ADLINK Technology Inc., a global leader in edge computing solutions, has unveiled brand-new series of expandable DLAP Edge AI platforms, including 3 products—DLAP-5200, DLAP-4100, and DLAP-8100—each engineered to meet the evolving demands of edge computing, AI inference, and industrial automation. These platforms feature latest Intel Core processors for powerful computing performance, and support dedicated GPU acceleration through MXM or PEG (PCIe Graphics) slots to unlock advanced AI capabilities.

The expandable DLAP Edge AI platforms feature comprehensive I/O including USB 3.2 Gen 2, 2.5GbE Ethernet, HDMI, DisplayPort, serial and digital I/O, along with PCIe Gen 4/Gen 5 slots, M.2 expansions, and SATA SSD trays for versatile integration and expansion. Certified GPU support delivers up to 91.1 TFLOPS AI performance using NVIDIA RTX 6000 ADA GPUs. The platforms' rugged, fanless design ensures reliable operation from -20°C to +60°C, with anti-shock, vibration resistance, and corrosion-resistant stainless steel, ideal for harsh environments like oil & gas, industrial automation, and healthcare.

ADLINK Technology Inc., a global leader in edge computing, proudly announces that its newly released EMP-520 Series industrial compact box PC has been recognized for its excellence, securing the Best-in-Show award in the Computer Boards, Systems, Components & Peripherals category at embedded world 2025. It was selected for its innovative design, user-centric features, and exceptional performance in industrial environments.

Smart, Reliable, and Efficient Industrial Computing Solution
Designed to meet the needs of modern industrial applications, the EMP-520 Series delivers high computing performance with minimal maintenance, helping businesses maximize productivity and reduce downtime. Powered by Intel 14th Gen Core processors, it ensures energy-efficient operation, making it ideal for high-demand environments that require continuous, reliable computing. Supporting four simultaneous 4K video outputs and EDID emulation, users can achieve seamless visual performance. The compact design enables easy integration into space-constrained environments while ensuring reliable operation in mission-critical applications.

ADLINK Technology Inc., a global leader in edge computing, unveiled its new "DLAP Supreme Series", an edge generative AI platform. By integrating Phison's innovative aiDAPTIV+ AI solution, this series overcomes memory limitations in edge generative AI applications, significantly enhancing AI computing capabilities on edge devices. Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment and accelerating the adoption of generative AI across various industries, especially in edge computing.

Lower AI Computing Costs and Significantly Improved Performance
As generative AI continues to penetrate various industries, many edge devices encounter performance bottlenecks due to insufficient DRAM capacity when executing large language models, affecting model operations and even causing issues such as inadequate token length. The DLAP Supreme series, leveraging aiDAPTIV+ technology, effectively overcomes these limitations and significantly enhances computing performance. Additionally, it supports edge devices in conducting generative language model training, enabling them with AI model training capabilities and improving their autonomous learning and adaptability.

ADLINK Technology Inc., a global leader in edge computing, has introduced the all-new Mini PC EMP-100. The smallest of its kind of the series (just 13 x 10.7 x 2.8 cm), this fanless PC and Dual 4K Media Player is robust and extremely versatile. It includes an Intel Celeron N6210/J6412 processor; IoT connectivity (Single GbE LAN and Optional Wi-Fi 6/BT 5.2 module); an M.2 2280 Key M for optional storage and Key E for optional Wi-Fi/BT modules; and two HDMI output ports. This combination plus adaptable function expansion makes it truly multipurpose.

Exceptional Media player
The EMP-100 Series was developed to support sophisticated digital signage with Dual 4K UHD display for clear and vibrant content; interactive kiosks; and the development of IoT and AI applications in the smart retail sector - enhancing the customer experience and boosting commercial engagement. The fanless design can be operated continuously in a broad range of temperatures and significantly reduces maintenance.

ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new AmITX Mini-ITX motherboards, a range of compact form factor motherboards sporting the latest Intel technology for high-performance computing. The new AmITX series supports processor options ranging from low power consumption Intel N97 to high-performance 14/13/12th generation Intel Core i9/i7/i5/i3 and includes features such as PCIe 5.0 x16, 2.5 Gbe, DDR5, USB 3.2 Gen 2, and M.2 B/E/M Key to suit applications in smart city, smart manufacturing, and smart medicine.

The Mini-ITX motherboards in the AmITX series boast 2.5GbE LAN for ultra-fast data connectivity, USB 3.2 Gen 2 to connect with other devices, M.2 B/E/M Key slots for SSD, and wireless cards, and RS-232/422/485 to connect with machine components. The high-performance computing AmITX-RL-I supports 14/13/12th Gen Intel Core i9/i7/i5/i3 processors up to 65 W TDP, up to 64 GB of DDR5 4800 MHz memory, and has a PCIe 5.0 x16 slot for a GPU card. The low power consumption AmITX-ALN has an Intel N97 processor with 12 W ultra-low power, supports up to 32 GB of DDR4 3200 MHz memory, and has a PCIe 3.0 x1 slot.

ADLINK Technology Inc., a global leader in edge computing and a renowned supplier of industrial PCs and motherboards, is proud to announce the launch of the new SBC35 Series of 3.5" Single Board Computers (SBC). This innovative series introduces a range of motherboards specifically engineered to maximize efficiency in compact spaces. The SBC35 Series features two models: the high-performance SBC35-RPL, powered by the 13th Gen Intel Core processors, and the energy-optimized SBC35-ALN, equipped with the Intel N97 processor. Additionally, the series boasts an expansive range of I/O modules and SBC-FM Adaptive Function Modules (AFM) that significantly enhance system capabilities. These advancements make the SBC35 Series exceptionally suitable for a wide array of applications in automation, transportation, medical fields, and smart city projects, including Autonomous Mobile Robots (AMRs), Electric Vehicle (EV) charging stations, and self-service kiosks.

The SBC35 Series showcases two compact models in a 146x102mm 3.5" SBC form factor, each designed to maximize space and functionality in demanding settings. While the high-performance SBC35-RPL supports up to 64 GB DDR5 4800 MHz RAM and four independent displays, the efficiency-optimized SBC35-ALN accommodates up to 16 GB DDR5 4800 MHz RAM and three independent displays. Both units are equipped with an extensive array of connectivity options, including four USB ports and versatile M.2 slots (2280 M Key, 2230 E Key, 3042 B Key), supplemented by dual RS-232/422/485, and additional dual RS-232 ports, audio, and digital I/O capabilities. Optional TPM 2.0 further enhances security, making these models highly adaptable for a broad range of industrial applications. Their comprehensive I/O and expansion options ensure that they can be customized to meet specific project requirements, providing exceptional versatility and scalability.

ADLINK Technology Inc., a global leader in edge computing, and a global supplier of industrial PCs and motherboards, announces the launch of the new IMB-C Value Series of ATX motherboards, extending the IMB series motherboard range with new, more affordable, options for users seeking high-performance at a lower price point. The IMB-C value series comes with processor options ranging from Gen 10 to Gen 14 Intel Core i9/i7/i5/i3 and includes features such as 2.5 Gbe, PCIe 4.0, DDR4, and USB 3.0, to suit applications in warehousing, industrial automation, smart manufacturing, and new energy.

The IMB-C series expands the IMB ATX motherboard range, providing a cost-effective alternative to the high-performance IMB-M series. Tailored for budget-sensitive projects without sacrificing essential features, the IMB-C models support DDR4 and PCIe 4.0, catering to applications that require solid performance with cost efficiency. Conversely, the IMB-M series is designed for top-tier performance, supporting DDR5 and PCIe 5.0, ideal for cutting-edge industrial use. The IMB-C series offers a comprehensive portfolio from Intel's 10th to 14th gen processors. Specifically, the IMB-C46 and IMB-C46H models come equipped with the Q470 and H420E chipsets respectively, optimized for 10th Gen Intel Core processors. Meanwhile, the IMB-M47 with the Q670 chipset, and the IMB-M47H with the H610 chipset, both support the 12th to 14th gen Intel Core processors, aligning with advanced system requirements and higher performance expectations.

The industrial grade A380E graphics card features an exceptional cost/performance ratio, high reliability and low power consumption (50 W). As with all ADLINK industrial products, it delivers on longevity with availability guaranteed for a minimum of five years. In addition, the A380E graphics card is slim and compact with a single slot design, measuring only 69 mm x 156 mm.

Flexible application
Although the core market is likely to be commercial gaming, the A380E graphics card is also suited to industrial Edge AI applications such as Industrial IoT and retail analytics. Video wall graphics and media processing and delivery are examples of the many other potential uses.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Phison Electronics, a global leader in NAND flash and storage solutions, announces a technology demonstration of unique customer-based solutions fully realized through the IMAGIN+ customization service at Flash Memory Summit 2023.

Phison has expanded its IMAGIN+ design service to include AI computational models and AI services solutions. Customers work with specialized Phison teams to design and engineer custom flash deployments that precisely address the data performance and endurance requirements of next generation products including those highly optimized for aiDAPTIV AI+ML workloads. With IMAGIN+ design services, Phison teams work hand-in-hand with customers to deliver AI-boosted SSD solutions that address demanding requirements.

ADLINK Technology Inc., a global leader in edge computing, and a Titanium member of the Intel Partner Alliance, is proud to announce the launch of its latest MVP Series fanless modular computers—the MVP-5200 Compact Modular Industrial Computers and MVP-6200 Expandable Modular Industrial Computers—powered by 12/13th Gen Intel Core i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65 W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.

The MVP-5200/MVP-6200 series though expandable remains compact with support for up to 4 PCI/PCIe slots that allow for performance acceleration through GPUs, accelerators, and other expansion cards. Comprehensive modularized options and the ease of configuration can effectively reduce lead times for customers' diverse requirements. In addition, ADLINK also offers a broad range of pre-validated expansion cards, such as GPU, motion, vision, and I/O embedded cards, all can be easily deployed for your industrial applications.

ADLINK Technology Inc., a global leader in edge computing, today launched Pocket AI - the first ever ultra-portable GPU accelerator to offer exceptional power at a cost-effective price point. With hardware and software compatibility, Pocket AI is the perfect tool to boost performance and productivity. It provides plug-and-play scalability from development to deployment for AI developers, professional graphics users and embedded industrial applications.

Pocket AI is a simple, reliable route to impressive GPU acceleration at a fraction of the cost of a laptop with equivalent GPU power. Its many benefits include a perfect power/performance balance from the NVIDIA RTX A500 GPU; high functionality driven by NVIDIA CUDA X and accelerated libraries; quick, easy delivery/power via Thunderbolt 3 interface and USB PD; and compatibility supported by NVIDIA developer tools. For the ultimate portability, the Pocket AI is compact and lightweight - est. 106 x 72 x 25 mm and 250 grams.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

After GUNNIR showed the same product back in January, ADLINK is now offering both Intel Arc A-series GPUs in MXM form factor. The MXM (Mobile PCI Express Module) is a standardized form factor that is used mostly in laptops and some small form factor PCs. Product pages confirm that ADLINK offers both the Intel Arc A370M and the Intel Arc A350M in MXM form factor.

According to specifications The ADLINK MXM-AXe, as the product is called, is MXM 3.1 Type A based on Intel Arc GPU, packing 8 Xe-cores, 128 Execution Units, 4 GB of GDDR6 memory, and TDP of 35-50 W, which is pretty much standard for the Arc A370M GPU. The company also offers the same product with A350M GPU with TDP of 25-35 W. With decent power efficiency, full AV1 hardware encoding, and support for up to four 4K displays, such a GPU would be perfect for small form factor machines, and could be even a decent upgrade for some laptops.

ADLINK Technology, Inc., a leading provider of trusted embedded computing products, announces availability of the cPCI-6520, a 6U single-slot CompactPCI (cPCI) processor blade designed for mission critical applications such as robust computer makers, intelligent system integrators and military sectors. With its 22 nm 3rd generation quad- and dual-core Intel Core i7 and Mobile Intel QM77 Express Chipset with dual channel DDR3-1333/1600 ECC memory up to 16 GB capacity, the cPCI-6520 delivers tremendous computing power, massive I/O and memory capacity, and flexible connectivity for robust computing applications requiring server class performance.

The cPCI-6520 is a performance computing solution with enhanced management features such as PICMG 2.9 compliant IPMI, remote management based on Intel vPro(TM) technology and optional Trusted Platform Module (TPM) for security management. Wide temperature range support is available up to -40°C to 85°C (operating).

ADLINK Technology, Inc., a leading global provider of trusted I/O platforms, announces the release of its new Matrix MXE-1300 series of low-power fanless computers based on the Intel Atom D2550 processor. Equipped with the Intel Atom D2550 processor, the MXE-1300 increases processing power by 44% and graphics performance by 90% over the previous Intel Atom platform.

Featuring low power consumption, rich I/O capability, and large storage with 3.5" HDD support, the MXE-1300 series not only leads the market with its fanless, cable-free, and robust mechanical design in a compact form factor, but also makes an ideal application-oriented platform for digital surveillance, intelligent transportation, and factory automation applications.

ADLINK Technology, Inc., a leading provider of trusted telecom computing products, today announced availability of the aTCA-6200, a next-generation AdvancedTCA (ATCA) processor blade that demonstrates ADLINK's leadership in the development of high performance compute blades with flexible expansion capabilities.

The aTCA-6200 features two 1.8 GHz eight-core Intel Xeon processors E5-2648L, the Intel C604 chipset, DDR3-1600 memory up to 128 GB, and a PICMG mid-size AMC bay. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, CFast socket, and quad SAS channels, which provide leading-edge network performance and storage capabilities. The aTCA-6200 is ideal for carrier-grade applications such as media servers in IPTV, IP Multimedia Subsystem (IMS) broadband networks, and wireless infrastructures, providing telecom equipment manufacturers (TEMs) and network equipment providers (NEPs) with a flexible, cost-effective solution for mission-critical applications and a reliable, smooth path for scalability and expansion.

ADLINK Technology, Inc., a leading global provider of trusted I/O platforms, announces the release of the new Matrix MXE-5300 series of rugged, quad core, fanless computers, based on the high performance 2nd Generation Intel Core i7/i5/i3 processor and QM67 chipset. The MXE-5300 is the ultimate Matrix fanless embedded computer, featuring top-of-the-line processor performance, outstanding wireless optimization capability, robust mechanical design, and Intel AMT 7.0 support. The MXE-5300's combined features make it an ideal choice for intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.