TSMC had been working super hard in the past few years and has been investing in lots of new technologies to drive the innovation forward. At TSMC's Technology Symposium held this week was, the company has presented various things like the update on its 12 nm node, as well as future plans for node development. One of the most interesting announcements made this week was TSMC's state and ownership of Extreme Ultra-Violet (EUV) machines. ASML, the maker of these EUV machines used to etch the pattern on silicon, has been the supplier of the Taiwanese company. TSMC has announced that they own an amazing 50% of all EUV machine installations.

What is more important is the capacity that the company achieves with it. It is reported that TSMC achieves 60% of all EUV wafer capacity in the world, which is a massive achievement of what TSMC can do with the equipment. The company right now has only two nodes on EUV in high-volume manufacturing, the 7 nm+ node and 5 nm node (which is going HVM in Q4), however, that is more than any of its competitors. All of the future nodes are to be manufactured using the EUV machines and the smaller nodes require it. As far as the competitors go, only Samsung is currently making EUV silicon on the 7 nm LPP node. Intel is yet to release some products on a 7 nm node of its own, which is the first EUV node from the company.

Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA's Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA's programs to quickly and easily take advantage of Arm's leading IP, tools and support, accelerating innovation in a variety of fields.

"The span of DARPA research activity opens up a huge range of opportunities for future technological innovation," said Rene Haas, president, IP Products Group, Arm. "Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world's largest ecosystem of tools, services and software."

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes. Leveraging Samsung's through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable.

"Samsung's new 3D integration technology ensures reliable TSV interconnections even at the cutting-edge EUV process nodes," said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. "We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors."

The University of Florida and NVIDIA Tuesday unveiled a plan to build the world's fastest AI supercomputer in academia, delivering 700 petaflops of AI performance. The effort is anchored by a $50 million gift: $25 million from alumnus and NVIDIA co-founder Chris Malachowsky and $25 million in hardware, software, training and services from NVIDIA.

"We've created a replicable, powerful model of public-private cooperation for everyone's benefit," said Malachowsky, who serves as an NVIDIA Fellow, in an online event featuring leaders from both the UF and NVIDIA. UF will invest an additional $20 million to create an AI-centric supercomputing and data center.

According to the report from The Wall Street Journal, we have obtained information that SoftBank, owner of Arm Holdings, is considering a future of Arm Holdings without SoftBank's ownership. The report is indicating that SoftBank can either sell its subsidiary or make it go to public with Initial Public Offering (IPO). If we recall, SoftBank has purchased Arm Holdings in 2016 for 32 billion USD, and the company is potentially worth much more today. Arm Holdings was established as a joint between Acorn Computers, Apple Computer (now Apple Inc.), and VLSI Technology. The news of SoftBank selling Arm Holdings is coming just after Apple decided to make a Mac based on Arm ISA.

The report from WSJ says that the market interest for such acquisition is unknown, so there is a big possibility that SoftBank will ultimately do nothing and just keep the company. My speculations could be that Apple may have an interest in the company since it is using its royalties and intellectual property. If such a thing happens Apple would be forced to sign a deal by antitrust regulators that force the company to continue offering to license the ISA. After all, Apple was one of the founding members of the joint venture. The possibility of that is of course very low. If another option such as IPO happens, the company would still be in ownership of SoftBank, it would just go to the public trading market.

Today xMEMS Labs emerged from stealth mode to reinvent sound with the introduction of Montara, the world's first monolithic true MEMS speaker, delivering high fidelity, full-bandwidth sound and low total harmonic distortion (THD) for sealed in-ear personal audio devices, including true wireless stereo (TWS) earbuds. Montara is also the world's first IP-57 rated microspeaker, enabling water and dust-resistant earbuds. Consumers will benefit from enhanced audio fidelity with raised levels of clarity and detail for instruments and vocals, extremely low latency, waterproof earbuds, and longer listening times.

"With on-the-go media consumption on the rise such as subscription music, podcasts, video, audiobooks and mobile gaming, consumers are increasingly demanding enhanced audio quality and extended listen times between charges," said Joseph Jiang co-founder and CEO. "Until now, the industry has relied on antiquated, centuries-old multi-component voice coil speakers requiring labor-intensive, high variability factory assembly lines. Our revolutionary Montara product is a game changer for delivering a new combination of audio fidelity, size, energy consumption and uniformity not possible with traditional voice coil approaches."

MediaTek, the world's 4th largest global fabless semiconductor company, today launched its newest chips in the smartphone gaming-focused G series - the MediaTek Helio G25 and G35. The latest chips feature MediaTek HyperEngine game technology for faster, smoother performance, enhanced power efficiency, and brilliant graphics.

The new chipsets always keep you connected and deliver the lowest latency gaming experience. They also offer enhanced imaging features, making these G-series chipsets a perfect fit for photography enthusiasts and gamers alike.

The European Hardware Association (EHA), comprised of the nine largest independent technology news and review websites on the continent, has announced its hardware winners for 2020. And AMD has completely blindsided its competition in all possible metrics, whether you're talking about the GPU or CPU side of the equation. AMD's CPU division has completely razed Intel's offerings when it comes to awards, with no Intel CPU even being credited with a single prize. AMD's Ryzen 3000 series won the most-desired award in the form of the "Product of the Year" award. The Ryzen 3000 chiplet design in itself won the EHA "Best Technology" Award; and more specifically, AMD's Ryzen 9 3950X took home the "Best CPU" prize; the Ryzen 5 3600 won "Best Gaming Product"; and the Ryzen 3 3300X won "Best Overclocking Product".

But AMD didn't stop in the CPU category, besting even rival NVIDIA in the GPU side of the equation. AMD's Navi 10 GPU, used in the Radeon RX 5700 series, has won the "Best GPU" category, while the "Best AMD-based graphics card" award goes to the Sapphire RX 5700 XT Nitro+ (the ASUS ROG Strix GeForce RTX 2080 Ti OC won "Best NVIDIA Graphics Card" category). Another AMD-inside design won the "Best Gaming Notebook" Award - ASUS' ROG Zephyrus G14, which packs AMD's mobile Renoir CPUs inside.

AMD today announced it has exceeded its moonshot 25x20 goal set in 2014 to improve the energy efficiency of its mobile processors 25 times by 2020. The new AMD Ryzen 7 4800H mobile processor improves on the energy efficiency of the 2014 baseline measurement by 31.7 times1, and offers leadership performance2 and extraordinary efficiency for laptop PCs. Greater energy efficiency leads to significant user benefits including improved battery life, better performance, lower energy costs and reduced environmental impact from computing.

"We have always focused on energy efficiency in our processors, but in 2014 we decided to put even greater emphasis on this capability," said Mark Papermaster, chief technology officer and executive vice president, Technology and Engineering at AMD. "Our engineering team rallied around the challenge and charted a path to reach our stretch goal of 25 times greater energy efficiency by 2020. We were able to far surpass our objective, achieving 31.7 times improvement leading to gaming and ultrathin laptops with unmatched performance, graphics and long battery life. I could not be prouder of our engineering and business teams."

Intel today announced that systems designer-extraordinaire Jim Keller has departed the company citing personal reasons. Whether or not this is a blow to Intel likely depends on how far Jim Keller brought their Technology, Systems Architecture and Client Group throughout his two-year tenure at the company whilst serving as its Vice President. The semiconductor and chip architecture world isn't being driven by Mr. Keller himself, obviously; there are a number of architects and designers that bring the industry forward through their concerted efforts. However, it's hard to look past Jim Keller's pedigree when it comes to doing his job - if anything, AMD's Zen architecture is a testament to that, and has put Intel in the place we now see it in the CPU world.

To fill in the void, Intel has announced a reshuffling inside their Technology, Systems Architecture and Client Group. Jim Keller will still be serving with Intel for the next six months as a consultant, thus easing the transition. Read the full press-release below.