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AMD Ryzen 9 7945HX

16
Cores
32
Threads
55 W
TDP
2.5 GHz
Frequency
5.4 GHz
Boost
Dragon Range
Codename
Socket FL1
Socket
Front
Front
Connectivity
Connectivity
AMD Socket FL1
AMD Socket FL1
The AMD Ryzen 9 7945HX is a mobile processor with 16 cores, launched in January 2023. It is part of the Ryzen 9 lineup, using the Zen 4 (Dragon Range) architecture with Socket FL1. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 32 threads. Ryzen 9 7945HX has 64 MB of L3 cache and operates at 2.5 GHz by default, but can boost up to 5.4 GHz, depending on the workload. AMD is building the Ryzen 9 7945HX on a 5 nm production process using 13,140 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. You may freely adjust the unlocked multiplier on Ryzen 9 7945HX, which simplifies overclocking greatly, as you can easily dial in any overclocking frequency.
With a TDP of 55 W, the Ryzen 9 7945HX consumes typical power levels for a modern PC. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the computer, Ryzen 9 7945HX uses a PCI-Express Gen 5 connection. This processor features the Radeon 610M integrated graphics solution.
Hardware virtualization is available on the Ryzen 9 7945HX, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket FL1
Foundry: TSMC
Process Size: 5 nm
Transistors: 13,140 million
Die Size: 2x 71 mm²
I/O Process Size:6 nm
I/O Die Size:122 mm²
Package: µFC-BGAFL1
tJMax: 100°C

Processor

Market: Mobile
Production Status: Active
Release Date: Jan 4th, 2023
Part#: 100-000000870

Performance

Frequency: 2.5 GHz
Turbo Clock: up to 5.4 GHz
Base Clock: 100 MHz
Multiplier: 25.0x
Multiplier Unlocked: Yes
TDP: 55 W
Configurable TDP:55-75 W

Architecture

Codename: Dragon Range
Generation: Ryzen 9
(Zen 4 (Dragon Range))
Memory Support: DDR5
Rated Speed: 5200 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 5, 28 Lanes
(CPU only)

Core Config

# of Cores: 16
# of Threads: 32
SMP # CPUs: 1
Integrated Graphics: Radeon 610M

Cache

Cache L1: 64 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 64 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • NX-Bit
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost 2

Notes

Graphics engine dynamic frequency: 400-2200MHz
Nov 8th, 2024 09:28 EST change timezone

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