Bitspower, KRAMBU, and XFX have joined forces to bring advanced liquid-cooling solutions to AMD's cutting-edge RDNA 4.0 architecture. As AI workloads demand ever-increasing processing power, efficient thermal management is crucial to unlocking peak performance and long-term reliability. By integrating Bitspower's industry-leading cooling technology with KRAMBU's expertise in high-performance computing and XFX's GPU innovation, this partnership delivers a powerful, scalable solution for data centers and enterprise applications.

Designed for maximum efficiency, these liquid-cooled servers support up to 20 GPUs per system, significantly increasing computing density and accelerating AI, machine learning, and data analytics workloads. At the heart of these systems is AMD's Radeon RX 9070 XT, built on the 5 nm RDNA 4 Navi 48 architecture, which boasts 25% greater transistor density than NVIDIA's Blackwell GPUs—packing 53.9 billion transistors into a die smaller than GB203. By maintaining lower temperatures under heavy workloads, Bitspower's cooling solutions allow these high-density servers to operate at peak performance while reducing thermal throttling and energy consumption.

MSI is excited to introduce its latest lineup of graphics cards powered by the newly launched NVIDIA GeForce RTX 5070 GPU, featuring the VANGUARD, GAMING TRIO, INSPIRE, and VENTUS series. Engineered with cutting-edge graphics technology and refined thermal solutions, these cards are designed to meet the demands of high-performance gaming, AI applications, and content creation. With a focus on efficiency, they deliver outstanding power while maintaining low temperatures and quiet operation, ensuring an excellent user experience.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs revolutionize gaming and creativity with unprecedented AI horsepower. Unlock next-level performance and graphics fidelity with NVIDIA DLSS 4, generate images at record-breaking speeds, and unleash creative potential with NVIDIA Studio.

Apple today announced the new MacBook Air, featuring the blazing-fast performance of the M4 chip, up to 18 hours of battery life, a new 12MP Center Stage camera, and a lower starting price. It also offers support for up to two external displays in addition to the built-in display, 16 GB of starting unified memory, and the incredible capabilities of macOS Sequoia with Apple Intelligence—all packed into its strikingly thin and light design that's built to last. The new MacBook Air now comes in an all-new color—sky blue, a metallic light blue that joins midnight, starlight, and silver—giving MacBook Air its most beautiful array of colors ever. It also now starts at just $999—$100 less than before—and $899 for education, making it an incredible value for students, business professionals, or anyone looking for a phenomenal combination of world-class performance, portability, design, and durability. With two sizes to choose from, the new 13- and 15-inch MacBook Air are available to pre-order today, with availability beginning Wednesday, March 12.

"MacBook Air is by far the world's most popular laptop, and today we're giving everyone even more reasons to love it, including a big boost in performance with the M4 chip, a new Center Stage camera, and a beautiful new sky blue color," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Combined with its thin and light, fanless design, all-day battery life, and the incredible capabilities of macOS Sequoia with Apple Intelligence, MacBook Air is unlike any other laptop. And with a new lower starting price of $999, MacBook Air delivers more value to consumers than ever before, making this the perfect moment to upgrade or experience the Mac for the first time."

When the US imposed sanctions on Chinese semiconductor makers, China began the push for sovereign chipmaking tools. According to a study conducted by the Emerging Technology Observatory (ETO), Chinese institutions have dramatically outpaced their US counterparts in next-generation chipmaking research. Between 2018 and 2023, nearly 475,000 scholarly articles on chip design and fabrication were published worldwide. Chinese research groups contributed 34% of the output—compared to just 15% from the United States and 18% from Europe. The study further emphasizes the quality of China's contributions. Focusing on the top 10% of the most-cited articles, Chinese researchers were responsible for 50% of this high-impact work, while American and European research accounted for only 22% and 17%, respectively.

This trend shows China's lead isn't about numbers only, and suggests that its work is resonating strongly within the global academic community. Key research areas include neuromorphic, optoelectric computing, and, of course, lithography tools. China is operating mainly outside the scope of US export restrictions that have, since 2022, shrunk access to advanced chipmaking equipment—precisely, tools necessary for fabricating chips below the 14 nm process node. Although US sanctions were intended to limit China's access to cutting-edge manufacturing technology, the massive body of Chinese research suggests that these measures might eventually prove less effective, with Chinese institutions continuing to push forward with influential, high-citation studies. However, Chinese theoretical work is yet to be proven in the field, as only a single company currently manufactures 7 nm and 5 nm nodes—SMIC. Chinese semiconductor makers still need more advanced lithography solutions to reach high-volume manufacturing on more advanced nodes like 3 nm and 2 nm to create more powerful domestic chips for AI and HPC.

Microsoft is currently testing a completely reimagined version of its Copilot app for Windows 11—a significant departure from the previous web-based model towards a fully native interface. This preview, exclusively available to Windows Insiders, introduces a modern interface that mirrors the design principles of Windows 11, featuring refined elements such as mica blur effects, built-in context menus, and an optimized sidebar for managing chat sessions. Built on Microsoft's native UI framework, the updated app offers faster launch times and smoother interactions while delivering a cohesive visual experience. Although the core functionalities remain unchanged—allowing users to engage in text chats, utilize Copilot Voice, and access saved conversations—the redesign emphasizes enhanced visual appeal and usability.

A dedicated "new chat" button and a well-organized sidebar work together to simplify navigation and encourage more frequent use of AI-driven features. The update also preserves key settings like launching Copilot at startup and activating it via the Alt+Spacebar shortcut. This rollout follows last week's unexpected launch of a native Copilot app for macOS, which was odd given Microsoft's longstanding focus on Windows. With this update, Microsoft appears starts an era of offering a consistent experience across platforms, besides its core Office suite. The preview, identified as version 1.25023.106.0 and available through the Microsoft Store, invites Windows Insiders to test the new design—while a public release is anticipated pending further feedback.

Damo Academy—a research and development wing of Alibaba—launched its debut "server-grade processor" design late last week, in Beijing. According to a South China Morning Post (SCMP) news article, the C930 model is a brand-new addition to the e-commerce platform's XuanTie RISC-V CPU series. Company representatives stated that their latest product is designed as a server-level and high-performance computing (HPC) solution. Going back to March 2024, TechPowerUp and other Western hardware news outlets picked up on Alibaba's teasing of the Xuantie C930 SoC, and a related Xuantie 907 matrix processing unit. Fast-forward to the present day; Damo Academy has disclosed that initial shipments—of finalized C930 units—will be sent out to customers this month.

The newly released open-source RISC-V architecture-based HPC chip is an unknown quantity in terms of technical specifications. Damo Academy reps did not provide any detailed information during last Friday's conference (February 28). SCMP's report noted the R&D division's emphasizing of "its role in advancing RISC-V adoption" within various high-end fields. Apparently, the XuanTie engineering team has: "supported the implementation of more than thirty percent of RISC-V high-performance processors." Upcoming additions will arrive in the form of the C908X for AI acceleration, R908A for automotive processing solutions, and an XL200 model for high-speed interconnection. These XuanTie projects are reportedly still deep in development.

On June 1, 1988, the very first Madden video game was released to the world. Players needed to load up either a Commodore 64/Commodore 128, Apple II, or MS-DOS to launch the game. When they did, they were greeted with 8-bit animations of the NFL's most popular teams and found themselves controlling their favorite players to try and win themselves a Super Bowl. And at that time, it was amazing. Thirty-seven years later and EA SPORTS hasn't stopped advancing Madden and our American Football games.

Most recently, we launched EA SPORTS Madden NFL 25 and College Football 25, which are tentpoles of our beloved American Football Ecosystem. Yet our football games are no longer blocky pixels and four-directional controls. They're among the most realistic sports simulation titles on the planet. We even celebrated the recent Super Bowl weekend with these titles and our very own Madden Bowl, featuring championship games and incredible music all in the heart of New Orleans. This is in no small part due to the incredible teams and their mission to make our games better every single year. And technology plays a critical role in making this happen.

Jio Platforms Limited (JPL), together with AMD, Cisco, and Nokia, announced at Mobile World Congress 2025 plans to form an innovative, new Open Telecom AI Platform. Designed to support today's operators and service providers with real-world, AI-driven solutions, the Telecom AI Platform is set to drive unprecedented efficiency, security, capabilities, and new revenue opportunities for the service provider industry.

End-to-end Network Intelligence
Fueled by the collective expertise of world leaders from across domains including RAN, Routing, AI Data Center, Security and Telecom, the Telecom AI Platform will create a new central intelligence layer for telecom and digital services. This multi-domain intelligence framework will integrate AI and automation into every layer of network operations.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

RayNeo, a leading innovator in consumer Augmented Reality (AR) technology, has unveiled its latest XR glasses, the RayNeo Air 3s, at MWC 2025. Alongside this groundbreaking release, the company showcased its other two innovations: the AI-powered, Full-Color AR Glasses RayNeo X3 Pro and the Camera AI Glasses RayNeo V3. Together, these cutting-edge devices underscore RayNeo's unwavering commitment to redefining immersive experiences and enhancing everyday usability through advanced AR solutions.

RayNeo Air 3s: Lightweight XR for Seamless Daily Use
The RayNeo Air 3s redefines the landscape of lightweight XR glasses, seamlessly merging portability with state-of-the-art display technology. Equipped with 3840 Hz high-frequency dimming, a staggering 200,000:1 contrast ratio, and a 154% sRGB color gamut, the Air 3s delivers breathtaking image quality, setting a new benchmark for birdbath display solutions. Its expansive 201-inch virtual screen and TÜV Rheinland-certified eye comfort technology ensure an immersive yet comfortable experience, making it ideal for all-day wear.

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

This afternoon at Mobile World Congress 2025 (MWC), Newnal Inc. will unveil another global breakthrough in personal blockchain and AI innovation, the Newnal personal AI operating system (OS). Built on a web3 foundation, Newnal's blockchain-based OS can be embedded and accessed via any device. Newnal gives people the power to design, drive and protect the experiences and opportunities they care about the most.

"With Newnal ai, each of us can now create another 'I'," said founder and Chief Creative Officer YT Kim, "The last generation of technology underserved humanity. Web3 ai Newnal gives the power of creativity and experience back to people, allowing each of us to enhance our lives in ways that we could only have imagined in the past. It's AI focused on our hearts."

On February 27-28, the 2025 China RISC-V Ecosystem Conference was grandly held at the Zhongguancun International Innovation Center in Beijing. As a core promoter in the RISC-V field, SOPHGO was invited to deliver a speech and prominently launch a series of new products based on the SG2044 chip, sharing the company's cutting-edge practices in the heterogeneous fusion of AI and RISC-V, and contributing to the vigorous development of the global open-source instruction set ecosystem. During the conference, SOPHGO set up a distinctive exhibition area that attracted many attendees from the industry to stop and watch.

Focusing on AI Integration, Leading Breakthroughs in RISC-V Technology
At the main forum of the conference, the Vice President of SOPHGO RISC-V delivered a speech titled "RISC-V Breakthroughs Driven by AI: Integration + Heterogeneous Innovation," where he elaborated on SOPHGO's innovative achievements in the deep integration of RISC-V architecture and artificial intelligence technology. He pointed out that current AI technological innovations are driving market changes, and the emergence of DeepSeek has ignited a trillion-level computing power market. The innovation of technical paradigms and the penetration of large models into various sectors will lead to an explosive growth in inference demand, resulting in changes in the structure of computing power demand. This will also reshape the landscape of the computing power market, bringing significant business opportunities to domestic computing power enterprises, while RISC-V high-performance computing is entering a fast track of development driven by AI.

Today, at MWC 2025, Lenovo unveiled groundbreaking advancements in hybrid AI with integrated devices and solutions to empower creators, professionals, and enterprises. The new offerings exemplify Lenovo's vision of Smarter AI for all and showcase how end-to-end AI can offer seamless creation, connection, and collaboration. The range of technology launched at MWC—from new device form factors to affordable edge inference—show the maturity and versatility of Lenovo's AI portfolio while linking bold innovation with real-world impact.

"We believe in the power of convergence: bringing together AI models, data, and computing power—running on devices, on the edge, and in the cloud—to build AI solutions for customers," said Lenovo CEO and chairman Yuanqing Yang, who delivered a keynote address at MWC. "This convergence drives stronger ecosystem connectivity, unleashing the power of AI to augment human creativity to turn ideas into reality."

ASUS today announced ExpertCenter PN54, a high-performance Copilot+ mini PC powered by AMD Ryzen AI 300 Series processors and AMD Radeon graphics. ExpertCenter PN54 offers extensive connectivity, including WiFi 7 and Bluetooth 5.4, and is able to support up to four 4K displays. This mini PC enables retailers and business to maintain their competitive edge alike: it's well-equipped to handle data-intensive workloads, AI-enhanced applications, and edge data processing. PN54 boasts more I/O ports than other mini PCs, allowing retailers to connect to multiple devices for field deployment or in limited-space environments.

First Copilot+ mini PC by ASUS built on AMD architecture
At the heart of ExpertCenter PN54 is the latest AMD Ryzen AI 300 Series processor that delivers over 50% more on-chip memory for enhanced performance. Built on the cutting-edge AMD Zen 5 cores previously only available in desktop CPUs, this latest processor features eight cores of processing power and a 5 GHz boost frequency. And with the advanced AMD XDNA 2 NPU Architecture, ExpertCenter PN54 handles AI-powered content creation, code compilation, data analysis, meetings, and other tasks seamlessly.

Yesterday, OpenAI introduced its "strongest" GPT-4.5 model. A research preview build is only available to paying customers—Pro-tier subscribers fork out $200 a month for early access privileges. The non-profit organization's CEO shared an update via social media post; complete with a "necessary" hyping up of version 4.5: "it is the first model that feels like talking to a thoughtful person to me. I have had several moments where I've sat back in my chair and been astonished at getting actual good advice from an AI." There are apparent performance caveats—Sam Altman proceeded to add a short addendum: "this isn't a reasoning model and won't crush benchmarks. It's a different kind of intelligence, and there's a magic to it (that) I haven't felt before. Really excited for people to try it!" OpenAI had plans to make GPT-4.5 available to its audience of "Plus" subscribers, but major hardware shortages have delayed a roll-out to the $20 per month tier.

Altman disclosed his personal disappointment: "bad news: it is a giant, expensive model. We really wanted to launch it to Plus and Pro (customers) at the same time, but we've been growing a lot and are out of GPUs. We will add tens of thousands of GPUs next week, and roll it out to the plus tier then...Hundreds of thousands coming soon, and I'm pretty sure y'all will use every one we can rack up." Insiders believe that OpenAI is finalizing a proprietary AI-crunching solution, but a rumored mass production phase is not expected to kick-off until 2026. In the meantime, Altman & Co. are still reliant on NVIDIA for new shipments of AI GPUs. Despite being a very important customer, OpenAI is reportedly not satisfied about the "slow" flow of Team Green's latest DGX B200 and DGX H200 platforms into server facilities. Several big players are developing in-house designs, in an attempt to ween themselves off prevalent NVIDIA technologies.

Traditional cybersecurity measures are proving insufficient for addressing emerging cyber threats such as malware, ransomware, phishing and data access attacks. Moreover, future quantum computers pose a security risk to today's data through "harvest now, decrypt later" attack strategies. Cybersecurity technology powered by NVIDIA accelerated computing and high-speed networking is transforming the way organizations protect their data, systems and operations. These advanced technologies not only enhance security but also drive operational efficiency, scalability and business growth.

Accelerated AI-Powered Cybersecurity
Modern cybersecurity relies heavily on AI for predictive analytics and automated threat mitigation. NVIDIA GPUs are essential for training and deploying AI models due to their exceptional computational power.

GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) today announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies. The collaboration will be led by MIT's Microsystems Technology Laboratories (MTL) and GF's research and development team, GF Labs.

With an initial research focus on AI and other applications, the first projects are expected to leverage GF's differentiated silicon photonics technology, which monolithically integrates RF SOI, CMOS and optical features on a single chip to realize power efficiencies for datacenters, and GF's 22FDX platform, which delivers ultra-low power consumption for intelligent devices at the edge.

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

During its latest FY2024 earnings call, NVIDIA's CEO Jensen Huang gave a few predictions about future products. The upcoming Blackwell B300 series, codenamed "Blackwell Ultra," is scheduled for release in the second half of 2025. It will feature significant performance enhancements over the B200 series. These GPUs will incorporate eight stacks of 12-Hi HBM3E memory, providing up to 288 GB of onboard memory, paired with the Mellanox Spectrum Ultra X800 Ethernet switch, which offers 512 ports. Earlier rumors suggested that this is a 1,400 W TBP chip, meaing that NVIDIA is packing a lot of compute in there. There is a potential 50% performance increase compared to current-generation products. However, NVIDIA has not officially confirmed these figures, but rough estimates of core count and memory bandwidth increase can make it happen.

Looking beyond Blackwell, NVIDIA is preparing to unveil its next-generation "Rubin" architecture, which promises to deliver what Huang described as a "big, big, huge step up" in AI compute capabilities. The Rubin platform, targeted for 2026, will integrate eight stacks of HBM4(E) memory, "Vera" CPUs, NVLink 6 switches delivering 3600 GB/s bandwidth, CX9 network cards supporting 1600 Gb/s, and X1600 switches—creating a comprehensive ecosystem for advanced AI workloads. More surprisingly, Huang indicated that NVIDIA will discuss post-Rubin developments at the upcoming GPU Technology Conference in March. This could include details on Rubin Ultra, projected for 2027, which may incorporate 12 stacks of HBM4E using 5.5-reticle-size CoWoS interposers and 100 mm × 100 mm TSMC substrates, representing another significant architectural leap forward in the company's accelerating AI infrastructure roadmap. While these may seem distant, NVIDIA is battling supply chain constraints to deliver these GPUs to its customers due to the massive demand for its solutions.

Ahead of Mobile World Congress 2025, Qualcomm Technologies, Inc. and IBM (NYSE: IBM) announced an expanded collaboration to drive enterprise-grade generative artificial intelligence (AI) solutions across edge and cloud devices designed to enable increased immediacy, privacy, reliability, personalization, and reduced cost and energy consumption. Through this collaboration, the companies plan to integrate watsonx.governance for generative AI solutions powered by Qualcomm Technologies' platforms, and enable support for IBM's Granite models through the Qualcomm AI Inference Suite and Qualcomm AI Hub.

"At Qualcomm Technologies, we are excited to join forces with IBM to deliver cutting-edge, enterprise-grade generative AI solutions for devices across the edge and cloud," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "This collaboration enables businesses to deploy AI solutions that are not only fast and personalized but also come with robust governance, monitoring, and decision-making capabilities, with the ability to enhance the overall reliability of AI from edge to cloud."

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

Arm's new Cortex-A320 represents its first ultra-efficient CPU using the advanced Armv9 architecture dedicated to the needs of IoT and AI applications. The processor achieves over 50% higher efficiency compared to the Cortex-A520 through several microarchitecture optimizations, together with a narrow fetch and decode data path, densely banked L1 caches, and a reduced-port integer register file. It also delivers 30% improved scalar performance compared with its predecessor, the Cortex-A35, via efficient branch predictors, pre-fetchers, and memory system improvements.

The Cortex-A320 is a single-issue, in-order CPU with a 32-bit instruction fetch and 8-stage pipeline. The processor offers scalability by supporting single-core to quad-core configurations. It features DSU-120T, a streamlined DynamIQ Shared Unit (DSU) which enables Cortex-A320-only clusters. Cortex-A320 supports up to 64 KB L1 caches and up to 512 KB L2, with a 256-bit AMBA5 AXI interface to external memory. The L2 cache and the L2 TLB can be shared between the Cortex-A320 CPUs. The vector processing unit, which implements the NEON and SVE2 SIMD (Single Instruction, Multiple Data) technologies, can be either private in a single core complex or shared between cores in dual-core or quad-core implementations.

IBM today debuted the next generation of its Granite large language model (LLM) family, Granite 3.2, in a continued effort to deliver small, efficient, practical enterprise AI for real-world impact. All Granite 3.2 models are available under the permissive Apache 2.0 license on Hugging Face. Select models are available today on IBM watsonx.ai, Ollama, Replicate, and LM Studio, and expected soon in RHEL AI 1.5 - bringing advanced capabilities to businesses and the open-source community.

Huawei is likely celebrating milestones on multiple fronts—as reported earlier this month, the Chinese technology manufacture has pulled in record revenues and experienced consistent growth. Additionally, industry insiders believe that things are going well within the company's production pipeline. According to a Financial Times report, Huawei's next-generation AI accelerator model is on the way—the unannounced "Ascend 910C" is touted to directly compete with NVIDIA's H100 AI GPU. Industry moles believe that Huawei has partnered with SMIC for the manufacture of in-house accelerator designs. Whispers suggest a selection of the foundry's 7 nm N+2 process.

The alleged doubling of production yields (within a year)—from 20% to 40%—signals a significant achievement. As reported by FT, this milestone indicates Huawei's Ascend chip production line becoming profitable for the very first time. Two inside sources propose that Huawei and SMIC are targeting a 60% yield goal in the near future. In 2025, leaked plans suggest production tallies of roughly 100,00 Ascend 910C processors, and 300,000 of the current-gen Ascend 910B chip.