RiVAI Technologies, a Shenzhen-based semiconductor firm founded in 2018, unveiled this first fully domestic high-performance RISC-V server processor designed for compute-intensive applications. The Lingyu CPU features 32 general-purpose computing cores working alongside eight specialized intelligent computing cores (LPUs) in a heterogeneous "one-core, dual architecture" design. It aims for performance comparable to current x86 server processors, with the chip implementing optimized data pathways and enhanced pipelining mechanisms to maintain high clock frequencies under computational load. The architecture specifically targets maximum throughput for parallel processing workloads typical in data center environments. The chip aims to serve HPC clusters, all-flash storage arrays, and AI large language model inference operations.

Since its inception, RiVAI has accumulated 37 RISC-V-related patents and established partnerships with over 50 industry collaborators, including academic research relationships. Professor David Patterson, a RISC-V architecture pioneer, provides technical guidance to the company's development efforts. The processor's dual-architecture approach enables dynamic workload distribution between conventional processing tasks and specialized computational operations, potentially improving performance-per-watt metrics compared to traditional single-architecture designs. The Lingyu launch significantly advances China's semiconductor self-sufficiency strategy, potentially accelerating RISC-V ecosystem development while providing Chinese data centers with domestically engineered high-performance computing solutions, ultimately bypassing x86 and Arm solutions.

Quantum Machines (QM), the leading provider of advanced quantum control solutions, has recently announced the NVIDIA DGX Quantum Early Customer Program, with a cohort of six leading research groups and quantum computer builders. NVIDIA DGX Quantum, a reference architecture jointly developed by NVIDIA and QM, is the first tightly integrated quantum-classical computing solution, designed to unlock new frontiers in quantum computing research and development. As quantum computers scale, their reliance on classical resources for essential operations, such as quantum error correction (QEC) and parameter drift compensation, grows exponentially. NVIDIA DGX Quantum provides access to the classical acceleration needed to support this progress, advancing the path toward practical quantum supercomputers.

NVIDIA DGX Quantum leverages OPX1000, the best-in-class, modular high-density hybrid control platform, seamlessly interfacing with NVIDIA GH200 Grace Hopper Superchips. This solution brings accelerated computing into the heart of the quantum computing stack for the first time, achieving an ultra-low round-trip latency of less than 4 µs between quantum control and AI supercomputers - faster than any other approach. The NVIDIA DGX Quantum Early Customer Program is now underway, with selected leading academic institutions, national labs, and commercial quantum computer builders participating. These include the Engineering Quantum Systems group (equs.mit.edu) led by MIT Professor William D. Oliver, the Israeli Quantum Computing Center (IQCC), quantum hardware developer Diraq, the Quantum Circuit group (led by Ecole Normale Supérieure de Lyon Professor Benjamin Huard), and more.

Super Micro Computer, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is announcing the availability of new single-socket servers capable of supporting applications that required dual-socket servers for a range of data center workloads. By leveraging a single-socket architecture, enterprises and data center operators can reduce initial acquisition costs, ongoing operational costs such as power and cooling, and reduce the physical footprint of server racks compared to previous generations of systems based on older processors.

"We are entering a new era of compute where energy-efficient and thermally optimized single-socket architectures are becoming a viable alternative to traditional dual-processor servers," said Charles Liang, president and CEO of Supermicro. "Our new single-socket servers support 100% more cores per system than previous generations and have been designed to maximize acceleration, networking, and storage flexibility. Supporting up to 500-watt TDP processors, these new systems can be configured to fulfill a wide range of workload requirements."

Tachyum today announced that it has successfully enabled DRAM Failover correct system on its Prodigy Universal Processor, demonstrating enhanced reliability for even larger-scale AI and HPC applications even in the case of DRAM chip failures.

Tachyum's DRAM Failover is an advanced memory error correction technology that improves the reliability of DRAM and provides a higher level of protection than traditional Error Correction Code (ECC). DRAM Failover can correct multi-bit errors within a single memory chip or across multiple memory chips, allowing continued memory operation in the event of device-level faults in memory. With DRAM Failover, even a whole DRAM chip failure can be tolerated without affecting the system and applications.

Yield Engineering Systems, Inc. (YES), a global leader in materials and interface engineering equipment solutions, proudly announces the shipment of the first commercial VeroTherm Formic Acid Reflow tool to a leading global semiconductor manufacturer from its Sulur, Coimbatore, manufacturing facility. This landmark achievement signifies a pivotal moment for YES and the burgeoning semiconductor ecosystem in India, as it represents the first equipment produced in India for advanced semiconductor applications like High Bandwidth Memory (HBM), which is critical for AI and High-Performance Computing (HPC) applications worldwide.

YES commenced operations in September 2024 at this state-of-the-art manufacturing facility in Sulur, Coimbatore, India, located at 96/3 Vadakku Sambala Thottam, Trichy Road, Kannampalayam, Sulur Taluk. This facility is integral to YES's strategic expansion plan, aimed at serving its global customers' operations in India and the world with greater efficiency.

In industrial environments, equipment runs 24/7, handling frequent and intensive write operations. To support these demanding workloads, storage solutions must offer high endurance to extend lifespan, minimize downtime, and lower Total Cost of Ownership (TCO). Designed to meet these demands, the Cervoz T455 Series, M.2 2280 NVMe SSD delivers 35% greater endurance through a refined firmware architecture and proven storage technologies. Ideal for industrial automation, edge computing, and high-performance computing (HPC), it ensures reliable performance under heavy workloads.

Enhanced Endurance for Demanding Industrial Applications—Over-Provisioning Technology: Endurance SSD Performance and Longevity
Cervoz's Over-Provisioning technology optimizes SSD performance by reserving extra storage space, boosting efficiency, and extending lifespan. How SSD Over-Provisioning Delivers Benefits:

• Extended Lifespan: Efficiently reserves additional storage space, enhancing NAND durability at least 35%.
• Consistent Performance: Maintains steady performance levels even under high-intensity workloads.
• Optimized Resource Management: Reserved space allocation for optimal write efficiency.

MiTAC Computing Technology Corporation, a leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation, will present its latest innovations in AI infrastructure at GTC 2025. At booth #1505, MiTAC Computing will showcase its cutting-edge AI server platforms, fully optimized for NVIDIA MGX architecture, including the G4527G6, which supports NVIDIA H200 NVL platform and NVIDIA RTX PRO 6000 Blackwell Server Edition to address the evolving demands of enterprise AI workloads.

Enabling Next-Generation AI with High-Performance Computing
With the increasing adoption of generative AI and accelerated computing, MiTAC Computing introduces the latest NVIDIA MGX-based server solutions, the MiTAC G4527G6, designed to support complex AI and high-performance computing (HPC) workloads. Powered by Intel Xeon 6 processors, the G4527G6 accommodates up to eight NVIDIA GPUs, 8 TB of DDR5-6400 memory, sixteen hot-swappable E1.s drives, four NVIDIA ConnectX -7 NICs for high-speed east-west data transfer, and an NVIDIA BlueField -3 DPU for efficient north-south connectivity. The G4527G6 further enhances workload scalability with the NVIDIA NVLink interconnect, ensuring seamless performance for enterprise AI and high-performance computing (HPC) applications.

MSI, a leading global provider of high-performance server solutions, unveiled its next-generation server platforms—ORv3 Servers, DC-MHS Servers, and NVIDIA MGX AI Servers—at CloudFest 2025, held from March 18-20 at booth H02. The ORv3 Servers focus on modularity and standardization to enable seamless integration and rapid scalability for hyperscale growth. Complementing this, the DC-MHS Servers emphasize modular flexibility, allowing quick reconfiguration to adapt to diverse data center requirements while maximizing rack density for sustainable operations. Together with NVIDIA MGX AI Servers, which deliver exceptional performance for AI and HPC workloads, MSI's comprehensive solutions empower enterprises and hyperscalers to redefine cloud infrastructure with unmatched flexibility and performance.

"We're excited to present MSI's vision for the future of cloud infrastructure." said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our next-generation server platforms address the critical needs of scalability, efficiency, and sustainability. By offering modular flexibility, seamless integration, and exceptional performance, we empower businesses, hyperscalers, and enterprise data centers to innovate, scale, and lead in this cloud-powered era."

Equal1 today unveils Bell-1, the first quantum system purpose-built for the HPC era. Unlike first-generation quantum computers that demand dedicated rooms, infrastructure, and complex cooling systems, Bell-1 is designed for direct deployment in HPC-class environments. As a rack-mountable quantum node, it integrates directly alongside classical compute—as compact as a GPU server, yet exponentially more powerful for the world's hardest problems. Bell-1 is engineered to eliminate the traditional barriers of cost, infrastructure, and complexity, setting a new benchmark for scalable quantum computing integration.

Bell-1 rewrites the rule book. While today's quantum computers demand specialized infrastructure, Bell-1 is a silicon-powered quantum computer that integrates seamlessly into existing HPC environments. Simply rack it, plug it in, and unlock quantum capabilities wherever your classical computers already operate. No new cooling systems. No extraordinary power demands. Just quantum computing that works in the real world, as easy to deploy as a high-end GPU server. It plugs into a standard power socket, operates at just 1600 W, and delivers on-demand quantum computing for computationally intensive workloads.

TrendForce reveals that the combined revenue of the world's top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase. The booming AI industry has fueled growth across the semiconductor sector, with NVIDIA leading the charge, posting an astonishing 125% revenue growth, widening its lead over competitors, and solidifying its dominance in the IC industry.

Looking ahead to 2025, advancements in semiconductor manufacturing will further enhance AI computing power, with LLMs continuing to emerge. Open-source models like DeepSeek could lower AI adoption costs, accelerating AI penetration from servers to personal devices. This shift positions edge AI devices as the next major growth driver for the semiconductor industry.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of 32 Gbps per lane, the highest speed defined in the UCIe specification. The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications.

In this test chip, several dies with North-South and East-West IP orientations are interconnected through CoWoS interposer. The silicon measurements show robust 32 Gbps operation with wide horizontal and vertical eye openings. GUC is working aggressively on the full-corner qualification, and the complete silicon report is expected to be available in the coming quarter.

At Embedded World 2025, Congatec unveiled an acetone-based heat pipe cooling solution explicitly engineered for sub-zero operating environments. The system addresses thermal management challenges in extreme cold conditions where traditional cooling mechanisms risk freezing and component damage. Yes, even at sub-zero environments the CPU still needs a dissipation medium as its heat density is still a problem. Operating reliably at temperatures as low as -40°C, the technology utilizes acetone's -95°C freezing point to maintain thermal transfer functionality in arctic environments. The solution resolves a fundamental limitation of water-based systems, which become inoperable at their 0°C freezing threshold. Despite water's superior latent heat of vaporization (2,260 J/g), its physical properties render it unsuitable for extreme cold applications.

Acetone's thermal properties prevent ice formation and reduce condensation risks, creating a stable heat transfer mechanism for polar research, high-altitude infrastructure, cold storage, and industrial automation in harsh climates. Imagine an edge server operating in the North Pole, needing to collect and process data locally before getting it to the research/scientist team. The solution integrates directly with Congatec's Computer-on-Module (COM) portfolio, including COMe, COM-HPC, and COM-HPC mini designs, eliminating the need for custom cooling system development. An optional heat pipe adapter will be available for specialized implementations. The company clarified that acetone-based cooling is purpose-built exclusively for extreme cold environments rather than general applications, as water remains superior for conventional temperature ranges due to its greater heat dissipation capacity, lower cost, and widespread availability.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries.

"As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN."

MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. and a global leader in server design and manufacturing, will showcase its latest AI and HPC innovations at Supercomputing Asia 2025, taking place from March 11 at Booth #B10. The event highlights MiTAC's commitment to delivering cutting-edge technology with the introduction of the G4520G6 AI server and the TN85-B8261 HPC server—both engineered to meet the growing demands of artificial intelligence, machine learning, and high-performance computing (HPC) applications.

G4520G6 AI Server: Performance, Scalability, and Efficiency Redefined
The G4520G6AI server redefines computing performance with an advanced architecture tailored for intensive workloads. Key features include:

• Exceptional Compute Power- Supports dual Intel Xeon 6 Processors with TDP up to 350 W, delivering high-performance multicore processing for AI-driven applications.
• Enhanced Memory Performance- Equipped with 32 DDR5 DIMM slots (16 per CPU) and 8 memory channels, supporting up to 8,192 GB DDR5 RDIMM/3DS RDIMM at 6400 MT/s for superior memory bandwidth.

Avalue Technology introduces the HPM-GNRDE high-performance server motherboard, powered by the latest Intel Xeon 6 Processors (P-Core) 6500P & 6700P.

Designed to deliver quality computing performance, ultra-fast memory bandwidth, and advanced PCIe 5.0 expansion, the HPM-GNRDE is the ideal solution for AI workloads, high-performance computing (HPC), Cloud data centers, and enterprise applications. The HPM-GNRDE will make its debut at embedded world 2025, showcasing Avalue's innovation in high-performance computing.

Bolt Graphics announces Zeus, a completely new GPU design for high performance workloads including rendering, HPC, and gaming. Zeus addresses performance, efficiency, and functionality limitations with legacy GPUs.

Zeus is orders of magnitude faster than any other GPU in key workloads. Users can gain 10x in rendering performance, 6x in FP64 HPC workload performance, and 300x in electromagnetic wave simulations. Users running these types of demanding workloads need access to large amounts of memory. Bolt brings expandable memory to GPUs, for the first time, which allows users to increase their memory up to 384 GB in a PCIe card, and up to 2.25 TB per Zeus in a 2U server. A rack of Zeus 2U servers can be configured with up to 180 TB of memory, 8x larger than legacy GPUs.

Codasip, the European RISC-V leader, announced that it has been selected to provide a general purpose, high-end processor as part of the large-scale European supercomputing project Digital Autonomy with RISC-V in Europe (DARE).

DARE is set to build a supercomputing compute stack, featuring high-performance and energy-efficient RISC-V-based processors and accelerators designed and developed in Europe. The European Union has committed 240 million Euros in funding for the first 3-year program phase. The selected partners will leverage hardware/software co-design to achieve competitive performance and efficiency.

One of the main pillars that vendors of Arm-based processors often cite as a competitive advantage versus x86 processors is a keen focus on energy efficiency and predictability of performance. In the quest for higher efficiency and performance, Arm vendors have largely designed out the ability to operate on multiple threads concurrently—something that most enterprise-class CPUs have enabled for years under the technology description of "SMT"—which was also created in the name of enabling performance and efficiency benefits.

Arm vendors often claim that SMT brings security risks, creates performance unpredictability from shared resource contention and drives added cost and energy needed to implement SMT. Interestingly, Arm does support multi-threading in its Neoverse E1-class processor family for embedded uses such as automotive. Given these incongruities, this blog intends to provide a bit more clarity to help customers assess what attributes of performance and efficiency really bring them value for their critical workloads.

Giga Computing, a subsidiary of GIGABYTE Technology, has signed a Memorandum of Understanding (MoU) with SK Telecom and SK Enmove to collaborate on advancing AI Data Center (AIDC) and high-performance computing (HPC) while accelerating the adoption of liquid cooling technology in next-generation data centers.
This strategic partnership sets the stage to nurture and develop high-performance, energy-efficient, and sustainable data center solutions.

Driving AI and Cooling Technology Innovation Together
Performance AI servers, liquid cooling technologies, and modular AI clusters to support SK's various business units, including:

• SK Telecom: Strengthening AIDC infrastructure to support next-generation data centers
• SK Enmove: Advancing liquid cooling technologies to improve energy efficiency and sustainability in data centers

When the US imposed sanctions on Chinese semiconductor makers, China began the push for sovereign chipmaking tools. According to a study conducted by the Emerging Technology Observatory (ETO), Chinese institutions have dramatically outpaced their US counterparts in next-generation chipmaking research. Between 2018 and 2023, nearly 475,000 scholarly articles on chip design and fabrication were published worldwide. Chinese research groups contributed 34% of the output—compared to just 15% from the United States and 18% from Europe. The study further emphasizes the quality of China's contributions. Focusing on the top 10% of the most-cited articles, Chinese researchers were responsible for 50% of this high-impact work, while American and European research accounted for only 22% and 17%, respectively.

This trend shows China's lead isn't about numbers only, and suggests that its work is resonating strongly within the global academic community. Key research areas include neuromorphic, optoelectric computing, and, of course, lithography tools. China is operating mainly outside the scope of US export restrictions that have, since 2022, shrunk access to advanced chipmaking equipment—precisely, tools necessary for fabricating chips below the 14 nm process node. Although US sanctions were intended to limit China's access to cutting-edge manufacturing technology, the massive body of Chinese research suggests that these measures might eventually prove less effective, with Chinese institutions continuing to push forward with influential, high-citation studies. However, Chinese theoretical work is yet to be proven in the field, as only a single company currently manufactures 7 nm and 5 nm nodes—SMIC. Chinese semiconductor makers still need more advanced lithography solutions to reach high-volume manufacturing on more advanced nodes like 3 nm and 2 nm to create more powerful domestic chips for AI and HPC.

Damo Academy—a research and development wing of Alibaba—launched its debut "server-grade processor" design late last week, in Beijing. According to a South China Morning Post (SCMP) news article, the C930 model is a brand-new addition to the e-commerce platform's XuanTie RISC-V CPU series. Company representatives stated that their latest product is designed as a server-level and high-performance computing (HPC) solution. Going back to March 2024, TechPowerUp and other Western hardware news outlets picked up on Alibaba's teasing of the Xuantie C930 SoC, and a related Xuantie 907 matrix processing unit. Fast-forward to the present day; Damo Academy has disclosed that initial shipments—of finalized C930 units—will be sent out to customers this month.

The newly released open-source RISC-V architecture-based HPC chip is an unknown quantity in terms of technical specifications. Damo Academy reps did not provide any detailed information during last Friday's conference (February 28). SCMP's report noted the R&D division's emphasizing of "its role in advancing RISC-V adoption" within various high-end fields. Apparently, the XuanTie engineering team has: "supported the implementation of more than thirty percent of RISC-V high-performance processors." Upcoming additions will arrive in the form of the C908X for AI acceleration, R908A for automotive processing solutions, and an XL200 model for high-speed interconnection. These XuanTie projects are reportedly still deep in development.

Baya Systems, a leader in system IP technology that empowers the acceleration of intelligent compute, and Semidynamics, a provider of fully customizable high-bandwidth and high-performance RISC-V processor IP, today announced a collaboration to boost innovation in development of hyper-efficient, next-generation platforms for artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications.

The collaboration integrates Semidynamics' family of 64-bit RISC-V processor IP cores, known for their exceptional memory bandwidth and configurability, with Baya Systems' innovative WeaveIP Network on Chip (NoC) system IP. WeaveIP is engineered for ultra-efficient, high-bandwidth, and low-latency data transport, crucial for the demands of modern workloads. Complementing this is Baya Systems' software-driven WeaverPro platform, which enables rapid system-level optimization, ensuring that key performance indicators (KPIs) are met based on real-world workloads while providing unparalleled design flexibility for future advancements.

MSI introduces new server platforms powered by the latest Intel Xeon 6 family of processors with the Performance Cores (P-Cores). Engineered for high-density performance, seamless scalability, and energy-efficient operations, these servers deliver exceptional throughput, dynamic workload flexibility, and optimized power efficiency. Optimized for AI-driven applications, modern data centers, and cloud-native workloads, MSI's new platforms help lower total cost of ownership (TCO) while maximizing infrastructure efficiency and resource optimization.

"As data-driven transformation accelerates across industries, businesses require solutions that not only deliver performance but also enable sustainable growth and operational agility," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our Intel Xeon 6 processor-based servers are designed to support this shift by offering high-core scalability, energy-efficient performance, and dynamic workload optimization. These capabilities empower organizations to maximize compute density, streamline their digital ecosystems, and respond to evolving market demands with greater speed and efficiency."

Intel today launched two new Ethernet product lines - the Intel Ethernet E830 Controllers and Network Adapters, and the Intel Ethernet E610 Controllers and Network Adapters - designed to meet the growing demands of enterprise, telecommunications, cloud, edge, high performance computing (HPC) and artificial intelligence (AI) applications. These next-generation solutions provide robust, high-performance connectivity while enhancing energy efficiency and security, and lowering total cost of ownership (TCO).

"In today's interconnected world, networking is essential to the success of business and technology transformation. With the launch of the Intel Ethernet E830 and E610 products, we are helping customers meet the growing demand for high-performance, energy-efficient solutions that optimize network infrastructures, lower operational costs and enhance TCO." -Bob Ghaffari, Intel vice president, Network and Edge Group

As enterprises modernize infrastructure to meet the demands of next-gen workloads like AI, high-performing and efficient compute is essential across the full spectrum - from data centers to networks, edge and even the PC. To address these challenges, Intel today launched its Xeon 6 processors with Performance-cores (P-cores), providing industry-leading performance for the broadest set of data center and network infrastructure workloads and best-in-class efficiency to create an unmatched server consolidation opportunity.

"We are intensely focused on bringing cutting-edge leadership products to market that solve our customers' greatest challenges and help drive the growth of their business," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "The Xeon 6 family delivers the industry's best CPU for AI and groundbreaking features for networking, while simultaneously driving efficiency and bringing down the total cost of ownership."