ASUS IoT, the global AIoT solution provider, today announced PE8000G at Embedded World 2024, a powerful edge AI computer that supports multiple GPU cards for high performance—and is expertly engineered to handle rugged conditions with resistance to extreme temperatures, vibration and variable voltage. PE8000G is powered by formidable Intel Core processors (13th and 12th gen) and the Intel R680E chipset to deliver high-octane processing power and efficiency.

With its advanced architecture, PE8000G excels at running multiple neural network modules simultaneously in real-time—and represents a significant leap forward in edge AI computing. With its robust design, exceptional performance and wide range of features, PE8000G series is poised to revolutionize AI-driven applications across multiple industries, elevating edge AI computing to new heights and enabling organizations to tackle mission-critical tasks with confidence and to achieve unprecedented levels of productivity and innovation.

While we are all used to having a system with a CPU, GPU, and, recently, NPU—X-Silicon Inc. (XSi), a startup founded by former Silicon Valley veterans—has unveiled an interesting RISC-V processor that can simultaneously handle CPU, GPU, and NPU workloads in a chip. This innovative chip architecture, which will be open-source, aims to provide a flexible and efficient solution for a wide range of applications, including artificial intelligence, virtual reality, automotive systems, and IoT devices. The new microprocessor combines a RISC-V CPU core with vector capabilities and GPU acceleration into a single chip, creating a versatile all-in-one processor. By integrating the functionality of a CPU and GPU into a single core, X-Silicon's design offers several advantages over traditional architectures. The chip utilizes the open-source RISC-V instruction set architecture (ISA) for both CPU and GPU operations, running a single instruction stream. This approach promises lower memory footprint execution and improved efficiency, as there is no need to copy data between separate CPU and GPU memory spaces.

Called the C-GPU architecture, X-Silicon uses RISC-V Vector Core, which has 16 32-bit FPUs and a Scaler ALU for processing regular integers as well as floating point instructions. A unified instruction decoder feeds the cores, which are connected to a thread scheduler, texture unit, rasterizer, clipping engine, neural engine, and pixel processors. All is fed into a frame buffer, which feeds the video engine for video output. The setup of the cores allows the users to program each core individually for HPC, AI, video, or graphics workloads. Without software, there is no usable chip, which prompts X-Silicon to work on OpenGL ES, Vulkan, Mesa, and OpenCL APIs. Additionally, the company plans to release a hardware abstraction layer (HAL) for direct chip programming. According to Jon Peddie Research (JPR), the industry has been seeking an open-standard GPU that is flexible and scalable enough to support various markets. X-Silicon's CPU/GPU hybrid chip aims to address this need by providing manufacturers with a single, open-chip design that can handle any desired workload. The XSi gave no timeline, but it has plans to distribute the IP to OEMs and hyperscalers, so the first silicon is still away.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

Qualcomm Technologies, Inc. unveiled its latest advancements in artificial intelligence (AI) at Mobile World Congress (MWC) Barcelona. From the new Qualcomm AI Hub, to cutting-edge research breakthroughs and a display of commercial AI-enabled devices, Qualcomm Technologies is empowering developers and revolutionizing user experiences across a wide range of devices powered by Snapdragon and Qualcomm platforms.

"With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialization of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences."

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6 nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20 MHz, thus ensuring the peak data rate of up to 227 Mbps downlink and 122 Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

At MWC 2024, Intel announced its new Edge Platform, a modular, open software platform enabling enterprises to develop, deploy, run, secure, and manage edge and AI applications at scale with cloud-like simplicity. Together, these capabilities will accelerate time-to-scale deployment for enterprises, contributing to improved total cost of ownership (TCO).

"The edge is the next frontier of digital transformation, being further fueled by AI. We are building on our strong customer base in the market and consolidating our years of software initiatives to the next level in delivering a complete edge-native platform, which is needed to enable infrastructure, applications and efficient AI deployments at scale. Our modular platform is exactly that, driving optimal edge infrastructure performance and streamlining application management for enterprises, giving them both improved competitiveness and improved total cost of ownership," said Pallavi Mahajan, Intel corporate vice president and general manager of Network and Edge Group Software.

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

Samsung Electronics foundry has reportedly bagged a mass production order for its cutting edge 2 nm EUV foundry node from Japanese AI chip startup PFN (Preferred Networks). This is reportedly the first major third party order for the 2 nm node. Founded in 2014, PFN specializes in AI and IoT chips, and spun off from Preferred Infrastructure. Samsung's 2 nm node, called the SF2, is on track for delivery of mass produced chips in 2025, which means much of 2024 will be spent on testing, validation, and risk production, with the node expected to go live toward the end of the year. Samsung SF2 is being designed to offer 25% higher power efficiency (at iso-clocks), and 12% increase in performance, over SF3 (3 nm EUV FinFET). In the semiconductor fabrication market, Samsung SF2 competes against TSMC N2 and Intel 20A.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the BIH61-AHA industrial motherboard, designed for smooth, seamless industrial application from AIOT machines, Edge computing, HMI machine, Digital Signage and more. Built based on the Intel H610 chipset, the BIOSTAR BIH61-AHA motherboard is engineered to support the latest Intel Core i7/i5/i3 processors (LGA1700). Featuring the latest DDR5 technology with support for 2x DDR5-4800 MHz LONG-DIMM up to 96 GB max, it offers extensive customization to meet the intricate needs of various industries.

Targeting a diverse audience, from system integrators looking to build sophisticated AIoT machines to enthusiasts aiming to construct powerful automation or edge computing systems, the BIH61-AHA provides unparalleled connectivity and expansion options. With 10 COM ports, 5 PCI slots, dual Intel GbE LAN ports for reliable and high-speed network communication, extensive USB connectivity with 6x USB2.0 & 4x USB 3.2 Gen 1 ports, and multiple storage interfaces, including 4x SATA 6 Gb/s and 1x M.2 M-KEY socket. Its support for a wide operating temperature range (0 ~ 60 degrees C) and ATX power input also ensures the motherboard's adaptability in challenging environments.

DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel Core Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.

According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies.

ASUS and ASUS IoT today announced that they have entered into a strategic partnership with Quividi, the pioneer and leader in AI and computer vision (CV)‑based real-time audience measurement platforms for the digital signage and retail industries. The collaboration allows for seamless integration of Quividi's advanced audience measurement solutions into the range of ASUS NUCs and ASUS IoT Tinker Board-based digital signage solutions.

ASUS, having recently licensed Intel's NUC product lines, has embarked on the development, manufacturing, and sale of current and future NUC systems. This move positions ASUS as a key player in producing customizable small-form-factor (SFF) devices, ideal for edge computing environments and widely utilized in the digital signage and retail industries.

ASUS IoT, the global AIoT solution provider, today announced the launch of industry-leading ultra-compact edge computers and embedded boards with the all-new Intel Core Ultra processors. This lineup comprises the C7146ES-IM-AA, C5143ES-IM-AA single-board computer (SBC), EBS-S500W edge computer and PE2200U ultra-compact fanless embedded computer - offering AI-ready CPU, GPU and NPU enhancements, coupled with remarkable power efficiency. These solutions cater to a wide range of applications such as smart retail, traffic analysis, medical imaging, utility management and edge AI, exemplifying ASUS IoT's commitment to enabling next-generation AI capabilities at the edge.

"ASUS IoT is proud to present our leading solutions to the market, enabling easy deployment of next-generation AI capabilities at the edge," said KuoWei Chao, General Manager of ASUS IoT Business Group. "By collaborating with Intel, ASUS IoT solutions can provide faster AI results, support more media streams per device and ensure long-term value through product longevity."

TP-Link, a leading global provider of consumer and business networking products, and the first-to-market Wi-Fi 7 brand, is proud to announce its latest line of Wi-Fi 7 innovations at CES 2024. This exciting lineup features a more robust collection of Deco Mesh Wi-Fi systems, next-gen Archer routers, and the industry's most powerful gaming router, along with the debut of the world's first Wi-Fi 7 client adapter. TP-Link is committed to delivering an unparalleled connectivity experience for homes of any size and internet access type.

Wi-Fi 7 Whole Home Mesh All-Scenario Solution
Deco offers a seamlessly integrated and comprehensive mesh Wi-Fi solution, allowing users to effortlessly create a whole home mesh Wi-Fi system. Whether consumers have a small apartment or a spacious residence with expansive floor plans and outdoor requirements, Deco ensures a robust and reliable network with faster speeds, lower latency, and more capacity than ever before. At CES 2024, TP-Link will unveil an impressive end-to-end range of Deco solutions that fit any scenario, including the BE95, BE65 Pro, BE63, BE65-5G, BE65-PoE, BE25, BE25-Outdoor, and more.

Wi-Fi CERTIFIED 7 is here, introducing powerful new features that boost Wi-Fi performance and improve connectivity across a variety of environments. Cutting-edge capabilities in Wi-Fi CERTIFIED 7 enable innovations that rely on high throughput, deterministic latency, and greater reliability for critical traffic. New use cases - including multi-user AR/VR/XR, immersive 3-D training, electronic gaming, hybrid work, industrial IoT, and automotive - will advance as a result of the latest Wi-Fi generation. Wi-Fi CERTIFIED 7 represents the culmination of extensive collaboration and innovation within Wi-Fi Alliance, facilitating worldwide product interoperability and a robust, sophisticated device ecosystem.

Wi-Fi 7 will see rapid adoption across a broad ecosystem with more than 233 million devices expected to enter the market in 2024, growing to 2.1 billion devices by 2028. Smartphones, PCs, tablets, and access points (APs) will be the earliest adopters of Wi-Fi 7, and customer premises equipment (CPE) and augmented and virtual reality (AR/VR) equipment will continue to gain early market traction. Wi-Fi CERTIFIED 7 pushes the boundaries of today's wireless connectivity, and Wi-Fi CERTIFIED helps ensure advanced features are deployed in a consistent way to deliver high-quality user experiences.

LG Electronics (LG) is ready to unveil its innovative smart home Artificial Intelligence (AI) agent at CES 2024. LG's smart home AI agent boasts robotic, AI and multi-modal technologies that enable it to move, learn, comprehend and engage in complex conversations. An all-around home manager and companion rolled into one, LG's smart life solution enhances users' daily lives and showcases the company's commitment to realizing its "Zero Labor Home" vision.

With its advanced 'two-legged' wheel design, LG's smart home AI agent is able to navigate the home independently. The intelligent device can verbally interact with users and express emotions through movements made possible by its articulated leg joints. Moreover, the use of multi-modal AI technology, which combines voice and image recognition along with natural language processing, enables the smart home AI agent to understand context and intentions as well as actively communicate with users.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today that it has designed and tested a 32-bit CPU core based on the open-standard RISC-V instruction set architecture (ISA). Renesas is among the first in the industry to independently develop a CPU core for the 32-bit general-purpose RISC-V market, providing an open and flexible platform for IoT, consumer electronics, healthcare and industrial systems. The new RISC-V CPU core will complement Renesas' existing IP portfolio of 32-bit microcontrollers (MCUs), including the proprietary RX Family and the RA Family based on the Arm Cortex -M architecture.

RISC-V is an open ISA which is quickly gaining popularity in the semiconductor industry, due to its flexibility, scalability, power efficiency and open ecosystem. While many MCU providers have recently created joint investment alliances to accelerate their development of RISC-V products, Renesas has already developed a new RISC-V core on its own. This versatile CPU can serve as a main application controller, a complementary secondary core in SoCs, on-chip subsystems, or even in deeply embedded ASSPs. This positions Renesas as a leader in the emerging RISC-V market, following previous introductions of its 32-bit voice-control and motor-control ASSP devices, as well as the RZ/Five 64-bit general purpose microprocessors (MPUs), which were built on CPU cores developed by Andes Technology Corp.

MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with today's introduction of the company's new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Synopsys, Inc. (Nasdaq: SNPS) today announced it has extended its ARC Processor IP portfolio to include new RISC-V ARC-V Processor IP, enabling customers to choose from a broad range of flexible, extensible processor options that deliver optimal power-performance efficiency for their target applications. Synopsys leveraged decades of processor IP and software development toolkit experience to develop the new ARC-V Processor IP that is built on the proven microarchitecture of Synopsys' existing ARC Processors, with the added benefit of the expanding RISC-V software ecosystem.

Synopsys ARC-V Processor IP includes high-performance, mid-range, and ultra-low power options, as well as functional safety versions, to address a broad range of application workloads. To accelerate software development, the Synopsys ARC-V Processor IP is supported by the robust and proven Synopsys MetaWare Development Toolkit that generates highly efficient code. In addition, the Synopsys.ai full-stack AI-driven EDA suite is co-optimized with ARC-V Processor IP to provide an out-of-the-box development and verification environment that helps boost productivity and quality-of-results for ARC-V-based SoCs.

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

ASUS today announced that the official signing ceremony with Intel Corporation, marking the handover of the Intel Next Unit of Computing (NUC) product lines, has been successfully completed. ASUS will now manufacture and sell Intel NUC 10th to 13th generation systems product lines, and will develop future NUC systems. Intel NUC solutions are small-form-factor devices or compute elements that are customizable and ideal for business, edge computing, and gaming environments.

A smooth transition
Following the official handover from Intel, ASUS kicked-off its NUC business and started to take orders for NUC 10th to 13th generation systems on September 1. The new business is generating a wide variety of exciting opportunities for the company and the transition has progressed smoothly for NUC customers. The vision of the newly established ASUS NUC BU is to provide the most impactive edge computing with comprehensive commercial and AIoT solutions that can sustain the industry and businesses.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today took its award-winning Orbi line to new heights with a powerful new antenna design and exclusive, patented technology that enhance the benefits of WiFi 7. Born of over 25 years of NETGEAR pioneering WiFi expertise, the Orbi 970 Series delivers unparalleled performance, speeds of up to 27 Gbps, a slim, elegant design and high-performance antennas for 360-degree coverage across just about any home, no matter the layout.

With the rise of faster multi-gig internet speeds now available to more households, the growing number of connected devices per family and the ever-increasing growth of bandwidth-intensive applications such as 4K/8K video streaming, HD Zoom calls, graphics-focused work, highly interactive real-time gaming and immersive AR/VR entertainment, the need for faster WiFi speeds, lower latency and more capacity becomes imperative. Enter WiFi 7. While WiFi 6E opened the 6 GHz band as a superhighway for the latest, fastest devices, WiFi 7 builds on that promise by expanding the channels to 320 MHz and unleashing unprecedented speeds and performance. The Orbi 970 Series maximizes the potential of the new standard with innovative, new technology that ensures the benefits are delivered throughout the home, from the front door to the backyard, across all devices simultaneously.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

OpenHW Group today announced that the industry's most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered. The OpenHW CORE-V MCU DevKit includes an open-source printed circuit board (PCB) which integrates OpenHW's CORE-V MCU and various peripherals, a software development kit (SDK) with a full-featured Eclipse-based integrated development environment (IDE), as well as connectivity to Amazon Web Services (AWS) via AWS IoT ExpressLink for secure and reliable connectivity between IoT devices and AWS cloud services.

The comprehensive open-source CORE-V MCU DevKit enables software development for embedded, internet-of-things (IoT), and artificial intelligence (AI)-driven applications. The CORE-V MCU is based on the open-source CV32E40P embedded-class processor, a small, efficient, 32-bit, in-order open-source RISC-V core with a four-stage pipeline that implements the RV32IM[F]C RISC-V instruction extensions.