According to Tom's Hardware, AMD has confirmed that its upcoming FidelityFX Super Resolution 4 (FSR 4.0) graphics upscaling solution will harness the power of AI for frame generation and frame interpolation. This update marks a significant shift from the company's previous analytical-based approaches, as revealed by Jack Huynh, AMD's senior vice president and general manager of the Computing and Graphics Business Group. Initially, FSR4's primary focus is addressing the persistent challenge of battery life in handheld gaming devices. Huynh emphasized the need for extended playtime, stating, "I need to play a Wukong for three hours, not 60 minutes." To achieve this, AMD has been working on AI-based upscaling techniques for nearly a year. As a reminder, FSR 1.0 used spatial upscaling, version 2.0 used temporal upscaling, and FSR 3.0 also used temporal upscaling with optional frame generation.

While the initial context for FSR4 centers on handheld devices, AMD's work with developing open-source, architecture-agnostic algorithms suggests broader applications. FSR4 might be compatible with a wide range of GPU solutions, including non-handheld devices, benefiting desktop and laptop users as well. This move to AI-based technology aligns AMD with competitors like Intel, who have implemented similar approaches in their XeSS technology, and NVIDIA with its DLSS solution. Although the release date for FSR4 remains unannounced, its year-long development suggests it may be nearing completion. However, as with previous upscaling solutions, widespread adoption in games may take time following its release.

ASUS today announced its participation in the upcoming IBC 2024, showcasing the theme A Glimpse into Tomorrow's Tech.Visitors to the ASUS booth (Hall 2 Booth #A29 RAI Amsterdam) will be able to enjoy the ProArt Masters' Talks featuring industry experts from renowned companies Adobe, NVIDIA and Scan Computers, as well as professional filmmaker Bas Goossens, professional senior trainer Leon Barnard, and co-founder and CEO of Redshark Media, Matt Gregory.

As well, through the full run of IBC from September 13-16, 2024, ASUS will highlight a range of cutting-edge technology ideal for professionals, including ProArt Display PA32KCX, the world's first 8K Mini LED professional monitor; ProArt Display OLED PA32UCDM, which brings 4K QD-OLED to creators; ProArt Display 5K PA27JCV, featuring a stunning 5120 x 2880 resolution for unparalleled clarity; and ProArt Display PA32UCE and PA27UCGE, the latest 4K monitors with built-in calibration. The latest ASUS AI-powered laptops and workstations will also be on show.

TrendForce's latest reports reveal that the second quarter of 2024 saw a significant increase in demand for enterprise SSDs due to the increased deployment of NVIDIA GPU platforms and rising storage needs driven by AI applications, along with a surge in demand from server brands. The surge in demand for high-capacity SSDs for AI applications—coupled with suppliers' inability to adjust capacity in the first half of the year—resulted in a supply shortage that drove average enterprise SSD prices up by more than 25% QoQ. This price increase led to a revenue growth of over 50% for suppliers.

Looking ahead to the third quarter, demand from North American CSP customers continues to rise, and server brands show no signs of slowing down their orders, further boosting procurement volumes of enterprise SSD. With supply shortages persisting into the third quarter, TrendForce forecasts a 15% increase in contract prices compared to the previous quarter, with supplier revenues expected to grow by nearly 20%.

SK hynix unveiled an enhanced Accelerator-in-Memory based Accelerator (AiMX) card at the AI Hardware & Edge AI Summit 2024 held September 9-12 in San Jose, California. Organized annually by Kisaco Research, the summit brings together representatives from the AI and machine learning ecosystem to share industry breakthroughs and developments. This year's event focused on exploring cost and energy efficiency across the entire technology stack. Marking its fourth appearance at the summit, SK hynix highlighted how its AiM products can boost AI performance across data centers and edge devices.

Booth Highlights: Meet the Upgraded AiMX
In the AI era, high-performance memory products are vital for the smooth operation of LLMs. However, as these LLMs are trained on increasingly larger datasets and continue to expand, there is a growing need for more efficient solutions. SK hynix addresses this demand with its PIM product AiMX, an AI accelerator card that combines multiple GDDR6-AiMs to provide high bandwidth and outstanding energy efficiency. At the AI Hardware & Edge AI Summit 2024, SK hynix presented its updated 32 GB AiMX prototype which offers double the capacity of the original card featured at last year's event. To highlight the new AiMX's advanced processing capabilities in a multi-batch environment, SK hynix held a demonstration of the prototype card with the Llama 3 70B model, an open source LLM. In particular, the demonstration underlined AiMX's ability to serve as a highly effective attention accelerator in data centers.

Oracle today announced the first zettascale cloud computing clusters accelerated by the NVIDIA Blackwell platform. Oracle Cloud Infrastructure (OCI) is now taking orders for the largest AI supercomputer in the cloud—available with up to 131,072 NVIDIA Blackwell GPUs.

"We have one of the broadest AI infrastructure offerings and are supporting customers that are running some of the most demanding AI workloads in the cloud," said Mahesh Thiagarajan, executive vice president, Oracle Cloud Infrastructure. "With Oracle's distributed cloud, customers have the flexibility to deploy cloud and AI services wherever they choose while preserving the highest levels of data and AI sovereignty."

SambaNova Systems, provider of the fastest and most efficient chips and AI models, announced SambaNova Cloud, the world's fastest AI inference service enabled by the speed of its SN40L AI chip. Developers can log on for free via an API today — no waiting list — and create their own generative AI applications using both the largest and most capable model, Llama 3.1 405B, and the lightning-fast Llama 3.1 70B. SambaNova Cloud runs Llama 3.1 70B at 461 tokens per second (t/s) and 405B at 132 t/s at full precision.

"SambaNova Cloud is the fastest API service for developers. We deliver world record speed and in full 16-bit precision - all enabled by the world's fastest AI chip," said Rodrigo Liang, CEO of SambaNova Systems. "SambaNova Cloud is bringing the most accurate open source models to the vast developer community at speeds they have never experienced before."

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

Today, AMD announced "Advancing AI 2024," an in-person and livestreamed event on October 10, 2024 to showcase the next-generation AMD Instinct accelerators and 5th Gen AMD EPYC server processors, as well as Networking and AI PC updates, in addition to highlighting the Company's growing AI solutions ecosystem. AMD executives and AI ecosystems partners, customers and developers will join Chair and CEO Dr. Lisa Su to discuss how AMD products and software are reshaping the AI and high-performance computing landscape. The live stream will start at 9:00 a.m. PT/12:00 p.m. ET on Thursday, October 10

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Apple today announced iPhone 16 and iPhone 16 Plus, built for Apple Intelligence, the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. The iPhone 16 lineup also introduces Camera Control, which brings new ways to capture memories, and will help users quickly access visual intelligence to learn about objects or places around them faster than ever before. The powerful camera system features a 48MP Fusion camera with a 2x Telephoto option, giving users two cameras in one, while a new Ultra Wide camera enables macro photography. Next-generation Photographic Styles help users personalize their images, and spatial photo and video capture allows users to relive life's precious memories with remarkable depth on Apple Vision Pro. The new A18 chip delivers a huge leap in performance and efficiency, enabling demanding AAA games, as well as a big boost in battery life.

iPhone 16 and iPhone 16 Plus will be available in five bold colors: black, white, pink, teal, and ultramarine. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

Apple today introduced iPhone 16 Pro and iPhone 16 Pro Max, featuring Apple Intelligence, larger display sizes, new creative capabilities with innovative pro camera features, stunning graphics for immersive gaming, and more—all powered by the A18 Pro chip. With Apple Intelligence, powerful Apple-built generative models come to iPhone in the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. Camera Control unlocks a fast, intuitive way to tap into visual intelligence and easily interact with the advanced camera system. Featuring a new 48MP Fusion camera with a faster quad-pixel sensor that enables 4K120 FPS video recording in Dolby Vision, these new Pro models achieve the highest resolution and frame-rate combination ever available on iPhone. Additional advancements include a new 48MP Ultra Wide camera for higher-resolution photography, including macro; a 5x Telephoto camera on both Pro models; and studio-quality mics to record more true-to-life audio. The durable titanium design is strong yet lightweight, with larger display sizes, the thinnest borders on any Apple product, and a huge leap in battery life—with iPhone 16 Pro Max offering the best battery life on iPhone ever.

iPhone 16 Pro and iPhone 16 Pro Max will be available in four stunning finishes: black titanium, natural titanium, white titanium, and desert titanium. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.

The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.

According to new information from Tom's Hardware, AMD has announced plans to unify its consumer-focused gaming RDNA and data center CDNA graphics architectures into a single, unified design called "UDNA." The announcement was made by AMD's Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group, at IFA 2024 in Berlin. The goal of the new UDNA architecture is to provide a single focus point for developers so that each optimized application can run on consumer-grade GPU like Radeon RX 7900XTX as well as high-end data center GPU like Instinct MI300. This will create a unification similar to NVIDIA's CUDA, which enables CUDA-focused developers to run applications on everything ranging from laptops to data centers.

Jack HuynhSo, part of a big change at AMD is today we have a CDNA architecture for our Instinct data center GPUs and RDNA for the consumer stuff. It's forked. Going forward, we will call it UDNA. There'll be one unified architecture, both Instinct and client [consumer]. We'll unify it so that it will be so much easier for developers versus today, where they have to choose and value is not improving.

TrendForce reports that NAND Flash prices continued to rise in 2Q24 as server inventory adjustments neared completion and AI spurred demand for high-capacity storage products. However, high inventory levels among PC and smartphone buyers led to a 1% QoQ decline in NAND Flash bit shipments. Despite this, ASP increased by 15% and drove total revenue to US$16.796 billion, a 14.2% growth compared to the previous quarter.

All NAND Flash suppliers returned to profitability starting in the second quarter and are expanding capacity in the third quarter to meet strong demand from AI and server markets. However, weaker-than-expected PC and smartphone sales in the first half of the year are likely to constrain NAND Flash shipment growth.

As AI workloads continue to evolve and expand, memory bandwidth and capacity are increasingly critical for system performance. The latest GPUs in the industry need the highest performance high bandwidth memory (HBM), significant memory capacity, as well as improved power efficiency. Micron is at the forefront of memory innovation to meet these needs and is now shipping production-capable HBM3E 12-high to key industry partners for qualification across the AI ecosystem.

Micron's industry-leading HBM3E 12-high 36 GB delivers significantly lower power consumption than our competitors' 8-high 24 GB offerings, despite having 50% more DRAM capacity in the package
Micron HBM3E 12-high boasts an impressive 36 GB capacity, a 50% increase over current HBM3E 8-high offerings, allowing larger AI models like Llama 2 with 70 billion parameters to run on a single processor. This capacity increase allows faster time to insight by avoiding CPU offload and GPU-GPU communication delays. Micron HBM3E 12-high 36 GB delivers significantly lower power consumption than the competitors' HBM3E 8-high 24 GB solutions. Micron HBM3E 12-high 36 GB offers more than 1.2 terabytes per second (TB/s) of memory bandwidth at a pin speed greater than 9.2 gigabits per second (Gb/s). These combined advantages of Micron HBM3E offer maximum throughput with the lowest power consumption can ensure optimal outcomes for power-hungry data centers. Additionally, Micron HBM3E 12-high incorporates fully programmable MBIST that can run system representative traffic at full spec speed, providing improved test coverage for expedited validation and enabling faster time to market and enhancing system reliability.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Global technology brand HONOR today announced its groundbreaking AI-enabled hardware capabilities and a collaborative AI privacy protection architecture, showcasing its commitment to innovative empowerment in an AI-driven world, at IFA 2024. The HONOR MagicBook Art 14 represents a groundbreaking leap in laptop industry, transforming conventional laptop experience by infusing human-centric innovation with robust capabilities.

Showcasing the Vine-leaf Curves Design and Satin Enamel Spraying Technology, this laptop is a marvel of lightweight engineering, incorporating cutting-edge platform-level AI features alongside robust hardware and software solutions, ensuring unmatched productivity and user experience. Translating the lightweight and slim characteristics synonymous with smartphones to laptops, HONOR is introducing the so far lightest and slimmest AIPC to the market. The HONOR MagicBook Art 14 showcases the pioneering Topology Lightweight Structure, weighing just approximately 1 kg and measuring a slim thickness of 10 mm. Boasting an alloy body crafted from magnesium and a keyboard constructed with titanium, this laptop epitomizes a perfect balance of lightweight design and durability.

Lenovo, a global leader in technology innovation, announced its latest advancements at Lenovo Innovation World 2024, unveiling a series of AI PC devices, including ThinkPad, ThinkBook, Yoga, and IdeaPad laptops, designed to transform both enterprise and consumer user experiences.

AI PC Era
AI PCs are set to revolutionize computing as their relevance grows, with 60% of PCs shipped by 2027 anticipated to be AI-capable. Lenovo's AI PCs are at the forefront of this transformation, leveraging natural interactions, personalized large language models, and advanced computing architectures. These innovations make computing more personal by tailoring experiences to individual users, more productive by enhancing workflow efficiency, and more protected by integrating robust security features into AI-driven systems.

During the Semicon Taiwan 2024 summit event, TSMC VP of Advanced Packaging Technology, Jun He, spoke about the importance of merging AI chip memory and logic chips using 3D IC technology. He predicted that by 2030 the worldwide semiconductor industry would hit the $1 trillion milestone with HPC and AI leading 40 percent of the market share. In 2027, TSMC will introduce the 2.5D CoWoS technology that includes eight A16 process chipsets and 12 HBM4. AI processors that use this technology will not only be much cheaper to produce but will also provide engineers with a greater level of convenience. Engineers will have the option to write new codes into them instead. Manufacturers are cutting the SoC and HBM architectural conversion and mass production costs down to nearly one-fourth.

Nevertheless, the increasing production capacities of 3D IC technology remain the main challenge, as the size of chips and the complexity of manufacturing are decisive factors. However, the higher the size of the chips, the more chiplets are added, and thus the performance is improved, but this now makes the process even more complicated and is associated with more risks of misalignment, breakage, and extraction failure.

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, today announced significant updates to its S14I semi-rugged laptop, expanding its product line supporting modern-day data-intensive tasks. With the performance of Intel Core Ultra processor, this AI-powered 14" semi-rugged laptop exceeds expectations by delivering a powerful, premium performance and exceptional user experience.

Durabook also produces the Z14I fully rugged laptop, the world's most durable and reliable fully rugged PC designed specifically to support demanding AI applications in the field. Twinhead's CEO, Fred Kao, said: "AI technology has emerged as an important tool to handle and maximise data and create new, more capable and powerful systems. Durabook aims to equip our mobile computing devices with optimum capability for professional users in the field. Our customers can exploit these advancements to their advantage and greatest benefit with laptop solutions delivering up to 100 TOPS with AI accelerator."

ASUS today announced ExpertBook P5 (P5405), a groundbreaking Copilot+ PC1 designed to empower modern professionals. Powered by the latest Intel Core Ultra processor (Series 2) with up to 48 NPU TOPS2, delivering an up to 3X AI performance boost over the prior generation and featuring ASUS AI ExpertMeet, this AI-driven powerhouse streamlines workflows and enhances collaboration. Its sleek, durable aluminum chassis houses a stunning 2.5K 144 Hz display, delivering exceptional visuals. With a 1.29 kg3 feather-light design, robust security features, and a focus on sustainability, ExpertBook P5 is the perfect companion for on-the-go professionals seeking peak performance and efficiency.

The future of work
Crafted with meticulous attention to detail, ExpertBook P5 boasts a premium aluminum design that seamlessly blends aesthetics and ergonomics. Despite its lightweight construction, at just 1.29 kg, P5 offers exceptional durability — meeting the exacting US MIL-STD 810H military standard. Its thoughtfully designed workspace, featuring conveniently placed function keys and a spacious mouse area, optimizes productivity and comfort during video conferences and multitasking. Engineered with the ASUS ExpertCool thermal structure, a newly-enhanced cooling design, the ExpertBook P5 ensures consistent, optimal cooling whether the lid is open or closed, guaranteeing peak performance even during extended usage. It is a productivity powerhouse designed to elevate professional performance, empowering users to achieve their full potential.

ASUS today announced the all-new ExpertBook P1403 and P1503 laptop models, aimed at administrators and budget-conscious professionals who require essential computing services without compromise. Available in 14-inch or 15-inch Full HD options, ExpertBook P1 blends effective performance with everyday functionality, housed in a practical design that delivers where it counts.

The compact and elegant ExpertBook P1 series starts at a lightweight 1.4 kg and features an elegant new design that unlocks impressive efficiency to supercharge daily productivity, empowered by the exclusive ASUS AI ExpertMeet2 tool. This enhances meeting productivity by overcoming language barriers with built-in translation, distinguishing speakers, summarizing discussions and much more.

The U.S. Department of Justice has stepped up its probe into NVIDIA and several other companies in the hopes of gaining evidence that NVIDIA could have violated antitrust laws. The DOJ moved from sending questionnaires to issuing subpoenas requiring recipients to provide more information. This puts the government one step closer to potentially filing a formal complaint. Antitrust officials are concerned that NVIDIA might be making it difficult for customers to switch to other suppliers and could be penalizing those who don't exclusively use its AI chips, according to sources familiar with the investigation.

The probe, which first came to light in June via Bloomberg, has seen investigators reaching out to other tech companies for information. The DOJ's San Francisco office is leading the inquiry, though the department has declined to comment publicly on the matter. In response to the investigation, NVIDIA said in an emailed statement that its market dominance is due to the superior quality and performance of its products. "NVIDIA wins on merit, as reflected in our benchmark results and value to customers, who can choose whatever solution is best for them".

According to a recent Reuters report, Intel's 18A node doesn't seem to be production-ready. As the sources indicate, Broadcom has been reportedly testing Intel's 18A node on its internal company designs, which include an extensive range of products from AI accelerators to networking switches. However, as Broadcom received the initial production run from Intel, the 18A node seems to be in a worse state than initially expected. After testing the wafers and powering them on, Broadcom reportedly concluded that the 18A process is not yet ready for high-volume production. With Broadcom's comments reflecting high-volume production, it signals that the 18A node is not producing a decent yield that would satisfy external customers.

While this is not a good sign of Intel's Fundry contract business development, it shows that the node is presumably in a good state in terms of power/performance. Intel's CEO Pat Gelsinger confirmed that 18A is now at 0.4 d0 defect density, and it is now a "healthy process." However, alternatives exist at TSMC, which proves to be a very challenging competitor to take on, as its N7 and N5 nodes had a defect density of 0.33 during development and 0.1 defect density during high-volume production. This leads to better yields and lower costs for the contracting party, resulting in higher profits. Ultimately, it is up to Intel to improve its production process further to satisfy customers. Gelsinger wants to see Intel Foundry as "manufacturing ready" by the end of the year, and we can see the first designs in 2025 reach volume production. There are still a few more months to improve the node, and we expect to see changes implemented by the end of the year.

ASUS today announced that it showcased its latest technological innovations at the Always Incredible Media Day for IFA 2024 in Berlin, Germany. The company highlighted its commitment to its Ubiquitous AI. Incredible Possibilities vision by unveiling a new portfolio of next-generation ASUS Copilot+ PCs. Equipped with the latest Intel Core Ultra processors (Series 2), they deliver style, robust features and functionality, robust connectivity and heighten levels of performance alongside AI capabilities. ASUS has harnessed the full potential of Intel Core Ultra processors (Series 2) in the latest ASUS NUC mini PC. This new model outperforms the competition with superior performance, while maintaining an impressively compact design and robust array of connections and expansion support. With an integrated NPU delivering up to 48 TOPS, it enabled on-device AI capabilities. The NUC 14 Pro Ai will receive a free update to Copilot+ PC experiences when available.

The company's collaboration with Intel has been key in bringing these cutting-edge devices to life. "The powerful Intel Core Ultra processors at the heart of our latest Zenbook, Vivobook, ExpertBook laptops, and NUC Mini PC deliver unmatched performance and enable a wide range of AI experiences," said Rangoon Chang, ASUS Corporate Vice President, Consumer Business Unit. "With these new devices, together we are empowering users to harness the full potential of AI to enjoy smarter, more intuitive computing."