xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry's first in-module active thermal management solution to high-performance optical transceivers.

Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6T optical transceivers—a critical yet underserved category in next-gen AI infrastructure.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

Ayar Labs, a leader in silicon photonics for chip-to-chip connectivity, will showcase its in-package optical I/O solution integrated with Intel's industry-leading Agilex Field-Programmable Gate Array (FPGA) technology. In demonstrating 5x current industry bandwidth at 5x lower power and 20x lower latency, the optical FPGA - packaged in a common PCIe card form factor - has the potential to transform the high performance computing (HPC) landscape for data-intensive workloads such as generative artificial intelligence (AI), machine learning, and support novel new disaggregated compute and memory architectures and more.

"We're on the cusp of a new era in high performance computing as optical I/O becomes a 'must have' building block for meeting the exponentially growing, data-intensive demands of emerging technologies like generative AI," said Charles Wuischpard, CEO of Ayar Labs. "Showcasing the integration of Ayar Labs' silicon photonics and Intel's cutting-edge FPGA technology at Supercomputing is a concrete demonstration that optical I/O has the maturity and manufacturability needed to meet these critical demands."

Today, IBM introduced the new IBM Storage Scale System 6000, a cloud-scale global data platform designed to meet today's data intensive and AI workload demands, and the latest offering in the IBM Storage for Data and AI portfolio.

For the seventh consecutive year and counting, IBM is a 2022 Gartner Magic Quadrant for Distributed File Systems and Object Storage Leader, recognized for its vision and execution. The new IBM Storage Scale System 6000 seeks to build on IBM's leadership position with an enhanced high performance parallel file system designed for data intensive use-cases. It provides up to 7M IOPs and up to 256 GB/s throughput for read only workloads per system in a 4U (four rack units) footprint.

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that its VectorPath accelerator card featuring a Speedster 7t FPGA has been certified by PCI-SIG for PCIe Gen 5 and is the first and only FPGA accelerated CEM add-in card certified for PCIe Gen 5 x16 at 32 gigatransfers per second (GT/s) on the PCI-SIG Integrator's list. VectorPath S7t-VG6 accelerator cards are designed to reduce time to market when developing high-performance compute and acceleration functions for AI, ML, networking and data center applications and are shipping today.

"Achronix continues to drive acceleration in the high-performance FPGA add-in card market," said Craig Petrie, Vice President at BittWare. "Achieving PCI-SIG Gen 5 certification is an important milestone. Our customers can be assured of the highest PCIe bandwidths and have confidence that VectorPath cards will interoperate with Gen 5 servers."

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that their VectorPath accelerator card featuring the Speedster 7t FPGA has been certified by PCI-SIG and added to the CEM Add-In card integrators list supporting PCIe Gen4 x16. The VectorPath S7t-VG6 accelerator card is designed to reduce time to market when developing high-performance compute and acceleration functions for AI, ML, networking and data center applications. The VectorPath accelerator cards are available and shipping today for new orders.

"Achronix is an important, strategic partner for BittWare. The Speedster7t FPGA has an innovative architecture that provides significant differentiation in the high-performance FPGA market segment," said Craig Petrie, VP of sales and marketing at BittWare. "Designers can now use the VectorPath accelerator card in PCIe Gen4-based system with the confidence of PCI-SIG certification."

BittWare, a Molex company, a leading supplier of enterprise-class accelerators for edge and cloud-computing applications, today introduced new card and server-level solutions featuring Intel Agilex FPGAs. The new BittWare IA-860m helps customers alleviate memory-bound application workloads by leveraging up to 32 GB of HBM2E in-package memory and 16-lanes of PCIe 5.0 (with CXL upgrade option). BittWare also added new Intel Agilex I-Series FPGA-based products with the introduction of the IA-440i and IA-640i accelerators, which support high-performance interfaces, including 400G Ethernet and PCIe 5.0 (CXL option). These newest models complement BittWare's existing lineup of Intel Agilex F-Series products to comprise one of the broadest portfolios of Intel Agilex FPGA-based offerings on the market. This announcement reinforces BittWare's commitment to addressing ever-increasing demands of high-performance compute, storage, network and sensor processing applications.

"BittWare is excited to apply Intel's advanced technology to solve increasingly difficult application problems, quickly and at low risk," said Craig Petrie, vice president, Sales and Marketing of BittWare. "Our longstanding collaboration with Intel, expertise with the latest development tools, including OneAPI, as well as alignment with Molex's global supply chain and manufacturing capabilities enable BittWare to reduce development time by 12-to-18 months while ensuring smooth transitions from proof-of-concept to volume product deployment."

ADVA today announced that CSC - IT Center for Science, which operates the Finnish University and Research Network (FUNET) and the Swedish University Computer Network (SUNET), have conducted a world-first trial carrying data at 400Gbit/s over more than 10,000 km. Using both FUNET and SUNET, the demo harnessed the ADVA FSP 3000 TeraFlex CoreChannel to transmit services at unprecedented line speeds for a live ultra-long-haul network. The trial shows how data-intensive applications can be connected over inter-continental distances using existing links. This offers significant benefits to FUNET and SUNET customers in the R&E community who will be able to leverage high-throughput technologies and collaborate by sharing huge data sets over longer distances than ever before.

"Our multi-domain field trial with the ADVA FSP 3000 TeraFlex CoreChannel terminal evaluated flexibility and the terminal's capabilities to adapt to use cases where ultra-long-haul 400GbE services are needed. The results that were achieved - trans-oceanic reach over terrestrial systems - were far beyond our expectations and typical real-life service requirements," said Jani Myyry, senior network specialist at FUNET. "Nordic research and education networks are shifting towards a federated next-generation model where optical spectrum resources are shared within the region. We have already built multiple programmable cross-border interconnection links between the FUNET and SUNET ADVA open line systems to exchange spectrum transparently. The trial utilized these interconnection links and the FUNET and SUNET network footprint to create the extremely transparent optical routes used during the tests."

NVIDIA today announced the NVIDIA BlueField -3 DPU, its next-generation data processing unit, to deliver the most powerful software-defined networking, storage and cybersecurity acceleration capabilities available for data centers.

The first DPU built for AI and accelerated computing, BlueField-3 lets every enterprise deliver applications at any scale with industry-leading performance and data center security. It is optimized for multi-tenant, cloud-native environments, offering software-defined, hardware-accelerated networking, storage, security and management services at data-center scale.

NVIDIA today introduced the next generation of NVIDIA Mellanox 400G InfiniBand, giving AI developers and scientific researchers the fastest networking performance available to take on the world's most challenging problems.

As computing requirements continue to grow exponentially in areas such as drug discovery, climate research and genomics, NVIDIA Mellanox 400G InfiniBand is accelerating this work through a dramatic leap in performance offered on the world's only fully offloadable, in-network computing platform. The seventh generation of Mellanox InfiniBand provides ultra-low latency and doubles data throughput with NDR 400 Gb/s and adds new NVIDIA In-Network Computing engines to provide additional acceleration.

The 25 Gigabit Ethernet Consortium, originally established to develop 25, 50 and 100 Gbps Ethernet specifications, announced today it has changed its name to the Ethernet Technology Consortium in order to reflect a new focus on higher-speed Ethernet technologies.

The goal of the consortium is to enhance the Ethernet specification to operate at new speeds by utilizing specifications that are developed or in development. This allows the organization to work alongside other industry groups and standards bodies to adapt Ethernet at a pace that aligns with the rapidly evolving needs of the industry. The ETC has more than 45 members with top-level promoter members that include Arista, Broadcom, Cisco, Dell, Google, Mellanox and Microsoft.

Xilinx, Inc. today announced Versal Premium, the third series in the Versal ACAP portfolio. The Versal Premium series features highly integrated, networked and power-optimized cores and the industry's highest bandwidth and compute density on an adaptable platform. Versal Premium is designed for the highest bandwidth networks operating in thermally and spatially constrained environments, as well as for cloud providers who need scalable, adaptable application acceleration.

Versal is the industry's first adaptive compute acceleration platform (ACAP), a revolutionary new category of heterogeneous compute devices with capabilities that far exceed those of conventional silicon architectures. Developed on TSMC's 7-nanometer process technology, Versal Premium combines software programmability with dynamically configurable hardware acceleration and pre-engineered connectivity and security features to enable a faster time-to-market. The Versal Premium series delivers up to 3X higher throughput compared to current generation FPGAs, with built-in Ethernet, Interlaken, and cryptographic engines that enable fast and secure networks. The series doubles the compute density of currently deployed mainstream FPGAs and provides the adaptability to keep pace with increasingly diverse and evolving cloud and networking workloads.

Marvell, a leader in storage, networking and connectivity semiconductor solutions, today announced the launch of the 88X7120, the latest offering in its Alaska C family of high-speed Ethernet physical layer (PHY) transceivers, designed to improve bandwidth and performance in the data center. The new transceiver is purpose-built to address the transition in hyperscale data centers from 25GbE (Gigabit Ethernet) and 100GbE to 50GbE, 200GbE and 400GbE as new applications like artificial intelligence and machine learning continue to drive exponential processing and I/O bandwidth demands. The 88X7120 addresses this I/O speed transition in hyperscale data centers with support of 16 ports of 50GbE, 4 ports of 200GbE and 2 ports of 400GbE, utilizing 50G PAM4 signaling.

Marvell provides a wide variety of products for data center applications and PHYs are a critical element in Marvell's strategy, as they form the backbone of high-speed data center interconnects. The new transceivers add to the Marvell portfolio of switches and other differentiated products targeted at the data center market, including scaling interconnect speeds to match the I/O throughput requirements in a cost-effective and power-efficient manner.

The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today commended the IEEE 802.3 Ethernet Working Group on the approval of IEEE 802.3bs, Standard for Ethernet Amendment: Media Access Control Parameters, Physical Layers, and Management Parameters for 200 gigabit per second (Gb/s) and 400 Gb/s Operation. The specification of 200 gigabit Ethernet (200GbE) and 400 gigabit Ethernet (400GbE) operation across various interconnects will help satisfy mounting bandwidth demands from cloud-scale data centers, internet exchanges, co-location services, service provider networks, and other bandwidth intensive application spaces, while delivering better economies of scale and lower cost-per-port performance.

"IEEE 802.3bs represents a transformational moment in the move to next generation of networks. The delivery of 200G and 400G is arriving just in time to meet growing needs for reliable, high-speed connectivity from a diverse array of applications and markets," said John D'Ambrosia, chairman, Ethernet Alliance; and senior principal engineer, Huawei. "The exceptional effort resulting in the completion of this standard is only the start of the industry's investment in the networks of tomorrow. We've laid a firm foundation for 200G and 400G with our early interoperability demonstrations and plugfests, but it's time to kick things into high gear. The real work of testing and verifying multivendor interoperability begins now, and the Ethernet Alliance is ready. We look forward to building on past successes, and helping accelerate 200G and 400G Ethernet's rollout and adoption."

IEEE, the world's largest professional organization advancing technology for humanity, today announced the launch of an IEEE 802.3 "Standard for Ethernet" study group to explore development of a 400 Gb/s Ethernet standard to efficiently support ever-increasing, exponential network bandwidth growth.

"Traffic is growing everywhere-more Internet users, more ways to access the Internet more quickly, higher-bandwidth content, new applications enabled, etc.-and it's critical that we move now to create a plan for the Ethernet ecosystem to evolve beyond today's capabilities, in order to accommodate the burgeoning bandwidth tsunami," said John D'Ambrosia, chair of the new IEEE 802.3 400 Gb/s Ethernet Study Group and chief Ethernet evangelist, CTO office, Dell. "The launch of this study group is the next critical step in evolving the IEEE 802.3 standard to stay ahead of industry's needs. It builds on two years of open efforts around inviting Ethernet's vast array of stakeholders into the work of assessing and tackling the market's emerging application requirements."