Thursday, February 26th 2009
ASUS Shines with New Marine Cool Motherboard Concept
This year ASUS will try to leave the competition far behind, by introducing a brand new motherboard concept, the Marine Cool series. The Marine Cool series design goes far ahead from current Republic of Gamers (R.O.G.) mainboard products. For starters, the new motherboard has a new back plate that utilizes "micro-porous ceramic" technology and spreads across the whole PCB. The heat-pipe system that cools the motherboard's main components is also different, compared to current shipping products. Although the cooling technology remains the same, the whole look of the system reminds of a robot armour. Finally, it looks that ASUS engineers have decided to use SO-DIMM modules to cope with current Core 2 processors (if I'm right that appears to be LGA775 socket). I know it sounds a bit crazy, but pictures don't lie. Have a look and write what you think. The ASUS Marine Cool prototype will make first appearance during this year's CeBIT 2009 in Hannover, Germany.
Source:
AnandTech
89 Comments on ASUS Shines with New Marine Cool Motherboard Concept
edit: lets keep i7 discussions out of here.
Here is a heat sink of a so-dimm and I think it is going to fit
SO-DIMMs on that board are shown commonly how they are used on laptops, stacked like this:
So that area is not a clearance issue.
tho.. the board still has a southbridge onboard which slows it down..
the lack of a southbridge on a motherboard is independant.. the less it uses. the better..
You need to take your theories to another thread man. Seriously.
the southbridge still is the slowest part on the motherboard :p
www.newegg.com/Product/Product.aspx?Item=N82E16820231124
Would it make that much of a difference being sandwiched there, dunno :)
These wouldn't fit as there is that one component on the top right corner, but more serious heat spreader:
www.newegg.com/Product/Product.aspx?Item=N82E16820231165
let me think about it in GIMP
lala..
Sorry if I'm wrong.. correct me if I am
So in the i7 intel is working on splitting the cores of the cpu.. 1 goes to the NB the other to the SB.
Intel is really working on this :cool:
.. however this isn't an X58 board. Saying that, the ICH10 is the same as on the P45, but I don't understand your point about the South-bridge.
one core to the ICH10R and the other to the X58
can you now think of 4 cores and 8 cores ? :D :cool:
Do I need to explain the 8 cores ?
Or.. you rather have me saying : "You can't touch this" :cool:
OT:
I like the looks of the board...but I agree that it looks more like a design in progress. Still unsure of the SO-DIMM though...that does puzzle me.
www.youtube.com/watch?v=WGoi1MSGu64
:rolleyes:
Maybe he works for a X58 manufacturer in Belgium. :p
Anyway, back on topic... I like the ceramic backplate if it really works as advertised and acts like one large heatsink.
I guess I'm confused about the SO-DIMMS as well. Is it to save space for extra stuff and give better airflow? It couldn't be a height thing because the heatsinks around the CPU are ginormous. Dark Revenger, were you asking WTF that thing is above the southbridge? I'm kinda curious myself.
Anyone else notice the insane amount of capacitors on this thing?
Most likely this is an early prototype, I've never seen an ATX board run SO-DIMM's. I don't think any of us have. I'd say this is such an early concept that anything can change on it and I wouldn't doubt if it did.