Asetek will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC13 including a running 92 node cluster cooled by RackCDU D2C (Direct to Chip) with monitoring software providing real-time reporting and alerting in Denver, Colorado - November 18-21.

Asetek's RackCDU range includes RackCDU D2C and RackCDU ISAC (In-Server Air Conditioning). RackCDU D2C provides cooling cost reductions up to 80% and density increases of 2.5x-5x. RackCDU ISAC provides cooling cost reductions exceeding 80% and enables operation without concern for air quality. Operating demonstrations of both technologies will be on display in Asetek's booth #4329.

Global supercomputer leader Cray Inc. today announced the Company has broadened its support for accelerators and coprocessors, and is now selling the Cray XC30 series of supercomputers with NVIDIA Tesla K20X GPU accelerators and Intel Xeon Phi coprocessors. This marks the latest step in Cray's Adaptive Supercomputing vision, which is focused on delivering innovative systems that integrate diverse technologies like multi-core and many-core processing into a unified architecture.

"Our first experience with climate and materials science applications showed that replacing one of the multi-core processors in the XC30 with an NVIDIA Tesla GPU boosts application performance and disproportionally reduced energy to solution," said Thomas Schulthess, professor at ETH Zurich and director of the Swiss National Supercomputing Center, which was one of the first Cray customers to order a hybrid Cray XC30 system. "This provides necessary proof of principle in favor of hybrid compute nodes as a promising solution to the energy challenges we face in supercomputing."

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, will showcase the company's latest enterprise storage and acceleration solutions at the 2013 High Performance Computing (HPC) for Wall Street Show in booth 201 at the Roosevelt Hotel in New York City on September 9. One of the largest shows catering to the HPC market, it is an ideal venue for OCZ to showcase solid state storage products designed for addressing big data performance and low latency for financial applications.

OCZ will unveil the upcoming Aeon Series 3.5" SSD, a Non-Volatile Memory (NVM) SAS drive specifically targeted to meet the stringent requirements of latency sensitive applications currently being mired by legacy hard-disk drive (HDD) infrastructures. Designed for demanding transactional environments such as high-frequency trading (HFT), Aeon delivers the speed and ultra low latency read and writes of DRAM with the persistence and scalability of storage. Aeon reduces file system overhead in enterprise appliances while accelerating applications and improving overall I/O efficiency, along with providing unlimited endurance supporting an infinite number of drive writes per day without wearing out or slowing down.

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, will present its cutting-edge GPU supporting platform during the NVIDIA GTC 2013. Ranging from 2U to 4U and compatible with1 to 8 GPUs. TYAN offers a full product portfolio to customers which are compatible with NVIDIA Tesla K Series GPU Accelerators. The TYAN S7055 and S7056 motherboard will be showcased as well as TYAN TA77-B7061 and FT48-B7055 barbones at TYAN's booth (#503) during the GTC 2013.

Targeting from mainstream applications to the most complicated high performance computing, TYAN develops a rich product portfolio of GPU based platforms. These products offer flexible and scalable performance as well as maximum efficiency in order to help customers deploying an ideal GPU cluster solutions. All the TYAN GPU platforms are under-validation with industry-leading companies' GPU products. The TYAN TA77-B7061, FT48-B7059 and FT77-B7059 GPU platforms passed the validation and are fully compatible with NVIDIA Tesla K Series GPU Accelerators. The bundled product portfolios of TYAN GPU platforms and NVIDIA Tesla K Series will be widely available in Q2.

The growing ranks of programmers using the Python open-source language can now take full advantage of GPU acceleration for their high performance computing (HPC) and big data analytics applications by using the NVIDIA CUDA parallel programming model, NVIDIA today announced.

Easy to learn and use, Python is among the top 10 programming languages with more than three million users. It enables users to write high-level software code that captures their algorithmic ideas without delving deep into programming details. Python's extensive libraries and advanced features make it ideal for a broad range of HPC science, engineering and big data analytics applications. Support for NVIDIA CUDA parallel programming comes from NumbaPro, a Python compiler in the new Anaconda Accelerate product from Continuum Analytics.

According to the International Data Corporation (IDC) Worldwide Quarterly Server Tracker, factory revenue in the worldwide server market decreased 4.0% year over year to $12.2 billion in the third quarter of 2012 (3Q12). This is the fourth consecutive quarter of year-over-year revenue decline, as server market demand continued to soften following a strong refresh cycle that characterized the market in most of 2010 and 2011. After declining in 2Q12, server unit shipments increased 0.6% year over year in 3Q12 to 2.1 million units. This was the 11th time in the past 12 quarters that server units have grown on a year-over-year basis.

On a year-over-year basis, volume systems experienced a 0.5% revenue decline. At the same time, demand for midrange and high-end systems experienced year-over-year revenue declines of 14.0% and 8.9% respectively in 3Q12. All three segments were impacted by difficult year-over-year compares combined with transitions in the technology refresh cycles.

HP today unveiled the industry's first server built to help clients operationalize Big Data, drive new business opportunities and save up to $1 million over three years.

With the advent of Big Data software and the promise that it brings, many organizations have tried to deploy these solutions on existing architectures not designed to handle the specific needs of these workloads. As a result, the outcomes from these early deployments have been suboptimal from a performance and cost perspective.

Integrating new AMD Opteron 6300 processors, a full range of ASUS servers and server boards offers greater flexibility with five expansion slots and extreme computing power via support for up to four CPUs and two GPUs in select models (RS920A-E6/RS8, RS924A-E6/RS8 servers) to accommodate the needs of data center, enterprise and HPC applications. The dedicated BIOS developed by ASUS to make the most of the new processors is now available at the official ASUS support site.

RS920A-E6/RS8 and RS924A-E6/RS8 servers have been designed with a 4-way layout that supports up to four AMD Opteron 6300 processors on a single board, delivering extreme computing power and enhanced scalability. With each Opteron 6300 processor utilizing 16 cores, the new ASUS servers can sustain up to 64 cores as well as a maximum 512GB memory. They ship with four PCI Express 2.0 x16 slots plus one dedicated slot for an ASUS PIKE RAID card. This layout offers more flexible system setup and upgrade options, with an internal design that allows for up to twin double-deck graphics cards. The combined CPU/GPU power on offer creates high-output hybrid computing that matches the processing-intensive demands of HPC and data center applications.

AMD today launched the AMD FirePro S10000, the industry's most powerful server graphics card, designed for high-performance computing (HPC) workloads and graphics intensive applications.

The AMD FirePro S10000 is the first professional-grade card to exceed one teraFLOPS (TFLOPS) of double-precision floating-point performance, helping to ensure optimal efficiency for HPC calculations. It is also the first ultra high-end card that brings an unprecedented 5.91 TFLOPS of peak single-precision and 1.48 TFLOPS of double-precision floating-point calculations. This performance ensures the fastest possible data processing speeds for professionals working with large amounts of information. In addition to HPC, the FirePro S10000 is also ideal for virtual desktop infrastructure (VDI) and workstation graphics deployments.

Asetek Inc., the world's leading supplier of liquid cooling solutions for computers announced today that it will showcase a state of the art power efficient HPC cluster at SC12 in Salt Lake City, Utah - November 12-15. Formal presentations and live demonstrations will be available at Asetek's booth #4045.

The showcase is groundbreaking in the areas of power efficiency, performance and density. The cluster is built on an industry standard 48U rack, 46Us of which are filled with 23 2U 4-node Intel H2216WPJR servers, each with dual Xeon E5 2690 CPUs providing a total CPU and core count of 184 and 1472 respectively.

Global supercomputer leader Cray Inc. (NASDAQ: CRAY) today announced the launch of the Company's next generation high-end supercomputing systems -- the Cray XC30 supercomputer. Previously code-named "Cascade," the Cray XC30 supercomputer is the Company's most-advanced high performance computing system ever built. The Cray XC30 combines the new Aries interconnect, Intel Xeon processors, Cray's powerful and fully-integrated software environment, and innovative power and cooling technologies to create a production supercomputer that is designed to scale high performance computing (HPC) workloads of more than 100 petaflops.

CoolIT Systems Inc, the leading supplier of liquid cooling solutions for high-performance desktops, enterprise servers, and high-performance clusters has teamed up with Montreal's Ciara Technologies Inc. in the Demand Liquid Alliance to use Rack Direct Contact Liquid Cooling to enable unparalleled performance at the CPU and GPU level. this joint solution will be showcased in CoolIT System's booth at SC12 in Salt Lake City (Booth #4629).

Experienced with CoolIT's technology, Ciara is once again looking to harness liquid cooling to push the boundaries of computing productivity. "We are overclocking our CPUs in a 1u chassis allowing for densities never seen before. Our customers are demanding unprecedented compute productivity and CoolIT's Rack DCLC allows us to deliver", said Darcy Letemplier, VP of Engineering, Ciara Technologies. Rack DCLC is allowing Ciara to build and test server architecture in a 1u form factor that was previously only available in a 3u chassis.

AMAX, a leader in High-Performance Computing (HPC) solutions, today announced the immediate availability of its latest, most advanced CPU-based HPC solutions built upon the world's fastest 16-core x86 processor, the AMD Opteron 6300 series "Piledriver" CPUs.

The new server solutions target HPC, Big Data, Cloud, and Datacenter users with large scale-out applications seeking the highest performance and scalability to accelerate, transform and advance scientific discovery and business analytics. Multi-threaded workloads are becoming increasingly popular, but also ever more complex and demanding, and users are challenging AMAX to deliver solutions that provide a rich mix of performance, scalability and efficiency -- precisely what AMAX's ServMax server solutions with AMD Opteron 6300 series processors are engineered for.

As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced today its next-generation data center solid-state drive (SSD), the Intel Solid-State Drive DC S3700 Series, designed to remove storage bottlenecks and maximize multi-core CPU performance. The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today's most demanding data center applications.

"Today's data explosion creates unique storage challenges for data center professionals," said Rob Crooke, Intel vice president and general manager for the Intel Non-Volatile Memory (NVM) Solutions Group. "High latencies and slow storage I/O can cripple data centers' ability to deliver exciting big data or cloud-computing applications with fast, low latency data access. Intel's next-generation Intel SSD DC S3700 Series breaks through SSD limitations for the data center on all fronts - fast, consistent performance, strong data protection and high endurance -- so IT professionals can deliver on their most demanding technology initiatives."

Global supercomputer leader Cray Inc. (NASDAQ: CRAY) today announced the Cray XE6 and Cray XE6m supercomputers are now available with the new AMD Opteron 6300 Series processor, using its next-generation "Piledriver" core. With a performance-per-watt that is up to 40 percent higher than prior generations, these new AMD (NYSE: AMD) Opteron processors are designed to enhance power efficiency with more application performance within the same power budget.

"Cray supercomputers are specifically designed to allow our customers to easily upgrade their systems so they can take advantage of the latest, most innovative processing technologies while also reducing their total-cost-of-ownership over the life of the system," said Peg Williams, Cray's senior vice president of high performance computing systems. "We believe the new AMD Opteron 6300 Series processors will significantly improve the performance and efficiency for Cray customers upgrading their current Cray XE6 and Cray XE6m systems. We look forward to delivering this capability to our customers."

Specifications of NVIDIA's Tesla K20 GPU compute processor, which was launched way back in May, are finally disclosed. We've known since then that the K20 is based on NVIDIA's large GK110 GPU, a chip never used to power a GeForce graphics card, yet. Apparently, NVIDIA is leaving some room on the silicon that allows it to harvest it better. According to a specifications sheet compiled by Heise.de, Tesla K20 will feature 13 SMX units, compared to the 15 available on the GK110 silicon.

With 13 streaming multiprocessor (SMX) units, the K20 will be configured with 2,496 CUDA cores (as opposed to 2,880 physically present on the chip). The core will be clocked at 705 MHz, yielding single-precision floating point performance of 3.52 TFLOP/s, and double-precision floating point performance of 1.17 TFLOP/s. The card packs 5 GB of GDDR5 memory, with memory bandwidth of 200 GB/s. Dynamic parallelism, Hyper-Q, GPUDirect with RDMA are part of the new feature-set. The TDP of the GPU is rated at 225W, and understandably, it uses a combination of 6-pin and 8-pin PCI-Express power connectors. Built in the 28 nm process, the GK110 packs a whopping 7.1 billion transistors.

Netstor is pleased to announce the release of TurboBox Extreme PCIe Gen3 GPU enclosure series of desktop version NA255A and rackmount version NA265A. These newly-launched GPU enclosures apply the latest PCIe 3.0 technology and PCIe 3.0 x16 (16-lane) host interface with 8Gbps throughput per lane, offering blazing-fast data transfer rates up to 128Gbps between host and enclosure, dedicated for GPU-accelerated applications. The GPU enclosures are designed to have 4 PCIe x16 slots and 2 PCIe x4 slots (optional) on backplane, supporting up to 4 double-width Gen3 GPU cards (backward compatible with Gen2 GPUs) to work with host, server or workstation for areas such as HPC, telecom, and data centers.

AMAX, a leading innovator of High Performance Computing (HPC), dynamic Enterprise IT, and custom Appliance Manufacturing solutions, has updated its storage optimized StorMax NAS product line with Windows Storage Server 2012, the most advanced Windows-based storage OS. The AMAX StorMax NAS series with Windows Storage Server 2012 introduces a host of new features designed to provide high-performance and reliable storage for virtualization applications, and flexible, cost-effective options for shared storage.

"As part of a network-attached storage appliance, Windows Storage Server 2012 helps to reduce the storage costs associated with building modern datacenters and private clouds by enhancing traditional file serving capabilities and leveraging robust, industry standard hardware," said James Huang, Product Marketing Manager, AMAX. "AMAX's enterprise-class NAS solutions based on Windows Storage Server 2012 are perfect for those looking to deploy highly reliable, high-performance shared storage for database needs, or for those looking to deploy a converged private cloud infrastructure with the ability to run either physical or virtual workloads."

Signaling its commitment to energy-efficient high- performance computing, Intel Corporation today announced that it will work with HP to help design and provide the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) with a supercomputing system that will drive research across a number of energy-related initiatives, including renewable energy and energy-efficient technologies. The new High Performance Computer (HPC) data center promises to become one of the world's most efficient installations.

The system is scheduled to deliver full compute capacity in the summer of 2013 and will feature approximately 3,200 Intel Xeon processors including current-generation Intel Xeon processor E5-2670, future 22nm Ivy Bridge based processors and approximately 600 new Intel Xeon Phi co-processors. The total peak performance of the system is expected to exceed 1 Petaflop (equivalent to a thousand trillion floating point operations per second) and it will be the largest supercomputer dedicated solely to renewable energy and energy efficiency research. Leading energy-efficient capabilities of Intel Xeon processors and Intel Xeon Phi co-processors combined with the new HP warm water cooling solution and innovative data center design will result in this facility likely being the world's most efficient data center with a power usage effectiveness (PUE) rating of 1.06 or better.

Today the Heterogeneous System Architecture (HSA) Foundation announced six new members. The HSA Foundation is pleased to welcome Apical, Arteris Inc., MulticoreWare Inc., Sonics, Symbio and Vivante Corporation to the membership roster. Each company adds expertise to the HSA ecosystem by assisting with research, development, production, manufacture, use, and the sale of HSA IP and heterogeneous computing software and solutions.

These new members have joined at different levels including: supporter, contributor and associate. Working closely with the founder members of AMD, ARM, Imagination Technologies, MediaTek Inc., Samsung Electronics and Texas Instruments (TI), the new members will contribute to the growing adoption of HSA in heterogeneous computing.

During HotChips symposium, George Chrysos, the leading architect of Intel Xeon Phi co-processor shared the new architecture details of upcoming Intel's HPC powerhouse. Designed for highly-parallel applications, Intel Xeon Phi co-processor based on Intel Mani Integrated Core architecture will deliver the combination of industry leading performance per watt with the ability to re-use the existing code and applications without necessity of re-writing them.

Equipped with more than 50 cores and built using Intel's latest 22nm 3D Tri-gate transistor technology, new co-processors will be in production this year with first supercomputers from top500 list already taking advantage of this technology. In his blog here, George shares his aspirations and goals during designing the co-processor and summarizes all new disclosed information. The HotChips presentation is also available below.

With the U.S. Government increasingly using high- performance computing (HPC) to address current and future national challenges, Intel Corporation today announced it has been awarded two subcontracts totaling $19 million with the U.S. Department of Energy (DOE). As part of these two awards, Intel Federal LLC, a wholly owned subsidiary, will be a major participant in the Lawrence Livermore National Security, LLC (LLNS) managed Extreme-Scale Computing Research and Development "FastForward" program aimed at driving advancements in exascale computing.

The DOE has been a leading developer of supercomputing technology for a broad range of critical applications in the space of national security, economy, energy resources and consumption. The "FastForward" program will harness the talents of the national laboratories, academia and U.S. industry to develop the next generation of HPC technologies.

AMD today announced that it was selected for an award of $12.6 million for two research projects associated with the U.S. Department of Energy's (DOE) Extreme-Scale Computing Research and Development Program, known as "FastForward." The DOE award provides up to $9.6 million to AMD for processor-related research and up to $3 million for memory-related researchi. AMD's award-winning AMD Opteron processor has powered many of the world's largest supercomputers over the past decade and the company invented the world's first and only Accelerated Processing Unit (APU).

FastForward is a jointly funded collaboration between DOE Office of Science, and National Nuclear Security Administration (NNSA) to initiate partnerships with multiple companies to accelerate the research and development of critical technologies needed for extreme scale computing, on the path toward exascale computing. Exascale computing is essentially a grand challenge to provide the next level of computational power required to help ensure the prosperity and security of the United States. The DOE's strategic plan seeks to address the nation's most pressing scientific challenges by advancing simulation-based scientific discovery made possible by the world's highest performing exascale supercomputers.