Thursday, February 26th 2009
ASUS Shines with New Marine Cool Motherboard Concept
This year ASUS will try to leave the competition far behind, by introducing a brand new motherboard concept, the Marine Cool series. The Marine Cool series design goes far ahead from current Republic of Gamers (R.O.G.) mainboard products. For starters, the new motherboard has a new back plate that utilizes "micro-porous ceramic" technology and spreads across the whole PCB. The heat-pipe system that cools the motherboard's main components is also different, compared to current shipping products. Although the cooling technology remains the same, the whole look of the system reminds of a robot armour. Finally, it looks that ASUS engineers have decided to use SO-DIMM modules to cope with current Core 2 processors (if I'm right that appears to be LGA775 socket). I know it sounds a bit crazy, but pictures don't lie. Have a look and write what you think. The ASUS Marine Cool prototype will make first appearance during this year's CeBIT 2009 in Hannover, Germany.
Source:
AnandTech
89 Comments on ASUS Shines with New Marine Cool Motherboard Concept
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I still don't understand the SO-DIMMs, even after reading that little sticker.
How much power that battery holds, I've no idea...But I doubt they could throw even 10minutes of juice on a high end system.
And what the hell is the cost of this board going to be? I dont need a battery I have a UPS, I don't need 2 and I prefer standard DIMM's to SO. I don't see this concept going very far.
My question is why is Asus using a crazy "technology inspired" backplate to help dissipate the heat when the real engineering breakthrough would be to include passive heat distribution within the PCB. Thats one to think about!
There has got to be a good reason for that. Maybe some SO-DIMMs are coming out that will be uber.