The release of Cyberpunk 2077 has brought a rather large controversy around it, with many gamers being disappointed with their purchases. The game has generated massive hype before it was released, and when it dropped, gamers from all around the world found themselves disappointed in the quality of the game itself. Most notably, the game developer, CD Project RED, has made a massive game and discovered many bugs along the way. That buggy release was shipped to customers. However, the game developer is not going to watch it remain like that and has issued a hotfix release 1.05 that is supposed to iron out a few major bugs and bring many improvements.

On PC, the game was underperforming on AMD Ryzen CPUs, and now the patch is applied: "[AMD SMT] Optimized default core/thread utilization for 4-core and 6-core AMD Ryzen (tm) processors. 8-core, 12-core and 16-core processors remain unchanged and behaving as intended. This change was implemented in cooperation with AMD and based on tests on both sides indicating that performance improvement occurs only on CPUs with 6 cores and less." For a full list of gameplay, UI, visual, and quest updates, please check out this hotfix list here. Update is now available on all platforms and you should download it.

Der8auer has picked up Intel's latest TEC cooler, built in conjunction with EKWB, and unceremoniously plopped it right into an AMD Ryzen 9 5950X CPU. Well, not completely unceremoniously - there were many accommodations that had to be made in order to achieve this. For one, as this is a solution designed specifically for Intel CPUs and sockets, Der8auer had to Frankenstein his way through a number of cooling parts to be able to adapt the TEC solution to the AM4 socket. Not only that, but Intel's TEC requires deep software control for it to work properly - software control which only works with Intel silicon, of course. Der8auer thus had to have a second machine running an Intel 10900K CPU to control the software on the Intel cryo cooler.

All in all, the results were interesting, to say the least. The 16-core, 32-thread Ryzen 9 5950X saw single-core-load CCD temperatures in the 90 °C department with the TEC solution disabled - which promptly dropped down to only 50 °C with the cryo cooler actually operating. With a game load, the 5959X achieved up to 5.050 GHz in single-cores on its automatic boost profile. The entire chip often boosted to 4.8 - 4.9 GHz on all cores at once (with variances between the CCDs) whilst under this cooling solution and workload. With the TEC operating in its unregulated mode - which means, with no considerations for CPU operating temperature and power usage for the cooling process - saw the Ryzen 9 5950X achieving 2 °C core temperature results, and boosted frequencies up to a staggering 5323 MHz on all cores - before crashing. An interesting piece of work which you catch on video after the break; one can rest assured that most PC cooling specialists are already working on their own TEC-based cooling solutions following Intel's achievement in this field.

Apple today announced M1, the most powerful chip it has ever created and the first chip designed specifically for the Mac. M1 is optimized for Mac systems in which small size and power efficiency are critically important. As a system on a chip (SoC), M1 combines numerous powerful technologies into a single chip, and features a unified memory architecture for dramatically improved performance and efficiency. M1 is the first personal computer chip built using cutting-edge 5-nanometer process technology and is packed with an astounding 16 billion transistors, the most Apple has ever put into a chip.

It features the world's fastest CPU core in low-power silicon, the world's best CPU performance per watt, the world's fastest integrated graphics in a personal computer, and breakthrough machine learning performance with the Apple Neural Engine. As a result, M1 delivers up to 3.5x faster CPU performance, up to 6x faster GPU performance, and up to 15x faster machine learning, all while enabling battery life up to 2x longer than previous-generation Macs. With its profound increase in performance and efficiency, M1 delivers the biggest leap ever for the Mac.

The processors may be a few days away from availability, but the overclocking records are already trickling out. Darklord posted a CPU-Z validation for a Ryzen 9 5950X 16-core processor overclocked to 5898.63 MHz (or roughly 5.90 GHz), with all 16 cores and 32 threads enabled, and dual-channel memory. It appears to be a straight up multiplier overclock with the multiplier set to 59.0X, and stock base-clock. What's interesting, though, is the core voltage that this feat took—a scorching 1.656 V. Other components include an ASUS ROG Crosshair VIII Impact X570 motherboard, dual-channel DDR4-3600 memory, and basic GT 710 graphics. There's no word on cooling, but with this kind of voltage, an extreme method such as LN2 won't surprise us. Find the validation here.

It would seem that a number of players have received their Zen 3 samples, considering the amount of performance leaks that have surfaced just in the past two days. The new AMD Zen 3 processors carry a huge weight on their shoulders - demonstrating AMD's touted leadership in CPU performance in all metrics, whilst justifying their increased pricing against Zen 2 offerings. Many rivers of ink (and some tears) have flown in regards to pricing of the new AMD processors, so it all pertains to performance considerations on whether that pricing is justified or not.

Leaker extraordinaire TUM_APISAK has leaked some benchmarks on AMD's upcoming Ryzen 9 5900X and 5950X CPUs - namely, in Geekbench 5. In this round of leaks - which are, admittedly, originating from two different systems), the 12-core, 24-thread AMD Ryzen 9 5900X scores 1605 points in single-core and 12869 in the Multi-core benchmarks. The 16-core, 32-thread Ryzen 9 5950X, on the other hand, scores 1575 points in single and 13605 points in Multi-core workloads. The Ryzen 9 5900X's higher base clocks may be responsible for the higher single-core score; however, the Ryzen 9 5959X pulls ahead - expectedly - in the Multi-core portion of the benchmark. Comparing scores between the Zen 3 5950X and the Zen-based 3950X (via AnandTech), which carry the same amount of cores, the 5950X offers a 18% and 12% advantage, respectively, in the single and multi-threaded tests - not a far cry from AMD's touted 19% IPC uplift.

Hold on to your helmets: a wild rumor that Intel may be looking to introduce the same design considerations as they already did with their Lakefield architecture has appeared. According to momomo via Twitter (a user who has already shared many rumors and details in the PC hardware space) as well as some other sources, Intel is looking to bring a Big.Little-like design (which Intel calls Hybrid architecture) to the desktop platform in the form of Alder Lake-S, to be reportedly built on the 10 nm process. While Intel's Lakefield (especially geared for the mobile market) only sported four Atom (Intel's low power) Tremont cores combined with one high-performance Sunny Cove core, Alder Lake-S could sport as many as an 8+8 configuration, with a TDP currently set up to 80 W (and up to 125 W TDP is also set in the revealing slides with a disclosure regarding investigating performance scaling in up to 150 W TDP).

Should this actual Alder Lake-S product materialize in the 10 nm process, this could be a way for Intel to salvage what it can from the 10 nm process for the desktop platform. As we know from multiple reports on the state of Intel's 10 nm, yields and operating frequencies aren't close to what was expected, and Intel's CFO George Davis even said at last week's Morgan Stanley's Analyst Conference that their 10 nm process wouldn't be as profitable as even 22 nm, which does show that Intel is already looking past this process for their 7 nm deployment. A Big.Little design for a desktop architecture does seem like a more plausible design decision for a struggling process than a full 16-core monolithic die such as those Intel currently employs.

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

On a charm offensive, motherboard maker BIOSTAR revealed that it will extend support for the upcoming 16-core Ryzen 9 3950X even to its cheapest motherboards based on AMD's entry-level A320 chipset. Support for the processor will be added through a UEFI firmware update that should go live on the company website soon, and downloadable from the support section of each motherboard's product page. BIOSTAR's list of motherboards for the 3950X includes almost its entire socket AM4 motherboard lineup, spanning the A320, B350, X370, B450, X470, and X570 chipsets. A spokesperson for BIOSTAR confirmed to us that this wasn't a typo on the company website.

AMD's upcoming Ryzen 9 3950X socket AM4 processor beats Intel's flagship 18-core processor, the Core i9-10980XE, by a staggering 24 percent at 3DMark Physics, according to a PC Perspective report citing TUM_APISAK. The 3950X is a 16-core/32-thread processor that's drop-in compatible with any motherboard that can run the Ryzen 9 3900X. The i9-10980XE is an 18-core/36-thread HEDT chip that enjoys double the memory bus width as the AMD chip, and is based on Intel's "Cascade Lake-X" silicon. The AMD processor isn't at a tangible clock-speed advantage. The 3950X has a maximum boost frequency of 4.70 GHz, while the i9-10980XE isn't much behind, at 4.60 GHz, but things differ with all-core boost.

When paired with 16 GB of dual-channel DDR4-3200 memory, the Ryzen 9 3950X powered machine scores 32,082 points in the CPU-intensive physics tests of 3DMark. In comparison, the i9-10980XE, paired with 32 GB of quad-channel DDR4-2667 memory, scores just 25,838 points as mentioned by PC Perspective. Graphics card is irrelevant to this test. It's pertinent to note here that the 3DMark physics test scales across practically any number of CPU cores/threads, and the AMD processor could be benefiting from a higher all-core boost frequency than the Intel chip. Although AMD doesn't mention a number in its specifications, the 3950X is expected to have an all-core boost frequency that's north of 4.00 GHz, as its 12-core sibling, the 3900X, already offers 4.20 GHz all-core. In contrast, the i9-10980XE has an all-core boost frequency of 3.80 GHz. This difference in boost frequency, apparently, even negates the additional 2 cores and 4 threads that the Intel chip enjoys, in what is yet another example of AMD having caught up with Intel in the IPC game.

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.AMD's full statement is quoted below.

AMD updated its technology roadmaps to reflect a 2020 launch window for its upcoming CPU and graphics architectures, "Zen 3" and RDNA2. The two will be based on 7 nm+ , which is AMD-speak for the 7 nanometer EUV silicon fabrication process at TSMC, that promises a significant 20 percent increase in transistor-densities, giving AMD high transistor budgets and more clock-speed headroom. The roadmap slides however hint that unlike the "Zen 2" and RDNA simultaneous launch on 7th July 2019, the next-generation launches may not be simultaneous.

The slide for CPU microarchitecture states that the design phase of "Zen 3" is complete, and that the microarchitecture team has already moved on to develop "Zen 4." This means AMD is now developing products that implement "Zen 3." On the other hand, RDNA2 is still in design phase. The crude x-axis on both slides that denotes year of expected shipping, too appears to suggest that "Zen 3" based products will precede RDNA2 based ones. "Zen 3" will be AMD's first response to Intel's "Comet Lake-S" or even "Ice Lake-S," if the latter comes to fruition before Computex 2020. In the run up to RDNA2, AMD will scale up RDNA a notch larger with the "Navi 12" silicon to compete with graphics cards based on NVIDIA's "TU104" silicon. "Zen 2" will receive product stack additions in the form of a new 16-core Ryzen 9-series chip later this month, and the 3rd generation Ryzen Threadripper family.

Market availability of the 16-core Ryzen 9 3950X may be far away, given its September 2019 launch, but engineering samples (ESes) of the chip seem to be already in circulation. "uzzi38" on Twitter posted this spy-shot of a 3950X ES making short work of Cinebench R15. CPU-Z recognizes the chip by its codename "Matisse," and puts out the correct CPU core and thread count, but doesn't give a name-string. It also recognizes the MSI MEG X570 GODLIKE motherboard this test is run on.

The purported Ryzen 9 3950X ES, overclocked to 5.42 GHz, scores a gargantuan 5,501 points in the multi-threaded benchmark. To put this number into perspective, at stock frequencies, a Ryzen Threadripper 2950X (same core-count, double the memory bus width), scores 3,645 points. The 3950X benefits from not just its massive overclock that's over 1 GHz higher than the stock TR-2950X, but also higher IPC, and a more consolidated memory interface. This feat goes to show that AMD's upcoming Ryzen chips love to overclock, and deliver a significantly higher single-thread performance over the previous generation.

When AMD launched its Ryzen 9 3900X 12-core/24-thread processor at its Computex 2019 keynote, our readers commented on the notable absence of a 16-core SKU, given that a "Matisse" multi-chip module with two 8-core "Zen 2" chiplets adds up to that core-count. Some readers noted this could be a case of AMD holding back its top performing part in the absence of competition in the segment from Intel. It turns out, the company was saving this part up for an E3 2019 unveiling.

The Ryzen 9 3950X maxes out "Matisse" MCM with 16 cores, 32 threads via SMT, a staggering 64 MB of L3 cache (72 MB including the 8 MB of total L2 cache), and a stunning 105-Watt TDP figure that's unchanged from the company's TDP for the 3900X. The Ryzen 9 3950X is clocked at 3.50 GHz, with a maximum boost frequency of 4.70 GHz. The company is yet to reveal its price, but given that the $499 price-tag has already been taken by the 3900X, one could expect an even higher price. It remains to be seen if the 3950X will launch alongside the rest of the series on 7/7.

MSI, without naming its product, teased its MEG X570 Ace motherboard late last week, obeying the cardinal rules of a teaser, such as not putting out clear pictures or names. BIOSTAR probably wanted to do something similar, but ended up leaking glaring details and pictures of its flagship socket AM4 motherboard based on the AMD X570 chipset, the Racing X570GT8. The X570 is AMD's first in-house design chipset for the AM4 socket after "Promontory" and FM2-based "Bolton," supplied by ASMedia. It was necessitated by the need to get downstream PCIe connectivity from the chipset to be certified for the latest generations (gen 3.0 or later), by AMD, and overcome many of the connectivity limitations of ASMedia "Promontory," from which AMD carved out previous socket AM4 chipsets.

Design compulsions of being a flagship product aside, there are signs of a clear focus on strengthening the CPU VRM on the Racing X570GT8, to cope with the rumored Ryzen 9 series 16-core "Zen 2" processor. The board draws power from a combination of 24-pin ATX and 8+4 pin EPS connectors, conditioning it for the processor with a 12-phase VRM. There are two metal-reinforced PCI-Express x16 slots wired to the AM4 SoC, and we get the first glimpse of the PCI-Express gen 4.0 lane switching and re-driver circuitry. We haven't seen anything to suggest that the downstream PCIe lanes from the X570 chipset are gen 4.0, yet, but we expect them to at least be gen 3.0. The presence of three M.2 slots bodes well for the downstream PCIe lane count. ASMedia "Promontory" puts out a paltry eight gen 2.0 lanes. It's also interesting to see an active fan-heatsink cooling the X570 chipset, indicating a rather high TDP compared to the 3-5 Watt TDP of the 400-series "Promontory" low-power variant chipsets. The component choices by BIOSTAR look premium and are a callback to its T-Power glory days enthusiasts remember.

AMD is giving finishing touches to its 3rd generation Ryzen socket AM4 processor family which is slated for a Computex 2019 unveiling, followed by a possible E3 market availability. Based on the "Matisse" multi-chip module that combines up to two 8-core "Zen 2" chiplets with a 14 nm I/O controller die, these processors see a 50-100 percent increase in core-counts over the current generation. The Ryzen 5 series now includes 8-core/16-thread parts, the Ryzen 7 series chips are 12-core/24-thread, while the newly created Ryzen 9 series (designed to rival Intel Core i9 LGA115x), will include 16-core/32-thread chips.

Thai PC enthusiast TUM_APISAK confirmed the existence of the Ryzen 9 series having landed himself with an engineering sample of the 16-core/32-thread chip that ticks at 3.30 GHz with 4.30 GHz Precision Boost frequency. The infamous Adored TV leaks that drew the skeleton of AMD's 3rd generation Ryzen roadmap, referenced two desktop Ryzen 9 parts, the Ryzen 9 3800X and Ryzen 9 3850X. The 3800X is supposed to be clocked at 3.90 GHz with 4.70 GHz boost, with a TDP rating of 125W, while the 3850X tops the charts at 4.30 GHz base and a staggering 5.10 GHz boost. The rated TDP has shot up to 135W. We can now imagine why some motherboard vendors are selective with BIOS updates on some of their lower-end boards. AMD is probably maximizing the clock-speed headroom of these chips out of the box, to preempt Intel's "Comet Lake" 10-core/20-thread processor.

One of our readers tipped us off with a very plausible looking image that drops a motherlode of information about what AMD's 2nd generation Ryzen (aka Ryzen 3000 series) processor lineup could look like. This includes a vast selection of SKUs, their CPU and iGPU core configurations, clock-speeds, and OEM channel pricing. The list speaks of a reentry for 7th generation A-series "Excavator" as Duron X4 series, followed by Duron 300GE-series based on a highly cut down "Raven Ridge," Athlon 300GE 2-core/4-thread based on an implausible "Zen+ 12 nm" APU die, followed by quad-core Ryzen 3 3000 series processors with and without iGPUs, making up the company's entry-level product lineup.

The core counts seem to jump from 4-core straight to 8-core, with no 6-core in between, for the Ryzen 5 series. This is also where AMD's new IP, the 7 nm "Zen 2" architecture, begins. There appears to be a large APU die (or a 3-chip MCM) with an 8-core CPU and 20-CU iGPU, which makes up certain Ryzen 5 SKUs. These chips are either 8-core/8-thread or 8-core/16-thread. The Ryzen 7 series is made up of 12-core/24-thread processors that are devoid of iGPU. The new Ryzen 9 series extension caps off the lineup with 16-core/32-thread SKUs. And these are just socket AM4.

AMD announced its second-generation Ryzen Threadripper high-end desktop (HEDT) processor series, succeeding its lean and successful first-generation that disrupted much of Intel's Core X HEDT series, forcing Intel to open up new high-core-count (HCC) market segments beyond its traditional $1000 price-point. AMD's 16-core $999 1950X proved competitive with even Intel's 12-core and 14-core SKUs priced well above the $1200-mark; and now AMD looks to beat Intel at its game, with the introduction of new 24-core and 32-core SKUs at prices that are sure to spell trouble for Intel's Core X HCC lineup. The lineup is partially open to pre-orders, with two SKUs launching within August (including the 32-core one), and two others in October.

At the heart of AMD's second-generation Ryzen Threadripper is the new 12 nm "Pinnacle Ridge" die, which made its debut with the 2nd Generation Ryzen AM4 family. This die proved to introduce 3-5 percent IPC improvements in single-threaded tasks, and multi-threaded improvements with an improved Precision Boost II algorithm, which boosted frequencies of each of 8 cores on-die. The Threadripper is still a multi-chip module, with 2 to 4 of these dies, depending on the SKU. There are four of these - the 12-core/24-thread Threadripper 2920X, the 16-core/32-thread Threadripper 2950X; the 24-core/48-thread Threadripper 2970WX, and the flagship 32-core/64-thread Threadripper 2990WX.

That didn't take long - from the moment we've put our eyes on AMD's premium packaging for their new Threadripper 2 lineup, we're getting images that slowly expose the workings and ritual of unboxing these feats of silicon, engineering, and human ingenuity. The original video has, in the meantime, been taken down, but of course, whatever hits the web, stays in the web, and screenshots abound that give us a taste of what to expect.

AMD in its Q2-2018 investors conference call dropped more hints at when it plans to launch its 3rd generation Ryzen processors, based on its "Zen2" architecture. CEO Lisa Su stated in the Q&A session that rollout of 7 nm Ryzen processors will only follow that of 7 nm EPYC (unlike 1st generation Ryzen preceding 1st generation EPYC). What this effectively means is that the fabled 16-core die with 8 cores per CCX won't make it to the desktop platform any time soon (at least not in the next three quarters, certainly not within 2018).

AMD CEO touched upon the development of the company's 7 nm "Rome" silicon, which will be at the heart of the company's 2nd generation EPYC processor family. 2nd generation EPYC, as you'd recall from our older article, is based on 7 nm "Zen2" architecture, and not 12 nm "Zen+." 3rd generation Ryzen is expected to be based on "Zen2." As of now, the company is said to have completed tape-out of "Rome," and is sending samples out to its industry partners for further testing and validation. The first EPYC products based on this will begin rolling out in 2019. The 7 nm process is also being used for a new "Vega" based GPU, which has taped out, and will see its first enterprise-segment product launch within 2018.

AMD at its Computex 2018 presser unveiled the 2nd generation Ryzen Threadripper high-end desktop (HEDT) processors. These processors are multi-chip modules of four 12 nm 8-core "Pinnacle Ridge" dies, with up to 32 cores, and SMT enabling up to 64 threads. Much like the first-generation Threadripper family, there could be 16-core, 12-core, and 8-core SKUs; in addition to 24-core, 28-core, and 32-core ones. AMD did mention that these chips are backwards compatible with X399 motherboards, although it remains to be seen how AMD wires out the memory of two extra dies on the X399 platform. In all likelihood, there could be a new wave of motherboards that retain the TR4 socket with backwards-compatibility with 1st generation Threadripper proccessors, but having 8-channel memory slots.

The 2nd generation chips feature higher clock-speeds, and all of the "Zen+" features introduced by "Pinnacle Ridge," including Precision Boost II and XFR 2.0. AMD put up a demo of the chip challenging Intel's top-dog Core i9-7980XE, which has two more cores than it. This probably explains why Intel revealed a 28-core HEDT SKU yesterday. AMD stated that the lineup is en route Q3-2018 launch.

Intel expanded the upper end of its Core X "Skylake-X" HEDT processor family, with the introduction of the Core i9-7980XE 18-core flagship processor, and the i9-7960X 16-core processor. Designed to give pro-sumers and PC enthusiasts extreme mega-tasking performance, the i9-7980XE features all components physically present on the 14 nm "Skylake-X" silicon, featuring 18 cores, with HyperThreading enabling 36 threads; 1 MB of dedicated L2 cache per core, 24.75 MB of shared L3 cache, and rather restrained clock speeds of 2.60 GHz, with Turbo Boost speeds of 4.20 GHz, and Turbo Boost Max 3.0 frequency of 4.40 GHz.

Despite its gargantuan core-count, the TDP of this chip is rated at 165W, lower than the 180W rated for competing Ryzen Threadripper processors. The other high-end processor launched by Intel is the Core i9-7960X. This 16-core/32-thread chip features clock speeds of 2.80 GHz, with 4.20 GHz Turbo Boost, and 4.40 GHz Turbo Boost Max 3.0. It features 22 MB of shared L3 cache, and 1 MB of dedicated L2 cache per core. The Core i9-7980XE is priced at USD $1,999 in the retail channel; while the Core i9-7960X goes for $1,699.

In a Forbes interview conducted by Anthony Leather, AMD officials Senior Vice President and General Manager Jim Anderson, Corporate Vice President of Worldwide Marketing John Taylor, Sarah Youngbauer of AMD's communications team, and James Prior, AMD's Senior Product Manager, have shed some light on the development process for AMD's equivalent of a flash hit - their HEDT, HCC Threadripper chips. Threadripper, which leverages AMD's Zen architecture used in their Ryzen and EPYC processors, makes use of an MCM design with up to 16 cores and 32 threads, with AMD's svelte Zen, 8-core base units linked through the company's high speed interconnect Infinity Fabric.

This has allowed the company to scale designs from four core processors with Ryzen 3, all the way towards the current cream of the crop Threadripper 1950X. It's an extremely scalable design, which brings with it improved yields and some pretty significant cost savings for AMD due to smaller dies. This, in turn, means the company is able to more agressively price their Ryzen and Threadripper processors compared to the competition, at least when it comes to high core and thread counts for the same price bracket - and the success of that business decision is showing.For our forum lurkers, this article is marked as an editorial.

AMD has published a list of coolers that are officially compatible with their upcoming Threadripper CPUs. It's no surprise there needs to be a compatibility list - the new CPUs top out at 16-core, 32-thread monsters which have never before graced the HEDT space, with an accompanying large CPU die size and heatsink. The socket being an entirely new affair, a new retention kit must also be made available by cooler manufacturers.

AMD itself will be offering an Asetek retention kit for AIO cooling solutions on their Threadripper retail packaging, which should make most Asetek-built AIOs to be compatible with the TR4 socket. These coolers are automatically added to the list. However, there may be some other coolers that are compatible with the newest socket that are not listed on AMD's site as of yet. For those cases, AMD reminds us all that we should check with our cooling solution manufacturer whether an adapter is available or not, and whether our current cooling solution is sufficient for the task at hand. Other coolers are now receiving mid-production updates after a certain date to include the compatible mounting hardware. Check the source link for the AMD compatibility page, and the below image for the current state of affairs.

AMD maybe have shaken up the HEDT (high-end desktop) processor market with three Ryzen Threadripper SKU announcements early this week; but the two specifications that eluded us were their rated TDP and cache amounts. The first Ryzen Threadripper models will be available in the market from the 10th of August, and will include the 12-core/24-thread 1920X and the flagship 16-core/32-thread 1950X. Both models will feature the full 32 MB of L3 cache available from a pair of 14 nm "Summit Ridge" dies, which work out to "total cache" (L2+L3) amounts of 38 MB for the 1920X and 40 MB for the 1950X. The TDP of the 1920X and 1950X is rated at 180W. The TDP and cache configuration of the 8-core/16-thread 1900X remains unknown, for now.

AMD today officially announced some more details on its brain-child and market-stormer Ryzen Threadripper HEDT line of CPUs. Ryzen is a true new stand-alone architecture for AMD, the result of more than four years of careful planning and silicon design towards reaching a truly scalable, highly-flexible, non-glued together MCM design that could power all experiences and workloads through a single architecture design. The Ryzen architecture is already powering desktops with Ryzen 3, 5 and 7 desktop CPUs; has extended to server-side deployments through its EPYC line-up and will begin shipping for professionals with Ryzen PRO starting in Q3 2017. Also announced was that it will find its way to mobile APUs around Q4, paired with the new Vega graphics microarchitecture; and will even power professional-geared mobile solutions in 1H18. But more immediately, it's coming to the HEDT market. And AMD is putting that fight in the hands of Threadripper.

AMD pits its HEDT line-up to developers, researchers, prosumers, creators, and even multi-tasking gamers. Increased compute capabilities with up to 16 cores and 32 threads; larger memory footprint, increased I/O and storage, and support for many more GPUs and PCIe lanes ensure a stable, impressive platform for today's large data sets and tomorrow's exponentially more resource-intensive workloads. AMD will execute this with a three-pronged approach. There will be three processor models on offer for their HEDT platform. The $999 TR 1950X and $799 TR 1920X are known quantities already, with their respective 16 cores (32 threads) and 12 cores (24 threads). The new addition, however, comes in the form of the $549 TR 1900X, which offers not only 8 cores (16 threads) and 3.8 GHz base, 4.0 GHz boost clocks, but a clear upgrade path within AMD's new platform. Say what you will about AMD's offerings and execution, one thing is for sure: Zen and all the silicon it powers have prompted a reshuffle of the CPU landscape as we hadn't seen in years. Coincidence? AMD doesn't think so.