Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

Intel has released the 0x12B microcode for 13th and 14th Gen Intel Core desktop processors to improve system stability. In response, MSI has updated the BIOS for its Intel 700 and 600 series motherboards with this new microcode to address stability issues. The first batch of updated BIOS versions is now available, with additional models to follow. Users are encouraged to check MSI's official channels and product pages for the latest BIOS updates.

Z790

• MEG Z790 GODLIKE MAX
• MEG Z790 ACE MAX
• MPG Z790 CARBON MAX WIFI
• MPG Z790 CARBON MAX WIFI II
• MPG Z790 EDGE TI WIFI
• MAG Z790 TOMAHAWK MAX WIFI
• MAG Z790 TOMAHAWK WIFI
• PRO Z790-P WIFI
• PRO Z790-VC WIFI
• Z790 GAMING PLUS WIFI
• Z790MPOWER

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Intel is set to launch its Arrow Lake processors on October 24th, likely alongside the official release of the Z890 motherboards. Meanwhile, AMD is expected to launch its new X870 and X870E motherboards on September 30th. Ahead of these dates, we've already seen many of them showcased at Computex, however, today an Australian retailer listed several MSI motherboards, including one Z890 model (MSI Z890 Carbon WiFi) and three X870/X870E models (MSI MPG X870E Carbon WiFi, MSI MAG X870 Tomahawk WiFi, and MSI PRO X870-P WiFi).

MSI Z890 Carbon WiFi
This is a mid-range motherboard, however without an official spec sheet, we're left trying to decipher details from the pictures. From what we can see, it offers a solid set of features, including USB 3.2, USB Type-C ports, BIOS Flash, Clear CMOS, and Smart Buttons. The board itself includes an 8-pin PCI-E connector and at least three M.2 slots. Currently, there is no information about its retail price.

ASUS today announced its participation in the upcoming IBC 2024, showcasing the theme A Glimpse into Tomorrow's Tech.Visitors to the ASUS booth (Hall 2 Booth #A29 RAI Amsterdam) will be able to enjoy the ProArt Masters' Talks featuring industry experts from renowned companies Adobe, NVIDIA and Scan Computers, as well as professional filmmaker Bas Goossens, professional senior trainer Leon Barnard, and co-founder and CEO of Redshark Media, Matt Gregory.

As well, through the full run of IBC from September 13-16, 2024, ASUS will highlight a range of cutting-edge technology ideal for professionals, including ProArt Display PA32KCX, the world's first 8K Mini LED professional monitor; ProArt Display OLED PA32UCDM, which brings 4K QD-OLED to creators; ProArt Display 5K PA27JCV, featuring a stunning 5120 x 2880 resolution for unparalleled clarity; and ProArt Display PA32UCE and PA27UCGE, the latest 4K monitors with built-in calibration. The latest ASUS AI-powered laptops and workstations will also be on show.

ASUS and GIGABYTE have registered a large number of Intel Z890 motherboards with the Eurasian Economic Commission (EEC). For ASUS, the registrations suggest that these will be released on October 10, followed by an official market launch on October 24. ASUS has added no less than 29 Z890 motherboards to its ROG MAXIMUS, ROG STRIX, TUF GAMING, PRIME, and other series, while GIGABYTE has added 18 models to both its AORUS and non-AORUS series.

ASUS Z890 Motherboards

• ROG MAXIMUS Series
  • ROG MAXIMUS Z890 EXTREME
  • ROG MAXIMUS Z890 FORMULA
  • ROG MAXIMUS Z890 APEX
  • ROG MAXIMUS Z890 APEX ENCORE
  • ROG MAXIMUS Z890 HERO
  • ROG MAXIMUS Z890 DARK HERO
  • ROG MAXIMUS Z890 HERO BTF

Intel is expected to launch its next-generation Core Ultra 200 "Arrow Lake-S" desktop processors on October 24, 2024, and since these chips introduce the new Socket LGA1851, they launch alongside new motherboards. The first wave of Core Ultra 200 series processors will be "K" or "KF" SKUs targeting gamers and enthusiasts, and the first compatible motherboards will be based on the premium Intel Z890 chipset. Intel is reportedly being extra careful not to repeat the "Raptor Lake" fiasco that saw motherboards power its 13th- and 14th Gen Core "Raptor Lake" processors with elevated voltages, causing their irreversible physical degradation over time. To this effect, Intel is reportedly getting its motherboard partners to ship their Intel Z890 chipset motherboards with Intel Default Power Profile out of the box.

A motherboard-level Power Profile dictates the processor base power (PL1), maximum turbo power (PL2), and IccMax values. We don't know these values for "Arrow Lake-S," particularly its top Core Ultra 9 285K part; but to illustrate what Default Power Profile out of the box means, we have to look at "Raptor Lake-S." For a Core i9-14900K, the Performance Power Profile—which is what Intel Z690 and Z790 motherboards enable out of the box—provide a PL1 of 125 W, PL2 of 253 W, and IccMax of 307 W, which is what Intel considers stock for this processor model.

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

Motherboard vendors have been sporadically announcing their new premium- and high-end motherboards based on the AMD X870E and AMD X870 desktop chipsets, however, we've had a hard time finding or ordering these online. It turns out that although AMD allowed its motherboard partners to tease or announce their products based on the new chipset models, their market availability is timed.

Apparently, you should be able to buy these motherboards starting September 30, 2024. In the run-up to their availability, various online retailers have put up these motherboards at fairly high prices. Motherboards based on the cheaper AMD X870 are typically priced above $250, while those based on the top X870E start around $325. It is widely rumored that the mid-range AMD B850 will launch early next year. Until then, you always have the option of older AMD B650 chipset motherboards. If you want to pair these with newer Ryzen 9000 series "Granite Ridge" processors, you can take advantage of the UEFI BIOS Flashback feature.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, launches the flagship iGame Z790D5 Vulcan W and Z790D5 Vulcan X motherboards. First seen at COMPUTEX 2024, the iGame Z790D5 Vulcan is available in white and black models and comes in an E-ATX form-factor. The motherboard comes equipped with the latest technologies including USB4 40 Gbps connectivity and the latest Wi-Fi 7 solution.

Designed for high-performance gaming and content creation, the iGame Z790D5 Vulcan W/X motherboards are equipped with a 19+1+1 power phase design with DrMos 105 A power stages. Furthermore, the motherboard has a dedicated LN2 Mode for extreme overclocking. The motherboard's server-grade 8-layer low-loss PCB helps achieve higher and stable overclocks.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.

Leading global motherboard manufacturer, ASRock has announced that its W790 series workstation motherboards, including the W790 WS and W790 WS R2.0, now support the newly released Intel Xeon W-3500 series and Xeon W-2500 series processors. This enables consumers to experience the superior performance of the latest Intel Xeon series processors.

The ASRock W790 WS series workstation motherboards feature up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the BIOS update that fixes a recently identified security vulnerability "Sinkclose" of AMD desktop processors.

This security flaw was reported to impact all AMD processors since 2006 and millions of devices globally. GIGABYTE remains working closely with AMD and demonstrates our commitment to swiftly addressing any issues that may affect our customers' experience. The latest AGESA BIOS which can fix the security vulnerability will be released to the website in succession starting by end of August.⁠

User are encouraged to install the updated BIOS at their earliest convenience. The BIOS can be easily updated using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. Please refer to the following table for the AGESA BIOS version and applicable models.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today announces the latest BIOS updates for Intel 700 and 600 series motherboards with the 0x129 microcode to mitigate the instability of the Intel Core 14th /13th Gen desktop processors. In response to recent instability concerns with Intel Core 14th and 13th Gen desktop processors, BIOSTAR releases BIOS update for Intel 700 and 600 series motherboards including the new 0x129 microcode, designed to enhance system stability for best performance.

The first batch release will cover the Z790 VALKYRIE and Z790A-SILVER, with further updates for the entire Intel 700 and 600 series motherboards expected to follow in the coming weeks. For further information, please visit BIOSTAR official website for latest information.

ASRock has released the AGESA 1.2.0.0a patch A BIOS update for its AM5 motherboards, enhancing compatibility and performance for AMD Ryzen 9000 series processors. The update is available for ASRock's AM5 motherboard lineup, including models with X670E, B650E, B650, and A620 chipsets. This new BIOS version allows users to fully leverage the capabilities of the Ryzen 9000 series processors, providing improved system performance and stability.

Users can easily download and install the update from the ASRock official website or use features like BIOS Flashback and Instant Flash. ASRock recommends updating to the latest BIOS version to ensure optimal system compatibility and performance for AMD Ryzen 9000 series processors.

Regarding the instability of the Intel Core 14th /13th Gen desktop processors, MSI will release the latest BIOS of Intel 700 and 600 series motherboards and 14th /13th Generation Desktop PC with 0x129 microcode to mitigate the instability.

The 1st batch of BIOS releasing models are MEG Z790 GODLIKE MAX, MEG Z790 ACE MAX, MPG Z790 CARBON MAX WIFI II, MPG Z790 CARBON WIFI, MAG Z790 TOMAHAWK MAX WIFI and Z790MPOWER. All BIOS of Intel 700 and 600 series motherboards and 14th /13th Generation Desktop PC will be released soon in coming weeks by the end of August. MSI will continue to update our users on the latest news. Please follow MSI's official channels and check the product pages for the latest BIOS updates.

ADLINK Technology Inc., a global leader in edge computing and a renowned supplier of industrial PCs and motherboards, is proud to announce the launch of the new SBC35 Series of 3.5" Single Board Computers (SBC). This innovative series introduces a range of motherboards specifically engineered to maximize efficiency in compact spaces. The SBC35 Series features two models: the high-performance SBC35-RPL, powered by the 13th Gen Intel Core processors, and the energy-optimized SBC35-ALN, equipped with the Intel N97 processor. Additionally, the series boasts an expansive range of I/O modules and SBC-FM Adaptive Function Modules (AFM) that significantly enhance system capabilities. These advancements make the SBC35 Series exceptionally suitable for a wide array of applications in automation, transportation, medical fields, and smart city projects, including Autonomous Mobile Robots (AMRs), Electric Vehicle (EV) charging stations, and self-service kiosks.

The SBC35 Series showcases two compact models in a 146x102mm 3.5" SBC form factor, each designed to maximize space and functionality in demanding settings. While the high-performance SBC35-RPL supports up to 64 GB DDR5 4800 MHz RAM and four independent displays, the efficiency-optimized SBC35-ALN accommodates up to 16 GB DDR5 4800 MHz RAM and three independent displays. Both units are equipped with an extensive array of connectivity options, including four USB ports and versatile M.2 slots (2280 M Key, 2230 E Key, 3042 B Key), supplemented by dual RS-232/422/485, and additional dual RS-232 ports, audio, and digital I/O capabilities. Optional TPM 2.0 further enhances security, making these models highly adaptable for a broad range of industrial applications. Their comprehensive I/O and expansion options ensure that they can be customized to meet specific project requirements, providing exceptional versatility and scalability.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.