TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

ASRock Rack Inc., the leading innovative server company, today is set to showcase a comprehensive range of servers for diverse AI workloads catering to scenarios from the edge, on-premises, and to the cloud at booth #1737 at SC 23 held at the Colorado Convention Center in Denver, USA. The event is from November 13th to 16th, and ASRock Rack will feature the following significant highlights:

At SC 23, ASRock Rack will demonstrate the NVIDIA-Qualified 2U4G-GENOA/M3 and 4U8G series GPU server solutions along with the NVIDIA H100 PCIe. The ASRock Rack 4U8G and 4U10G series GPU servers are able to accommodate eight to ten 400 W dual-slot GPU cards and 24 hot-swappable 2.5" drives, designed to deliver exceptional performance for demanding AI workloads deployed in the cloud environment. The 2U4G-GENOA/M3, tailored for lighter workloads, is powered by a single AMD EPYC 9004 series processor and is able to support four 400 W dual-slot GPUs while having additional PCIe and OCP NIC 3.0 slots for expansions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is expanding its AI reach with the upcoming support for the new NVIDIA HGX H200 built with H200 Tensor Core GPUs. Supermicro's industry leading AI platforms, including 8U and 4U Universal GPU Systems, are drop-in ready for the HGX H200 8-GPU, 4-GPU, and with nearly 2x capacity and 1.4x higher bandwidth HBM3e memory compared to the NVIDIA H100 Tensor Core GPU. In addition, the broadest portfolio of Supermicro NVIDIA MGX systems supports the upcoming NVIDIA Grace Hopper Superchip with HBM3e memory. With unprecedented performance, scalability, and reliability, Supermicro's rack scale AI solutions accelerate the performance of computationally intensive generative AI, large language Model (LLM) training, and HPC applications while meeting the evolving demands of growing model sizes. Using the building block architecture, Supermicro can quickly bring new technology to market, enabling customers to become more productive sooner.

Supermicro is also introducing the industry's highest density server with NVIDIA HGX H100 8-GPUs systems in a liquid cooled 4U system, utilizing the latest Supermicro liquid cooling solution. The industry's most compact high performance GPU server enables data center operators to reduce footprints and energy costs while offering the highest performance AI training capacity available in a single rack. With the highest density GPU systems, organizations can reduce their TCO by leveraging cutting-edge liquid cooling solutions.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, continues to be a leader in cooling IT hardware efficiently and in developing diverse server platforms for Arm and x86 processors, as well as AI accelerators. At SC23, GIGABYTE (booth #355) will showcase some standout platforms, including for the NVIDIA GH200 Grace Hopper Superchip and next-gen AMD Instinct APU. To better introduce its extensive lineup of servers, GIGABYTE will address the most important needs in supercomputing data centers, such as how to cool high-performance IT hardware efficiently and power AI that is capable of real-time analysis and fast time to results.

Advanced Cooling
For many data centers, it is becoming apparent that their cooling infrastructure must radically shift to keep pace with new IT hardware that continues to generate more heat and requires rapid heat transfer. Because of this, GIGABYTE has launched advanced cooling solutions that allow IT hardware to maintain ideal performance while being more energy-efficient and maintaining the same data center footprint. At SC23, its booth will have a single-phase immersion tank, the A1P0-EA0, which offers a one-stop immersion cooling solution. GIGABYTE is experienced in implementing immersion cooling with immersion-ready servers, immersion tanks, oil, tools, and services spanning the globe. Another cooling solution showcased at SC23 will be direct liquid cooling (DLC), and in particular, the new GIGABYTE cold plates and cooling modules for the NVIDIA Grace CPU Superchip, NVIDIA Grace Hopper Superchip, AMD EPYC 9004 processor, and 4th Gen Intel Xeon processor.

MSI, a leading global server provider, is showcasing its latest GPU and CXL memory expansion servers powered by AMD EPYC processors and 4th Gen Intel Xeon Scalable processors, which are optimized for enterprises, organizations and data centers, at SC23, booth #1592 in the Colorado Convention Center in Denver from November 13 to 16.

"The exponential growth of human- and machine-generated data demands increased data center compute performance. To address this demand, liquid cooling has emerged as a key trend, said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's server platforms offer a well-balanced hardware foundation for modern data centers. These platforms can be tailored to specific workloads, optimizing performance and aligning with the liquid cooling trend."

At SC23, Intel showcased AI-accelerated high performance computing (HPC) with leadership performance for HPC and AI workloads across Intel Data Center GPU Max Series, Intel Gaudi 2 AI accelerators and Intel Xeon processors. In partnership with Argonne National Laboratory, Intel shared progress on the Aurora generative AI (genAI) project, including an update on the 1 trillion parameter GPT-3 LLM on the Aurora supercomputer that is made possible by the unique architecture of the Max Series GPU and the system capabilities of the Aurora supercomputer. Intel and Argonne demonstrated the acceleration of science with applications from the Aurora Early Science Program (ESP) and the Exascale Computing Project. The company also showed the path to Intel Gaudi 3 AI accelerators and Falcon Shores.

"Intel has always been committed to delivering innovative technology solutions to meet the needs of the HPC and AI community. The great performance of our Xeon CPUs along with our Max GPUs and CPUs help propel research and science. That coupled with our Gaudi accelerators demonstrate our full breadth of technology to provide our customers with compelling choices to suit their diverse workloads," said Deepak Patil, Intel corporate vice president and general manager of Data Center AI Solutions.

Dozens of new supercomputers for scientific computing will soon hop online, powered by NVIDIA's breakthrough GH200 Grace Hopper Superchip for giant-scale AI and high performance computing. The NVIDIA GH200 enables scientists and researchers to tackle the world's most challenging problems by accelerating complex AI and HPC applications running terabytes of data.

At the SC23 supercomputing show, NVIDIA today announced that the superchip is coming to more systems worldwide, including from Dell Technologies, Eviden, Hewlett Packard Enterprise (HPE), Lenovo, QCT and Supermicro. Bringing together the Arm-based NVIDIA Grace CPU and Hopper GPU architectures using NVIDIA NVLink-C2C interconnect technology, GH200 also serves as the engine behind scientific supercomputing centers across the globe. Combined, these GH200-powered centers represent some 200 exaflops of AI performance to drive scientific innovation.

Ayar Labs, a leader in silicon photonics for chip-to-chip connectivity, will showcase its in-package optical I/O solution integrated with Intel's industry-leading Agilex Field-Programmable Gate Array (FPGA) technology. In demonstrating 5x current industry bandwidth at 5x lower power and 20x lower latency, the optical FPGA - packaged in a common PCIe card form factor - has the potential to transform the high performance computing (HPC) landscape for data-intensive workloads such as generative artificial intelligence (AI), machine learning, and support novel new disaggregated compute and memory architectures and more.

"We're on the cusp of a new era in high performance computing as optical I/O becomes a 'must have' building block for meeting the exponentially growing, data-intensive demands of emerging technologies like generative AI," said Charles Wuischpard, CEO of Ayar Labs. "Showcasing the integration of Ayar Labs' silicon photonics and Intel's cutting-edge FPGA technology at Supercomputing is a concrete demonstration that optical I/O has the maturity and manufacturability needed to meet these critical demands."

NVIDIA's AI platform raised the bar for AI training and high performance computing in the latest MLPerf industry benchmarks. Among many new records and milestones, one in generative AI stands out: NVIDIA Eos - an AI supercomputer powered by a whopping 10,752 NVIDIA H100 Tensor Core GPUs and NVIDIA Quantum-2 InfiniBand networking - completed a training benchmark based on a GPT-3 model with 175 billion parameters trained on one billion tokens in just 3.9 minutes. That's a nearly 3x gain from 10.9 minutes, the record NVIDIA set when the test was introduced less than six months ago.

The benchmark uses a portion of the full GPT-3 data set behind the popular ChatGPT service that, by extrapolation, Eos could now train in just eight days, 73x faster than a prior state-of-the-art system using 512 A100 GPUs. The acceleration in training time reduces costs, saves energy and speeds time-to-market. It's heavy lifting that makes large language models widely available so every business can adopt them with tools like NVIDIA NeMo, a framework for customizing LLMs. In a new generative AI test ‌this round, 1,024 NVIDIA Hopper architecture GPUs completed a training benchmark based on the Stable Diffusion text-to-image model in 2.5 minutes, setting a high bar on this new workload. By adopting these two tests, MLPerf reinforces its leadership as the industry standard for measuring AI performance, since generative AI is the most transformative technology of our time.

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

EK, the leading premium liquid cooling gear manufacturer, will soon provide a one-stop-shop purchasing option where System Integrators, Data Centers, AI/ML-focused companies, and similar customers can get full enterprise-grade custom liquid-cooling loops for their systems. The products belong to the EK-Pro line of professional liquid cooling solutions tailor-made for HPC systems and high-compute density applications. This means that System Integrators and Data Centers will be able to purchase full liquid cooling loops for their HPC servers and workstations and enjoy all the benefits that water-cooled HPC systems can provide.

The Advantages of Liquid Cooling for HPC Systems
High Performance Computing facilities use servers and workstations that leverage powerful GPUs, multithreaded CPUs, petabytes of RAM, and extensive storage space. All this computing power, despite modern advancements in manufacturing and power efficiency, generates tremendous amounts of heat. In fact, it is estimated that up to 40% of the total energy requirements of these facilities is spent on keeping the IT equipment within acceptable operating temperatures. Plus, the components that use conventional air cooling tend to underperform and have shorter lifespans.

Dell Technologies, Intel and the University of Cambridge announce the deployment of the co-designed Dawn Phase 1 supercomputer. Leading technical teams built the U.K.'s fastest AI supercomputer that harnesses the power of both artificial intelligence (AI) and high performance computing (HPC) to solve some of the world's most pressing challenges. This sets a clear way forward for future U.K. technology leadership and inward investment into the U.K. technology sector. Dawn kickstarts the recently launched U.K. AI Research Resource (AIRR), which will explore the viability of associated systems and architectures. Dawn brings the U.K. closer to reaching the compute threshold of a quintillion (1018) floating point operations per second - one exaflop, better known as exascale. For perspective: Every person on earth would have to make calculations 24 hours a day for more than four years to equal a second's worth of processing power in an exascale system.

"Dawn considerably strengthens the scientific and AI compute capability available in the U.K., and it's on the ground, operational today at the Cambridge Open Zettascale Lab. Dell PowerEdge XE9640 servers offer a no-compromises platform to host the Intel Data Center GPU Max Series accelerator, which opens up the ecosystem to choice through oneAPI. I'm very excited to see the sorts of early science this machine can deliver and continue to strengthen the Open Zettascale Lab partnership between Dell Technologies, Intel and the University of Cambridge, and further broaden that to the U.K. scientific and AI community," said Adam Roe, EMEA HPC technical director at Intel.

AMD in its post Q3-2023 financial results call stated that it expects the Instinct MI300X accelerator to be the fastest product in AMD history to rake in $1 billion in sales. This would be the time it took for a product in its lifecycle to register $1 billion in sales. With the MI300 series, the company hopes to finally break into the AI-driven HPC accelerator market that's dominated by NVIDIA, and at scale. This growth is attributable to two distinct factors. The first of which is that NVIDIA is supply bottlenecked, and customers and looking for alternatives, and finally found a suitable one with the MI300 series; and the second is that with the MI300 series, AMD has finally ironed out the software ecosystem backing the hardware that looks incredible on paper.

It's also worth noting here, that AMD is rumored to be sacrificing its market presence in the enthusiast-class gaming GPU segment with its next-generation, with the goal of maximizing its foundry allocation for HPC accelerators such as the MI300X. HPC accelerators are a significantly higher margin class of products than gaming GPUs such as the Radeon RX 7900 XTX. The RX 7900 XTX and its refresh under the RX 7950 series, are not expected to have a successor in the RDNA4 generation. "We now expect datacenter GPU revenue to be approximately $400 million in the fourth quarter and exceed $2 billion in 2024 as revenue ramps throughout the year," said Dr. Lisa Su, CEO AMD, at the company's earnings call with analysts and investors. "This growth would make MI300 the fastest product to ramp to $1 billion in sales in AMD history."

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

Samsung Electronics today reported financial results for the third quarter ended September 30, 2023. Total consolidated revenue was KRW 67.40 trillion, a 12% increase from the previous quarter, mainly due to new smartphone releases and higher sales of premium display products. Operating profit rose sequentially to KRW 2.43 trillion based on strong sales of flagship models in mobile and strong demand for displays, as losses at the Device Solutions (DS) Division narrowed.

The Memory Business reduced losses sequentially as sales of high valued-added products and average selling prices somewhat increased. Earnings in system semiconductors were impacted by a delay in demand recovery for major applications, but the Foundry Business posted a new quarterly high for new backlog from design wins. The mobile panel business reported a significant increase in earnings on the back of new flagship model releases by major customers, while the large panel business narrowed losses in the quarter. The Device eXperience (DX) Division achieved solid results due to robust sales of premium smartphones and TVs. Revenue at the Networks Business declined in major overseas markets as mobile operators scaled back investments.

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of the ProMagix G480a and G480i - two GPU servers optimized for High Performance Computing and Artificial Intelligence. Powered by either dual AMD Epyc 4th Gen or dual 4th Gen Intel Scalable Xeon processors, these 4U form factor servers support up to eight dual slot PCIe Gen 5 GPUs to create incredible compute power designed specifically for the highest demand workflows including simulation, rendering, analytics, deep learning, AI, and more. Shipments begin immediately.

"By putting emphasis on scalability, functionality, and performance, we've created a line of server solutions that tie in the legacy of our high-end brand while also offering businesses alternative options for more specialized solutions for the highest demand workflows," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to introduce a whole new market to what we can do."

According to sources close to Reuters, NVIDIA is reportedly developing its custom CPUs based on Arm instruction set architecture (ISA), specifically tailored for the client ecosystem, also known as PC. NVIDIA has already developed an Arm-based CPU codenamed Grace, which is designed to handle server and HPC workloads in combination with the company's Hopper GPU. However, as we learn today, NVIDIA also wants to provide CPUs for PC users and to power Microsoft's Windows operating system. The push for more vendors of Arm-based CPUs is also supported by Microsoft, which is losing PC market share to Apple and its M-series of processors.

The creation of custom processors for PCs that Arm ISA would power makes the decades of x86-based applications either obsolete or in need of recompilation. Apple allows users to emulate x86 applications using the x86-to-Arm translation layer, and even Microsoft allows it for Windows-on-Arm devices. We are left to see how NVIDIA's solution would compete in the entire market of PC processors, which are expected to arrive in 2025. Still, the company could make some compelling solutions given its incredible silicon engineering history and performant Arm design like Grace. With the upcoming Arm-based processors hitting the market, we expect the Windows-on-Arm ecosystem to thrive and get massive investment from independent software vendors.

Lenovo today announced the Europe based Innovation Centre specializing in HPC and AI, will now operate with enhanced customer experience from the in-house manufacturing facility in Budapest.

Running the new Innovation Center operations from the Budapest factory with onsite inventory stock, allows Lenovo customers to access the most advanced power and cooling infrastructure solutions and latest generation technology within the supply chain. This access ensures that workloads are tested on accurate representations of end purchased solutions, enabling customers to know with certainty the Lenovo solution installed will perform successfully for the intended workload.

Supermicro, Inc., a Total IT Solution manufacturer for AI, Cloud, Storage, and 5G/Edge, is announcing one of the industry's broadest portfolios of new GPU systems based on the NVIDIA reference architecture, featuring the latest NVIDIA GH200 Grace Hopper and NVIDIA Grace CPU Superchip. The new modular architecture is designed to standardize AI infrastructure and accelerated computing in compact 1U and 2U form factors while providing ultimate flexibility and expansion ability for current and future GPUs, DPUs, and CPUs. Supermicro's advanced liquid-cooling technology enables very high-density configurations, such as a 1U 2-node configuration with 2 NVIDIA GH200 Grace Hopper Superchips integrated with a high-speed interconnect. Supermicro can deliver thousands of rack-scale AI servers per month from facilities worldwide and ensures Plug-and-Play compatibility.

"Supermicro is a recognized leader in driving today's AI revolution, transforming data centers to deliver the promise of AI to many workloads," said Charles Liang, president and CEO of Supermicro. "It is crucial for us to bring systems that are highly modular, scalable, and universal for rapidly evolving AI technologies. Supermicro's NVIDIA MGX-based solutions show that our building-block strategy enables us to bring the latest systems to market quickly and are the most workload-optimized in the industry. By collaborating with NVIDIA, we are helping accelerate time to market for enterprises to develop new AI-enabled applications, simplifying deployment and reducing environmental impact. The range of new servers incorporates the latest industry technology optimized for AI, including NVIDIA GH200 Grace Hopper Superchips, BlueField, and PCIe 5.0 EDSFF slots."

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

Solidigm today announced the D7-5810, an enterprise SSD for extremely intensity write workloads. Such a drive would be capable of write endurance in the neighborhood of 50 DWPD. For reference, the company's D7-P5620, a write-centric/mixed workload drive for data-logging, and AI ingest/preparation, offers around 3 DWPD of endurance, depending on the variant; and the read-intensive drive meant for CDNs, the D5-P5336, offers around 0.5 DWPD. Use cases for the new D7-P5810 include high performance caching for flash arrays dealing with "cooler" data; high-frequency trading, and HPC.

Solidigm D7-P5810 uses SK hynix 144-layer 3D NAND flash that's made to operate in a pure SLC configuration. The drive comes in 800 GB and 1.6 TB capacities, and offers 50 DWPD over an endurance period of 5 years (4K random writes). More specifically, both models offer 73 PBW (petabytes written) of endurance. The drive comes in enterprise-relevant 15 mm-thick U.2 form-factor, with PCIe Gen 4 x4 interface, with NVMe 1.3c and NVMe MI 1.1 protocols.

Intel Innovation 2023 - September 13, 2023 - MiTAC Computing Technology, a professional IT solution provider and a subsidiary of MiTAC Holdings Corporation, will showcase its DSG (Datacenter Solutions Group) product lineup powered by 4th Gen Intel Xeon Scalable processors for enterprise, cloud and AI workloads at Intel Innovation 2023, booth #H216 in the San Jose McEnery Convention Center, USA, from September 19-20.

"MiTAC has seamlessly and successfully managed the Intel DSG business since July. The datacenter solution product lineup enhances MiTAC's product portfolio and service offerings. Our customers can now enjoy a comprehensive one-stop service, ranging from motherboards and barebones servers to Intel Data Center blocks and complete rack integration for their datacenter infrastructure needs," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology.

The Exascale supercomputer arms race is making everyone invest their resources into trying to achieve the number one spot. Some countries, like China, actively participate in the race with little proof of their work, leaving the high-performance computing (HPC) community wondering about Chinese efforts on exascale systems. Today, we have some information regarding the next-generation Sunway system, which is supposed to be China's first exascale supercomputer. Replacing the Sunway TaihuLight, the next-generation Sunway will reportedly boast over 40 million cores in its system. The information comes from an upcoming presentation for Supercomputing 2023 show in Denver, happening from November 12 to November 17.

The presentation talks about 5 ExaFLOPS in the HPL-MxP benchmark with linear scalability on the 40-million-core Sunway supercomputer. The HPL-MxP benchmark is a mixed precision HPC benchmark made to test the system's capability in regular HPC workloads that require 64-bit precision and AI workloads that require 32-bit precision. Supposedly, the next-generation Sunway system can output 5 ExaFLOPS with linear scaling on its 40-million-core system. What are those cores? We are not sure. The last-generation Sunway TaihuLight used SW26010 manycore 64-bit RISC processors based on the Sunway architecture, each with 260 cores. There were 40,960 SW26010 CPUs in the system for a total of 10,649,600 cores, which means that the next-generation Sunway system is more than four times more powerful from a core-count perspective. We expect some uArch and semiconductor node improvements as well.