InWin has showcased several new server chassis models at CES—these new introductions form part of the company's efforts to expand regional IPC, server, and systems assembly operations going into 2025. New manufacturing facilities in the USA and Malaysia were brought online last year, and new products have sprung forth. TechPowerUp staffers were impressed by InWin's RG650B model—this cavernous rackmount GPU server has been designed with AI and HPC applications in mind. Its 6.5U dual-chamber design is divided into two sections with optimized and independent heat dissipation systems—GPU accelerators are destined for the 4.5U space, while the motherboard and CPUs go into the 2U chamber.

The RG650B's front section is dominated by the nine pre-installed hot swappable 80 x 30 mm (12,000 RPM max. rated) PWM fans. This array should provide plenty of cooling for any contained hardware; these components will be powered by an 80 Plus Titanium CRPS 3200 W PSU (with four 12V-2x6 pin connectors). InWin's spec sheet states that their RG650B supports 18 FHFL PCI-Express slots with four PCI-Express riser cables—granting plenty of potential for the installation of add-in boards.The InWin RL200 is a high-end liquid cooled 2U rackmount edge server chassis—the demonstration unit featured a pre-fitted 240 mm 2U AIO liquid cooler and a safety-certified CRPS high-performance 2000 W PSU. Customers can also configure the RL200 with air cooling. Its short-depth design is ideal for situations where space is limited. The InWin specification sheet states that the RL200 can house a single full-height GPU.The RS116 is a 1U rackmount case with a full-height PCIe slot that supports PCI-Express Gen 5 expansion. It can run up to sixteen NVMe E1.S 15 mm hot-swap drives. Two pre-installed MCIO (8i) backplane cage kits can support eight drives each. The six pre-installed 21,500 RPM fans are said to be powerful enough to meet the challenge of cooling PCIe Gen 5 devices as well as any added accelerator card.InWin will offer RS116 customers a custom I/O shield service (using SGCC material)—for instances where certain motherboard designs require a different backplate layout.