The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel's Foveros advanced packaging technology allows Intel to "mix and match" technology IP blocks with various memory and I/O elements - all in a small physical package for significantly reduced board size. The first product designed this way is "Lakefield," the Intel Core processor with Intel hybrid technology.

Industry analyst firm The Linley Group recently named Intel's Foveros 3D-stacking technology as "Best Technology" in its 2019 Analysts' Choice Awards. "Our awards program not only recognizes excellence in chip design and innovation, but also acknowledges the products that our analysts believe will have an impact on future designs," said Linley Gwennap, of The Linley Group.

A reportedly leaked Intel slide via DigitalTrends has given us a load of information on Intel's upcoming take on the high performance graphics accelerators market - whether in its server or consumer iterations. Intel's Xe has already been cause for much discussion in a market that has only really seen two real competitors for ages now - the coming of a third player with muscles and brawl such as Intel against the already-established players NVIDIA and AMD would surely spark competition in the segment - and competition is the lifeblood of advancement, as we've recently seen with AMD's Ryzen CPU line.

The leaked slide reveals that Intel will be looking to employ a Multi-Chip-Module (MCM) approach to its high performance "Arctic Sound" graphics architecture. The GPUs will be available in up to 4-tile configuration (the name Intel is giving each module), which will then be joined via Foveros 3D stacking (first employed in Intel Lakefield. This leaked slide shows Intel's approach starting with a 1-tile GPU (with only 96 of its 128 total EUs active) for the entry level market (at 75 W TDP) a-la DG1 SDV (Software Development Vehicle).

MSI got bored of old dark/gray/white laptop designs and decided to spice things up a bit. Say goodbye to the old boring laptops and enter the MSI Prestige 14 Limited Edition Rose Pink laptop. Designed as a premium-looking machine, it has decent specifications to back up the good looks. Equipped with a 14-inch IPS display comes in two variants, a 1080p version, and 4K edition, and it has 100% coverage of the AdobeRGB spectrum. With such specifications, we know that it is targeting the professional content creators.

Under the hood, there is Intel's 10th generation Core i7-10710U "Comet Lake" processor paired with 16 GB of LPDDR3 2133 MHz RAM running in single-channel mode. For graphics, NVIDIA's GTX 1650 Max-Q GPU is on board with 4 GB of GDDR6 memory. Storage is limited to 512 gigabytes of PCIe 3.0 NVMe SSD space, as there is no room for expansion. Connectivity options include Bluetooth 5 and Wi-Fi 6 powered by Intel Wi-Fi 6 AX201 wireless adapter. When it comes to the IO, the Prestige 14 laptop is rocking two USB 2.0 adapter along with two Thunderbolt 3 ports, one 3.5 mm headphone jack, and one Micro-SD card reader. There is also a 3-cell 50 Whr battery powering the system. Price-wise, this laptop is retailing for around $1399 on stores like Amazon and Newegg.

The leading global motherboard, graphics card and mini PC manufacturer, ASRock, announces X570 Phantom Gaming-ITX/TB3 receives the Thunderbolt Host certification from Intel. It is the first Thunderbolt Certified AMD motherboard.

X570 Phantom Gaming-ITX/TB3 is the high-end Mini-ITX model in the ASRock X570 series motherboard which supports AMD Ryzen 2000 and 3000 series processors with AM4 socket. It is equipped with 10 power phase design (Dr.MOS) which provides completely smooth power delivery to the CPU to offer unmatched overclocking capabilities, and enhanced performance with the lowest temperature for advanced gamers. The key feature of this motherboard, Thunderbolt 3 technology, enables lightning-fast data bandwidth up to 40 Gbps, and can also provide both data and video transmission. Meanwhile, X570 Phantom Gaming-ITX/TB3 can connect up to six Thunderbolt 3 devices such as graphics card, hard disk or monitor simultaneously by means of Daisy Chain technology.

The Designare brand of motherboards by GIGABYTE target content creators, and the company is extending the brand to memory, with the new Designare Memory series. It debuts with a high-capacity 64 GB dual-channel memory kit using two 32 GB modules. The rationale behind these densities is that creators may need them to deal with large data-sets. These are not off-spec "double height" modules, but are common dual-rank modules that stick to JEDEC compatibility spec, and pack XMP profiles that can run them at DDR4-3200 with 16-18-18-38 timings at 1.35 V.

GIGABYTE has tested these modules to work on all of its AMD X570, AMD B450, AMD TRX40, Intel X299, and Intel Z390 motherboards. For X570 and B450, however, the company states that only 3rd generation "Matisse" processors can handle this memory density. In its compatibility testing, GIGABYTE used 18-19-19-39 timings. Physically, the Designare modules have regular 32 mm height, a black PCB, and aluminium heatspreaders. GIGABYTE is backing the modules with lifetime warranty. The company didn't reveal pricing.

Microsoft today has released several microcode updates for Intel CPUs. The updates are meant to be applied in a case-by-case basis under their Windows 10 operating system, and these updates target several releases of that OS (ranging from version 1507 through version 1903/1909). These address several vulnerability exploits related to side-channel and speculative execution attacks on Intel CPUs.

The updates need to be installed specifically for the Windows OS version you're rocking, and on systems with CPUs affected by the vulnerabilities and covered by this microcode update release. These include Intel's Denverton (Atom C3000 series); Sandy Bridge, Sandy Bridge E and EP (2000 and 3000 series), Valleyview (Atom Z3000 series) and Whiskey Lake U CPUs (8000U series, 5000U series, and 4200U series). These updates must be installed manually by users.

Thanks to the findings of VideoCardz, we have information that GIGABYTE has listed its upcoming motherboards for AMD and Intel platforms. Starting with AMD's upcoming mid-range chipset, the B550 model is supposed to bring PCIe 4.0 connectivity options to lower-priced motherboard variants. So far, only high-end chipset versions like X570 had PCIe 4.0 support, while the mid-range option was lacking. GIGABYTE has prepared a total of six B550 AORUS models, along with a GAMING series which is supposed to be a tier below AORUS models. The B550 chipset will span all motherboard sizes, including ATX, Micro-ATX, and Mini-ITX.

In the EEC listing, GIGABYTE also submitted Intel's upcoming Z490 motherboards for Comet Lake-S CPUs. In the listing, we see a total of 15 motherboards listed with an unusable entry. Again the W480 chipset appears, which is meant to power workstation motherboards. This chipset will go inside a new motherboard lineup called the "VISION" series. While we don't know what this new series brings, we know that both the workstation enabled W480 chipset and regular Z490 chipset will be a part of it.

According to VideoCardz, ASRock has already listed Intel's upcoming lineup of motherboards in its Polychrome Sync software for controlling the RGB lighting of your motherboard. In the installed program files, ASRock displays several of the models that are a part of Intel's upcoming LGA1200-based Comet Lake-S 10th generation of CPUs. There are a total of nine Z490 motherboards and they are ASRock Z490 AQUA, Phantom Gaming 4, Phantom Gaming 4 SR, Phantom Gaming 6, Pro4, Steel Legend, Taichi, Z490M ITX AC, and Z490M Pro4.

When it comes to the cheaper, non-overclockable H470 chipset, there are two motherboards listed - H470 Steel Legend and H470M ITX AC. Additionally, perhaps one of the most interesting finds is the appearance of W480 chipset meant for workstation solutions. The motherboard using the new chipset is a model named W480 Creator, which should be a new addition to the consumer motherboard lineup.

Intel Core i5-L16G7 is the first commercial SKU that implements Intel's "Lakefield" heterogenous x86 processor architecture. This 5-core chip features one high-performance "Sunny Cove" CPU core, and four smaller "Tremont" low-power cores, with an intelligent scheduler balancing workloads between the two core types. This is essentially similar to ARM big.LITTLE. The idea being that the device idles most of the time, when lower-powered CPU cores can hold the fort; performance cores kick in only when really needed, until which time they remain power-gated. Thai PC enthusiast TUM_APISAK discovered the first public appearance of the i5-L16G7 in an unreleased Samsung device that has the Userbenchmark device ID string "SAMSUNG_NP_767XCL."

Clock speeds of the processor are listed as "1.40 GHz base, with 1.75 GHz turbo," but it's possible that the two core types have different clock-speed bands, just like the cores on big.LITTLE SoCs. Other key components of "Lakefield" include an iGPU based on the Gen11 graphics architecture, and an LPDDR4X memory controller. "Lakefield" implements Foveros packaging, in which high-density component dies based on newer silicon fabrication nodes are integrated with silicon interposers based on older fabrication processes, which facilitate microscopic high-density wiring between the dies. In case of "Lakefield," the Foveros package features a 10 nm "compute field" die sitting atop a 22 nm "base field" interposer.

Blizzard today released the system requirements for their remastered version of Warcraft III, Warcraft III: Reforged. The new game sees the inclusion of the original Reign of Chaos campaign and its expansion, the Frozen Throne, amounting to 60 campaign missions. Reworked graphics, four-hours of updated in-game cutscenes and re-recorded voice-overs are paired with rebalanced online play and the addition of social and matchmaking capabilities.

Requirements-wise, it's a light game on its minimum settings for sure: Blizzard says gamers will need an Intel Core i3-530 or AMD Athlon Phenom II X4 910. A mere 4 GB of system RAM and an NVIDIA GeForce GTS 450 or AMD Radeon HD 5750 will be required to power the games' visuals. If you aren't looking for the minimum specs but how good of an experience you'll have, the Recommended specs up the ante: an Intel Core i5-6400 or AMD Ryzen 7 1700X or better are being called for, paired with 8 GB of RAM and an NVIDIA GeForce GTX 960 or AMD Radeon R9 280X.

Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.

The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.

With its own silicon fabrication facilities pushed to their capacity limits, Intel is looking for third-party semiconductor foundries to share some of its supply load, and according to a WCCFTech report, its latest partner could be GlobalFoundries, which has a 14 nm-class fab in Upstate New York. If it goes through, the possible Intel-GloFo deal could see contract manufacturing commence within 2020.

GloFo's fab offers 14 nm FinFET and 12LPP, a refinement that's marketed as 12 nm. According to the report, Intel could use GloFo for manufacturing CPU dies, specifically its entry-level chips such as Core i3, Pentium, and Celeron. Intel is also known to shed its own manufacturing workload by contracting foundries for 14 nm core-logic (chipsets). In a bid to maximize 14 nm fab allocation for its CPUs, Intel also started making some of its 300-series chipsets on the older 22 nm process, which goes to show the company's appetite for 14 nm.

Intel's upcoming 400-series desktop chipset will lack support for PCI-Express gen 4.0. The motherboards will stick to gen 3.0 for both the main x16 PEG slots wired to the LGA1200 socket, and general purpose PCIe lanes from the PCH, according to a Tom's Hardware report. It was earlier expected that 400-series chipset motherboards will come with preparation for PCIe gen 4.0, so even if the upcoming 10th gen "Comet Lake" desktop processors lacked gen 4.0 root-complexes, the boards would be fully ready for the new bus standard in 11th gen "Rocket Lake" desktop processors.

10th gen "Comet Lake" desktop processors are built on 14 nm process, and implement Intel's current-gen CPU core design Intel has been implementing since 6th gen "Skylake." It's only with 11th gen "Rocket Lake" that the mainstream desktop platform could see a new CPU core design, with the company reportedly back-porting "Willow Cove" CPU cores to the 14 nm process. "Rocket Lake" is also expected to feature a small Gen12 iGPU with 32 execution units, and a new-gen uncore component that implements PCIe gen 4.0. PCIe gen 4.0 doubles bandwidth over gen 3.0, and while only a handful GPUs support it, the standard is made popular by a new generation of M.2 NVMe SSDs that are able to utilize the added bandwidth to push sequential transfer rates beyond M.2 PCIe 3.0 x4 limitations.

As we gear up for another Intel CPU launch with their 10th Gen Comet Lake-S CPUs with up to 10 cores, motherboard manufacturers have to go through the process of getting their products approved through various regulatory requirements. The Eurasian Economic Commission is one which constantly gives little snippets towards the future, and now, MSI motherboards based on Intel's Z490 chipset and LGA 1200 socket have shown up.

Knowing MSI's usual staple of motherboards for each product generation, there aren't many surprises here. The entries refer to these MSI motherboards: Z490-A PRO (Standard ATX); Creator Z490I (Mini-ITX); MAG Z490 TOMAHAWK (Standard ATX); MPG Z490M GAMING EDGE WIFI (Micro-ATX); MPG Z490 GAMING; CARBON WIFI (Standard ATX); MPG Z490 GAMING PLUS (Standard ATX); MEG Z490I UNIFY (Mini-ITX); MEG Z490 UNIFY (Standard ATX); MPG Z490 GAMING EDGE; WIFI (Standard ATX); MEG Z490 ACE (Standard ATX); MEG Z490 GODLIKE (E-ATX). You can expect the GODLIKE to be so in both features and price, as usual, topping out MSI's lineup.

CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced industry leading chipmaker Intel as its newest member. Intel is contributing the Advanced Interface Bus (AIB) to CHIPS Alliance to foster broad adoption.

CHIPS Alliance is hosted by the Linux Foundation to foster a collaborative environment to accelerate the creation and deployment of open SoCs, peripherals and software tools for use in mobile, computing, consumer electronics and Internet of Things (IoT) applications. The CHIPS Alliance project develops high-quality open source Register Transfer Level (RTL) code and software development tools relevant to the design of open source CPUs, SoCs, and complex peripherals for Field Programmable Gate Arrays (FPGAs) and custom silicon.

Back at CES, at the FSP booth, we spied an inconspicuous-looking PSU with a curious 10-pin connector in place of the 24-pin ATX. The FSP500-30AKB turned out to be the first public exhibit of a the pure 12-Volt PC power supply standard being pushed by Intel, which is called "ATX12VO," which abbreviates Advanced Technology eXtended 12-Volt Only. According to the specification, the PSU only puts out +12 V and 12 Vsb voltage domains, and does away with the 5 V, 5 Vsb, and 3.3 V domains. This greatly simplifies the design of PSUs, as PCs of today don't use too many power-hungry 5 V or 3.3 V devices (such as half-a-dozen mechanical hard drives). The PC will still need 5 V for interfaces such as USB, but VRM on the motherboard will be responsible for DC-to-DC switching of 12 V to those lower-voltage domains. It's also likely that the motherboard will now put out a handful SATA power connectors.

Intel could debut ATX12VO within 2020 via its next-generation desktop platform, which features a 10-pin connector instead of 24-pin. It remains to be seen if the company could help the transition from current PSUs to the new standard by having its motherboard partners include a 24-pin to 10-pin adapter of some sort. In addition to the 10-pin connector, ATX12VO PSUs will put out two other purely-12 V connector types: 8-pin/4+4 pin EPS and 6+2 pin PCIe power. The EPS connector powers the CPU VRM, while the PCIe connector powers add-on cards, such as graphics cards. 4-pin Molex connectors could also be put out, but those will only feature 12 V pins (the 5 V pins will be absent).

Intel Corporation announced today that at the company's Jan. 15 board meeting Andy D. Bryant stepped down as chairman and the board elected lead independent director Dr. Omar Ishrak to succeed Bryant as an independent chairman, effective immediately. Intel also announced that Alyssa Henry was elected to Intel's board. Her election marks the seventh new independent director added to Intel's board since the beginning of 2016.

Bryant will remain on the board through the end of Intel's 2020 annual stockholders' meeting. He had previously notified the board in March 2019 that he did not intend to stand for re-election at this year's meeting. Bryant made the decision to leave the role now in order to facilitate an effective transition.

QNAP Systems, Inc. today launched the 2-bay TS-251D NAS. Powered by an Intel J4005 dual-core processor, the TS-251D can be used with QNAP's smart AI photo management application, QuMagie, which integrates AI image recognition to group similar photos together in album "People", "Things" and "Places". The 4K media transcoding and streaming capabilities of the TS-251D brings users an excellent and satisfying cross-device multimedia experience. The TS-251D also provides a PCIe slot for expanding its core functionality.

Powered by an Intel Celeron J4005 dual-core 2.00 GHz processor (burst up to 2.7 GHz), DDR4 RAM (up to 8 GB), one Gigabit LAN port, and supports SATA 6 Gbps drives. The TS-251D provides dependable read/write speeds and Intel AES-NI 256 hardware-accelerated encryption to secure sensitive and confidential data on the NAS. The TS-251D also supports snapshots, allowing users to quickly recover data in the event of accidental deletion/modification or ransomware attack.

Intel's policy on CPU pricing has been a strong, definite one for years: no price reductions. Faced with less than admirable competition from a struggling AMD back in its Phenom and especially Bulldozer days, Intel enforced a heavy hand on the market and on CPU pricing. However, a much revitalized AMD and difficulties in the transition to the 10 nm process have left Intel with no other recourse than to cut pricing on its CPUs in order to remain competitive. No uptake of new I/O technologies such as PCIe 4.0 has also taken its toll on Intel's position in the server and HEDT market, which has led to recent price-cuts and tightening of Intel's Xeon line of CPUs - as well as price-cuts in the order of 50% in their Cascade Lake-X processors compared to the previous generation.

DigiTimes, citing industry PC makers, says that Intel is gearing up to keep fighting in the only front it actually can, besides puny core count increases on their heavily-iterated Skylake architecture - pricing. This move comes in a bid to keep its market dominance, which Intel themselves have said - after Zen 2, that is - isn't a priority for the consumer market. You can rest assured that Intel is very, very likely already practicing hefty price reductions for tray-quantity purchases for partners. However, it seems that the company might bring some price cuts on to its upcoming Comet Lake CPUs. The company has always been loathe to reduce pricing on existing inventory, rather choosing to reduce the price on new launches (see the Cascade Lake-X example above), which, arguably, saves Intel's face on claims of only being able to compete on pricing - which lurks dangerously close to Intel being painted as the budget, price-cut alternative to AMD.

Intel NUC 11 Extreme is the spiritual successor to the "Hades Canyon" and "Skull Canyon" NUC, and implements the company's next-generation 10 nm+ "Tiger Lake" processor. Codenamed "Panther Canyon," the NUC 11 Extreme represents a line of ultra-compact desktops with serious computing power, bringing together the company's highest-performance CPU cores and iGPUs. The "Tiger Lake-U" SoC powering the NUC 11 Extreme will reportedly be configured with a 28-Watt TDP, and will come in Core i3, Core i5, and Core i7 variants.

The "Tiger Lake-U" processor is expected to combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture, in what could be the first commercial outing for both. The NUC 11 Extreme "Panther Canyon" will also support up to 64 GB of dual-channel DDR4-3200 memory over SO-DIMMs, an M.2-2280 slot with PCI-Express 4.0 x4 and SATA 6 Gbps wiring, and option for Intel Optane M10 cache memory. On the connectivity front, and Intel AX-201 WLAN card provides 802.11ax Wi-Fi 6, and Bluetooth 5. A 2.5 GbE wired interface will also be available. These will also be among the first NUCs to feature front- and rear-Thunderbolt ports (possibly next-gen 80 Gbps given that the platform implements PCIe gen 4.0). The NUC 11 Extreme "Panther Canyon" is expected to launch some time in the second half of 2020.

This year's Game Developers Conference (GDC) that will take place in March is forming to become a very interesting one. According to the GDC schedule platform, Intel is having a presentation about its upcoming Xe graphics card architecture. Saying that "Intel's brand new Xe Architecture, has been teased for a while, and is scheduled for release later this year! This update brings a significant compute, geometry and throughput improvements over today's widely used Gen9 and Gen11 graphics.", Intel is giving us a slight hint of what is to come.

Presented by Intel's senior developer relations engineer, Antonie Cohade, the talk will include an in-depth look of the Xe hardware architecture and its implementations. Said to introduce "powerful new features", the talk about Xe graphics should include a mention of the latest trend in the world of 3D graphics, ray tracing, and show us what are the capabilities of the new GPU architecture.

Razer had an interesting outing at CES 2020. There were no new PC gaming peripherals, other than Star Wars "storm trooper" co-branded Kraken, Goliathus, and Atheris; but three interesting exhibits. To begin with, Razer Kishi is an adjustable, split game controller for smartphones. The controller's two ends (meant for your left and right hands, wrap around the two ends of your smartphone. You get two analog thumbsticks, a D-pad, four action buttons, and four triggers. The Razer Gamepad app lets you map the controller to your smartphone over Bluetooth, and provides custom button mapping. The company also showed off Arctech line of smartphone sleeves that are designed to dissipate heat.

Having made its mark as a leading gaming notebook vendor, Razer is turning its attention to pre-built gaming desktops, and we saw one of its first creations, the Tomahawk SFF. Much like Apple, Razer has a serious focus on form as much as function, and that's evident with the aluminium CNC precision-milled chassis with tempered glass side-panels, and a size that's fit both for desks and the living room.

The ThinkPad brand from Lenovo has always represented serious business on the move, right from its IBM origins. At CES 2020, the company unveiled what is possibly the best foldable PC design we've seen till date, the ThinkPad X1 Fold. The X1 Fold is a 13.3-inch tablet that folds perfectly along the middle to either a book-like orientation, or as a laptop, in which the top half becomes the display, and the bottom half your keyboard of whichever possible layout. If a touchscreen keyboard doesn't appeal to you, you can dock an accessory that has a physical keyboard and trackpad.

Under the hood of the X1 Fold is an Intel "Lakefield" Hybrid x86 SoC that combines high-performance and high-efficiency x86 cores and dynamically allots workload to them while power-gating on the fly (a la ARM big.LITTLE). When it comes out mid-2020 (likely a Computex 2020 launch), the ThinkPad X1 Fold will be driven by Windows 10X, a new operating system Microsoft is designing specifically for dual-screen mobile computing devices. The Flex 5G is Lenovo's first business notebook with an integrated 5G modem (in addition to Wi-Fi 6), so you can enjoy high-speed mobile Internet on the move. Lastly, we spotted the Lenovo Ducati notebook, a co-branded product of the company's MotoGP team sponsorship.

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the release of the Vulkan 1.2 specification for GPU acceleration. This release integrates 23 proven extensions into the core Vulkan API, bringing significant developer-requested access to new hardware functionality, improved application performance, and enhanced API usability. Multiple GPU vendors have certified conformant implementations, and significant open source tooling is expected during January 2020.

Vulkan continues to evolve by listening to developer needs, shipping new functionality as extensions, and then consolidating extensions that receive positive developer feedback into a unified core API specification. Carefully selected API features are made optional to enable market-focused implementations. Many Vulkan 1.2 features were requested by developers to meet critical needs in their engines and applications, including: timeline semaphores for easily managed synchronization; a formal memory model to precisely define the semantics of synchronization and memory operations in different threads; descriptor indexing to enable reuse of descriptor layouts by multiple shaders; deeper support for shaders written in HLSL, and more.

Way back in June 2018, when the first Threadrippers made landfall, it was reported that Intel was working on a new 22-core "Skylake-X" silicon that sat in between the 18-core HCC (high core-count) die, and the 28-core XCC (extreme core-count) die. The roughly 700 mm² XCC die, with its 6 memory channels, couldn't be integrated with the LGA2066 package, and was reserved for the enterprise LGA3647 package that made a workstation/quasi-client debut with the 28-core Xeon W-3175X. It was hence rumored that an in-between 22-core silicon was under development that could be integrated with LGA2066. Fast forward to 2020, and Intel's client HEDT processor lineup doesn't look much different from its 2017 one. The 18-core i9-10980XE leads the pack, and despite its $1,000 price, has received largely lukewarm reviews. If screenshots surfacing on Chinese tech forums are to be believed, Intel is toying with the idea of the 22-core die meant for LGA2066 once again.

Referenced as Core i9-10990XE in straight-up CPU-Z screenshots, the processor is based on the "Cascade Lake-X" microarchitecture, and has the same I/O as the i9-10980XE, looking at the instruction sets featured. It has 22 cores and HyperThreading enables 44 threads. Cache hierarchy and balance are characteristic of "Cascade Lake," with 1 MB of dedicated L2 cache per core, and 30.25 MB of shared L3 cache. The I/O is likely identical to the i9-10980XE as that's a function of the platform and the socket. What's more interesting are the clock-speeds. The name-string of the engineering sample references a nominal clock-speed of 4.00 GHz, and in the screenshot, the chip is shown running at 5.00 GHz (at least on one core). There's also a performance benchmark to go with the leak, possibly CineBench R20 nT. Here, the i9-10990XE is shown scoring 14,005 points, which is in the same ballpark as the 24-core Ryzen Threadripper 3960X.