Thursday, February 11th 2021
First Comprehensive Review of the Core i7-11700K (ES) Surfaces
Lab501 posted the first comprehensive review of an Intel Core i7-11700K "Rocket Lake-S" engineering sample. The ES has clock speeds matching the rumored clock speeds of the retail version, and should give you a fair idea of how the finished product should perform. The i7-11700K, which is an 8-core/16-thread chip, was tested to be being consistently behind the AMD Ryzen 7 5800X in synthetics such as WPrime, rendering tests such as Blender, video-encoding tests such as Handbrake, and was negligibly trading blows with the 5800X at gaming ±1%. The chip does post leads over the previous-gen i7-10700K in all these areas, though.
Performance aside, the Core i7-11700K is shown to have significantly higher power draw, with the whole-system power draw being 27% higher than a 5800X-based whole-system, when measured using Prime95 (which only adds a CPU load). In a real-world scenario such as gaming, where GPU power draw is added, this whole-system power draw percentage difference should come down. Interestingly, the i7-11700K isn't a "hot" processor, running up to 18°C cooler than a 5800X under Prime95 load. Check out this, and other invaluable early insights into "Rocket Lake" by hitting the source link below.
Source:
Lab501.ro
Performance aside, the Core i7-11700K is shown to have significantly higher power draw, with the whole-system power draw being 27% higher than a 5800X-based whole-system, when measured using Prime95 (which only adds a CPU load). In a real-world scenario such as gaming, where GPU power draw is added, this whole-system power draw percentage difference should come down. Interestingly, the i7-11700K isn't a "hot" processor, running up to 18°C cooler than a 5800X under Prime95 load. Check out this, and other invaluable early insights into "Rocket Lake" by hitting the source link below.
59 Comments on First Comprehensive Review of the Core i7-11700K (ES) Surfaces
It's a little late to be beating the dead horse that is "but it's Intel, how can it run cooler??". Comet Lake released months ago with die thinning and a new heatspreader, none of this is news. Intel has the monstrous power draw without the thermal density, AMD has the efficiency without the die area to properly dissipate it.
One thing is for sure, Superfin and Golden Cove needs to come to desktop ASAP, because the power draw is going to keep driving VRM throughput and already insane board prices up until Intel can get a handle on its PL2 numbers.
5600X is the one chip in the stack that runs uncharacteristically cool for various reasons, one of which is that it's actually closer to its TDP than PPT.
Although, in a sense, it's a bit of a strange comparison and unfair in a way since the 5800X is the uncharacteristically hot one in the stack.
Can only imagine its performance with 4133mhz c16 ram, it Will beat zen 3 In games for sure.
If 11600k comes at 250€-280€, and with stock, we have a winner for gaming.
11400f for 160€-180€ Will also be an interesting budget option paired with a B560 motherboard.
As these chip companies start moving into chiplet design, I feel heat issues will become more common.
More on that subject as you push the IMC harder at a given frequency and reducing CL by 1 or conversely at a given CL speed you using a higher memory frequency strap it raises CPU temps in turn quite progressively. The end result of course is a lower tcase chip will hit a IMC system memory bandwidth/latency limitation more rapidly far as I can tell. Which considering how involved cooling the FSB was when the IMC was on the chipset and not integrated on the CPU itself that certainly makes logical sense. I actually think Intel should remove the IMC on it's big.LITTLE approach for the Core chip die (RIP) and retain it on the Atom chip that they place side by side on substrate in the same socket. The Atom chip die should run cooler so the IMC could be pushed more aggressively without causing as much CPU temperature rise in the process when you use a higher memory frequency strap on the IMC or if you reduce the CL latency at the same frequency strap.
I think there are pro's and con's to that approach, but if it means a higher memory frequency strap you end up with higher bandwidth which gives you more true latency upside than reducing CL latency so it balances out a bit. The Atom die would be closer to the Core die in the first place as well on the same substrate on the same socket much more so than in the old days where the memory controller resided on the NB MILES AWAY literally ;) not figuratively from the CPU socket. The latency penalty wouldn't be anywhere close to as pronounced as it was with the IMC on the NB in reality. The other aspect is any tasks run by the Atom chip itself would suffer any latency drawback in the first place. The big thing is that the Atom chip die should run cooler which should make moving the IMC to that chip die beneficial in terms of dealing with cooling.
The other option is Intel could put 1 channel of bandwidth on each chip die to spread the heat output from the IMC between them in some sort of variable rate memory channel configuration between both dies where one channel runs quicker than the other channel, but can still access the other. You might be able to push each IMC on each die chip higher though if their each running a single channel however much like on a motherboard where if you populate more DIMM slot's pushing peak frequency scaling drops a bit for additional DIMM's. I have the solution to that issue mix and match die sizes and scale the heat and performance of them around the die size, but arrange them on a substrate a bit like mipmaps for texturing.
give me CPU that wil boost performance in 4k on 144hz panel and ill consider changing my 5950x thats boosts to 4,85-5,09 with top temps of 53'C on my watercooling
On the actual topic:
yikez....I was hoping for a bit more there Intel...makes it even more logical to just wait for Alderlake, course in the end, it all comes down to price
There is no hardware reason for AMD CPUs to be so much slower in sims like MS Flight Simulator 2020, DCS World, IL2 for example, in fact they should be faster based on benchmarks than intel counterparts, but they're not. It all comes down to game code optimization in the end. No matter how good hardware potential is, it still comes down to software utilization of it. Same goes with AMD's RDNA/RDNA2 and some productivity apps support like Adobe Creative Suite unfortunately. 94% of Adobe users use Nvidia so they don't bother with AMD GPUs optimization.
Btw, I'd opt for 11700F instead of 11700K if I were not waiting for Alder Lake / Zen4 to upgrade. It will have much better power consumption profile and still be within 5% 11700K/5800X performance in low res gaming. Even 10700F is very tempting at current 256 bucks price tag versus hard to get 5800X with hard to swallow $448 price tag. Sure it's a bit slower, but looking at the price difference, it's a no brainer what to buy if you you're looking for optimal price/performance ratio imho.
videocardz.com/newz/intel-core-i9-11900k-tested-against-amd-ryzen-7-5700g-both-unreleased-8-core-processors