Intel has today launched a new product called Data Streaming Accelerator known as Intel DSA shortly. The new device is going to be present inside every future Intel processor with a goal of "optimizing streaming data movement and transformation operations common with applications for high-performance storage, networking, persistent memory, and various data processing applications."

The DSA processor will replace an existing solution that is Intel QuickData Technology, which was previously used for data movement. This new dedicated processor has a much-needed purpose to free up CPU cycles from doing IO work like moving data to/from volatile memory, persistent memory, memory-mapped I/O, and through a Non-Transparent Bridge (NTB) device to/from remote volatile and persistent memory inside a chip. In addition to the usual data movement operations, the DSA processor can create and test CRC checksums for any errors in storage and networking applications.

The HEDT or high-end desktop platform occupies the gray area between desktops and workstations. It has been originally meant for power-users, enthusiasts, and creative professionals. Over the years, with ballooning core-counts, memory bandwidth, and I/O connectivity, the target-audience of the HEDT evolved. Now these processors are useful for people who need a lot of multi-threaded CPU performance with more I/O connectivity than what traditional desktop platforms offer; and who have not use for "workstation" features such as ECC memory, or simply don't want to spend the money.

AMD doubled CPU core counts for its traditional Ryzen desktop platform this year with the introduction of 12-core and 16-core parts; forcing its 3rd gen Threadripper family to begin with even higher core-counts, starting with the 3960X 24-core part at $1,399. Intel, on the other hand, is in a bit of a pickle. Intel's 10 nm silicon fabrication node development isn't benefiting its desktop or HEDT platforms. Allocations of its 10 nm node are mopped up by its high-volume mobile processor and high-margin enterprise processor businesses, leaving too little allocation to roll out desktop or HEDT 10 nm chips at scale.

Intel is set to become the world's largest semiconductor supplier of 2019, according to the research from IC Insights. Intel held a crown for the largest semiconductor supplier since 1992, until 2018 when Samsung overtook it because of the booming DRAM business driven by high demand and not enough supply. Being Samsung's main business, any DRAM price/demand fluctuation was having a massive impact on its business. Due to high demand and high pricing, Samsung saw a massive revenue jump which resulted in a new king of the world's largest semiconductor supplier.

However, having seen predictions for a fall of 34% for this year, the decrease in demand will result in lower revenue for all DRAM market suppliers. SK Hynix, Micron and Samsung are expecting their revenues to decline around 29% on a year-over-year basis given the situation. This is resulting in lower revenue for Samsung than Intel has, and makes Intel the king of semiconductors once more. Intel's revenue is expected to reach around 70 billion USD, which is similar to last year's numbers.

With its "Skylake" microarchitecture, Intel significantly re-balanced the cache hierarchy of its HEDT and enterprise multi-core processors to equip CPU cores with larger amounts of faster L2 caches, and lesser amounts on slower shared L3 cache. The company retained its traditional cache balance for its mobile and desktop processor derivatives. This could change with the company's "Tiger Lake" microarchitecture, particularly the "Willow Cove" CPU cores they use, according to a Geekbench online database listing for a prototype quad-core "Tiger Lake-Y" mobile processor.

According to this listing, assuming Geekbench is reading the platform correctly; the "Tiger Lake-Y" processor features a 4-core/8-thread CPU, with a massive 1,280 KB (1.25 MB) of L2 cache per core, and 12 MB of L3 cache. Intel also enlarged the L1D (data) cache to be 48 KB in size, while the L1I (instruction) cache remains 32 KB. This amounts to a 400% increase in L2 cache size, and a 50% increase in L3 cache size. Unlike with "Skylake-X," the increase in L2 cache size doesn't come with a decrease in shared L3 cache size (per core). The "Tiger Lake-Y" processor is being tested on a "Corktown" prototyping platform (a specialized motherboard that has all possible I/O connectivity available with the platform, for testing. "Tiger Lake" is expected to make its debut some time in 2020-21 as a successor to "Ice Lake," and will be built on Intel's refined 10 nm++ silicon fabrication node. Find the Geekbench entry in the source link below.

Intel executive vice-president and general manager for sales, marketing, and communications, Michelle Johnston Holthaus, in a letter addressing the company's customers and partners, expressed regret that the company hasn't been able to resolve the challenge of PC CPU supply falling behind market growth (demand) despite its "best efforts." She elaborated on these efforts by summarizing additional billions of dollars in capital-expenditure the company spent in retrofitting its facilities to 14 nm fabs. The added capacity increased Intel's output in 2H 2019 by a "double digit" percentage compared to 1H, however, even that proved insufficient to cope with market demand. "Sustained market growth in 2019 has outpaced [Intel's] efforts and exceeded third-party forecasts," she said.

"Supply remains extremely tight in our PC business where we are operating with limited inventory buffers. This makes us less able to absorb the impact of any production variability, which we have experienced in the quarter. This has resulted in the shipment delays you are experiencing, which we appreciate is creating significant challenges for your business," she added, probably referring to the vast portfolio of dozens of SKUs of products that aren't yet EOL, but share the same 14 nm node. Intel deployed its product representatives to proactively reach out to all their customers to "answer their questions." This is probably another way of saying "retaining your businesses." Intel is embattled on two fronts: to make its 14 nm supply keep pace with demand; and to quantitatively transition to the newer 10 nm process.

ASUS today announced the new ProArt StudioBook Pro X (W730), which provides a wide range of features designed for professional creators. It's the first Quadro laptop that is powered by 9th Gen Intel Xeon processor with NVIDIA Quadro RTX 5000 graphics. This combination of cutting edge graphics and portability makes it perfect for creative professionals to achieve their goals on-the-go or in office.

ProArt StudioBook Pro X delivers the needed performance to create, edit, and render multilayered files using the latest NVIDIA Quadro RTX 5000 graphics. These NVIDIA RTX Studio laptops utilize NVIDIA Turing architecture, allowing creative and technical professionals to take advantage of the power of hardware-accelerated ray tracing, deep learning, and advanced shading techniques when creating amazing content. Intel Xeon processors are designed to handle complex, multithreaded applications, and takes mobile computing to another level by making it incredibly smooth and responsive.

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

MATLAB is a popular math computing environment in use by engineering firms, universities, and other research institutes. Some of its operations can be made to leverage Intel MKL (Math Kernel Library), which is poorly optimized for, and notoriously slow on AMD Ryzen processors. Reddit user Nedflanders1976 devised a way to restore anywhere between 20 to 300 percent performance on Ryzen and Ryzen Threadripper processors, by forcing MATLAB to use advanced instruction-sets such as AVX2. By default, MKL queries your processor's vendor ID string, and if it sees anything other than "GenuineIntel...," it falls back to SSE, posing a significant performance disadvantage to "AuthenticAMD" Ryzen processors that have a full IA SSE4, AVX, and AVX2 implementation.

The tweak, meant to be manually applied by AMD Ryzen users, forces MKL to use AVX2 regardless of the CPU Vendor ID query result. The tweak is as simple as it is powerful. A simple 4-line Windows batch file with a set of arguments starts MKL in AVX2 mode. You can also make the tweak "permanent" by creating a system environment variable. The environment variable will apply to all instances of MATLAB, and not just those spawned by the batch file. Nedflanders1976 also posted a benchmark script that highlights the performance impact of AVX2, however you can use your own scripts and post results.

For those wanting 802.11ax Wi-Fi 6 on their desktops without an M.2 E-key slot on their motherboards, ASUS came up with the PCE-AX3000, a low-profile capable (half-height) NIC that provides up to 3000 Mbps (2.4 Gbps over 5 GHz and 600 Mbps over 2.4 GHz) wireless connectivity, and the added convenience of Bluetooth 5.0 for short-range communications. A set of MU-MIMO antennae come included. Besides MU-MIMO, the card supports OFDMA for better collision-prevention with other devices in the same channel, and WPA3 security protocol. The NIC is essentially a PCI-Express 3.0 x1 add-on card with an M.2 E-key slot that holds an Intel AX200 "Cyclone Peak" WLAN card. We expect the AX3000 to be priced well under $50 given that the "Cyclone Peak" card at the heart of it costs just $10-17 in volume pricing.

At Supercomputing 2019, Intel unveiled its vision for extending its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and an ambitious new software initiative that represents a paradigm shift from today's single-architecture, single-vendor programming models.

Addressing the increasing use of heterogeneous architectures in high-performance computing, Intel expanded on its existing technology portfolio to move, store and process data more effectively by announcing a new category of discrete general-purpose GPUs optimized for AI and HPC convergence. Intel also launched the oneAPI industry initiative to deliver a unified and simplified programming model for application development across heterogenous processing architectures, including CPUs, GPUs, FPGAs and other accelerators. The launch of oneAPI represents millions of Intel engineering hours in software development and marks a game-changing evolution from today's limiting, proprietary programming approaches to an open standards-based model for cross-architecture developer engagement and innovation.

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from customers and distributors. The boxed SKU of the E-2274G, which includes a stock cooling solution, has been marked as "discontinued" and "end of life." Intel is offering an E-2274G tray processor (chip-only) as replacement for the returned inventory. The cause for the recall is the cooling solution included in the boxed SKU, which has been found to be insufficient to cool the E-2274G, a 4-core/8-thread processor based on the 14 nm++ "Coffee Lake" microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is supplied by Foxconn, and has been known to be bundled with Intel's entry-level client-segment processors, such as the Pentium Gold series and Core i3 series (chips with TDP typically rated 65 W or less). It features a thin, circular, all-aluminium heatsink, which lacks a copper core that certain other LGA115x-compatible stock coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium surface, with spirally-projecting fins dissipating heat under the fan's airflow. It could be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that's designed for the rigors of mission-critical use-cases such as workstations and small-business servers.Heatsink images courtesy: AndyKingParts (Amazon seller)

Intel's first Xe GPU built on the company's 7 nm silicon fabrication process will be codenamed "Ponte Vecchio," according to a VideoCardz report. These are not gaming GPUs, but rather compute accelerators designed for exascale computing, which leverage the company's CXL (Compute Express Link) interconnect that has bandwidth comparable to PCIe gen 4.0, but with scalability features slated to come out with future generations of PCIe. Intel is preparing its first enterprise compute platform featuring these accelerators codenamed "Project Aurora," in which the company will exert end-to-end control over not just the hardware stack, but also the software.

"Project Aurora" combines up to six "Ponte Vecchio" Xe accelerators with up to two Xeon multi-core processors based on the 7 nm "Sapphire Rapids" microarchitecture, and OneAPI, a unifying API that lets a single kind of machine code address both the CPU and GPU. With Intel owning the x86 machine architecture, it's likely that Xe GPUs will feature, among other things, the ability to process x86 instructions. The API will be able to push scalar workloads to the CPU, and and the GPU's scalar units, and vector workloads to the GPU's vector-optimized SIMD units. Intel's main pitch to the compute market could be significantly lowered software costs from API and machine-code unification between the CPU and GPU.Image Courtesy: Jan Drewes

All Intel CPU microarchitectures since 2013 are vulnerable to a new class of "Zombieload," attacks, chronicled under "Zombieload v2" (CVE-2019-11135). This is the fifth kind of microarchitectural data sampling (MDS) vulnerability, besides the four already disclosed and patched against in Q2-2019. The vulnerability was kept secret by the people who discovered it, as Intel was yet to develop a mitigation against it. There is no silicon-level hardening against it, and Intel has released a firmware-level mitigation that will be distributed by motherboard manufacturers as BIOS updates, or perhaps even OS vendors. While Intel's latest enterprise and HEDT microarchitecture, "Cascade Lake" was thought to be immune to "Zombieload," it's being reported that "Zombieload v2" attacks can still compromise a "Cascade Lake" based server or HEDT that isn't patched.

"Zombieload v2" is an exploitation of the Asynchronous Abort operation of Transactional Synchronization Extensions (TSX), which occurs when malware creates read operation conflicts within the CPU. This reportedly leaks data about what else is being processed. "The main advantage of this approach is that it also works on machines with hardware fixes for Meltdown, which we verified on an i9-9900K and Xeon Gold 5218," reads the latest version of the Zombieload whitepaper that's been updated with "Zombieload v2" information. TSX is a requisite for "Zombieload v2," and all Intel microarchitectures since "Haswell" feature it. AMD processors are inherently immune to "Zombieload v2" as they lack TSX. Intel downplayed the severity or prevalence of "Zombieload v2," but dispatched microcode updates flagged "critical" nevertheless.

Here are some of the first pictures of Intel's new generation "Frost Canyon" NUC based on the company's 10th generation Core "Comet Lake-U" SoC. The top-spec variant, NUC10i7FN, is powered by a Core i7-10710U SoC, which packs a 6-core/12-thread CPU with 12 MB L3 cache, up to 4.70 GHz Turbo Boost, UHD Graphics clocked at 1.15 GHz, and 25 W cTDP (configurable TDP). The middle variant, NUC10i5FN, is powered by the 4-core/8-thread Core i5-10210U (up to 4.20 GHz CPU Turbo Boost, UHD Graphics with up to 1.00 GHz clocks, 8 MB L3 cache, and 25 W cTDP). At the entry level is the NUC10i3FN powered by the Core i3-10110U (2-core/4-thread CPU clocked up to 4.10 GHz, 4 MB L3 cache, UHD Graphics clocked up to 1.00 GHz, and 25 W cTDP).

Physically, these 10th generation NUCs look similar to their "Coffee Lake" powered predecessors codenamed "Bean Canyon," with the exception of just one each type-C and type-A USB 3.2 front panel ports. Other connectivity includes possible Wi-Fi 6 (802.11ax WLAN), 1 GbE, HDMI 2.0, Thunderbolt 3 with DP output on the top model, and an additional pair of 10 Gbps USB 3.2 ports. Intel is likely to launch "Frost Canyon" on December 12.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which now comes in a white edition along with new frequencies of 3,200 MHz and 3,600 MHz 2x 8 GB. TOUGHRAM is supported by Intel and AMD platforms and features 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB white edition is not only visually appealing, but is also high in performance. The TOUGHRAM RGB White Edition is built with premium fine coating that reveals true elegance from inside out.

The TOUGHRAM RGB DDR4 Memory Series 3,200 MHz and 3,600 MHz white edition is now available for pre-order at the TT Premium website. Please refer to the Thermaltake website or contact your local Thermaltake sales or PR representative for more information on pricing for the Thermaltake TOUGHRAM RGB DDR4 3,200 MHz and 3,600 MHz white edition memory kits.

Intel has today announced the Stratix 10 GX 10M - a Field Programmable Gate Array (FPGA) built on 14 nm technology that has an astonishing 43.3 Billion transistors, making it the largest FPGA in the world, dethroning the Xilinx with their previously largest Virtex VU19P FPGA which had a "mere" 35 Billion transistors. The Stratix 10 GX 10M is a home to over 10.2 million logic cells housed inside two large dies, connected by Intel's own Embedded Multi-die Interconnect Bridge (EMIB).

The 10M model is packing four additional dies besides the two for logic, also connected by EMIB, that feature 48 transceivers in total which have a combined bandwidth of up to 4.5Tb/s. If you are wondering about the bandwidth between all dies, then judging by EMIB's 25,920 connections, there is 6.5 Tb/s of inner-die bandwidth, meaning that components will not be starving for additional speeds to transfer the data. Additionally there are 2,304 user I/O pins, allowing for some creative integration solutions that involve plenty of ports for development purposes.

Intel CFO George Davis in an interview with Barron's commented on the company's financial health, and some of the reasons behind its rather conservative gross margin guidance looking forward to at least 2023. Intel's current product stack is moving on to the company's 10 nm silicon fabrication process in a phased manner. The company is allocating 10 nm to mobile processors and enterprise processors, while brazening it out with 14 nm on the client-desktop and HEDT platforms until they can build 10 nm desktop parts. AMD has deployed its high-IPC "Zen 2" microarchitecture on TSMC's 7 nm DUV process, with plans to go EUV in the coming months.

"We're still keenly focused on gross margin. Everything from capital efficiency to the way we're designing our products. What we've said though, the delay in 10 nanometer means that we're going to be a little bit disadvantaged on unit cost for a period of time. We actually gave guidance for gross margin out in 2021 to help people understand. 2023 is the period that we were ultimately guiding [when] we're going to see very strong revenue growth and margin expansion. We've got to get through this period where we have the 10 nanometer being a little bit late [as] we're not optimized on a node that we're on. But [by] then we're moving to a two to two and a half year cadence on the next nodes. So we're pulling in the spending on 7 nanometer, which will start up in the second half of 2021 because we think it's the right thing to do competitively," he said.

Intel announced its 10th generation Core i9 XE "Cascade Lake-X" HEDT processor family in October. At the time, market availability of these chips was slated for November 2019, although a date wasn't specified. A report by Chinese tech publication PCDIY sheds more light. According to the report, market availability of these chips could begin from 25th November, 2019, which would be 49 days or 7 weeks following its October 7 product announcement. Intel's lean 10th gen Core HEDT processor lineup includes 10-core, 12-core, 14-core, and 18-core SKUs at price-points ranging from roughly-$600 to $1,000.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which comes in new frequencies of 4,000 MHz, 4,266 MHz and 4,400 MHz 2x8 GB modules, supported by Intel and AMD platforms. Featuring 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB enhances overclocking performance and betters gaming experiences. The high-frequency memory kits are constructed with higher standard chips, which have been tested to achieve higher and more stable overclocks. Our latest module 4,400 MHz and 4,000 MHz was tested with Intel's Core i7 platform, ASUS ROG MAXIMUS XI GENE and MAXIMUS XI HERO motherboards and remained stable under load.

Thermaltake CEO Kenny Lin is excited to launch the newest addition to the TOUGRAM RGB Series. "We are glad to embrace the new era of high-frequency memory. With the rapid rise of esports, higher frequency ram is essential for faster and smoother performance. Level up your gameplay with the next level TOUGHRAM RGB DDR4 16 GB Memory Kit in 4,000 MHz, 4,266 MHz, 4,400 MHz." stated Thermaltake CEO Kenny Lin.

Brainbox, a Korean media outlet, has gathered information on Intel's newest Ice Lake and Cooper Lake server processors from a presentation ASUS held for its server lineup. With Cooper Lake-SP paving the way for the first server CPU model to be released on the new "Whitley" platform, it is supposed to launch in Q2 of 2020. Cooper Lake-SP comes with TDP of 300 W and will be available with configurations of up to 48 cores, but there also should be a 56 core model like the Xeon Platinum 9282, that has a TDP of 400 W. Cooper Lake-SP supports up to 64 PCIe 3.0 lanes, 8 channel memory (16 DIMMs in total) that goes up to 3200 MHz and four Ultra Path Interconnect (UPI) links.

Ice Lake-SP, built on the new 10 nm+ manufacturing process, is coming in soon after Cooper Lake-SP release, with a launch window in Q3 of 2020. That is just few months apart from previous CPU launch, so it will be a bit hard to integrate the launches of two rather distinct products. As far as the specifications of Ice Lake-SP goes, it will have up to 38 core for the top end model, within 270 W TDP. It supports 64 PCIe 4.0 lanes with three UPI links. There is also 8 channel memory support, however this time there is an option to use 2nd generation Optane DC Persistent Memory. Both CPU uArches will run on the new LGA 4189 on the P+ socket.

GIGABYTE expanded its AORUS RGB DDR4 memory family with two new kits that introduce a proprietary performance enhancement dubbed AORUS Memory Boost. Exclusive to GIGABYTE's AORUS-branded motherboards (listed below), and requiring a BIOS update to use, AORUS Memory Boost is a toggle that runs the memory at a clock-speed and timing combination that's a notch above its highest Intel XMP profile. For example, the memory kits debuting with the feature today feature an XMP 2.0 profile for DDR4-3600. Flicking on AORUS Memory Boost runs them at DDR4-3733, in essence making it an additional memory profile that's exclusive to GIGABYTE motherboards.

The memory kits being launched today are GP-AR36C18S8K2HU416R and GP-AR36C18S8K2HU416RD. The former is 2x 8 GB (16 GB) dual-channel, while the latter is 2x 8 GB (16 GB) with two dummy modules. These dummy modules fill up vacant DIMM slots, look and light up like real modules, and could boost the aesthetics of your build without having you spend on two additional real modules. Out of the box, the memory modules (real ones) in these kits run at DDR4-2667 with 19-19-19-43 on Intel processors and 20-19-19-43 on AMD ones. The included DDR4-3600 XMP profile has timings of 18-19-19-39. GIGABYTE didn't mention how AORUS Memory Boost affects timings. Out of the box, the module voltage is 1.2 V, and the XMP profile dials it up to 1.35 V. The dummies work with whatever module voltage you specify in the BIOS, and interface with GIGABYTE RGB Fusion software. The company didn't reveal pricing.

Today, MAINGEAR is pleased to announce that the all-new Intel 9th Gen Core i9-9900KS flagship processor is now available across its product line of award-winning custom gaming PCs and workstations. Created to be the ultimate gaming processor, the i9-9900KS features up to 5.0 GHz all-core turbo frequency across 8 cores and 16 threads — gamers looking for the ultimate power boost need look no further. MAINGEAR products featuring the i9-9900KS offer an unmatched level of performance that takes your gaming and streaming experience to the next level!

To celebrate this amazing achievement in processing power, MAINGEAR is offering the i9-9900KS in select desktop configurations, like the award-winning VYBE, with a Limited Edition VYBE 9900KS Edition — in extremely limited quantities. Powered by an 8-core Intel Core i9-9900KS, this special offering is a top-tier gaming machine and the best way to experience the incredible performance the i9-9900KS has to offer. The VYBE 9900KS Edition combines this monstrous processor with an NVIDIA GeForce RTX 2080 Ti, ASUS ROG Ryujin 360 RGB AiO CPU Liquid Cooler with color display that helps users keep temperatures low and all-white VYBE chassis.

Samsung Electronics today introduced Galaxy Book Flex and Galaxy Book Ion at the Samsung Developer Conference 2019 (SDC19), two premium laptops offering ultra-portable and ultra-powerful computing experiences to meet the unique needs of modern professionals for their always on-the-go lifestyles. Today's on-the-go consumers need PCs that deliver maximum productivity, while being mobile enough to take wherever you're going. Galaxy Book Flex and Galaxy Book Ion were built for that and more, offering a seamless continuity across multiple devices.

"Consumers often have to choose between mobility and high-performance hardware when choosing a laptop," said YoungGyoo Choi, Senior Vice President of, Mobile Communications Business at Samsung Electronics. "Galaxy Book Flex and Galaxy Book Ion eliminate the need to compromise by offering powerful performance with unparalleled portability and display innovation."

If you're one to pay more bucks for the same silicon in a bid to decrease risk of having a lower-performing overclocker than is possible with the latest AMD and Intel chips, this post is for you. Silicon Lottery has announced (absolutely expected) plans to bin AMD and Intel's latest high-performance processors starting this November.

AMD's Ryzen 9 3950X and Intel's Core i9 9900KS will be up for grabs in the website with guaranteed maximum clocks for you to peruse and then seat in your motherboard of choice. Just wait a little while longer for them to become available, since AMD's own Ryzen 9 3950X isn't yet available in the retail channel. Intel's own Core i9 9900KS has just been announced though, with availability just two days from now, on October 30th. So if you want to skip the hassle (or fun, as you see it) of finding just the right settings for your CPU of choice, keep refreshing Silicon Lottery's page. Availability is expected to be extremely limited on either part.

Intel today announced full details and availability for the new 9th Gen Intel Core i9-9900KS Special Edition processor. Delivering up to 5.00 GHz all-core turbo frequency out of the box for the ultimate gaming experience, the 9th Gen Intel Core i9-9900KS will be available beginning Oct. 30, with recommended customer price starting at $513. This special edition processor will be available for a limited time only and can be found at retailers worldwide.

"Intel has raised the bar for desktop gaming with the new 9th Gen Intel Core i9-9900KS Special Edition processor. Based on the 9th Gen Intel Core i9-9900K architecture, it's the world's best gaming desktop processor made even better and created specifically for extreme gamers who want the most performance possible. This processor demonstrates another innovation milestone for Intel, following last year's limited edition 8th Gen Intel Core i7-8086K," said Frank Soqui, Intel vice president and general manager of the Desktop, Workstation and Channel Group. The i9-9900KS processor is unlocked and boasts eight cores and 16 threads, up to 4.00 GHz base frequency, 127 W TDP, 16 MB Intel Smart Cache, and up to 40 platform PCIe lanes for gaming and overclocking.