Taiwanese corporation United Micro Electronics (UMC) has pled guilty on charges of trade theft. The charges, originally pressed in November 2018 by US authorities, placed UMC and China's Fujian Jinhua in hot waters under suspicion of stealing trade secrets from US-based Micron technologies, one of the world's foremost players in memory semiconductor technologies. UMC's guilty plea serves as a way for the company to avoid heavier penalties, and includes a provision for the company's assistance in investigating Fujian Jinhua's actions in regards to this IP theft.

The whole story revolves around UMC's hiring of three Micron employees from Micron's subsidiary in Taiwan, Micron Memory Taiwan (MMT), back around September 2015. At least two of these employees migrated Micron trade secrets to UMC, which then inked a deal with china's Fujian Jinhua for the development of 32nm DRAM and "32Snm" DRAM technologies that Fujian Jinhua could then deploy for the manufacture of memory products - a deal which had Fujian Jinhua paying $300 million for equipment purchase plus $400 million for technology development to UMC. This all fell in line with the Chinese government's Made in China 2025 plan, which aims to bring the country to semiconductor independence from the western world. UMC says that the company itself didn't partake in the underhanded IP delivery to Fujian Jinhua, claiming instead that rogue employees did so of their own volition. The company further states that it only pleads guilty because according to the US Trade Secrets Act, the company still bears legal responsibilities for employee acts, whether or not top management is involved.

MSI launch MS-9893 with the latest Intel Atom Platform. This is the multi-display outputs of mini-ITX form factor board with the latest 32nm process technology for the highest HD graphics quality, and offers lower power consumption and enhanced graphic and media performance.

MSI MS-9893 supports multi-display outputs, including single Channel 18/24 bit LVDS, VGA, one HDMI. It has great graphics performance and support for up to 1080P high definition video.MSI MS-9893 is equipped with single-channel DDR3 1066 MHz memory up to a maximum of 4 GB in 1 x 204 SO-DIMM slots. MS-9893 supports D2550(10W) / N2800(6.5W) two SKU, with VGA, HDMI, Video Output: LVDS/ Single CH 24bit by D2550 (LVDS/ Single CH 18bit by N2800). Power Input support, one ATX for D2550, and another is DC-in 12V for D2550 / N2800. I/O, and expansion connectivity, including 6* COM-ports(2 x Real, 4 x Internal), 6* USB2.0(4 x Real, 2 x Internal), and 8*GPIO(4 x GPI, 4 x GPO), one PCI slot and one Mini-PCIe slot could support the m-SATA/wireless function.

Samsung Electronics Co. Ltd., a world leader in advanced semiconductor solutions, today introduced the industry's first quad-core application processor built on the High-k Metal Gate (HKMG) low-power process technology. With unprecedented performance capabilities exceeding 1.4GHz based on the ARM CORTEX A9 quad-core, the powerful, yet energy-efficient Exynos 4 Quad, allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20 percent lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual.

"The quad-core processor offers phenomenal multitasking abilities surpassing any single or dual application processor. Since all the cores must share a single battery, the power management and efficiency in the limited battery capacity are indispensable for mobile computing devices," said Taehoon Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics. "Given the diverse functionalities consumers are demanding from their mobile devices today, the Exynos 4 Quad meets those high-performance needs while keeping power consumption very low."

GLOBALFOUNDRIES today announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing and carries on a long tradition of rapidly ramping leading-edge technologies to volume production.

On a unit basis, cumulative 32nm shipments for the first five quarters of wafer production are more than double that achieved during the same period of the 45nm technology ramp, demonstrating that the overall 32nm ramp has significantly outpaced the 45nm ramp, despite the integration of a number of new and complex elements in both design and process technologies.

Toshiba Corporation today announced the development of BENAND, a versatile, multi-application single level cell (SLC) NAND flash memory with an embedded error correction code (ECC). BENAND's diverse applications include LCD TVs and digital cameras along with robots and other industrial applications. Samples of eight BENAND products in two capacities, 4 Gigabit and 8 Gigabit, will be available from today and mass production will follow from March 2012.

The simple interface and high reliability of small capacity SLC NAND has won it wide use in consumer applications and industrial programming. Until now, the ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction.

Following a good few months of delays, Intel has today finally introduced its third-generation Atom processors, the 32nm chips codenamed Cedar Trail.

While still paired up with the NM10 Express chipset found in Pine Trail-based systems, the 'Cedar Trail' CPUs bring quite a few updates, including the already mentioned 32nm process (enabling higher clocks and a drop in power draw of up to 20% for the whole platform), plus a media engine that allows for Full HD (1080p) video playback and Blu-ray support, an integrated memory controller supporting DDR3-800/1066 memory, and updated, but still DirectX 9-enabled graphics (Intel Graphics Media Accelerator 3600/3650 based on the PowerVR SGX 545 from Imagination Technologies).

VR-Zone have been having a little chat with Intel 'sources', who have leaked some juicy tidbits for us to enjoy in the form performance and power news. The upcoming next generation Medfield platform is Intel's first true System on a Chip (SoC) and is designed to compete with various low power ARM offerings in the tablet space. To help achieve this, they've gone through an internal restructure, merging four business units into just one: Ultra-Mobility, Mobile Wireless, Mobile Communications and Netbook & Tablet PC. The business unit is now simply known as Mobile and Communications. It's being run by Mike Bell and Hermann Eul and the first product to emerge from it will be is the 32 nm Medfield SoC solution.

VR-Zone explained that the competition will be "Apple's A-Series, NVIDIA Tegra, Qualcomm Snapdragon, Samsung Exynos, Texas Instruments OMAP and the likes. Out of all the chips mentioned above, only Samsung's Exynos is currently manufactured in 32nm process, just like Medfield."

Intel Sandy Bridge-E may be a duo this time, having only two processors (the Core i7-3960X and i7-3930K hexa-cores) to choose from, but early next year it will turn into a trio through the release of the Core i7-3820. This new model is the cheapest in the Sandy Bridge-E family and has begun to become available for pre-order around the world.

Built using 32nm process technology, the i7-3820 features four cores clocked at 3.6 GHz (3.9 GHz Turbo), eight threads, 10 MB of L3 cache, a quad-channel memory controller, and a TDP of 130W. The Core i7-3820 can be found listed in the US at $311.54 and in Europe at 276 Euro.

In addition to introducing the 'new' Radeon HD 7000M mobile GPUs, AMD has this week updated its A-Series family of APUs (accelerated processing units) by adding to it no less than seven models specifically targeting the mobile segment. All seven chips are manufactured using 32nm process technology and should keep laptops makers (relatively) happy until Trinity lands in the first half of 2012.

TYAN, an industry-leading server platform manufacturer and a subsidiary of MiTAC International Corp., will announce its latest platforms that fully support the latest 32nm AMD Opteron 6200 and 4200 Series processors (NYSE: AMD) at SC11. TYAN will be presenting a live demo of its GN70-B8236-IL, a powerful and cost-effective GPU/HPC 2U server solution installed with two AMD Opteron 6200 Series processors and two AMD FirePro V8800P Graphic Cards at TYAN booth #4202 during the show.

TYAN will be showcasing its broad portfolio featuring AMD Opteron 6200 and 4200 Series processors which ensure that customers experience power efficiency, performance, scalability and management flexibility via features such as AMD Turbo CORE technology and HyperTransport 3.0 Technology. TYAN offers a total of 13 AMD G34 solutions that support the 16-Core AMD Opteron 6200 Series processors which deliver advanced performance for complex workloads and offer flexible scalability for expanding HPC requirements. TYAN also offers six AMD C32 platforms which are compatible with AMD Opteron 4200 Series processors and target applications ranging from general purpose computing to highly-threaded mission-critical applications such as SMB cloud computing, web servers as well as VM applications and virtual machines.

AMD (NYSE: AMD) today announced that revenue for the third quarter ending Oct. 1, 2011 is expected to increase four to six percent as compared to the second quarter of 2011. The company previously forecasted third quarter 2011 revenue to increase 10 percent, plus or minus two percent, from the second quarter of 2011.

In addition, AMD expects third quarter gross margin to be approximately 44 to 45 percent. The company previously forecasted third quarter 2011 gross margin to be approximately 47 percent.

Eurocom Corporation, a leading developer of long lifespan, fully upgradable notebooks, high performance mobile workstations and mobile servers is adding new high performance Intel Core i7 Processors to its line of High Performance Notebooks.

"Eurocom is always striving to offer the best available technology, and in our mind the second generation Intel Core i7 Mobile Processors will greatly improve our Business and Gaming Notebooks, through increased efficiency and performance" said Mark Bialic, Eurocom President.

At the International Supercomputing Conference (ISC), Kirk Skaugen, Intel Corporation vice president and general manager of the Data Center Group, outlined the company's vision to achieve ExaFLOP/s performance by the end of this decade. An ExaFLOP/s is quintillion computer operations per second, hundreds times more than today's fastest supercomputers.

Reaching exascale levels of performance in the future will not only require the combined efforts of industry and governments, but also approaches being pioneered by the Intel Many Integrated Core (Intel MIC) Architecture, according to Skaugen. Managing the explosive growth in the amount of data shared across the Internet, finding solutions to climate change, managing the growing costs of accessing resources such as oil and gas, and a multitude of other challenges require increased amounts of computing resources that only increasingly high-performing supercomputers can address.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

The RamSan-70 "Gorilla" is a high-performance, half-length PCIe card with 900 GB of usable SLC Flash capacity. Delivering 330K IOPS and 2 GB/s of bandwidth, it offers higher performance and greater capacity than any other half-length SLC Flash PCIe card.

Texas Memory Systems, Inc. (TMS), maker of The World's Fastest Storage, introduces the new high-performance RamSan-70, a 900-GB half-length PCIe card featuring Toshiba's newest 32nm SLC Flash. The RamSan-70 carries on Texas Memory Systems' tradition of delivering a complete integrated RamSan storage solution on a single board.

Intel Corporation today announced a significant breakthrough in the evolution of the transistor, the microscopic building block of modern electronics. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional structure will be put into high-volume manufacturing. Intel will introduce a revolutionary 3-D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer (nm) node in an Intel chip codenamed "Ivy Bridge." A nanometer is one-billionth of a meter.

The three-dimensional Tri-Gate transistors represent a fundamental departure from the two-dimensional planar transistor structure that has powered not only all computers, mobile phones and consumer electronics to-date, but also the electronic controls within cars, spacecraft, household appliances, medical devices and virtually thousands of other everyday devices for decades.

The GS-AH6G3N embeds the new LGA1155 Intel platform for mobile products, with the most powerful and efficient processor and chipset for a reliable and durable business notebook. Designed for professional end users, our product includes all the most important features required by a utilization in a business environment. The GS-AH6G3N is therefore a very versatile business notebook, with the highest standard of performance and quality from GIGABYTE. It is nevertheless a stylish product, with an excellent design and ultra-thin profile, as well as a very light weight and a large power autonomy for the smoothest mobility. With its high value features, the GS-AH6G3N has everything to be the best work tool for your daily business life.

The GS-AH6G3N offers all the important features that e good business notebook should have. Probably the most critical feature, the GS-AH6G3N has a power autonomy of about 7 hours, which can be extended to 10 hours with a second battery docked in the swappable ODD bay (this bay can also dock a second HDD).

Intel Corporation today announced that the Intel Atom platform, formerly codenamed "Oak Trail," is now available and will be in devices starting in May and throughout 2011. Over 35 innovative tablet and hybrid designs from companies including Evolve III, Fujitsu Limited, Lenovo, Motion Computing, Razer, and Viliv are based on "Oak Trail" and running a variety of operating systems.

In addition, at the Intel Developer Forum in Beijing, the company will give a sneak peak of its next-generation, 32nm Intel Atom platform, currently codenamed "Cedar Trail." This solution will help to enable a new wave of fanless, cool and quiet, sleek and innovative netbooks, entry-level desktops and all-in-one designs.

Internationally renowned mainboard and graphics card manufacturer MSI officially announced its AMD AM3 mainboards and the corresponding BIOS versions with full compatibility with all AMD AM3+ multi-core processors. By upgrading the BIOS with a few simple steps, users can enjoy the powerful performance of AMD AM3+ multi-core processors without extra expenses. The brand new AMD AM3+ multi-core processors have more cores and larger L3 cache memory capacity. Also, the built-in 2nd generation Turbo Core technology also boosts the performance of the new AMD AM3+ multi-core processors. Along with the latest 32nm process which significantly enhances the electrical specifications, AMD AM3+ multi-core processors will absolutely be the next-generation indicator of performance.

In addition to upgrading all BIOS on the existing AM3 mainboards supporting AMD AM3+ multi-core processors before shipping to correspond to the upcoming AMD AM3+ processors, MSI will post the BIOS of corresponding mainboards with support for the new AMD AM3+ processors for consumers to upgrade their MSI AM3 mainboards in order to meet their demands for system upgrade and experiencing the powerful performance of the next-generation AMD processors.

Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND, its next-generation 24-nanometer (nm) NAND flash product family. The SmartNAND series integrates leading-edge 24nm process NAND flash technology with a control chip that supports error correction code (ECC) and is available in densities ranging from 4 to 64 gigabyte (GB).

The new series is expressly designed to remove the burden of ECC from the host processor, while minimizing protocol changes. SmartNAND simplifies the host-side design and application of advanced NAND technology in a range of applications including portable media players, tablet PCs, digital TVs, set-top-boxes, and other devices that require high-density, non-volatile memory.

AMD (NYSE: AMD) announced that it amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. The primary purpose of the amendment was to revise the pricing methodology applicable to wafers delivered in 2011 for AMD's microprocessor and accelerated processing unit (APU) products. The amendment also modified AMD's existing commitments regarding future increases in production of certain graphics processing unit (GPU) and chipset products at GLOBALFOUNDRIES.

Under the amended agreement, GLOBALFOUNDRIES has committed to provide AMD with, and AMD has committed to purchase, a fixed number of 45nm and 32nm wafers per quarter in 2011. AMD will pay GLOBALFOUNDRIES fixed prices for 45nm wafers delivered in 2011. AMD's price for 32nm products will be based on good die.

GIGABYTE INC., a leading manufacturer of motherboards and graphics cards today announced a new line of 16 "Black Socket" motherboards previously unveiled at CeBIT 2011 that offer support for AMD's next generation , 32nm AM3+ CPUs and are based on current generation AMD 800/700 series chipset-based motherboards.

Wanting to ensure users their motherboard is able to take advantage of all the performance enhancements that AMD's upcoming AM3+ CPUs have to offer, GIGABYTE has equipped their entire line of AM3+ CPU ready motherboards with a new black colored socket, making it easy to spot for AM3+ support. In addition, GIGABYTE "Black Socket" series offer full backwards compatibility with AMD's current generation AM3 socket CPUs, allowing for painless migration to the AM3+ CPUs when they become available. To learn more about the GIGBYTE AM3+ ready "Black Socket" motherboards, please visit this page.

Eurocom Corporation announces support for Intel's new high performance i7-990X Extreme Edition Processor inside the EUROCOM Panther 2.0 performance notebook. The addition of the Intel Core i7-990X to the long list of processor options gives Eurocom customers even greater choice when customizing their unique systems.

The Intel Core i7-990X comes unlocked and runs at 3.46GHz, with a 3.73GHz Turbo Boost. "The i7-990X gives our clients a super powerful, unlocked processor that is built for unmatched performance" said Mark Bialic, President of Eurocom "Customers can now match the Intel i7-990X extreme processor with AMD Radeon HD6970M or NVIDIA GTX 485M video cards in single or dual configuration for a super computer experience inside a notebook form factor."

With more than one million computers selling each day, Intel Corporation introduced its game-changing 2nd Generation Intel Core processor family today. Intel highlighted several surprising new features, services and partnerships that combine to deliver an entirely new visual experience with processor graphics built in. More than 500 desktop and laptop PCs are expected from all major OEMs worldwide throughout the next year.

New features include Intel Insider, Intel Quick Sync Video, and a new version of the company's award-winning Intel Wireless Display (WiDi), which now adds 1080p HD and content protection for those wishing to beam premium HD content from their laptop screen to their TV. The company also revealed arrangements with CinemaNow, Dixons Retail plc, Hungama Digital Media Entertainment, Image Entertainment, Sonic Solutions, and Warner Bros. Digital Distribution.

Intel Corporation announced today that the company will invest between $6 billion and $8 billion on future generations of manufacturing technology in its American facilities. The action will fund deployment of Intel's next-generation 22- nanometer (nm) manufacturing process across several existing U.S. factories, along with construction of a new development fabrication plant (commonly called a "fab") in Oregon. The projects will support 6,000 to 8,000 construction jobs and result in 800 to 1,000 new permanent high-tech jobs.

"Today's announcement reflects the next tranche of the continued advancement of Moore's Law and a further commitment to invest in the future of Intel and America," said Intel President and CEO Paul Otellini. "The most immediate impact of our multi-billion-dollar investment will be the thousands of jobs associated with building a new fab and upgrading four others, and the high-wage, high-tech manufacturing jobs that follow."