Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

Global supercomputer leader Cray Inc. today announced the launch of the Cray CS-Storm -- a high-density accelerator compute system based on the Cray CS300 cluster supercomputer. Featuring up to eight NVIDIA Tesla GPU accelerators and a peak performance of more than 11 teraflops per node, the Cray CS-Storm system is one of the most powerful single-node cluster architectures available today.

Designed to support highly scalable applications in areas such as energy, life sciences, financial services, and geospatial intelligence, the Cray CS-Storm provides exceptional performance, energy efficiency and reliability within a small footprint. The system leverages the supercomputing architecture of the air-cooled Cray CS300 system, and includes the Cray Advanced Cluster Engine cluster management software, the complete Cray Programming Environment on CS, and NVIDIA Tesla K40 GPU accelerators. The Cray CS-Storm system includes Intel Xeon E5 2600 v2 processors.

AMD today announced the AMD FirePro S9150 server card -- the most powerful server Graphics Processing Unit (GPU) ever built for High Performance Computing. Based on the AMD Graphics Core Next (GCN) architecture, the first AMD architecture designed specifically with compute workloads in mind, the AMD FirePro S9150 server card is the first server card to support enhanced double precision and break the 2.0 TFLOPS double precision barrier. With 16 GB of GDDR5 memory -- 33 percent more than the competition -- and maximum power consumption of 235 watts, AMD FirePro S9150 server GPUs provide supercomputers with massive compute performance while maximizing available power budgets.

"Today's supercomputers feature an increasing mix of GPUs, CPUs and co-processors to achieve great performance, and many of them are being implemented in an environmentally responsible manner to help reduce power and water consumption," said David Cummings, senior director and general manager, professional graphics, AMD. "Designed for large scale multi-GPU support and unmatched compute performance, AMD FirePro S9150 ushers in a new era of supercomputing. Its memory configuration, compute capabilities and performance per watt are unmatched in its class, and can help take supercomputers to the next level of performance and energy efficiency."

Puget Systems has been providing quad socket workstations for years now. Today, we refresh that product with a new duo of quad socket workstations that offer even more capacity, better cooling, and quieter operation. The new Peak Quad CPU workstations come in both Intel and AMD varieties. Our intention with this refresh is to take some of the highest performance workstation configurations available today and make them something you can put in your lab or office. Most workstations and servers of this caliber come with a prohibitive noise level but the Peak line of workstations solves this problem while still providing excellent cooling and long component lifespan.

In addition to supporting four CPUs, these workstations also support other high performance options such as large SSD arrays and accelerator cards including Intel Xeon Phi and NVIDIA Tesla. Most importantly, we have designed these workstations to be flexible. With systems at this level, it is typical for us to plan, design, implement and test a custom solution for each customer and use case. If you are unsure whether Peak is right for you, just ask! We have dedicated staff on hand for HPC, parallel and cluster computing.

Eurotech, a leading provider of embedded and supercomputing technologies, has teamed up with Applied Micro Circuits Corporation and NVIDIA to develop a new, original high performance computing (HPC) system architecture that combines extreme density and best-in-class energy efficiency. The new architecture is based on an innovative highly modular and scalable packaging concept.

Eurotech, which has years of significant experience in designing and manufacturing original HPC systems, has successfully developed an HPC systems architecture that optimizes the benefits of greater density, as well as the energy efficiency of ARM processors and high-performance GPU accelerators.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

NVIDIA today announced that multiple server vendors are leveraging the performance of NVIDIA GPU accelerators to launch the world's first 64-bit ARM development systems for high performance computing (HPC).

ARM64 server processors were primarily designed for micro-servers and web servers because of their extreme energy efficiency. Now, they can tackle HPC-class workloads when paired with GPU accelerators using the NVIDIA CUDA 6.5 parallel programming platform, which supports 64-bit ARM processors.

ASUS today announced ESC4000 G2S, a new 2U-sized server series based on the dual Intel Xeon E5-2600 v2 processor platform and designed for use in environments that demand high-density GPU/coprocessor servers.

The new ESC4000 G2S series servers feature a highly optimized thermal design, six hot-swappable 2.5-inch SATA drive bays and nine PCI Express 3.0 (PCIe 3.0) x16 expansion slots. The innovative and thoughtful design delivers high-density computing power, easy scalability and exceptional energy efficiency, making ESC4000 G2S series servers the ideal choice for applications in the high-performance computing (HPC) fields of life and medical sciences, engineering science, financial modeling and virtualization.

Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

"In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

AMD today announced that it was selected for an award of $3.1 million for a research project associated with the U.S. Department of Energy (DOE) Extreme-Scale Computing Research and Development Program, known as "DesignForward." The DOE award is an expansion of work started as part of another two-year award AMD received in 2012 called "FastForward." The FastForward award aims to accelerate the research and development of processor and memory technologies needed to support extreme-scale computing. The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

DesignForward is a jointly funded collaboration between the DOE Office of Science and the U.S. National Nuclear Security Administration (NNSA) to accelerate the research and development of critical technologies needed for extreme-scale computing, on the path toward Exascale computing. Exascale supercomputers are expected to be capable of performing computation hundreds of times faster than today's fastest computers, with only slightly higher power utilization.

Global supercomputer leader Cray Inc. today announced the Cray CS300 line of cluster supercomputers and the Cray XC30 supercomputers are now available with the NVIDIA Tesla K40 GPU accelerators. Designed to solve the most demanding supercomputing challenges, the NVIDIA Tesla K40 provides 40 percent higher peak performance than its predecessor, the Tesla K20X GPU.

"The addition of the NVIDIA K40 GPUs furthers our vision for Adaptive Supercomputing, which provides outstanding performance with a computing architecture that accommodates powerful CPUs and highly-advanced accelerators from leading technology companies like NVIDIA," said Barry Bolding, vice president of marketing at Cray. "We have proven that acceleration can be productive at high scalability with Cray systems such as 'Titan', 'Blue Waters', and most recently with the delivery of a Cray XC30 system at the Swiss National Supercomputing Centre (CSCS). Together with Cray's latest OpenACC 2.0 compiler, the new NVIDIA K40 GPUs can process larger datasets, reach higher levels of acceleration and provide more efficient compute performance, and we are pleased these features are now available to customers across our complete portfolio of supercomputing solutions."

NVIDIA today unveiled the NVIDIA Tesla K40 GPU accelerator, the world's highest performance accelerator ever built, delivering extreme performance to a widening range of scientific, engineering, high performance computing (HPC) and enterprise applications.

Providing double the memory and up to 40 percent higher performance than its predecessor, the Tesla K20X GPU accelerator, and 10 times higher performance than today's fastest CPU, the Tesla K40 GPU is the world's first and highest-performance accelerator optimized for big data analytics and large-scale scientific workloads.

Asetek will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC13 including a running 92 node cluster cooled by RackCDU D2C (Direct to Chip) with monitoring software providing real-time reporting and alerting in Denver, Colorado - November 18-21.

Asetek's RackCDU range includes RackCDU D2C and RackCDU ISAC (In-Server Air Conditioning). RackCDU D2C provides cooling cost reductions up to 80% and density increases of 2.5x-5x. RackCDU ISAC provides cooling cost reductions exceeding 80% and enables operation without concern for air quality. Operating demonstrations of both technologies will be on display in Asetek's booth #4329.

Global supercomputer leader Cray Inc. today announced the Company has broadened its support for accelerators and coprocessors, and is now selling the Cray XC30 series of supercomputers with NVIDIA Tesla K20X GPU accelerators and Intel Xeon Phi coprocessors. This marks the latest step in Cray's Adaptive Supercomputing vision, which is focused on delivering innovative systems that integrate diverse technologies like multi-core and many-core processing into a unified architecture.

"Our first experience with climate and materials science applications showed that replacing one of the multi-core processors in the XC30 with an NVIDIA Tesla GPU boosts application performance and disproportionally reduced energy to solution," said Thomas Schulthess, professor at ETH Zurich and director of the Swiss National Supercomputing Center, which was one of the first Cray customers to order a hybrid Cray XC30 system. "This provides necessary proof of principle in favor of hybrid compute nodes as a promising solution to the energy challenges we face in supercomputing."

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, will showcase the company's latest enterprise storage and acceleration solutions at the 2013 High Performance Computing (HPC) for Wall Street Show in booth 201 at the Roosevelt Hotel in New York City on September 9. One of the largest shows catering to the HPC market, it is an ideal venue for OCZ to showcase solid state storage products designed for addressing big data performance and low latency for financial applications.

OCZ will unveil the upcoming Aeon Series 3.5" SSD, a Non-Volatile Memory (NVM) SAS drive specifically targeted to meet the stringent requirements of latency sensitive applications currently being mired by legacy hard-disk drive (HDD) infrastructures. Designed for demanding transactional environments such as high-frequency trading (HFT), Aeon delivers the speed and ultra low latency read and writes of DRAM with the persistence and scalability of storage. Aeon reduces file system overhead in enterprise appliances while accelerating applications and improving overall I/O efficiency, along with providing unlimited endurance supporting an infinite number of drive writes per day without wearing out or slowing down.

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, will present its cutting-edge GPU supporting platform during the NVIDIA GTC 2013. Ranging from 2U to 4U and compatible with1 to 8 GPUs. TYAN offers a full product portfolio to customers which are compatible with NVIDIA Tesla K Series GPU Accelerators. The TYAN S7055 and S7056 motherboard will be showcased as well as TYAN TA77-B7061 and FT48-B7055 barbones at TYAN's booth (#503) during the GTC 2013.

Targeting from mainstream applications to the most complicated high performance computing, TYAN develops a rich product portfolio of GPU based platforms. These products offer flexible and scalable performance as well as maximum efficiency in order to help customers deploying an ideal GPU cluster solutions. All the TYAN GPU platforms are under-validation with industry-leading companies' GPU products. The TYAN TA77-B7061, FT48-B7059 and FT77-B7059 GPU platforms passed the validation and are fully compatible with NVIDIA Tesla K Series GPU Accelerators. The bundled product portfolios of TYAN GPU platforms and NVIDIA Tesla K Series will be widely available in Q2.

The growing ranks of programmers using the Python open-source language can now take full advantage of GPU acceleration for their high performance computing (HPC) and big data analytics applications by using the NVIDIA CUDA parallel programming model, NVIDIA today announced.

Easy to learn and use, Python is among the top 10 programming languages with more than three million users. It enables users to write high-level software code that captures their algorithmic ideas without delving deep into programming details. Python's extensive libraries and advanced features make it ideal for a broad range of HPC science, engineering and big data analytics applications. Support for NVIDIA CUDA parallel programming comes from NumbaPro, a Python compiler in the new Anaconda Accelerate product from Continuum Analytics.

According to the International Data Corporation (IDC) Worldwide Quarterly Server Tracker, factory revenue in the worldwide server market decreased 4.0% year over year to $12.2 billion in the third quarter of 2012 (3Q12). This is the fourth consecutive quarter of year-over-year revenue decline, as server market demand continued to soften following a strong refresh cycle that characterized the market in most of 2010 and 2011. After declining in 2Q12, server unit shipments increased 0.6% year over year in 3Q12 to 2.1 million units. This was the 11th time in the past 12 quarters that server units have grown on a year-over-year basis.

On a year-over-year basis, volume systems experienced a 0.5% revenue decline. At the same time, demand for midrange and high-end systems experienced year-over-year revenue declines of 14.0% and 8.9% respectively in 3Q12. All three segments were impacted by difficult year-over-year compares combined with transitions in the technology refresh cycles.

HP today unveiled the industry's first server built to help clients operationalize Big Data, drive new business opportunities and save up to $1 million over three years.

With the advent of Big Data software and the promise that it brings, many organizations have tried to deploy these solutions on existing architectures not designed to handle the specific needs of these workloads. As a result, the outcomes from these early deployments have been suboptimal from a performance and cost perspective.

Integrating new AMD Opteron 6300 processors, a full range of ASUS servers and server boards offers greater flexibility with five expansion slots and extreme computing power via support for up to four CPUs and two GPUs in select models (RS920A-E6/RS8, RS924A-E6/RS8 servers) to accommodate the needs of data center, enterprise and HPC applications. The dedicated BIOS developed by ASUS to make the most of the new processors is now available at the official ASUS support site.

RS920A-E6/RS8 and RS924A-E6/RS8 servers have been designed with a 4-way layout that supports up to four AMD Opteron 6300 processors on a single board, delivering extreme computing power and enhanced scalability. With each Opteron 6300 processor utilizing 16 cores, the new ASUS servers can sustain up to 64 cores as well as a maximum 512GB memory. They ship with four PCI Express 2.0 x16 slots plus one dedicated slot for an ASUS PIKE RAID card. This layout offers more flexible system setup and upgrade options, with an internal design that allows for up to twin double-deck graphics cards. The combined CPU/GPU power on offer creates high-output hybrid computing that matches the processing-intensive demands of HPC and data center applications.

AMD today launched the AMD FirePro S10000, the industry's most powerful server graphics card, designed for high-performance computing (HPC) workloads and graphics intensive applications.

The AMD FirePro S10000 is the first professional-grade card to exceed one teraFLOPS (TFLOPS) of double-precision floating-point performance, helping to ensure optimal efficiency for HPC calculations. It is also the first ultra high-end card that brings an unprecedented 5.91 TFLOPS of peak single-precision and 1.48 TFLOPS of double-precision floating-point calculations. This performance ensures the fastest possible data processing speeds for professionals working with large amounts of information. In addition to HPC, the FirePro S10000 is also ideal for virtual desktop infrastructure (VDI) and workstation graphics deployments.

Asetek Inc., the world's leading supplier of liquid cooling solutions for computers announced today that it will showcase a state of the art power efficient HPC cluster at SC12 in Salt Lake City, Utah - November 12-15. Formal presentations and live demonstrations will be available at Asetek's booth #4045.

The showcase is groundbreaking in the areas of power efficiency, performance and density. The cluster is built on an industry standard 48U rack, 46Us of which are filled with 23 2U 4-node Intel H2216WPJR servers, each with dual Xeon E5 2690 CPUs providing a total CPU and core count of 184 and 1472 respectively.