Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services' (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe. MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.

"As one of the world's leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth," said IFS President Randhir Thakur. "We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications."

Peratech, a leading innovator in tactile-based user interfaces for high-performance electronics, has announced that its full-range, force-sensing technology will be in the latest Lenovo Legion 7i and 7 (16", 7) gaming laptops' W-A-S-D keys. Integrated into Lenovo Legion's high-performance premium gaming laptops, Peratech's Force Keyboard and Hydra user interface software deliver a more immersive, engaging gaming experience.

Unlike other gaming laptops that have added force function to the W, A, S, D keys, Peratech's full-analog response enables players to engage with games on a much more intuitive, physical level by extending the simple on/off switch of a standard key to unleash the full range of force in real-world interaction. Jim Thomas, Peratech CCO shared, "Imagine driving down your local highway and your accelerator is restricted to just 2 options, 'off' or 'full speed.' Reality-based physics calls for acceleration dependent on how hard you press on the gas pedal, or how hard you turn the steering wheel. This is the difference Peratech intelligent tactile sensing makes."

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced support for AMD Ryzen Threadripper PRO 5000WX Series processors on GIGABYTE motherboards, MC62-G40 and MC62-G41, and a workstation, W771-Z00; additionally, a BIOS update is available now to support the new CPU series. The Threadripper PRO line of CPUs is designed for the best in productivity at professional workstations. These GIGABYTE workstation products have enterprise-class reliability and have been in the market supporting the prior generation Threadripper PRO 3000WX series, and now these products will support the 5000WX series for fast rendering, encoding, compiling, modeling, simulating, and more.

Samsung Electronics, the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. Multi-Bridge-Channel FET (MBCFET), Samsung's GAA technology implemented for the first time ever, defies the performance limitations of FinFET, improving power efficiency by reducing the supply voltage level, while also enhancing performance by increasing drive current capability. Samsung is starting the first application of the nanosheet transistor with semiconductor chips for high performance, low power computing application and plans to expand to mobile processors.

"Samsung has grown rapidly as we continue to demonstrate leadership in applying next-generation technologies to manufacturing, such as foundry industry's first High-K Metal Gate, FinFET, as well as EUV. We seek to continue this leadership with the world's first 3 nm process with the MBCFET," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "We will continue active innovation in competitive technology development and build processes that help expedite achieving maturity of technology."

Nanya Technology, part of the Formosa Plastics Group, which is one of the largest conglomerates in Taiwan, will hold a ground-breaking ceremony for its new 12-inch fab that will be built in New Taipei City later this week. It'll be the biggest investment Nanya has done in the past decade, as the company is investing US$10.1 billion into building the new fab. This is obviously a lot less than TSMC is investing, but DRAM is made on different nodes to those that TSMC makes its customers products on, since DRAM doesn't benefit as much from node shrinking as other types of semiconductors.

The new fab will be located near one of Nanya's current fabs, in the Taishan district. Mass production is scheduled to start some time in 2025 and the fab is said to have a monthly capacity of around 45,000 wafers. Right now it's scheduled for a 10 nm technology node, but this might change by the time that the fab is up and running, especially considering that Nanya is already producing a range of 10 nm based products in some of its current fabs. Nanya's goal is to develop its next generation of 10 nm DRAM independently from other DRAM makers, as to avoid having to pay patent licence fees to its competitors.

JUPITER, the first European exascale supercomputer, will be hosted by the Jülich Supercomputing Centre in Germany. Exascale supercomputers are systems capable of performing more than a billion billion calculations per second and represent a significant milestone for Europe. By supporting the development of high-precision models of complex systems, they will have a major impact on European scientific excellence.

Cooler Master launches the availability of the all-new GM Series Curved Monitor lineup for work and play. The ultra-fast GM27-CFX with a 240 Hz refresh rate is available starting today May 26 2022 while the ultra-wide GM34-CWQ ARGB hits shelves on May 30 2022.

GM27-CFX
Cooler Master's new FHD GM27-CFX 1500R Curved monitor delivers outstanding performance for "Work & Play" Setups with a 98% DCI-P3 color spectrum coverage. The GM27-FQX runs an ultra-fast 240 Hz framerate with 0.5 ms response time and features quantum dot picture quality enabling a 3001:1 contrast ratio for deep blacks and bright whites.

IonQ, an industry leader in quantum computing, announced IonQ Forte, its latest generation of quantum systems. The system features novel, cutting-edge optics technology that enables increased accuracy and further enhances IonQ's industry leading system performance. Forte is expected to be initially available for select developers, partners, and researchers in 2022 and is expected to be available for broader customer access in 2023. Forte is the latest evolution towards a "software-configurable quantum computer," which is designed to allow the company to optimize the computing hardware for targeted user problems-ultimately, giving users customized algorithmic performance. The new system features acousto-optic deflector (AOD) technology, which allows IonQ to dynamically direct laser beams that drive quantum gates towards individual ions. The AOD is designed to minimize noise and overcome variations in ion position, improving fidelity in long chains of trapped ions, which is crucial for scaling quantum computers. In addition, key parameters, including qubit and gate configuration, can be tailored to user needs, creating a truly dynamic and flexible system.

Forte joins IonQ Aria as the company's second system with capacity of up to 32 qubits, has AOD systems capable of addressing up to 40 individual ion qubits, and is currently configured to use 31 of them. With this technological leap, IonQ furthers its commitment to building ever more powerful quantum computers with an increasing number of algorithmic qubits, an application-oriented performance metric for quantum computers. The new announcement follows IonQ's announcement of open-source access to native gates, which allows quantum application developers to explore software breakthroughs on top of IonQ hardware without having to choose from a set menu of gates.

One of the largest cloud providers in China, Alibaba, has today announced a preview for a new instance powered by Yitian 710 processor. The new processor is a collection of Alibaba's efforts to develop a home-grown design capable of powering cloud instances and the infrastructure needed for it and its clients. Without much further ado, the Yitian 710 is based on Armv9 ISA and features 128 cores. Ramping up to 3.2 GHz, these cores are paired with eight-channel DDR5 memory to enable sufficient data transfer. In addition, the CPU supports 96 PCIe 5.0 lanes for IO with storage and accelerators. These are most likely custom designs, and we don't know if they are using a blueprint based on Arm's Neoverse. The CPU is manufactured at TSMC's facilities on 5 nm node and features 60 billion transistors.

Alibaba offers these processors as a part of their Elastic Compute Service (ECS) instance called g8m, where users can select 1/2/4/8/16/32/64/128 vCPUs, where each vCPU is equal to one CPU core physically. Alibaba is running this as a trial option and notes that users should not run production code on these instances, as they will disappear after two months. Only 100 instances are available for now, and they are based in Alibaba's Hangzhou zone in China. The company notes that instances based on Yitian 710 processors offer 100 percent higher efficiency than existing AMD/Intel solutions; however, they don't have any useful data to back it up. The Chinese cloud giant is likely trying to test and see if the home-grown hardware can satisfy the needs of its clients so that they can continue the path to self-sustainability.

Last month, Intel released its Arc Alchemist lineup for mobile/laptop configurations. As expected, being the first discrete GPU that the company made, there are some hiccups here and there that happen along the way. Today, we have an interesting case of Intel Arc A350M getting a heavy performance boost with Dynamic Tuning Technology (DTT) disabled. The DTT is Intel's solution to automatically and dynamically allocate power between an Intel processor and an Intel Discrete Graphics Card to optimize performance and improve battery life. This is essentially a competing tech for AMD SmartShift and NVIDIA Dynamic Boost implementations. Thanks to a South Korean YouTuber, BullsLab, we have information that disabling DTT in drivers helps Arc 350M GPU reach higher performance targets.

He found when disabling DTT in drivers that the gaming performance improved significantly and that the Arc 350M was outputting 30-80 more frames per second. This is no slight improvement and shows that the drivers are still not yet mature. Creating a discrete graphics card is not an easy task, as noted here; however, we hope to see Intel put out more fixes in the coming weeks and hopefully end this strange behavior.Below, you can see the YouTube video with benchmarks.

Polyn Technology announced today that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology's brain-mimicking architecture. It is the first Tiny AI true analog design to be used next to sensors. Polyn Technology is an innovative provider of ultra-low-power-performance NASP technology and a producer of unique Tiny AI chips and their associated IP. "This achievement validates the intensive work of our multinational team," said Aleksandr Timofeev, CEO and founder of Polyn Technology. "Our chip represents the most advanced technology bridging analog computations and the digital core. It is designed with neuroscience in mind, replicating pre-processing the primary cortical area of the human brain does at the periphery before learning at the center."

The NASP chip enables full data processing disaggregation between the sensor node and the cloud; it truly embodies the Tiny AI concept. The NASP test chip contains several neural networks. The chip is implemented in 55 nm CMOS technology. Its design proves the NASP "neuron" model as well as the scalability of the technology and efficiency of the chip design automation tools developed by Polyn. "Our first chip is created from trained neural networks by NASP Compiler and synthesis tools that generated Netlist and the silicon engineering files from the software math model simulation. We will continue to refine our technology for creation of new generation chips," said Yaakov Milstain, COO of Polyn. Polyn anticipates the chip will be available to customers in the first quarter of 2023 as its first wearables product, with a fusion of PPG and IMU sensors for the most accurate heart rate measurement along with recognition and tracking of human activity.

E Ink, the originator, pioneer, and global commercial leader in digital paper technology, today announced the launch of E Ink Kaleido 3. This new generation of E Ink Kaleido offers richer colors, along with 16 levels of grayscale and 4096 colors, perfect for displaying colorful images and information on eReaders and eNote devices. By optimizing the design of the ePaper module structure, E Ink Kaleido 3 has increased its color saturation by 30 percent compared to the previous generation, E Ink Kaleido Plus. E Ink Kaleido 3 is using E Ink's Print Color ePaper technology, where a color filter array (CFA) is used in conjunction with E Ink's Carta black and white ink film, creating a full color device for a more fully realized eBook shopping and reading experience.

In addition to improved color performance, Kaleido 3 uses E Ink ComfortGaze, a new front light technology designed by E Ink's Front Light Team. ComfortGaze has been engineered to reduce the amount of blue light reflected off the surface of the display, providing further comfort while reading. ComfortGaze has been engineered to reduce the amount of blue light reflected off the surface of the display, providing further comfort while reading with reduced Blue Light Ratio (BLR) and Blue Light Toxicity Factor (BLTF) by up to 60 percent and 24 percent respectively compared to the previous generation of front light design.

Fujitsu today announced the launch of its new service portfolio "Fujitsu Computing as a Service (CaaS)" to accelerate digital transformation (DX) and empower customers globally by offering access to some of the world's most advanced computing technologies via the cloud for commercial use. The new service encompasses advanced computing resources like Fujitsu's quantum-inspired Digital Annealer technology, the computing technology at the heart of the world's fastest supercomputer, Fugaku, and software applications that allow a wide range of users to solve problems with AI and machine learning. Fujitsu will begin delivery of these new services to the Japanese market starting in October 2022 with a global rollout to international regions including Europe, Asia Pacific, and the Americas to follow.

As the first step, Fujitsu will begin preorders for "Fujitsu Cloud Service HPC," which offers the computing power of the "Fujitsu Supercomputer PRIMEHPC FX1000," which shares the same CPU at the heart of the supercomputer Fugaku. Fujitsu will begin sales of the service for the general public and organizations in Japan starting April 6, 2022, with delivery to commence from October. In the months ahead, Fujitsu will further add services for its Digital Annealer technology and AI cloud services to its service lineup in order to provide further value-added services that seamlessly integrate various solutions.

Intel, Micron, Analog Devices, and MITRE Engenuity announced they have an agreement of principles to accelerate semiconductor research, development, and prototyping to build a more robust U.S. semiconductor industry, foster advanced manufacturing in the United States, and protect intellectual property amid increased global competition. This engagement signifies a commitment to collaborate on ensuring the resiliency of the industry. It establishes the Semiconductor Alliance to propose the foundation for a whole-of-nation approach for a more innovation-focused U.S. semiconductor industry and supply chain, one that ensures American innovation truly leads to American growth.

The Semiconductor Alliance, led by MITRE Engenuity, was developed from working groups in 2021, and its principles were published in a white paper on American Innovation for American Growth summarizing the Alliance's whole-of-nation call to action for a fair and objective National Semiconductor Technology Center (NSTC). The leading U.S. semiconductor manufacturers—Intel, Micron, and Analog Devices—and MITRE Engenuity seek engagement from industry and experts from all facets of the U.S. semiconductor ecosystem, including integrated device manufacturers; fabless chip companies; providers of infrastructure, design, and manufacturing tools; and technology innovators from industry and academia. MITRE Engenuity is built on MITRE's 60+ year history of serving as an independent, objective bridge and convener of government, industry, and academia, bringing together the whole of nation to tackle some of the biggest challenges to our national security.

IBM today unveiled IBM z16, IBM's next-generation system with an integrated on-chip AI accelerator—delivering latency-optimized inferencing. This innovation is designed to enable clients to analyze real-time transactions, at scale -- for mission-critical workloads such as credit card, healthcare and financial transactions. Building on IBM's history of security leadership, IBM z16 also is specifically designed to help protect against near-future threats that might be used to crack today's encryption technologies.

IBM innovations, including the IBM z16, have formed the technology backbone of the global economy for decades. Today's modern IBM mainframe is central to hybrid cloud environments, valued by two thirds of the Fortune 100, 45 of the world's top 50 banks, 8 of the top 10 insurers, 7 of the top 10 global retailers and 8 out of the top 10 telcos as a highly secured platform for running their most mission critical workloads. For example, according to a recent IBM commissioned study by Celent "Operationalizing Fraud Prevention on IBM Z," IBM zSystems run 70% of global transactions, on a value basis. "IBM is the gold standard for highly secured transaction processing. Now with IBM z16 innovations, our clients can increase decision velocity with inferencing right where their mission critical data lives," said Ric Lewis, SVP, IBM Systems. "This opens up tremendous opportunities to change the game in their respective industries so they will be positioned to deliver better customer experiences and more powerful business outcomes.

Fujitsu has successfully developed the world's fastest quantum computer simulator capable of handling 36 qubit quantum circuits on a cluster system featuring Fujitsu's "FUJITSU Supercomputer PRIMEHPC FX 700" ("PRIMEHPC FX 700")(1), which is equipped with the same A64FX CPU that powers the world's fastest supercomputer, Fugaku.

The newly developed quantum simulator can execute the quantum simulator software "Qulacs"(3) in parallel at high speed, achieving approximately double the performance of other significant quantum simulators in 36 qubit quantum operations. Fujitsu's new quantum simulator will serve as an important bridge towards the development of quantum computing applications that are expected to be put to practical use in the years ahead.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it closed out a prosperous 2021 in the number one spot for SSD Unit market share in the channel. SSD demand through Q4 2021 remained high due to continued growth in the client, enterprise and OEM sectors. In October, Kingston also broadened its portfolio by launching two new high performance client M.2 NVMe PCIe Gen 4 SSDs, KC3000 and Kingston FURY Renegade.

Market share data from analyst research company TRENDFOCUS showed Kingston as the number one client SSD vendor in the channel with 22.2% for unit market share and 22.3 million client SSDs shipped for all of 2021 in the channel. In Q4 alone, Kingston's client SSD market share grew to a substantial 26.8% in the channel which displays a healthy annual unit growth despite ongoing component shortages. According to TRENDFOCUS, total client SSD units increased 12.4% YoY in 2021. Notebook PC units increased 12% YoY while desktop PCs inched up 1% over the same period, reflecting the rapid adoption of solid-state drives by clients largely due to performance, size and reduced power consumption. Kingston maintains a competitive advantage by working closely with its suppliers, partners, and customers to remain flexible and adapt to ever-changing needs and market conditions.

A game-changing new material promises to keep your "battery health" meter stuck at a 100% for up to 5 years. Lihium-ion rechargeable batteries that power most of today's digital civilization, come with two limitations—one that they can only be recharged a finite number of times; and two, that their capacity reduces over time. On some smartphones, such as the iPhone, this is reported to end-users as "battery health."

Japan Advanced Institute of Science and Technology (JAIST) discovered a new material called [wait for it] bis-imino-acenaphthenequinone-paraphenylene (BP) co-polymer. This serves as a binder material on the anode (positive electrode). A binder is a substance used to coat an electrode to prevent the material of the electrode from falling apart or getting destroyed by the electrolyte. Li-ion cells use graphite anodes that are delicate, and were being coated by poly-vinylidene fluoride (PVDF), but this material had a durability of 500 recharge cycles at full (rated) capacity, and yielding only 65% of capacity the battery is "capable" of (with bare electrodes). Beyond 500 cycles, the PVDF binder wears, taking the electrode with it, which the capacity. JAIST's research has found its material to be capable of sustaining 1,700 recharge cycles while maintaining the battery's recharge capacity at 95 percent. For a smartphone that gets recharged once a day, that's nearly 5 years of full "battery health." The JAIST paper can be accessed here.

Intel today launched its 12th Gen Core Processors with vPro. Released across the company's mobile and desktop product lines, these processors are targeted at pre-built commercial desktops and commercial notebooks that companies typically issue their employees, which come with a host of security and remote-management features suitable to a large corporate environment. With this generation, Intel is bringing vPro to even more market segments, including ultraportables designed under the Intel Evo banner; a new breed of enterprise-grade Chromebooks for businesses built entirely on the Chrome OS platform and cloud-based apps; and for the first time, an SMB version of vPro called vPro Essentials, which will make it to entry-level Core i5 processors with vPro.

Security, Productivity, and Future-readiness form the three areas in which Intel innovated for 12th Gen Core processors with vPro. The company added new capabilities for Threat Detection Technology, which can detect ransomware and supply-chain attacks, and can work with various endpoint security software. Intel Hardware Shield technology prevents attacks from "below" the software (below ring-0, or at the firmware, microcode, or hardware levels). This is achieved through hardware-accelerated virtualization and encryption of the entire software environment. Hardware-based protections extend to vPro Enterprise for Chrome.

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

Comcast today announced the successful test of a prototype 10G modem using the core technology that will deliver multigigabit speeds to tens of millions of homes. In a world-first lab test, a Full Duplex DOCSIS 4.0 system-on-chip (SoC) cable modem built by Broadcom delivered upload and download speeds faster than 4 gigabits per second (Gbps) powered by 10G network technology. Today's announcement is the latest in a series of 10G milestones from Comcast. In October 2021, the company announced a successful test of a complete 10G connection using a virtualized cable modem termination system (vCMTS) powered by DOCSIS 4.0 technology. That announcement followed major 10G milestone announcements in April 2021, of the first-ever live lab test of a 10G system-on-chip (SOC) and October 2020, of a trial delivering 1.25 gigabit-per-second (Gbps) upload and download speeds over a live production network using Network Function Virtualization (NFV) combined with the latest DOCSIS technology

A key component of 10G, DOCSIS 4.0 is an evolutionary leap forward in the ability to deliver multigigabit upload and download speeds over the connections already installed in hundreds of millions of homes worldwide. "The great strength of our smart network design is that we are able to exceed our customers' demands today, even as we continuously evolve to meet the needs of the future," said Charlie Herrin, President of Technology, Product, Experience at Comcast Cable. "As our 10G journey continues to accelerate, customers will reap the benefits of ever-increasing security, reliability, and speed."

Infortrend Technology, Inc. (TWSE: 2495), the industry-leading enterprise storage provider, satisfies requirements of high throughput and fast response time for high-performance computing (HPC), media post-production, and medical PACS applications ­— with EonStor CS NVMe SSD storage delivering 13 GB/s throughput in a 3-node cluster, and performance linearly increases in a scale-out mode.

Today's HPC applications perform computationally intensive operations with billions of files across multiple resources of different nature at PB scale. Storage for HPC, therefore, must be able to simultaneously support multiple random and sequential IO workloads of different sizes. Otherwise, it can extensively delay the HPC application output and the company's success. EonStor CS NVMe SSD storage, CS 4014U, effectively eliminates these concerns and guarantees fast response time, satisfying various types of IO profiles.\

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces a new series of solid state drives (SSD), the ADATA LEGEND series, geared toward creators of different needs and budgets. They include the ADATA LEGEND 740, 750, and 840.

The LEGEND 740 and 750 utilize PCIe Gen3 x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the LEGEND 840 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5,000/4,500 MB per second.