Capacity: | 960 GB |
---|---|
Overprovisioning: | 129.9 GB / 14.5 % |
Production: | Active |
Released: | 2020 |
Part Number: | Unknown |
Market: | Enterprise |
Form Factor: | M.2 22110 (Double-Sided) |
---|---|
Interface: | PCIe 4.0 x4 |
Protocol: | NVMe 1.4 |
Power Draw: | Unknown |
Manufacturer: | CNEX Labs |
---|---|
Name: | CNX-2670AA-CB2T |
Architecture: | ARM |
Flash Channels: | Unknown |
Controller Features: | DRAM (enabled) |
Manufacturer: | Toshiba |
---|---|
Name: | BiCS4 |
Part Number: | TH58LJT1V24BA8H |
Type: | TLC |
Technology: | 96-layer |
Speed: | 533 MT/s .. 800 MT/s |
Capacity: | 4 chips @ 2 Tbit |
Toggle: | 3.0 |
Topology: | Charge Trap |
Process: | 19 nm |
Dies per Chip: | 8 dies @ 256 Gbit |
Planes per Die: | 2 |
Decks per Die: | 2 |
Word Lines: |
109 per NAND String
88.1% Vertical Efficiency |
Read Time (tR): | 59 µs |
Program Time (tProg): | 625 µs |
Die Read Speed: | 551 MB/s |
Die Write Speed: | 56 MB/s |
Endurance: (up to) |
1500 P/E Cycles
(3000 in SLC Mode) |
Page Size: | 16 KB |
Block Size: | 1152 Pages |
Plane Size: | 1980 Blocks |
Type: | DDR4-2666 |
---|---|
Name: | Micron MT40A1G8SA-075:E (D9VPP) |
Capacity: |
1024 MB
(1x 1024 MB) |
Organization: | 8Gx8 |
Sequential Read: | Unknown |
---|---|
Sequential Write: | Unknown |
Random Read: | Unknown |
Random Write: | Unknown |
Endurance: | Unknown |
Warranty: | Unknown |
Write Cache: | N/A |
TRIM: | Yes |
---|---|
SMART: | Yes |
Power Loss Protection: | Yes |
Encryption: |
|
RGB Lighting: | No |
PS5 Compatible: | No |
NAND Die:Read latency tR: 58 µs (ABL) |