xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers
xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry's first in-module active thermal management solution to high-performance optical transceivers.
Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers—a critical yet underserved category in next-gen AI infrastructure.
Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers—a critical yet underserved category in next-gen AI infrastructure.