Back in October of last year, pictures from an ASUS event in China appeared online, showing off a pair of mATX motherboards that had most of its peripheral and power connectors on the reverse side of the motherboard. Now it appears that ASUS has decided to launch such a product, in the shape of the unforgettably named TUF Gaming B760M-BTF WiFi D4. The BTF part in the model name stands Back To (the) Future, although ASUS is most likely not allowed to use that term due to copyright restrictions, so it had to make do with BTF. Regardless of naming, the interesting part here is that all of the power connectors, the four SATA ports, the USB-C and USB 3.0 headers, as well as multiple other headers and one of three M.2 slots, are on the reverse side of the motherboard. This is all done to allow for cleaner cable management.

Other noteworthy features on the board include a single PCIe 5.0 x16 slot, one PCIe 4.0 x4 and one x1 slot, three USB-C ports, of which one is capable of 20 Gbps speeds and 2.5 Gbps Ethernet. As this is a mid-range board, we presume ASUS wants to test the waters so to speak, to make sure there's a market for such a product. However, one major hurdle is the small fact that there aren't any suitable chassis in the market and the product page even mentions that "This motherboard is compatible with specific case models", without going into any details. Presumably, ASUS will offer a suitable chassis, or have some partner(s) lined up that will provide a suitable chassis. Gigabyte announced something similar in May last year, but decided to team up with system integrators, something ASUS might be planning on as well.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q670A1, the most advanced Mini-ITX board it has ever produced. The first AAEON solution across any of its product ranges to support both 12th and 13th Generation Intel Core i9/i7/i5/i3/Pentium /Celeron processors (formerly Alder Lake-S and Raptor Lake-S respectively), the MIX-Q670A1 harnesses up to 24 cores, 32 threads, and a host of peripheral technologies including Intel vPro, Intel Thermal Velocity Boost, and Intel UHD Graphics 770.

AAEON believe the MIX-Q670A1 will become the gold-standard for applications requiring real-time, high-performance computing on the edge. Supporting 64 GB of dual-channel DDR5 4800 MHz system memory and a PCIe [x16] Gen 5 slot, the MIX-Q670A1 offers a 44% increase in memory speed over previous generations. Combining this speed with an I/O consisting of two LAN, two COM, and ten USB ports, the MIX-Q670A1 offers both a wealth of connectors for peripheral devices and real-time data transmittance on the edge for smart city applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

At the end of January, we reported on issues with Intel's i226-V 2.5 Gbps Ethernet controllers, which are used on a wide range of motherboards with both Intel and AMD CPUs, where users were having issues with stuttering and connections dropping. Intel has now released a workaround and a patch for the issue, not only for the i226, but also the i225 and the Killer E3100 2.5 Gbps network controller. What the workaround does, is disable the Energy-Efficient Ethernet mode, or EEE as it's also known as. EEE is only supposed to kick in when an Ethernet connection is idle and it's said to reduce power consumption by up to 50 percent.

However, in this case, it seems like EEE kicks in even when the Ethernet connection is active, which is causing the stuttering and connection dropouts. The patch disables EEE for all speeds above 100 Mbps, but it's also possible to disable EEE manually in the device settings in Windows. MSI is the first motherboard manufacturer to have released an updated driver on its site, but as this isn't a final solution to the problem, it's unlikely that this is the last we'll hear about the issue. Intel is apparently working on finding the root cause of the problem, but it's unclear if it's going to be possible to patch it in software or if a hardware revision is going to be required in the end.Update Mar 4th: User @lovingbenji reports that on his system this new driver version does not fix the disconnect issue.

The four major North American cloud service providers (CSPs) have made cuts to their server procurement quantities for this year because of economic headwinds and high inflation. Turning to server OEMs such as Dell and HPE, they are observed to have scaled back the production of server motherboards at their ODM partners. Given these developments, TrendForce now projects that global server shipments will grow by just 1.31% YoY to 14.43 million units for 2023. This latest figure is a downward correction from the earlier estimation. The revisions that server OEMs have made to their outlooks on shipments shows that the demand for end products has become much weaker than expected. They also highlight factors such as buyers of enterprise servers imposing a stricter control of their budgets and server OEMs' inventory corrections.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today introduces two of their latest commercial motherboards, the TZ590-PRO DUO and the TZ590-PRO. Designed on Intel's Z590 single chip architecture, both TZ590-PRO series motherboards are optimized to extract the highest performance out of 10th / 11th Generation Intel Core processors.

With DDR4 RAM base and Intel 11th generation CPU, the TZ590-PRO and TZ590-PRO DUO have superior stability to handle the most demanding tasks, ideal for businesses, 3D content creators, AI integration systems and more. As ATX-based boards, the TZ590-PRO and PRO DUO offer a variety of features and functionality including 8 PCIe 3.0 slots, one PCIe 4.0 x16 slot, and an excellent power delivery system that provides users with seemingly limitless expansion capability. Additionally, the TZ590-PRO DUO supports up to 4 M.2 slots and 10 SATA III connectors (6 Gb/s) for reliable storage capability as well as business NAS setup.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly announces the launch of the EVOL X16 PRO gaming laptop. The new COLORFUL EVOL X16 PRO mainstream model is equipped an 13th Gen Intel Core i7-13700H processor and up to a NVIDIA GeForce RTX 4060 laptop graphics. The gaming laptop sports a 16-inch QHD 240 Hz IPS display with support for NVIDIA G-SYNC technology for smooth and stutter-free gaming visuals.

The EVOL X16 PRO also comes equipped with 16 GB of DDR5-4800 MHz memory, expandable up to 64 GB. For storage, the mainstream model comes with 512 GB of fast NVMe SSD storage with an empty M.2 slot for storage expansion. The laptop also features a USB-C Thunderbolt 4 port for high-speed data transmission and multi-device connectivity. For networking, the EVOL X16 PRO comes with a 2.5 GbE LAN port for gamers that prefer reliable and fast wired connection. For wireless networking, the gaming laptop also comes equipped with the latest Wi-Fi 6E + Bluetooth solution.

Antec Inc., a Californian supplier of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the AX90, a model oft he new budget-friendly AX series of Gaming cases. The mid-tower is equipped with three 120 mm ARGB fans in the front as well as one in the rear and is now available at a very affordable price of € 99.99 (recommended retail price including VAT).

The new AX series from Antec offers a large selection of gaming cases with LED lighting and eye-catching front panel designs - all at an affordable price. The new AX90 case has a side panel made of tempered glass and puts the built-in components in the limelight. Diamond-shaped frames in a mesh front panel create not only a visual highlight but also allow for excellent airflow.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

AMD's high-end X670E motherboard chipset combines two Promontory 21 chips working together to deliver a single solution. With regularly-sized ATX motherboards, having two chips to form a chipset is fine, as there is much room on the PCB. However, with Mini-ITX motherboards, packing two Promontory 21 chips is difficult as the PCB area is limited. To combat this, ASUS introduced an interesting solution to solve the problem and allowed the company to ship the high-end X670E chipset inside a Mini-ITX form factor. Thanks to UNIKO's Hardware's findings, we look at the exciting solution ASUS used to solve this problem.

Instead of two Promontory 21 chips side by side, one is placed on the motherboard directly, while the other stands vertically attached by M.2 PCIe slot. Below, the chipset's pictures and the highlight show how it looks disassembled.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Although we haven't been able to confirm these specs, full specifications of AMD's upcoming A620 chipset was posted on Twitter by @g01d3nm4ng0, who has proven to have solid details in the past. This is supposedly the cut-down version of the B650 chipset, due to the rumored delays of the actual A620 chipset. The A620 chipset will be identical to the B650 chipset when it comes to PCIe lane counts, but rather than PCIe 4.0 lanes, the chipset will only offer PCIe 3.0 lanes. What is unclear is if the PCIe 3.0 of the B650 chipset will remain or not, as they're not included in the leaked specs.

If not, then the A620 chipset will only have a total of eight usable PCIe lanes, but four lanes that are connected to the CPU, which will apparently also be limited to PCIe 3.0 speeds. There's also no mention of SATA port configurations. AMD has trimmed the amount of USB 3.x ports significantly, with the A620 chipset only getting two 10 Gbps and two 5 Gbps ports. USB 2.0 ports remain the same at a total of six. A620 motherboards will apparently also be limited to PCIe 4.0 for the lanes from the CPU, but this should be less of an issue for most consumers. As rumored, CPU overclocking is also said to be missing, but RAM overclocking will still be present.

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

According to HKEPC, AMD is set to introduce two versions of the A620 chipset for its lower-end motherboards, providing a lower barrier of AM5 entry for users on a smaller budget. As the new source notes, AMD is going to use its Promontory 21 (PROM21) module for A620 motherboards, the same one used on B650 and X670 models. However, for the first time, we are hearing about Promontory 22 (PROM22), a module that will allow A620-based motherboards to start at 125 US dollars—a promise made by AMD in its marketing slides (which you can see below). Two A620 chipsets will enable users to choose basic functionality or some additional features on a reasonable budget.

With PROM21 going inside all chipset SKUs, it carries silicon functionality disabled by AMD to create different categories. However, the PROM22 is a new silicon that doesn't need bells and whistles of the high-end boards inside a feature-deprived chipset like A620. This drives down AMD's costs, making it easier for vendors to adjust pricing. We have to wait for the launch and see how much of this will be fulfilled, so stay tuned for further updates.

For those that don't remember the early days of ASRock, the company started out making some rather unusual motherboards, often with some wild and wacky upgrade paths, such as both a slot and a socket for a CPU or both AGP and PCIe graphics card slots. Since then, ASRock has become a much more mainstream motherboard maker, but the company appears to have gone back to its roots with what the company calls the X670 Xpansion Kit. Right now, the expansion card appears to be working with the B650 LiveMixer motherboard and it's unknown if it's compatible with other models from ASRock. It seems to be limited to ASRock motherboards only, due to the fact that the add-in card requires not only a x4 PCIe slot with all lanes attached, on the motherboard, but also a custom cable that is most likely for "low-speed" I/O's such as I2C, SPI and so on.

As the name suggests, the X670 Xpansion Kit allows B650 motherboards to be turned into X670 motherboards, more or less. The card is home to a second chipset, which enables not only two additional M.2 slots for PCIe 4.0 NVMe SSDs, but it also features two SATA ports, a 10 Gbps USB-C port, three USB-A ports and—maybe most interestingly—a 10 Gbps Ethernet interface. It's unclear if this will be a retail product, but the card provided to Level1Techs doesn't appear to be an engineer unit, but a full retail ready product. It's definitely an interesting upgrade path for those that have invested in a B650 motherboard and there's no real reason why this shouldn't work as well as having the second chipset on the motherboard, especially as ASRock appears to have fitted a signal re-driver on the add-in card to make sure the PCIe signals are handled properly.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.