AMD unveiled its latest flagship graphics card, the Radeon Pro Duo. The card is designed for "creators who game, and gamers who create," as the tagline goes. It is a dual-GPU graphics card based on a pair of 28 nm "Fiji" chips, the same ones which drive the R9 Fury X and the R9 Nano. AMD is positioning this card in the gray-area between consumer graphics cards, and FirePro workstation products, as a new "workstation-class" product. Perhaps this allows the company to get away with things such as three 8-pin PCIe power connectors.

The Radeon Pro Duo features two "Fiji" GPUs in their maximum core configuration - 4,096 stream processors, 256 TMUs, and 64 ROPs, each; with 4 GB of HBM memory, each. The card hence packs a total of 8 GB HBM memory, and 16 TFLOP/s total single-precision floating-point performance. The card features a liquid-cooling solution designed by Cooler Master, with a thick 120 mm x 120 mm radiator that's similar to the one that ships with the R9 Fury X. The card's display output configuration is similar to the R9 Fury X, too, with three DisplayPort 1.2a and one HDMI 1.4a connectors. AMD is going ahead and claiming the title of "World's Fastest Graphics Card." The Radeon R9 Pro Duo is expected to be priced at US $1,499.

Korean DRAM and NAND flash giant SK Hynix will be ready to ship its 4 GB stacked second generation high-bandwidth memory (HBM2) chips from Q3, 2016. These packages will be made up of four 1 GB dies, with a bandwidth-per-pin of 1 Gbps, 1.6 Gbps, and 2 Gbps, working out to per-stack bandwidths of 128 GB/s, 204 GB/s, and 256 GB/s, respectively.

These chips will target applications such as graphics cards, network infrastructure, HPC, and servers. The company is also designing 8 GB stacks, made up of eight 1 GB dies. These stacks will be targeted at HPC and server applications. The company is also offering cost-effective 2 GB, 2-die stacks, for graphics cards. The cost-effective 2 GB, 2-die stacks could prove particularly important for the standard's competition against GDDR5X, particularly in mid-range and performance-segment graphics cards.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235A is available for free download from the JEDEC website.

JESD235A leverages Wide I/O and TSV technologies to support up to 8 GB per device at speeds up to 256 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard supports 2-high, 4-high and 8-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB - 8 GB per stack.

Sapphire announced its latest version of the TriXX overclocking utility, which it bundles with its graphics cards. Version 5.2.1 is one of the first pieces of software to support voltage control on AMD "Fiji" GPU graphics cards (R9 Fury, R9 Fury X, and R9 Nano), and HBM overclocking. The utility comes with a new "dashboard" themed user interface that gives you an analog readout of your card's main sensors - clocks, voltage, and temperatures; and a simpler layout. In addition, it also supports voltage control on other Radeon R9 300 series GPUs.DOWNLOAD: Sapphire TriXX 5.2.1

VLSI technical publication Chipworks posted the first clear die-shot of AMD's "Fiji" silicon, revealing intricate details of the most technically advanced GPU. What makes Fiji the most advanced graphics chip is its silicon interposer and stacked HBM chips making up a multi-chip module. It's the die in the center of all that, which went under Chipworks' microscope.

The die-shot reveals a component layout that's more or less an upscale of "Tonga." Some of the components, such as the front-end appear to be entirely identical to "Tahiti" or "Tonga." The shot reveals the 64 GCN compute units arranged in four rows, on either side of the central portion with the dispatch and primitive setup pipelines. The pad-area of the on-die memory controllers appear to be less than the large memory I/O pads that made up the 384-bit interface of "Tahiti." The first picture below is the die-shot of "Fiji," followed by a color-coded die-shot of "Tahiti."

AMD's upcoming mini-ITX friendly graphics card, the Radeon R9 Nano, which boasts of a typical board power of just 175W, is not a heavily stripped-down R9 Fury X, as was expected. The card will feature the full complement of GCN compute units physically present on the "Fiji" silicon, and in terms of specifications, is better loaded than even the R9 Fury. Specifications sheet of the R9 Nano leaked to the web, revealing that the card will feature all 4,096 stream processors physically present on the chip, along with 256 TMUs, and 64 ROPs. It will feature 4 GB of memory across the chip's 4096-bit HBM interface.

In terms of clock speeds, the R9 Nano isn't too far behind the R9 Fury X on paper - its core is clocked up to 1000 MHz, with its memory ticking at 500 MHz (512 GB/s). So how does it get down to 175W typical board power, from the 275W of the R9 Fury X? It's theorized that AMD could be using an aggressive power/temperature based clock-speed throttle. The resulting performance is 5-10% higher than the Radeon R9 290X, while never breaching a power target. Korean tech blog DGLee posted pictures of an R9 Nano taken apart. Its PCB is smaller than even that of the R9 Fury X, and makes do with a slimmer 4+2 phase VRM, than the 6+2 phase VRM found on the R9 Fury X.

Top technologists from AMD are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), codenamed "Carrizo," and the new AMD Radeon R9 Fury family of GPUs, codenamed "Fiji," at the prestigious annual Hot Chips symposium starting today. The presentations will focus on new details of the high-definition video and graphics processing engines on the 6th Generation AMD A-Series APU ("Carrizo"), and the eight year journey leading to die-stacking technology and all-new memory architecture included on the latest top-of-the-line AMD Radeon Fury Series GPUs ("Fiji") for 4K gaming and VR. Using a true System-on-Chip (SoC) design, 6th Generation AMD A-Series processors are designed to reduce the power consumed by the x86 cores alone by 40 percent, while providing substantial gains in CPU, graphics, and multimedia performance versus the prior generation APU. The new AMD Radeon R9 Fury X GPU achieves up to 1.5x the performance-per-watt of the previous high-end GPU from AMD.

"With our new generation of APU and GPU technology, our engineering teams left no stone unturned for performance and energy efficiency," said Mark Papermaster, chief technology officer at AMD. "Using innovative design for our APUs, we've vastly increased the number of transistors on-chip to increase functionality and performance, implemented advanced power management, and completed the hardware implementation of Heterogeneous System Architecture. For our latest GPUs, AMD is the first to introduce breakthrough technology in the form of die-stacking and High-Bandwidth Memory. The results are great products with very large generational performance-per-watt gains."

EK Water Blocks, Ljubljana based premium computer liquid cooling gear manufacturer, is excited to launch the true single-slot liquid cooling solution for AMD Radeon reference design R9 FURY X graphics card. EK-FC R9 Fury X directly cools the GPU, HBM as well as VRM (voltage regulation module) as water flows directly over these critical areas, thus allowing the graphics card and it's VRM to remain stable under high overclocks.

EK-FC R9 Fury X water block features EK unique central inlet split-flow cooling engine design for best possible cooling performance. Such system also works flawlessly with the reversed water flow without adversely affecting the cooling performance. Moreover, such design offers great hydraulic performance, allowing this product to be used in liquid cooling systems using weaker water pumps. Unlike the original AIO cooling solution that comes with AMD Radeon R9 FURY X and takes up two slots, EK-FC R9 Fury X water block will transform the FURY X into a single-slot graphics card.

Here are some of the first pictures of Sapphire's custom-design Radeon R9 Fury graphics card. The card features a triple-slot (or 2.2-slot) Tri-X cooling solution. Its PCB appears to be AMD reference-design (identical in design to the R9 Fury X), but cooled by a long triple-fan dual-stack heatsink, with over one-third of it being overhung. Quite a few GTX 970, GTX 670, and GTX 760 cards are known to have similar overhangs of coolers that are longer than the PCB.

The pics also come with leaked specs-sheets, which confirm its core configuration of 56 out of 64 compute units being enabled, yielding 3,584 stream processors; while leaving the 4 GB 4096-bit HBM memory untouched. The core clock speed is lower, at 1000 MHz, while the memory clock is left untouched at 500 MHz, compared to the R9 Fury X. Sapphire is also selling a factory-overclocked card with 1040 MHz core. The Radeon R9 Fury is expected to launch in mid-July (next week).

AMD's second graphics card based on its 28 nm "Fiji" silicon, the Radeon R9 Fury, will be an important SKU for the company. Ahead of its rumored mid-July launch, TweakTown got a whiff of its specifications from its sources. According to them, AMD will create the R9 Fury by enabling 56 of the 64 compute units on the silicon, yielding 3,584 stream processors. This sets the TMU count at 224. We doubt AMD will tinker with the render back-ends, and so the ROP count could remain at 64. The memory configuration could remain untouched, at 4 GB of 4096-bit HBM.

The clocks speeds on the R9 Fury will be the same as the R9 Fury X, at 1050 MHz core, and 500 MHz (512 GB/s) memory. One should expect temperatures of the R9 Fury to be higher, since it's being designed for air-cooled cards, although it's not expected to cross 75°C in typical gaming scenarios. Looking at the 12.5% drop in stream processors, one could expect the performance gap between the two Fury SKUs to be around 10-12%. This makes the R9 Fury a competitor to NVIDIA's GeForce GTX 980, if it's priced in its neighborhood (± $50).

Micron Technology announced during its Q3 FY-2015 earnings call, that it began shipping GDDR5 memory chips based on its 20 nm-class node. The company is reportedly shipping 8 Gb (1 gigabyte) GDDR5 memory chips. The company was last reported to be acquiring Japanese DRAM major Elpida, which also supplies GDDR5 chips to graphics cards, notebooks, and game console makers. The GDDR5 memory space has been saturated by companies such as Samsung and SK Hynix. The memory standard itself is on the brink of becoming obsolete; with AMD implementing HBM on its new high-end GPU, and NVIDIA expected to implement HBM with its upcoming "Pascal" GPU family. There is still quite a few GDDR5-equipped graphics cards to be sold, before HBM takes over GPUs of all market segments.

GIGABYTE announced availability of its AMD Radeon R9 Fury X graphics card. Based entirely on AMD's reference design, the card features reference clocks of 1050 MHz core, and 500 MHz (512 GB/s) HBM clocks. Since the card lacks DVI connectors, GIGABYTE is including a DP-DVI adapter in its package. Based on the 28 nm "Fiji" silicon, the R9 Fury X offers 4,096 stream processors, 256 TMUs, 64 ROPs, and a 4096-bit wide HBM interface, holding 4 GB of memory. The compact card is cooled by a factory-fitted closed-loop liquid cooling solution. The card is generally available at US $649.99.

As the world's No.1 in GAMING graphics cards, MSI is pleased to announce the availability of the revolutionary AMD Radeon R9 Fury X. With the MSI R9 Fury X 4G, MSI adds a new high-end graphics card to its recently introduced and already heavily awarded AMD R9 and R7 300 series range. The MSI R9 Fury X 4G is equipped with 4GB of the groundbreaking High Bandwidth Memory, which is engineered directly onto AMD's Fiji XT GPU for unprecedented performance. The AMD Fury X is built for the future of ultra-high resolution gaming and Virtual Reality, which is available for enthusiasts to explore.

The card is housed in a much smaller form factor than we are used to from a top-level graphics card, which means that it fits into nearly any case. It is cooled by a closed loop liquid cooling solution which is included in the box which keeps the GPU around 50 degree Celsius during typical gaming sessions. The radiator can be mounted on the inside of the case to blow the heat directly outwards, it uses a single high quality 120mm fan for quiet performance.

VisionTek Products LLC, a leading manufacturer of award-winning, high-performance upgrades and accessories for PCs and Macs, today announced the Radeon Fury X, alongside five other new Radeon R9 300 and R7 300 graphics cards designed with Advance Micro Devices (AMD) GPUs. The new VisionTek Radeon graphics cards will feature a new extreme look and are available starting June 24th, 2015.

The VisionTek Radeon Fury X opens a whole new dimension of gaming, for an unbelievable alternate reality. It is the world's first graphics card with AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip, delivering 60% more memory bandwidth over GDDR5. The VisionTek Radeon R9 Fury X features black-nickel aluminum exoskeleton, maintenance-free AIO closed-loop liquid cooling, GPU Tach activity indicator, and red LED "RADEON" illumination along the spine of this wicked beast. The compact 7.5-inch card packs a performance punch, leading the way to create small and powerful PCs by condensing the HBM memory into 94% less space than GDDR5. The VisionTek Fury X was built to enable the next generation of 4K and VR gaming. With this card, PC users won't just upgrade, they will revolutionize.

TUL Corporation, a leading and innovative manufacturer of AMD graphic cards since 1997, has released a new graphics card with the High Bandwidth Memory (HBM) from AMD's latest invention. HBM is a new type of memory chip with low power consumption, ultra-wide communication lanes, and a revolutionary new stacked configuration. HBM's vertical stacking and fast information transfer open the door for truly exciting performance in innovative form factors, not to mention that GPU applications are just the start - look for HBM's superior power efficiency and space savings to spark industry-wide innovation. PowerColor R9 Fury X easily handles the most graphically intense games today due to its advanced and innovative GPU to ever create for the beloved PC gaming community. This power comes from AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip that delivers more than 3 times the bandwidth per watt than GDDR5 along with a 4096-bit memory interface for incredible new advances in power and efficiency.

Spiff-up your gaming rig with sleek, envy-inducing design and make a powerful statement. It is packed with unique features, such as industrial styling including black-nickel aluminum exoskeleton and soft-touch aluminum plates, maintenance-free closed-loop liquid cooling, premium 120mm fan, GPU Tach activity indicator, and LED illumination highlight designs that details for that finished luxurious look. Pack that all in a slim and compact 7.5-inch card and you have yourself a stylish yet powerful graphics processing power that you can hold with your hands.

The future starts today. Get ready for a giant leap forward when it comes to the pinnacle of GPU engineering. Get ready for the revolutionary Club 3D Radeon R9 Fury X. The world's first graphics card featuring AMD-pioneered High Bandwidth Memory (HBM) for extreme performance in the highest resolutions. Benefit from an improved Graphics Core Next architecture, more advanced PowerTune management, improved connection flexibility enabling a 6K gaming setup with multiple monitors and a world class, whisper quiet Closed Loop Liquid Cooling Solution. The Club 3D Radeon R9 Fury X is the fastest GPU in the world and it's here to take your gaming performance to a completely new dimension.

Take the lead with the awesome gaming power of the most advanced and innovative GPU ever created for PC gaming. The Club 3D Radeon R9 Fury X is the world's first graphics card to feature AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip, delivering 60% more memory bandwidth over GDDR5 memory. With 4K Stream Processors, 4K MB High Bandwidth Memory, 4K Bit memory interface aimed at providing the best 4K gaming experience, Fury X marks the beginning of a new era in PC Gaming.

AMD officially launched its latest flagship graphics card, the Radeon R9 Fury X. Designed to compete with NVIDIA's high-end products, including the GTX TITAN X, and the recently launched GTX 980 Ti, this card implements a breakthrough new memory design, with HBM (high bandwidth memory), silicon interposer, and the memory being relocated to the GPU package, to reduce the chip's overall PCB footprint, allowing for an extremely compact main PCB.

The Radeon R9 Fury X comes with a factory-fitted liquid cooling solution, much like the R9 295X2, which promises gaming temperatures in the in the fifties (°C), and load noise output of 32 dB. Based on the new 28 nm "Fiji" silicon, the R9 Fury X offers 4,096 stream processors, 256 TMUs, 64 ROPs, and a 4096-bit wide HBM interface, holding 4 GB of standard memory amount, with a staggering 512 GB/s of memory bandwidth. The core is clocked at 1050 MHz, and the memory at 500 MHz. The card has the same typical board power figure as the R9 290X, at 275W, despite a 40 percent increase in number crunching muscle. Available now in some parts of the world, the card will be widely available in the following few weeks, priced at US $649.99.

Read the TechPowerUp Review of the R9 Fury X right here.

AMD's upcoming flagship GPU silicon, codenamed "Fiji," which is breaking ground on new technologies, such as HBM, memory-on-package, a specialized substrate layer that connects the GPU with it, called Interposer; features a hefty feature-set. More on the "Fiji" package and its memory implementation, in our older article. Its block diagram (manufacturer-drawn graphic showing the GPU's component hierarchy), reveals a scaling up, of the company's high-end GPU launches over the past few years.

"Fiji" retains the quad Shader Engine layout of "Hawaii," but packs 16 GCN Compute Units (CUs), per Shader Engine (compared to 11 CUs per engine on Hawaii). This works out to a stream processor count of 4,096. Fiji is expected to feature a newer version of the Graphics CoreNext architecture than "Hawaii." The TMU count is proportionately increased, to 256 (compared to 176 on "Hawaii"). AMD doesn't appear to have increased the ROP count, which is still at 64. The most significant change, however, is its 4096-bit HBM memory interface, compared to 512-bit GDDR5 on "Hawaii."

AMD announced no less than five new products based on its swanky new 28 nm "Fiji" silicon, the company's most powerful GPU, packing over 8 TFLOP/s of raw compute power, and the first GPU to feature stacked HBM (high-bandwidth memory), moved to the GPU package, and communicating with the GPU die over a special silicon substrate called the interposer. The "Fiji" silicon will enable AMD to target NVIDIA's entire high-end GPU lineup.

The first product is Project Quantum. This is a console-sized SFF gaming desktop designed by AMD, which will be sold by the company's add-in board partners. Despite its diminutive size, the desktop packs two "Fiji" GPUs in AMD CrossFireX, and an AMD 64-bit x86 machine driving the rest. All main components (the CPU, the chipset, and the two GPUs), are liquid-cooled. This desktop will enable smooth 4K/5K gaming in the living room.

Sources tell 3DCenter.org that NVIDIA has successfully taped out its next big silicon based on its upcoming "Pascal" GPU architecture, codenamed GP100. A successor to GM200, this chip will be the precursor to several others based on this architecture. A tape-out means that the company has successfully made a tiny quantity of working prototypes for internal testing and further development. It's usually seen as a major milestone in a product development cycle.

With "Pascal," NVIDIA will pole-vault HBM1, which is making its debut with AMD's "Fiji" silicon; and jump straight to HBM2, which will allow SKU designers to cram up to 32 GB of video memory. 3DCenter.org speculates that GP100 could feature anywhere between 4,500 to 6,000 CUDA cores. The chip will be built on TSMC's upcoming 16 nanometer silicon fab process, which will finally hit the road by 2016. The GP100, and its companion performance-segment silicon, the GP104 (successor to GM204), are expected to launch between Q2 and Q3, 2016.

AMD CEO Lisa Su unveiled the company's next flagship graphics processor at an event on the sidelines of Computex, in Taipei. Arguably the biggest GPU package, measuring in at 50 mm x 50 mm, Fiji will instead reduce graphics card PCB size, because memory has been moved to the GPU package, with four 1024-bit HBM1 stacks surrounding the GPU die on the package. We detailed the chip's memory implementation at great lengths in this article. The first graphics cards based on this chip could be unveiled at E3, two weeks from now; and market launch could follow a week later.

Since March, we've been hearing whispers that AMD could give the topmost tier SKU based on its swanky new HBM-equipped "Fiji" silicon a fancy name, just as NVIDIA names its top-dog the GTX TITAN. That name could be the AMD Radeon FURY. A similar name to the brand that launched the erstwhile ATI, with its Rage series, Radeon FURY will be AMD's (and probably the industry's) fastest GPU, and will compete with NVIDIA's GeForce GTX TITAN X.

The card itself is quite diminutive, but that's because of two reasons - with memory being moved to the GPU package, a large amount of PCB real-estate is saved, and so the card can make do with a smaller PCB; and because the rear-end of the card is where the fittings for its AIO liquid-cooling solution are located. These tubes lead to a 120 x 120 mm radiator, with a single 120 mm PWM fan. Given that such a contraption could cool the dual-GPU R9 295X2, it should be effective with the Radeon FURY, just as well. The card will draw power from a pair of 8-pin PCIe power connectors. Display outputs will include three DP 1.2a and one HDMI 2.0. The brand naming indicates that AMD wants to change the terms on which its top-end product competes with NVIDIA's. Low noise and high-performance will be the focus, not power draw. Nobody buys an Aventador for its MPG.

In the latest picture leaked of AMD's upcoming flagship graphics card, codenamed "Fiji-XT," we get a final confirmation of the reference-design card's length, particularly its short PCB. Since this card uses a factory-fitted AIO liquid cooling solution, and since the Fiji XT package is effectively smaller than that of Hawaii, with the surrounding memory chips gone (moved to the GPU package as HBM stacks), the PCB is extremely compact, with just the GPU package, and its VRM. Speaking of which, the card draws power from a pair of 8-pin PCIe power connectors. The coolant tubes stick out from the rear of the card, making their way to a 120 x 120 mm radiator, with a single included 120 mm PWM fan. With this card, AMD is doing away with DVI altogether. Connectors will be a mixture of DisplayPort 1.2a and HDMI 2.0.

Back in 2008, when it looked like NVIDIA owned the GPU market, and AMD seemed lagging behind on the performance and efficiency game, the company sprung a surprise. The company's RV770 silicon, the first GPU to implement GDDR5 memory, trounced NVIDIA's big and inefficient GeForce GTX 200 series, and threw AMD back in the game. GDDR5 helped the company double the memory bandwidth, with lower pin- and memory-chip counts, letting the company and its partners build graphics cards with fewer components, and earn great margins, which the company invested in development of its even better HD 5000 series, that pushed NVIDIA with its comical GeForce GTX 480, to hit its lowest ever in market-share. Could AMD be looking at a similar turnaround this summer?

Since the introduction of its Graphics CoreNext architecture in 2012, AMD has been rather laxed in its product development cycle. The company has come out with a new high-end silicon every 18-24 months, and adopted a strategy of cascading re-branding. The introduction of each new high-end silicon would relegate the existing high-end silicon to the performance segment re-branded, and the existing performance-segment silicon to mid-range, re-branded. While the company could lay out its upcoming Radeon R9 series much in the same way, with the introduction of essentially just one new silicon, "Fiji," it could just prove enough for the company. Much like RV770, "Fiji" is about to bring something that could prove to be a very big feature to the consumer graphics market, stacked high-bandwidth memory (HBM).

AMD's upcoming Radeon R9 390X graphics cards will ship in two SKUs - an air-cooled one, with a moderately long reference design board (though not as long as the R9 290X), and a new Water-Cooled Edition (WCE) SKU, which will feature a very compact PCB - one that could be no bigger than that of the GeForce GTX 970 reference. This is possible because of AMD's HBM implementation. The 8 GB of memory on this card is present on the GPU package, as bare 3D-stacked DRAM dies, surrounding the GPU die, with an IHS covering everything; rather than the GPU package being surrounded by memory chips. Below is a mock-up of the card by ChipHell. It's not a picture. The radiator is off-proportions, the Radeon logo is misaligned, and the PCIe I/O is misaligned, etc. It should still give you a good idea of what the card looks like, particularly its length. Other specs on hand so far, include 4,096 GCN 1.2 stream processors, 256 TMUs, 128 ROPs, and a 4096-bit wide HBM interface, which at 1.25 GHz memory clock, will offer memory bandwidth of 640 GB/s.

While Fiji package will be bigger than that of, say, "Hawaii," overall the setup is more space-efficient, and conserves PCB real-estate. The PCB hence only has the GPU package and the VRM. AMD is doing away with the DVI connector on its reference PCB. It will only feature three DisplayPort 1.2a and one HDMI 2.0a. The WCE variant will feature a pump+block covering the GPU package, which will come factory-fitted to a 120 x 120 mm radiator. The air-cooled R9 390X will be longer, but only to house a heatsink and lateral blower. The single-GPU card could offer performance comparable to the dual-GPU R9 295X2, which is faster than the GeForce GTX TITAN-X. AMD CEO Lisa Su, speaking at the Investor Day event, in New York, on 6th May, hinted that the product could launch on the sidelines of either Computex 2015 (early-June) or E3 (mid-June).Image Courtesy: ChipHell. Many Thanks to GhostRyder for the tip.