Users of Intel's 13th Gen unlocked K-series processors such as Core i9-13900K, i7-13700K, are reporting stability issues when gaming even at stock clock-speeds. Hassan Mujtaba of Wccftech and Tom's Hardware have isolated the issues to power limit unlocks. Most Z690 and Z790 chipset motherboards include BIOS-level unlocks for the power limits, particularly the Maximum Turbo Power (interchangeable with PL2). By default, the i9-13900K and i7-13700K come with a PL2 value of 253 W, but you can get the motherboard to unlock this to unlimited, which basically tells the processor that it has 4096 W of power on tap, so not technically a "stock" configuration anymore.

Of course, neither your PSU nor your CPU VRM are capable of delivering 4096 W, and so the processor tends to draw as much power as it needs, to maintain the best possible P-core boost frequencies, before running into thermal limits. At stock frequencies with stock boost bins, unlocked power limits can drive the power draw of i9-13900K as far high as 373 W under a multithreaded load, in our testing, when compared to 283 W with the power limits in place. It turns out, that unlocking the power limits can come with long-term costs, besides the literal cost of electricity—the processor's stability with gaming workloads can degrade with certain hardware combos and settings.

MSI, a prominent gaming hardware brand, is excited to reveal its renewed collaboration with Ubisoft, a distinguished game publisher. Anticipation builds as MSI and Ubisoft join forces to bring gamers an unparalleled experience in the highly anticipated game—Skull and Bones. Navigate Treacherous Waters, Unleash Pirate Fury! Embark on a thrilling maritime journey with Skull and Bones, a captivating co-op pirate open world action-RPG experience. Sail through treacherous seas, engage in epic ship battles, and become the legendary pirate you were destined to be. Beware of every wave, for the open world awaits with dangers and opportunities alike. Are you ready to rule the sea?

Let's begin your private journey with MSI's advanced technologies!
Embark on an exciting adventure with MSI's special offer—buy selected MSI products and a complimentary Skull and Bones for free. Elevate your gaming rig with MSI's cutting-edge motherboards, PC cases, power supplies, liquid coolers, and graphics card. Dive into the thrilling world of Skull and Bones for an immersive gaming experience.

ASRock releases new BIOS for Intel 600/700 series motherboards, the updated BIOS is able to drastically improve CPU performance on 14th gen non-K series processors up to 10% with I7-14700 by Cinebench R23. The performance gain is benefit from Intel's latest microcode and ASRock is the first to implement this new update before Chinese New Year, the new BIOS for Z790 series motherboards are as below, 600 & B760 series will be updated shortly!

You can find the full list of motherboards and BIOS versions in the table below.

GIGABYTE Technology, a pioneer in computer hardware, has taken a significant stride in shaping its European business model. Today, GIGABYTE has broadened its e-commerce platform, shop.gigabyte.eu, by integrating enterprise server and server motherboard solutions into its product portfolio. Being at the forefront of computer hardware manufacturing, GIGABYTE recognizes that it is imperative to expand its presence in the EMEA region to maintain its leadership across all markets. With the introduction of our enterprise-level server and motherboard solutions, we are dedicated to delivering a diverse range of high-performance products directly to our B2B clients.

GIGABYTE offers a complete product portfolio that addresses all workloads from the data center to edge including traditional and emerging workloads in HPC and AI to data analytics, 5G/edge, cloud computing, and more. Our enduring partnerships with key technology leaders ensure that our new products are at the forefront of innovation and launch with new partner platforms. Our systems embody performance, security, scalability, and sustainability. Within the e-commerce product portfolio, we offer a selection of models from our Edge, Rack, GPU, and Storage series. Additionally, the platform provides server motherboards for custom integration. The current selection comprises a mix of solutions tailored to online sales. For more complex solutions, customers can get in touch via the integrated contact form.

DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel Core Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.

According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces that its AMD AM4 series motherboards are now compatible with the latest AMD Ryzen 5000 series processors.With the official unveiling of the Ryzen 8000 Series desktop processors, AMD has further enhanced its Ryzen 5000 Series, first released in 2020, by introducing four new processors. These additions include the Ryzen 7 5700X3D, Ryzen 7 5700, Ryzen 5 5600GT, and Ryzen 5 5500GT, all built on AMD's efficient Zen 3 architecture. This expansion of the Ryzen 5000 Series offers users a broader range of options, from high-end to mainstream, demonstrating AMD's dedication to diversifying its CPU offerings.

The AMD Ryzen 7 5700X3D and Ryzen 7 5700 processors are equipped with advanced technologies like AMD StoreMI, which enhances storage performance by combining SSDs and HDDs into a more efficient, single-tiered storage system. Additionally, they support AMD Ryzen VR-Ready Premium technology, offering greater immersion in virtual reality, even on older hardware. This combination of StoreMI and VR-Ready Premium technology ensures these processors deliver high storage efficiency and an enhanced VR experience, making them suitable for a wide range of demanding applications.

An exclusive report provides an initial tease of MSI's relaunch of MPOWER—a beloved product line of high performance yet wallet friendly motherboards. Wccftech published their Z790MPOWER model coverage only a few hours ago. MSI's final batch of MPOWER-branded boards landed back in 2017, with Z170 and Z270 chipsets (on Intel Socket 1151). Here is Wccftech's statement on the matter: "MSI is marking the return of the MPOWER series with a new and cost-effective Z790 product, the Z790MPOWER. This motherboard may look like a very mainstream design but it has something that only a few high-end motherboards can do and that is support for the best DDR5 memory out there."

They moved onto showcasing the board's feature set: "Starting with the details, the MSI Z790MPOWER motherboard features the LGA 1700/1800 socket & supports 12th, 13th, and 14th Gen CPUs from Intel. It is powered by a 15-Phase VRM design which is provided power through dual 8-pin connectors. There are large heatsinks over the VRMs and the Mini-ATX with a silver and black finish looks great." The usual bits of overclocking terminology adorn Z790MPOWER's various heatsinks—including "Overclock, Frequency, MHz, Voltages and Clock."

V-COLOR announces the launch of their DDR5 overclocking R-DIMM the TRX50 Motherboards powered by AMD Ryzen Threadripper 7000 series processors with capacity 192 GB (4x48GB) ready to hit the market in speeds ranging from 6400 MHz up to 7200 MHz for end users who require the maximum capacity and speed. This package is geared toward content makers, intensive 3D modelers, AI programmers, trading machines, and HFT (high frequency trading) firms.

With EXPO ready v-color DDR5 OC R-DIMM memory is ready to for full potential, designed for a diverse user base that includes both non-overclocking users and overclocking enthusiasts, with a specific focus on content creators, intensive 3D modelers, AI programmers, trading machines or HFT (high frequency trading) companies. This kit is meticulously crafted with the most advanced SK Hynix DDR5 chips and Automated Binning sort for more reliability and endurance, continuously tested for full compatibility with all the motherboards TRX50.

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI. Designed for digital signage and self-service kiosks in the smart retail industry, or in large vehicles fitted with display-board advertising, this unique mini-PC offers up to 4 display outputs that can showcase a variety of rich and vibrant content. The highly flexible solution can display 4 different screens, mirror all screens the same, split one image across 4 displays, or splits of 3-and-1 or 2-and-2, affording maximum flexibility to cover wide areas of retail spaces that can easily plan and push a multitude of content to inform and advertise in attractive, dynamic, high-resolution visuals, all from a single device. The LIVA X3A mini-PC is ready to go right out the box, along with ECSIPC's own content management software to streamline product deployment.

Powered by a highly efficient Rockchip octa-core featuring a 4x Arm Cortex-A76 and 4x Arm Cortex-A55 processors in this Arm-based CPU, the highly efficient, fanless design ensures a sustainable solution that accommodates many use-cases. In addition, 8 GB of fast LPDDR5 and 64 GB of internal storage is preinstalled, while dual GbE, Wi-Fi 6 and Bluetooth 5.3 provide a variety of internet connectivity built-in, which can be further expanded with optional PoE and 4G LTE to meet specific deployment requirements.

In addition to the new AIO coolers and PSUs, ENERMAX brought a full lineup of new PC cases to the CES 2024 show, including the new ENERPAZO lineup, the new EK98, and the SK30 V2 PC cases. The ENERPAZO lineup with the ENERPAZO EP33 mid-tower and the ENERPAZO EP23 mini-tower PC cases, and the EK98 mid-tower PC case, all come with built-in USB 3.2 Gen 1 and USB 3.2 Gen 2 Type C ports and reusable PCIe slots, as well as feature recognizable ENERMAX design with grill front and glass side panel.

The ENERPAZO EP33 supports up to an E-ATX motherboards, has support for a 420 mm AIO liquid CPU cooler and up to 11 fans, while the ENERPAZO EP23, as mini-tower PC case, supports up to a micro-ATX motherboard and a 360 mm AIO liquid CPU cooler and up to 8 fans. The EK98 supports up to a 360 mm AIO liquid CPU cooler and up to 9 fans, as well as comes with vertical GPU installation support with rotatable PCIe slots and pre-installed 4 ARGB PWM fans. ENERMAX also showcased the new SK30 V2 PC case mid-tower PC case which also comes with USB 3.2 Type-C ports, supports up to 360 mm AIO liquid CPU cooler ass well as comes with the same vertical GPU installation support and couple of pre-installed ARGB PWM fans.

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

The AMD Ryzen 8000 and 5000 series desktop processors have been released, broadening system build options. Notably, they are respectively compatible with MSI AM5 and AM4 motherboards, offering enthusiasts expanded possibilities for powerful and customizable setups. The latest AMD Ryzen 8000 series desktop lineup includes the powerful Ryzen 7 8700G, Ryzen 5 8600G, and Ryzen 5 8500G processors. These processors come equipped with built-in AMD Radeon graphics solution, ensuring an exceptional gaming experience for all gamers. Compatible with MSI AM5 platform, including X670E, X670, B650, and A620 series motherboards.

MSI is diligently working to release the official BIOS version for gamers. The first wave of supported beta BIOS is already available on the MSI official website. More choices for system builds on the AM4 platform as AMD introduces the Ryzen 7 5700X3D, Ryzen 7 5700, Ryzen 5 5600GT, and Ryzen 5 5500GT processors, extending the portfolio for system builds. The MSI AM4 motherboards are fully compatible with the latest AMD Ryzen 5000 series processors. With the current AGESA ComboAm4v2PI 1.2.0.B official BIOS, users can seamlessly upgrade their processors hassle-free.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly unveils the world's first motherboard designed to seamlessly support the native USB-C 40 Gbps signal when paired with the cutting-edge AMD Ryzen 8000 series processors.

"We are thrilled to introduce a motherboard that not only supports the cutting-edge AMD Ryzen 8000 series processors but also incorporates advanced features that cater to the evolving needs of our users. This marks a significant leap forward in terms of performance, user-friendliness, and design aesthetics." Said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, is excited to share various innovations and technology demonstrations in the upcoming CES 2024. ASRock will unveil the latest motherboards, gaming monitors, graphics cards, and small form factor systems. Furthermore, ASRock will showcase the AI QuickSet software tool to demonstrate how it simplifies the installation and configuration process of artificial intelligence (AI) applications.

ASRock proudly reveals its new WRX90 WS EVO motherboard for AMD Ryzen Threadripper PRO 7000 WX-Series processors, with support of server grade storage expansion such as Slim-SAS & MCIO, dual 10 Gbps Ethernet and BMC support, WRX90 WS EVO is the perfect candidate for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is proud to introduce the BIQ67-AHP industrial motherboard, expertly crafted to facilitate system integration for both industrial and business applications, providing a robust and efficient solution for managing and streamlining complex processes and operations.

At the heart of the BIQ67-AHP's remarkable performance lies its compatibility with the Intel Core i7/i5/i3 processor (LGA1700), complemented by the Intel Q670 chipset and a Thermal Design Power (TDP) of 125 W. This powerful configuration ensures the BIQ67-AHP can easily handle demanding industrial and business applications. Its high-capacity memory support, featuring four DDR4 3200 MHz LONG-DIMM slots, enhances data reliability and system stability, making the BIQ67-AHP an ideal solution for environments where uninterrupted operation and data integrity are crucial.

MSI is planning to expand its small lineup of motherboards with ATX12VO power connectivity—the new desktop motherboard power standard that does away with the 5 V and 3.3 V power domains, and relies entirely on 12 V, with the aim of simplifying PSU designs and desktop PC power cabling. ATX12VO is still an emerging standard that hasn't gained traction in the DIY channel, but PC OEMs and systems integrators are beginning to catch on, for the cost savings to be had. MSI has been targeting this class of customers—OEMs and small SI, with motherboards under its mainstream PRO series. For the Socket LGA1700, the company has the PRO H610M 12VO, and now the company has its first ATX12VO motherboard for AMD Socket AM5—the PRO B650M 12VO/WiFi.

The company hasn't finalized the board design, but we know from its silhouette to be a Micro-ATX (240 mm x 240 mm) board, with the Socket AM5 wired to two DDR5 DIMM slots, a PCI-Express 4.0 x16, a handful M.2 NVMe Gen 4 slots, and some basic connectivity, including onboard Wi-Fi. As with all ATX12VO motherboards we've seen to date, onboard VRM is used to switch 12 V to lower voltage domains, including 5 V and 3.3 V needed for SATA drives, and the likes. MSI also revealed that it is working on a branded ATX12VO power supply series, so both the retail and OEM/SI channel customers can buy the motherboard+PSU as combos from a single source. Not much else is known about these PSUs at this point.

ASRock has announced its motherboards as the first to support Microsoft's Dynamic Lighting feature, offering users a native RGB lighting synchronization experience directly from generic Windows 11 OS. ASRock leads the industry in supporting Microsoft's Dynamic Lighting feature, a pioneering step in motherboard RGB lighting synchronization support.

To enable the Dynamic Lighting feature, users are required to update their Windows 11 OS to the 23H2 version and install the Beta firmware which can be downloaded from the ASRock official website. Once activated, users can control the motherboard LED lighting, RGB gaming mice, keyboards, and other RGB lighting devices via Windows 11 OS.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly announces that GIGABYTE DDR5 motherboards deliver breakthrough support for a memory capacity of single DIMM 64 GB with the latest Kingston FURY Renegade DDR5 memory. The 4DIMM model boosts the memory capacity up to 256 GB, while the 2DIMM model has a maximum capacity of up to 128 GB.⁠

With innovative layout design and top-notch components, GIGABYTE motherboards have played a leading role in memory performance. From the Intel 700 and 600 series to the AMD 600 series, GIGABYTE DDR5 motherboards will support a memory capacity of single DIMM 64 GB through BIOS update. The updated BIOS and memory support list will be available on the GIGABYTE official website, coinciding with the launch of the latest Kingston FURY Renegade DDR5 memory. Please stay tuned to the GIGABYTE official website for further information.

ASRock is announcing the support of 64 GB DDR5 memory module across Intel 700 Series and AMD AM5 Series motherboards. This enhancement boosts the maximum memory capacity to 256 GB with 4 DIMMs, offering increased performance and compatibility for enthusiasts. Additionally, we are committed to expanding support for the 64 GB DDR5 memory module across more motherboards with various chipsets, enhancing productivity for memory-intensive multitasking applications.

At the beginning of this year, MSI announced the pioneering support for a memory capacity of 192 GB. Today, we are proud to unveil an even greater milestone - MSI motherboards now support memory capacities of up to 256 GB for 4 DIMMs motherboards and 128 GB for 2 DIMMs motherboards. This significant enhancement empowers DIY enthusiasts with unparalleled flexibility to optimize multitasking capabilities and ensures a seamless computing experience.

This accomplishment underscores the strong collaboration between MSI and leading memory brands to achieve enhanced performance and remarkable milestones. The partnered memory for this achievement is Kingston FURY Renegade DDR5 memory, offering an impressive 64 GB capacity per module. Built on Micron's industry-leading 1β (1-beta) technology, enables new capacities not seen before for dual channel PCs.

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, has always committed to improving user experiences and proactively preventing any unforeseen issues, announces a crucial software update for its users.

GIGABYTE has received user feedback regarding unexpected behavior and issues when using certain brand memory modules in conjunction with GCC (GIGABYTE Control Center). After thorough investigation, it was identified that some DDR modules did not comply with JEDEC specifications, leading to the failure of SPD write protection. The issue was promptly addressed within a month by updating the BIOS to enable SPD write protection from motherboard side, thereby assisting customers in avoiding and resolving the problem.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.