Packaging

The G.SKILL Flare X5 DDR5-6000 kit comes in a blister pack with a sheet of paper behind the memory. The packaging itself has the company logo (name) in the top-left with the Flare X5 product branding to the right. All the information about the actual memory can be found on the sticker for each DIMM module. Flip the blister pack around and the back has a barcode with the part number and the same information as written on the memory stickers.

Inside is a piece of paper with information covering common questions and technical issues. While this is mostly just a nice way for G.Skill to say the consumer is on their own for any unsupported configurations, it's still helpful to keep misinformation from spreading, and these statements have some truth to them.

Some examples written on card:

• "Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure"
• "Memory kits will boot at the SPD speed at default BIOS settings with compatible hardware"
• "Reaching the rated XMP/EXPO overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used."