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EU Signs Declaration for 2 nm Node and Custom Processor Development

European Union has today processed a declaration that was signed by 17 member states about the development of a 2 nm semiconductor node and an advanced low-power processor. The declaration signed today proposes that the EU puts away 145 billion Euros for the development of the technologies needed to manufacture a 2 nm semiconductor manufacturing process, along with the development of a custom, low-power embedded processor designed for industrial applications. The 17 member countries include Belgium, France, Germany, Croatia, Estonia, Italy, Greece, Malta, Spain, The Netherlands, Portugal, Austria, Slovenia, Slovakia, Romania, Finland, and Cyprus. All of the countries listed are going to join the development of these technologies and will have the funds to do it over the next 2-3 years.
EU DeclarationTo ensure Europe's technology sovereignty and competitiveness, as well as our capacity to address key environmental and societal challenges and new emerging mass markets, we need to strengthen Europe's capacity to develop the next generation of processors and semiconductors. This includes chips and embedded systems that offer the best performance for specific applications across a wide range of sectors as well as leading-edge manufacturing progressively advancing towards 2 nm nodes for processor technology. Using connectivity, where Europe enjoys global lead, as a major use case driver for developing such capacity enables Europe to set the right level of ambition. This will require a collective effort to pool investment and to coordinate actions, by both public and private stakeholders.

NVIDIA to Introduce an Architecture Named After Ada Lovelace, Hopper Delayed?

NVIDIA has launched its GeForce RTX 3000 series of graphics cards based on the Ampere architecture three months ago. However, we are already getting information about the next-generation that the company plans to introduce. In the past, the rumors made us believe that the architecture coming after Ampere is allegedly being called Hopper. Hopper architecture is supposed to bring multi-chip packaging technology and be introduced after Ampere. However, thanks to @kopite7kimi on Twitter, a reliable source of information, we have data that NVIDIA is reportedly working on a monolithic GPU architecture that the company internally refers to as "ADxxx" for its codenames.

The new monolithically-designed Lovelace architecture is going make a debut on the 5 nm semiconductor manufacturing process, a whole year earlier than Hopper. It is unknown which foundry will manufacture the GPUs, however, both of NVIDIA's partners, TSMC and Samsung, are capable of manufacturing it. The Hopper is expected to arrive sometime in 2023-2024 and utilize the MCM technology, while the Lovelace architecture will appear in 2021-2022. We are not sure if the Hopper architecture will be exclusive to data centers or extend to the gaming segment as well. The Ada Lovelace architecture is supposedly going to be a gaming GPU family. Ada Lovelace, a British mathematician, has appeared on NVIDIA's 2018 GTC t-shirt known as "Company of Heroes", so NVIDIA may have already been using the ADxxx codenames internally for a long time now.

China Develops Tools for 28 nm Silicon Manufacturing

When the US decided to impose sanctions on all US-made technology use in foreign countries (China), the Chinese semiconductor manufacturing industry seemed at the time that it would just completely stop. Without the tools to manufacture silicon, Chinese manufacturers would need to turn to other countries to search for a possible solution. That, however, turned out impossible as the US administration has decided to stop the silicon from going into the hands of Chinese companies, by making a condition that any US-made technology can not get to China. Many of the parts for silicon manufacturing are designed in the US, so they have the power to restrict the use.

Today, in a surprising turn of events, we have information that Shanghai Micro Electronic Equipment (SMEE) has developed a deep ultraviolet (DUV) lithography scanner that is set for delivery in 2021. With a plan to deliver it in the fourth quarter of 2021, SMEE has designed this DUV scanner for the production of 28 nm node. While not being the most advanced node available to date, it is a significant start for Chinese technology independence. ASML, the producer of such scanners, used to be one of the few options there, however, it just gained a competitor. China will deliver its new silicon on a 28 nm process at the end of 2021. Pictured below, you can see how the scanner from SMEE looks like.

NVIDIA: RTX 30-series Shortages Partly Caused by Insufficient Wafer, Substrate and Component Supply

The current widespread shortages on anything gaming-related (be it gaming consoles or the latest GPUs from both NVIDIA and AMD) are a well-known quantity by now. However, it now seems that NVIDIA's shortages aren't just the result of "outstanding, unprecedented demand", aided by scalping practices, but also from wafer and component shortages. NVIDIA's CFO Colette Kress at Credit Suisse 24th Annual Technology Conference expanded on these issues, saying that "We do have supply constraints and our supply constraints do expand past what we are seeing in terms of wafers and silicon, but yes some constraints are in substrates and components. We continue to work during the quarter on our supply and we believe though that demand will probably exceed supply in Q4 for overall gaming."

There was no further information on exactly which components are experiencing shortages. An educated guess might pin some of these issues on the exotic GDDR6X memory subsystem on high-tier Ampere graphics cards, but there could be other factors at play here. If NVIDIA did underestimate demand for its Ampere graphics cards, though, that will make it that much harder for the company to ramp up orders (and hence production) with Samsung - semiconductor manufacturing works with several months of lead time between orders and their actual fulfillment.

Another Semiconductor Player Bites the Dust: Chinese HSMC Shutters Operations

The semiconductor manufacturing industry is a cutthroat competition mostly played between established forces. One need only look to AMD's decision to spin-off its manufacturing arm to create Global Foundries to see how even a grand company can hit manufacturing issues (though not only manufacturing issues hit AMD at that time, obviously) can threaten to shutter operations. Intel's recent issues with 10 nm and 7 nm fabrication also come to mind. as such, it comes at no great surprise that Chinese company Wuhan Hongxin Semiconductor Manufacturing Company (HSMC) has reportedly run out of cash. What's a little more surprising is how this company was actually backed by the Chinese government, and yet it still failed - proof of the semiconductor industry's technical and investment liquidity requirements.

HSMC back in 2017 announced plans to bring online a manufacturing plant in the central Chinese province of Hubei. The aim was to manufacture 14 nm and 7 nm chips as early as 2019/2020, funded by a $20 billion loan and numerous funding rounds. HSMC's ex-CEO Chiang Shang-yi (who previously served as former head of R&D at TSMC) said to EETimes that "Investors ran short of cash." And that was it for the company's aspirations. The company has now been absorbed by the municipal government in the central Chinese province of Hubei, and what will come of that (and the company's future) remain uncertain.
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