itself. And again, comparisons are hateful, but let's look for a slightly fairer comparison.

The official system requirements for the upcoming Battlefield V game have been outed, and there are three categories of such requirements now: Minimum, Recommended, and DXR. The minimum requirements are pretty steep as they are: DICE say at least an AMD FX-8350 or an i5 6600K CPU are required, alongside 8 GB of system RAM (on the graphics front, a GTX 1050 / RX 560 are mentioned).

The recommended system requirements do bring some interesting tables to the mix, though, with AMD's Ryzen 3 1300X and Intel's i7 4790 being hailed as good CPUs for the configuration. This is in stark contrast with the minimum requirements, but here's the gist: it appears that Battlefield V will be a well-paralellized game, though it will also require strong per-core performance (hence why the FX-8350 doesn't make the cut, and why a previous-gen i7 is higher on the list than the 6000 series i5 from Intel). Minimum RAM for the Recommended spec stands at a whopping 12 GB, though - I believe this is the highest I've ever seen for a game release. An RX 580 or a GTX 1060 round out the specs.

ASUS, via its Republic o Gamers branding, today announced the Strix GL10CS gaming desktop, which fits full-size power into a compact 27-liter case that uses futuristic armor and ROG's obsession with speed as design inspirations.

Customizable Aura Sync RGB lighting can be controlled from Armoury Crate, a single utility that provides all-access configuration and monitoring of the GL10CS. GL10CS is equipped with up to a 6-core 12-thread Intel Core i7-8700 processor, capable of handling multiple concurrent workloads such as gaming, streaming and running voice communication for teammates. With up to 32GB of DDR4 memory, GL10CS effortlessly switches from productivity tasks to more demanding workloads provided by multi-threaded applications used by content creators.

QNAP Systems, Inc. introduces the brand-new TS-2888X AI-Ready NAS, an all-in-one AI solution combining robust storage and a ready-to-use software environment that simplifies AI workflows with high cost-efficiency. Built using next-gen Intel Xeon W processors with up to 18 cores and employing a hybrid storage architecture with eight hard drives and twenty high-performance SSDs (including 4 U.2 SSDs), the TS-2888X also supports installing up to 4 high-end graphics cards and runs QNAP's AI developer package "QuAI". The TS-2888X packs everything required for machine learning AI to help organizations quickly and easily implement AI applications.

"Compared with typical AI workstations, the TS-2888X combines high-performance computing with huge-capacity storage to greatly reduce latency, accelerate data transfer, and to eliminate performance bottlenecks caused by network connectivity," said David Tsao, Product Manager of QNAP, adding "integrating AI-focused hardware and software reduces the time and complexity for implementing and managing AI tasks, making the TS-2888X the ideal AI solution for most organizations."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced the release of the Z390 DESIGNARE motherboard with full support for the newest 8-core Intel Core i9-9900K processors. The newest addition to the GIGABYTE DESIGNARE series is a feature-packed motherboard that provides content creators the fastest and most efficient tools to showcase their creativity and craftsmanship. GIGABYTE DESIGNARE Series motherboards bring out the best in workstation graphics cards, maximize M.2 SSD and DDR4 RAM performance, and fully support powerful CPUs such as the newest 8-core Intel Core i9-9900K CPU. With built in USB Type-C Thunderbolt , and native USB 3.1 Gen 2 to provide 40Gb/s transmission speed, the board is designed with effective storage performance as a key feature. GIGABYTE Ultra-Durable Technology and exclusive software also bring additional value for digital content creators and design professionals.

"Today's content creators are seeking faster and more efficient performance from their PCs. GIGABYTE created the DESIGNARE series a few years back to fulfill these user demands," stated Jackson Hsu, Deputy Director of the GIGABYTE Channel Solutions Product Development Division. "Z390 DESIGNARE is the newest addition to this constantly evolving content creation focused series and is loaded with features that enable content creators to express their artistic creativity through their PCs with excellent performance and efficiency."

GIGABYTE introduced the X299-WU8, a high-end desktop motherboard being sold as a quasi-workstation-class board, in the CEB form-factor (305 mm x 267 mm). Based on Intel X299 Express chipset, it features out-of-the-box support for Intel's socket LGA2066 Core X 9000-series processors, in addition to existing Core X 7000-series. A design focus with this board is on PCIe connectivity. The board employs two PLX PEX8747 PCIx gen 3.0 x48 bridge chips, which convert two gen 3.0 x16 links from the processor to four downstream x16 links, which can further be switched to x8. All seven expansion slots are PCI-Express 3.0 x16 physically, which are electrically "x16/NC/x16/NC/x16/NC/x16" or "x16/x8/x8/x8/x8/x8/x8." The topmost slot stays x16, while the other six share three x16 links depending on how you populate them. The board has certifications for 4-way SLI and CrossFireX.

The GIGABYTE X299-WU8 draws power from a combination of 24-pin ATX and two 8-pin EPS connectors, conditioning it for the CPU with an 8+1 phase VRM. An additional 6-pin PCIe power input, which is optional, stabilizes slot power delivery to the graphics cards. The CPU socket is flanked by eight DDR4 DIMM slots, supporting up to 128 GB of quad-channel DDR4 memory. Storage connectivity is surprisingly sparse, with just one M.2-2280 slot that has PCIe 3.0 x4 wiring, and eight SATA 6 Gbps ports. USB connectivity includes USB 3.1 gen 2 (including a type-C port), a number of USB 3.1 gen 1 ports, both on the rear panel and via headers; high-end onboard audio including an ALC1220 CODEC and headphones amp; and two 1 GbE networking interfaces. Expect this board to be priced around $600, given that the PEX8747 isn't cheap these days, and this board has two of it.

Apple today announced a slew of updates to there product lines including an all-new MacBook Air and Mac Mini. Starting with the MacBook Air, Apple has finally given the system a proper upgrade bringing it back to relevance after years of stagnation. These upgrades include a 13.3-inch Retina display, Intel's 8th generation Core i5 processor with UHD Graphics 617, up to 16 GB 2133 MHz LPDDR3 and SSDs with capacities up to 1.5 TB. In terms of design, the shell is made of 100% recycled aluminum with the entire system weighing in at just 2.75 lbs compared to the outgoing models 2.96 lbs.

On top of the various hardware improvements, Apple has also included their Touch ID fingerprint sensor which is paired with their T2 chip for a secure login much the same as the current MacBook Pro. These two inclusions, along with the T2 chips ability to deliver on-the-fly data encryption makes the MacBook Air one of the most secure notebooks on the market according to Apple. However, one thing missing here is the Touch Bar, which will likely make more than a few users happy. The keyboard also gets upgraded to the same third generation with butterfly mechanism used on the MacBook Pro lineup.

Darren McPhee worked 12 years for ATI and AMD. When he left AMD in 2015, he was one of the company's top marketing managers. For the last three years he has worked for various companies, but the surprise has come with Intel recruiting him to occupy the position of Product Marketing Manager in its 'Discrete Graphics' group, one of the most interesting initiatives in the recent times.

This division is working hard to develop a new family of discrete graphics cards that will theoretically compete with AMD and NVIDIA solutions. Intel has been steadily growing, and in fact Intel already signed Raja Koduri, AMD GPU architect, in November 2017. This firm has been attracting more and more talent from an AMD: Koduri was followed by Jim Keller, Ryzen Architect, and Chris Hook, who led AMD's Radeon Technologies Group Marketing Departmen prior to his move to Intel. These hires certainly make it clear that Intel is taking an increasingly promising project very seriously. We will have to be patient, however, because the firm already indicated in SIGGRAPH 18 that it will have its first models ready in 2020.

Intel is facing a manufacturing crisis, in which demand has far outstripped supply, and the company is firing up all its silicon fabrication facilities to manufacture 14 nm products, mainly processors under the Core and Xeon brands. We've been hearing reports since early-September of Intel seeking out third-party foundries such as TSMC to manufacture its chipsets. We now get confirmation that TSMC will also manufacture entry-level Intel processors under brands such as Atom, Celeron, and Pentium Silver SoCs, leaving the company's socketed processors to Intel's fabs. DigiTimes does not name the third-party foundry as TSMC, but mentions that the only company that meets Intel's requirements at the moment is TSMC.