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AMD Ryzen 5 8500G

6
Cores
12
Threads
65 W
TDP
3.5 GHz
Frequency
5 GHz
Boost
Phoenix2
Codename
Socket AM5
Socket
Front
Front
Back
Back
Installed
Installed
Package
Package
Package Back
Package Back
Bundled Heatsink
Bundled Heatsink
Bundled Heatsink 2
Bundled Heatsink 2
Connectivity
Connectivity
AMD Socket AM5
AMD Socket AM5
The AMD Ryzen 5 8500G is a mobile processor with 6 cores, launched in January 2024, at an MSRP of $179. It is part of the Ryzen 5 lineup, using the Zen 4 (Phoenix) architecture with Socket AM5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 12 threads. Ryzen 5 8500G has 16 MB of L3 cache and operates at 3.5 GHz by default, but can boost up to 5 GHz, depending on the workload. AMD is making the Ryzen 5 8500G on a 4 nm production node using 20,900 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen 5 8500G, which limits its overclocking potential.
With a TDP of 65 W, the Ryzen 5 8500G consumes typical power levels for a modern PC. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen 5 8500G uses a PCI-Express Gen 4 connection. This processor features the Radeon 740M integrated graphics solution. Inside the box you will not only find the processor, but also a Wraith Stealth cooler.
Hardware virtualization is available on the Ryzen 5 8500G, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) can run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket AM5
Foundry: TSMC
Process Size: 4 nm
Transistors: 20,900 million
Die Size: 137 mm²
Package: FC-LGA1718
tJMax: 95°C

Processor

Market: Mobile
Production Status: Active
Release Date: Jan 8th, 2024
Retail Availability:Jan 31st, 2024
Launch Price: $179
Part#: 100-000001491
Bundled Cooler: Wraith Stealth

Performance

Frequency: 3.5 GHz
P-Core Base:4.1 GHz
Turbo Clock: up to 5 GHz
E-Core Frequency: 3.2 GHz
up to 3.7 GHz
Base Clock: 100 MHz
Multiplier: 35.0x
Multiplier Unlocked: No
TDP: 65 W
Configurable TDP:45 W
PPT:61-88 W

Architecture

Codename: Phoenix2
Generation: Ryzen 5
(Zen 4 (Phoenix))
Memory Support: DDR5
Rated Speed: 5200 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 4, 14 Lanes
(CPU only)
Chipsets: X670E, X670, B650E, B650, A620

Core Config

# of Cores: 6
# of Threads: 12
Hybrid Cores: 2 + 4
SMP # CPUs: 1
Integrated Graphics: Radeon 740M

Cache

Cache L1: 64 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 16 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • NX-Bit
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost 2

Notes

Graphics engine boost clock: 2800MHz

ECC mode requires motherboard support.
Aug 14th, 2024 09:52 EDT change timezone

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